MSC8157TAG1000A vs MSC8156ESAG1000B Сравнение
Подробное сравнение бок о бок MSC8157TAG1000A от NXP Semiconductors и MSC8156ESAG1000B от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
MSC8157TAG1000A ⚠ Последняя закупкаNXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ Снят с производстваСравнение характеристик
| Параметр | MSC8157TAG1000A | MSC8156ESAG1000B |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | DSP | DSP |
| Статус жизненного цикла | Последняя закупка | Снято с производства |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $178,00 | $112,00 |
| Device Type | Six-core Digital Signal Processor (DSP) | — |
| DSP Architecture | StarCore SC3850 (6x cores) | — |
| Core Frequency | 1 GHz per core | — |
| L1 Instruction Cache | 32 KB per core | — |
| L1 Data Cache | 32 KB per core | — |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) | — |
| Accelerator | MAPLE-B2 baseband accelerator | — |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC | 64-bit DDR2/DDR3, up to 800 MT/s |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI | — |
| Корпус | 783-FCPBGA (29x29 mm) | 783-ball FCBGA (29x29 mm) |
| Ball Pitch | 1.0 mm | — |
| Рабочая температура | -40C to +105C | 0C to +105C |
| Напряжение питания | [DATA_NEEDED: core/IO voltage] | [DATA_NEEDED: core and I/O rail voltages] |
| MMU | Yes | — |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) | — |
| Timers | 2x 32-bit general-purpose per core | — |
| Статус RoHS | [DATA_NEEDED] | [DATA_NEEDED: RoHS compliance] |
| Уровень MSL | [DATA_NEEDED] | — |
| DSP Cores | — | 6x SC3850 StarCore cores |
| Core Clock Frequency | — | 1 GHz per core |
| Aggregate Performance | — | [DATA_NEEDED: aggregate MMACS rating] |
| Process Technology | — | 45 nm CMOS |
| Hardware Accelerator | — | MAPLE-B baseband accelerator (turbo decode) |
| SerDes Lanes | — | 2 lanes, SRIO or PCIe (selectable) |
| Ethernet | — | 1x Gigabit Ethernet MAC |
| Packet Engine | — | QUICC Engine subsystem |
| Security Engine | — | SEC 4.0 (Cryptographic accelerator) |
| Тип монтажа | — | Surface Mount (BGA) |
| Статус жизненного цикла | — | End of Life (per NXP PCN) |