MSC8157TAG1000A vs MSC8156ESAG1000B 对比
详细并排对比 MSC8157TAG1000A 出自 NXP Semiconductors 和 MSC8156ESAG1000B 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
MSC8157TAG1000A ⚠ 最后一次采购NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ 停产规格对比
| 参数 | MSC8157TAG1000A | MSC8156ESAG1000B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | DSP | DSP |
| 生命周期状态 | 最后采购期 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $178.00 | $112.00 |
| Device Type | Six-core Digital Signal Processor (DSP) | — |
| DSP Architecture | StarCore SC3850 (6x cores) | — |
| Core Frequency | 1 GHz per core | — |
| L1 Instruction Cache | 32 KB per core | — |
| L1 Data Cache | 32 KB per core | — |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) | — |
| Accelerator | MAPLE-B2 baseband accelerator | — |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC | 64-bit DDR2/DDR3, up to 800 MT/s |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI | — |
| 封装 | 783-FCPBGA (29x29 mm) | 783-ball FCBGA (29x29 mm) |
| Ball Pitch | 1.0 mm | — |
| 工作温度 | -40C to +105C | 0C to +105C |
| 电源电压 | [DATA_NEEDED: core/IO voltage] | [DATA_NEEDED: core and I/O rail voltages] |
| MMU | Yes | — |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) | — |
| Timers | 2x 32-bit general-purpose per core | — |
| RoHS 状态 | [DATA_NEEDED] | [DATA_NEEDED: RoHS compliance] |
| MSL 等级 | [DATA_NEEDED] | — |
| DSP Cores | — | 6x SC3850 StarCore cores |
| Core Clock Frequency | — | 1 GHz per core |
| Aggregate Performance | — | [DATA_NEEDED: aggregate MMACS rating] |
| Process Technology | — | 45 nm CMOS |
| Hardware Accelerator | — | MAPLE-B baseband accelerator (turbo decode) |
| SerDes Lanes | — | 2 lanes, SRIO or PCIe (selectable) |
| Ethernet | — | 1x Gigabit Ethernet MAC |
| Packet Engine | — | QUICC Engine subsystem |
| Security Engine | — | SEC 4.0 (Cryptographic accelerator) |
| 安装类型 | — | Surface Mount (BGA) |
| 生命周期状态 | — | End of Life (per NXP PCN) |