M7AFS600-FGG484I vs M7AFS600-1FG484I Сравнение
Подробное сравнение бок о бок M7AFS600-FGG484I от Microchip Technology и M7AFS600-1FG484I от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip
M7AFS600-FGG484I ✓ АктивенMicrochip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ АктивенСравнение характеристик
| Параметр | M7AFS600-FGG484I | M7AFS600-1FG484I |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $219,20 | $198,00 |
| Programmable Logic Family | Fusion (Microsemi/Actel, now Microchip) | — |
| System Gates | 600000 gates | 600000 |
| Embedded Processor | ARM CoreMP7 (ARM7TDMI-compatible) | — |
| User I/O | 172 I/O | 172 |
| Configuration Technology | Flash-based, on-chip | — |
| Core Supply Voltage | 1.5 V | — |
| Корпус | 484-BGA (FGG484), 1.0 mm ball pitch | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm |
| Тип монтажа | Surface Mount | Surface Mount |
| Рабочая температура | -40C to +100C (industrial, I grade) | Industrial, -40C to +85C |
| Memory - Listable Resource | 110592 (per DigiKey listing) | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| I/O Bank Count | [DATA_NEEDED: I/O bank count] | — |
| Embedded Flash Blocks | [DATA_NEEDED: embedded flash block count] | — |
| Analog Peripherals | [DATA_NEEDED: analog peripheral configuration] | — |
| Уровень MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Programming Tool Chain | Microchip Libero SoC (formerly Actel Libero) | — |
| Programmable Logic Tiles | — | 110592 |
| Family | — | Fusion (Flash FPGA with optional ARM CoreMP7 support) |
| Process Technology | — | 130 nm, 7-layer metal, Flash-based CMOS |
| Configuration Memory | — | Nonvolatile Flash, retains program when powered off |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Supply Voltage (Core) | — | 1.5 V |
| Logic Family | — | CMOS |
| Speed Grade | — | 1 |
| Ball Pitch | — | 1.0 mm |
| Embedded Processor Support | — | ARM CoreMP7 |