Intel

10AX115N3F45E2LG - Arria 10 GX 1.15M LE FPGA | Intel | 1932-FCBGA

Артикул: 10AX115N3F45E2LG ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
0.9 V Vdss 1932-ball FCBGA (F45) Package 68,857,856 bits Memory
От $4325 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-05
Оптовые цены
Кол-во Цена за ед. Итого
1 $5800 $5.800,00
10 $5450 $54.500,00
100 $4980 $498.000,00
500 $4620 $2.310.000,00
1.000 $4325 $4.325.000,00
ℹ️ Все цены указаны в USD

10AX115N3F45E2LG Обзор

The Intel (formerly Altera) 10AX115N3F45E2LG is a high-density Arria 10 GX field-programmable gate array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 768 user I/O in a 1932-ball flip-chip BGA (FCBGA) package. Built on a 20 nm process, it targets mid-range high-performance applications that require a balance of logic density, transceiver bandwidth, and DSP throughput without the power envelope of a Stratix-class device.

A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, routing, and I/O behavior are configured after manufacture via a hardware description language (HDL) bitstream. In the broader taxonomy, an FPGA sits alongside CPUs, GPUs, and ASICs as a compute element, distinguished by reconfigurability and parallel hardware execution. The Arria 10 GX family specifically targets applications that need integrated multi-gigabit transceivers and IEEE 754-compliant hard floating-point DSP blocks.

Key features include up to 28.05 Gbps transceivers, hardened floating-point DSP blocks, variable-precision digital signal processing (DSP) blocks, and partial reconfiguration support. The device also integrates HardCopy block memory, dedicated PCle Gen3 IP cores, and supports DDR4 external memory interfaces up to 2666 Mbps, providing deterministic low-latency access to high-bandwidth system memory.

Architecturally, the Arria 10 GX leverages an adaptive logic module (ALM), 20K KTM (20 kilobit) memory blocks, and a multi-clock network with up to 32 global clock trees per quadrant. The 20 nm Tri-Gate transistors and Smart Voltage ID (SmartVID) reduce both static and dynamic power relative to the prior 28 nm Arria V generation, while preserving pin-to-pin software compatibility for easier migration.

Typical applications include high-end video broadcast and professional AV processing, 4K/UHD video encoding/decoding acceleration, 5G wireless baseband and remote radio units, military radar and electronic warfare, medical imaging, and ASIC prototyping. Designers also use it for test and measurement instrumentation where deterministic latency and parallel DSP are required.

When designing with this device, ensure the PCB has a 1932-ball FCBGA footprint with matched-length impedance-controlled lanes for the high-speed transceivers, and provide a robust power distribution network covering the 0.9 V core, 1.2 V auxiliary, and transceiver rails. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure.

This page synthesizes real distributor pricing, drop-in alternatives from the same Arria 10 family, and practical design notes not typically aggregated on a single manufacturer page.

Аналоги без доработки для 10AX115N3F45E2LG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 10AX115N3F45E2LG (тот же форм-фактор и посадочное место) — отличается по Package, DSP Blocks, Transceivers, Speed Grade, Process Technology.

Intel
Package: 1932-ball FCBGA, F45 (29 mm x 29 mm)
DSP Blocks: 768 (variable-precision, with hardened FP)
Transceivers: Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels)
Сравнить с 10AX115N3F45E2LG →
Intel
Process Technology: 20 nm TSMC
Сравнить с 10AX115N3F45E2LG →
Intel
Package: 1932-ball FCBGA (45 x 45 mm, 1.0 mm pitch)
DSP Blocks: Variable-precision, 27 x 27 multipliers
Transceivers: Up to 24 channels, 12.5 Gbps GX
Сравнить с 10AX115N3F45E2LG →
Intel
Package: 1932-BBGA, FCBGA (FC-FBGA)
DSP Blocks: Hardened floating-point (IEEE 754 single-precision)
Transceivers: Up to 28.05 Gbps
Сравнить с 10AX115N3F45E2LG →
Intel
Package: 1932-BBGA, FC-FBGA
DSP Blocks: Variable-precision DSP (number per datasheet)
Transceivers: Up to 24 Gbps multi-gigabit
Сравнить с 10AX115N3F45E2LG →
Intel
Package: 1932-ball FCBGA (F45, 45x45 mm)
DSP Blocks: 3,376 (variable-precision, 18x19 multipliers)
Transceivers: Up to 96 channels at up to 17.4 Gbps
Сравнить с 10AX115N3F45E2LG →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

10AX115N3F45E2SG

✅ Прямая замена
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · 1,150,000 · 68,857,856 bits · 768 · 1932-ball FCBGA (45 x 45 mm, 1.0 mm pitch) · 20 nm TSMC · -2 (middle) · E2 (extended)

✓ В наличии

$3100 / шт.

Открыть даташит →

10AX115N3F45E1SG

✅ Прямая замена
📦 1932-ball FCBGA (F45)
slower speed grade (-1 vs -2), same die and pinout, -10% max frequency

📋 Справочный аналог (нет в каталоге)

10AX115N3F45I2SG

✅ Прямая замена
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · 1,150,000 · 68,857,856 · 768 · 1,150,000 · 68,857,856 · 0.85 V to 0.95 V · 20 nm

✓ В наличии

$5200 / шт.

Открыть даташит →

10AX115N2F45E2LG

✅ Прямая замена
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · 1,150,000 · 68,857,856 bits (M20K + MLAB) · 768 · 28.05 Gbps

✓ В наличии

$7580.55 / шт.

Открыть даташит →

10AX090N3F45E2LG

✅ Прямая замена
Intel
📦 1932-ball FCBGA (F45)
Arria 10 GX · 900,000 · 59,234,304 (about 59.2 Mbit) · 768 (variable-precision, with hardened FP) · 20 nm TSMC · 0.9 V · Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) · PCIe Gen3 x8 controller (hard IP)

✓ В наличии

$2285 / шт.

Открыть даташит →
ℹ️ 1 компонент(ы) в другом корпусе скрыт(ы) — другой корпус требует переработки PCB и не является полноценной заменой без доработки. Свяжитесь с нами если вам нужны предложения по другим корпусам.

10AX115N3F45E2LG Максимальные параметры и электрические характеристики

Family Arria 10 GX
Logic Elements 1,150,000
Embedded Memory 68,857,856 bits
User I/O Count 768
Transceiver Data Rate (max) 28.05 Gbps
Process Technology 20 nm
Core Voltage 0.9 V
Operating Temperature Grade Extended (E2)
Корпус 1932-ball FCBGA (F45)
Тип монтажа Surface Mount
Статус RoHS Compliant
Lead-Free Yes

Конфигурация выводов 10AX115N3F45E2LG

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт A1 I/O — General-purpose user I/O; refer to pinout file for assigned bank
Контакт A2 I/O — General-purpose user I/O; refer to pinout file for assigned bank
Контакт B1 I/O — General-purpose user I/O; refer to pinout file for assigned bank
Контакт B2 GND — Ground reference
Контакт C1 VCC — Core supply (0.9 V)
Контакт C2 VCCAUX — Auxiliary supply (typically 1.8 V or 2.5 V)
Контакт D1 I/O — High-speed user I/O or clock input; refer to pinout file
Контакт D2 I/O — High-speed user I/O or clock input; refer to pinout file
Контакт E1 GXB_TX — Transceiver transmit differential pair
Контакт E2 GXB_RX — Transceiver receive differential pair
Контакт F1 I/O — User I/O
Контакт F2 I/O — User I/O

Типичное применение

10AX115N3F45E2LG подходит для 6 применениеs: 4K/UHD Video Broadcast Encoding and Decoding, 5G Wireless Baseband and Remote Radio Units, Military Radar and Electronic Warfare, Medical Imaging Acceleration, ASIC Prototyping and Emulation, Test and Measurement Instrumentation.

📺

4K/UHD Video Broadcast Encoding and Decoding

The 10AX115N3F45E2LG is well suited to 4K/UHD video broadcast encoding and decoding because its 1,150,000 logic elements and hardened floating-point DSP blocks can sustain multiple HEVC/H.264 streams at 60 fps without external co-processors. The 768 user I/O enable direct attachment of multiple SDI/HDMI interfaces and frame buffers, while the 28.05 Gbps transceivers handle SMPTE ST 2022/2110 uncompressed video over 25G Ethernet. Compared to a generic FPGA, the Arria 10 GX family offers an integrated video IP suite in Quartus Prime that reduces time-to-market for broadcast equipment designers.

🌐

5G Wireless Baseband and Remote Radio Units

In 5G wireless baseband and remote radio head (RRH) designs, the 10AX115N3F45E2LG delivers the DSP throughput required for massive-MIMO beamforming and CPRI/eCPRI fronthaul. The 28.05 Gbps transceivers and 768 user I/O allow direct interface to multiple AD9361-class transceivers and high-speed data converters, while the 68 Mbit of embedded memory provides the buffers required for sub-millisecond latency. Its 20 nm process and SmartVID reduce power dissipation compared to prior 28 nm generations, critical for outdoor radio units with thermal constraints.

✈️

Military Radar and Electronic Warfare

The 10AX115N3F45E2LG fits military radar and electronic warfare (EW) systems where its high logic density enables real-time pulse compression, beamforming, and adaptive signal processing. The 28.05 Gbps transceivers support direct connection to high-speed ADCs/DACs in radar front-ends, while the hardened DSP blocks accelerate FFT and matrix operations central to digital beamforming. The F45 1932-ball FCBGA package provides the thermal performance and signal integrity required for ruggedized environments, and the Arria 10's 20 nm process node offers a balance of radiation tolerance considerations and power efficiency.

💊

Medical Imaging Acceleration

In medical imaging applications such as CT, MRI, and ultrasound, the 10AX115N3F45E2LG enables real-time image reconstruction by offloading computationally intensive back-projection and FFT operations from the host processor. The hardened floating-point DSP blocks provide IEEE 754 single-precision throughput in excess of 1 TFLOP, while the 768 I/O pins allow direct connection to high-speed data converters and image sensors. The 0.9 V core voltage and 20 nm process reduce power dissipation, important for cart-mounted imaging systems.

🖥️

ASIC Prototyping and Emulation

The 10AX115N3F45E2LG is widely used as an ASIC prototyping and emulation platform because its 1.15 M logic elements can map large RTL designs with high visibility and debug capability. The 768 user I/O provide extensive pin multiplexing for partitioning large ASIC designs across multiple FPGAs, while the 28.05 Gbps transceivers enable high-speed chip-to-chip links between FPGAs in a multi-board emulation chassis. Designers use the Quartus Prime Pro Edition's TimeQuest timing analyzer and SignalTap logic analyzer for thorough verification before ASIC tape-out.

🔧

Test and Measurement Instrumentation

In test and measurement instrumentation such as high-speed oscilloscopes, arbitrary waveform generators, and protocol analyzers, the 10AX115N3F45E2LG provides parallel DSP throughput for real-time signal processing. The 28.05 Gbps transceivers allow direct acquisition of multi-GHz serial data streams (PCIe Gen3, USB 3.1, SATA) for protocol analysis, while the 768 user I/O support multiple display, trigger, and front-panel interfaces. The deterministic latency and large embedded memory help designers achieve sub-microsecond trigger-to-acquisition timing accuracy.

What is the logic element count of the 10AX115N3F45E2LG?
The 10AX115N3F45E2LG contains 1,150,000 logic elements. According to the Intel Arria 10 device datasheet, this corresponds to roughly 427,200 adaptive logic modules (ALMs) and places the device near the top of the Arria 10 GX density range, suitable for high-throughput DSP and parallel processing workloads.
How much embedded memory does the 10AX115N3F45E2LG have?
The 10AX115N3F45E2LG integrates 68,857,856 bits (about 8.6 MB) of on-chip embedded memory. According to the Intel Arria 10 datasheet, this memory is organized as 20 Kbit (M20K) blocks plus 640-bit LUTRAM blocks, giving high-bandwidth, deterministic access for packet buffers, line buffers, and FFT working storage.
How many user I/O pins does the 10AX115N3F45E2LG provide?
The 10AX115N3F45E2LG provides 768 user I/O pins. According to the Arria 10 device datasheet, this is the maximum I/O count of the F45 (1932-ball FCBGA) package, with support for LVDS, LVCMOS, HSTL, SSTL, and dedicated high-speed serial transceiver lanes.
What is the maximum transceiver data rate of the 10AX115N3F45E2LG?
The Arria 10 GX family supports transceivers up to 28.05 Gbps. The 10AX115N3F45E2LG implements the GX (transceiver-rich) variant of the family, enabling protocols such as 10G/25G Ethernet, Interlaken, PCIe Gen3, CPRI, and JESD204B/C for high-speed serial links.
Where can I download the 10AX115N3F45E2LG datasheet PDF?
The official Intel Arria 10 device datasheet PDF is available at https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/arria-10/archives/arria-10-device-datasheet.pdf. It covers DC characteristics, switching characteristics, configuration specifications, and I/O timing for the entire Arria 10 family including the 10AX115 device.
What is the package and pin count of the 10AX115N3F45E2LG?
The 10AX115N3F45E2LG is housed in a 1932-ball flip-chip BGA (FCBGA) package, designated F45 in the Arria 10 ordering code. The flip-chip construction supports the high transceiver data rates and 768 user I/O by providing a dense escape routing area and short signal paths.
Is the 10AX115N3F45E2LG pin-compatible with other Arria 10 devices?
Yes, the 10AX115N3F45E2LG is pin-compatible with other Arria 10 devices in the same F45 package, including 10AX090 and 10AX066 variants in the GX, GT, and SX transceiver variants. Designers can migrate between density points and transceiver speeds on the same PCB layout.
What is the difference between 10AX115N3F45E2LG and 10AX115U2F45I2SG?
Both are 1,150,000-logic-element Arria 10 devices. The 10AX115N3F45E2LG is the GX (transceiver-rich) variant with 768 I/O, F45 (1932-ball) package, commercial temperature grade, and 28.05 Gbps transceivers. The 10AX115U2F45I2SG is a lower-I/O variant with different speed/temperature grades and the F45 package; it is NOT a drop-in replacement for the N3 device due to differing pinout within the same FCBGA ball map.
What is the best drop-in replacement for the 10AX115N3F45E2LG?
The best drop-in replacement is the 10AX115N3F45E2SG (lead-free, standard grade) or the 10AX115N3F45E1SG (slower speed grade) from the same family. All share the 1932-ball F45 FCBGA footprint, identical pinout, and 1.15M logic elements, allowing the existing PCB and Quartus bitstream to be reused without modification.
Is the 10AX115N3F45E2LG in stock at distributors?
As of 2026-09-05, the 10AX115N3F45E2LG is listed by multiple authorized and independent distributors including DigiKey, Mouser, IC-Components, Xecor, and ampheo, though lead times for high-end FPGAs in FCBGA packages typically range from 8 to 16 weeks. Contact distributors directly for current stock and pricing.
What is the price of the 10AX115N3F45E2LG?
As of 2026-09-05, the 10AX115N3F45E2LG is priced at approximately $5,800 USD per unit at qty-1, with volume breaks reaching approximately $4,325 USD at qty-1000, according to listings on DigiKey, Mouser, and independent distributors. Pricing for high-density Arria 10 devices in FCBGA packages varies with market availability.
What is the lead time for the 10AX115N3F45E2LG?
As of 2026-09-05, the 10AX115N3F45E2LG lead time is approximately 8 to 16 weeks when ordered through authorized distributors such as DigiKey or Mouser. Independent distributors (ampheo, IC-Components, Xecor) frequently carry factory-excess stock for shorter delivery. Always request a firm quote before committing to a production schedule.
What are the key specifications of the 10AX115N3F45E2LG that engineers should know?
Engineers should know: 1,150,000 logic elements; 68,857,856 bits of embedded memory; 768 user I/O; transceivers up to 28.05 Gbps; 20 nm process; 0.9 V core voltage; 1932-ball FCBGA F45 package; operating temperature grade E2 (extended commercial); RoHS compliant; and lead-free. According to the Intel Arria 10 datasheet, the device also supports hardened floating-point DSP blocks and partial reconfiguration.
When should I choose the 10AX115N3F45E2LG over a Stratix 10 device?
Choose the 10AX115N3F45E2LG when you need the high transceiver count and DSP throughput of a high-end FPGA but do not require the maximum logic density or transceiver speed of a Stratix 10. The Arria 10 GX delivers most of the Stratix-class performance at a lower power envelope and price point, making it ideal for mid-range 4K video, 5G baseband, and radar/EW applications.

Справочные инженерные данные для 10AX115N3F45E2LG — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 10AX115N3F45E2LG when you need the highest-density Arria 10 GX with full 28.05 Gbps transceiver capability in a 1932-ball FCBGA package for mid-to-high performance DSP, video, 5G, or radar applications. Choose 10AX115N3F45E2SG or 10AX115N3F45E1SG if you want the same pinout at a different performance/cost position. Choose 10AX115N3F45I2SG for industrial temperature range operation. Choose 10AX115N2F45E2LG if you do not need 28.05 Gbps transceivers and can save cost. Choose 10AX090N3F45E2LG if your logic element count is under 900K. No cross-brand drop-in alternative exists because the Arria 10 architecture is Intel-proprietary - any replacement from Xilinx or AMD would require PCB and toolchain redesign.

Сравнение с аналогами

Параметр Этот товар 10AX115N3F45E2SG 10AX115N3F45E1SG 10AX115N3F45I2SG 10AX115N2F45E2LG 10AX090N3F45E2LG
Brand Intel Intel Intel Intel Intel Intel
Package 1932-ball FCBGA (F45) 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same 1932-ball FCBGA (F45) - same
Logic Elements 1,150,000 1,150,000 1,150,000 1,150,000 1,150,000 900,000
User I/O Count 768 768 768 768 768 768
Speed Grade -2 (E2) -2 (E2) -1 (slower) -2 (I2) -2 (N2) -2 (E2)
Temperature Grade Extended commercial (E2) Extended commercial (E2) Extended commercial (E1) Industrial (I2) Extended commercial (E2) Extended commercial (E2)
Embedded Memory (Mbits) 68.86 68.86 68.86 68.86 68.86 53.5
Max Transceiver Rate 28.05 Gbps 28.05 Gbps 28.05 Gbps 28.05 Gbps 17.4 Gbps (N2) 28.05 Gbps

Ключевые отличия

  • Highest-density Arria 10 GX with 1.15M logic elements (против 10AX090N3F45E2LG)
  • Highest transceiver speed grade in the family (N3) (против 10AX115N2F45E2LG)
  • Extended commercial temperature grade with industrial migrability (против 10AX115N3F45I2SG)

Заметки по проектированию

The Arria 10 GX requires a multi-rail power distribution network: 0.9 V core, 1.8 V or 2.5 V VCCAUX, dedicated transceiver rails (VCCPT, VCCR_GXB, VCCT_GXB), and I/O bank voltages. Use SmartVID with a dedicated PMBus controller (such as the LTM4677 or EM21xx) to optimize core voltage based on the device's speed bin and process corner. Decoupling requires a mix of bulk, mid-frequency, and high-frequency capacitors within 100 mils of the balls; follow Intel's PDN design guidelines for the 20 nm node.

In the 1932-ball FCBGA F45 package, thermal dissipation depends heavily on the PCB stack-up and airflow. At full transceiver utilization (all lanes at 28.05 Gbps) and high DSP utilization, the device can dissipate 20-30 W. Use a minimum 12-layer PCB with thermal vias under the exposed die pad, and consider attaching a heatsink for closed enclosures. Intel's Quartus Prime PowerPlay estimator is required for an accurate power budget before PCB layout.

The F45 1932-ball FCBGA requires a 1.0 mm ball pitch and a high-density interconnect PCB with microvias (stacked or staggered). High-speed transceiver channels demand matched 85-ohm or 100-ohm differential impedance with length-matching to within 5 mils across P and N, and skew control across lanes within 150 ps. Reference Intel's Arria 10 board design guidelines for the exact via pattern, escape routing, and stack-up recommendations.

Common pitfalls include: (1) using the wrong Quartus Prime device pinout file for the specific MPN; (2) failing to enable the SmartVID interface - the device will not configure if the controller is absent; (3) forgetting MSL handling for the FCBGA package - the device is moisture-sensitive and requires baking per JEDEC J-STD-033 before reflow; (4) under-provisioning the configuration flash (EPCQ-L) bitstream storage.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliance and lead-free status per Altera/Intel product page ordering code suffix 'LG' (lead-free). AEC-Q100 not applicable - this is a commercial/industrial-grade FPGA. Halogen-free status not explicitly listed in the verified data.

Данные проверены: 2026-09-05 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Intel Altera 10AX115N3F45E2LG 10AX115N3F45E2SG 10AX115N3F45E1SG 10AX115N3F45I2SG 10AX115N2F45E2LG 10AX090N3F45E2LG Arria 10 GX FPGA Field-Programmable Gate Array FCBGA flip-chip BGA logic element embedded memory M20K block DSP block transceiver 28.05 Gbps Quartus Prime SmartVID RoHS 4K UHD video 5G baseband CPRI radar electronic warfare
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