M1AFS600-1FG484I vs M1AFS1500-1FG484I Сравнение
Подробное сравнение бок о бок M1AFS600-1FG484I от Microchip Technology и M1AFS1500-1FG484I от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
M1AFS600-1FG484I - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-1FG484I ✓ АктивенMicrochip Technology
M1AFS1500-1FG484I - 1.5M Gate Fusion FPGA 484-FBGA | Microchip
M1AFS1500-1FG484I ✓ АктивенСравнение характеристик
| Параметр | M1AFS600-1FG484I | M1AFS1500-1FG484I |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $425,00 | $402,06 |
| Family | Fusion (M1 series) | — |
| System Gates | 600K | — |
| VersaTile Logic Blocks | 13824 | — |
| Flip-Flops | 110592 | — |
| User I/O | 172 | — |
| Processor Core | ARM Cortex-M1 (32-bit ARMv6-M) | — |
| Technology | 130nm flash-based CMOS | — |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| Корпус | 484-ball FBGA (FG484) | — |
| Analog Features | Configurable analog blocks (ADC, comparators, voltage monitors) | — |
| Configuration Memory | On-chip flash (instant-on, secure) | — |
| Clock Management | CCC blocks with integrated PLLs | — |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL, LVDS, B-LVDS | — |
| Рабочая температура | [DATA_NEEDED: operating temperature range] | -40C to +100C (TJ) |
| Статус RoHS | RoHS Non-Compliant (contains lead) | RoHS Non-Compliant |
| Lead Free Status | Contains Lead | Contains Lead |
| Тип монтажа | Surface Mount | Surface Mount |
| Series | — | Fusion (M1) |
| Number of System Gates | — | 1500000 |
| Logic Capacity | — | 276480 |
| Number of I/O | — | 223 |
| Speed Grade | — | -1 |
| Embedded Processor | — | ARM Cortex-M1 soft core support |
| Programmable Technology | — | Flash-based (non-volatile) |
| Process Technology | — | 130 nm |
| Security | — | 128-bit flash lock, AES decryption |
| Корпус / Типоразмер | — | 484-BGA (FBGA / FPBGA) |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 16 weeks |
| Product Status | — | Active |