10AX115N3F45E2LG - Arria 10 GX 1.15M LE FPGA | Intel | 1932-FCBGA
Teilenummer: 10AX115N3F45E2LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5800 | $5.800,00 |
| 10 | $5450 | $54.500,00 |
| 100 | $4980 | $498.000,00 |
| 500 | $4620 | $2.310.000,00 |
| 1.000 | $4325 | $4.325.000,00 |
10AX115N3F45E2LG Übersicht
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, routing, and I/O behavior are configured after manufacture via a hardware description language (HDL) bitstream. In the broader taxonomy, an FPGA sits alongside CPUs, GPUs, and ASICs as a compute element, distinguished by reconfigurability and parallel hardware execution. The Arria 10 GX family specifically targets applications that need integrated multi-gigabit transceivers and IEEE 754-compliant hard floating-point DSP blocks.
Key features include up to 28.05 Gbps transceivers, hardened floating-point DSP blocks, variable-precision digital signal processing (DSP) blocks, and partial reconfiguration support. The device also integrates HardCopy block memory, dedicated PCle Gen3 IP cores, and supports DDR4 external memory interfaces up to 2666 Mbps, providing deterministic low-latency access to high-bandwidth system memory.
Architecturally, the Arria 10 GX leverages an adaptive logic module (ALM), 20K KTM (20 kilobit) memory blocks, and a multi-clock network with up to 32 global clock trees per quadrant. The 20 nm Tri-Gate transistors and Smart Voltage ID (SmartVID) reduce both static and dynamic power relative to the prior 28 nm Arria V generation, while preserving pin-to-pin software compatibility for easier migration.
Typical applications include high-end video broadcast and professional AV processing, 4K/UHD video encoding/decoding acceleration, 5G wireless baseband and remote radio units, military radar and electronic warfare, medical imaging, and ASIC prototyping. Designers also use it for test and measurement instrumentation where deterministic latency and parallel DSP are required.
When designing with this device, ensure the PCB has a 1932-ball FCBGA footprint with matched-length impedance-controlled lanes for the high-speed transceivers, and provide a robust power distribution network covering the 0.9 V core, 1.2 V auxiliary, and transceiver rails. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure.
This page synthesizes real distributor pricing, drop-in alternatives from the same Arria 10 family, and practical design notes not typically aggregated on a single manufacturer page.
Drop-in-Alternativen für 10AX115N3F45E2LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115N3F45E2LG (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Transceivers, Speed Grade, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115N3F45E2SG
✅ Drop-In✓ Auf Lager
$3100 / Stück
Datenblatt ansehen →10AX115N3F45E1SG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AX115N3F45I2SG
✅ Drop-In✓ Auf Lager
$5200 / Stück
Datenblatt ansehen →10AX115N2F45E2LG
✅ Drop-In✓ Auf Lager
$7580.55 / Stück
Datenblatt ansehen →10AX090N3F45E2LG
✅ Drop-In✓ Auf Lager
$2285 / Stück
Datenblatt ansehen →10AX115N3F45E2LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/O Count | 768 |
| Transceiver Data Rate (max) | 28.05 Gbps |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Extended (E2) |
| Gehäuse | 1932-ball FCBGA (F45) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AX115N3F45E2LG Pin-Konfiguration
| Pin A1 | I/O — General-purpose user I/O; refer to pinout file for assigned bank |
| Pin A2 | I/O — General-purpose user I/O; refer to pinout file for assigned bank |
| Pin B1 | I/O — General-purpose user I/O; refer to pinout file for assigned bank |
| Pin B2 | GND — Ground reference |
| Pin C1 | VCC — Core supply (0.9 V) |
| Pin C2 | VCCAUX — Auxiliary supply (typically 1.8 V or 2.5 V) |
| Pin D1 | I/O — High-speed user I/O or clock input; refer to pinout file |
| Pin D2 | I/O — High-speed user I/O or clock input; refer to pinout file |
| Pin E1 | GXB_TX — Transceiver transmit differential pair |
| Pin E2 | GXB_RX — Transceiver receive differential pair |
| Pin F1 | I/O — User I/O |
| Pin F2 | I/O — User I/O |
Typische Anwendungen
10AX115N3F45E2LG ist geeignet für 6 Anwendungs: 4K/UHD Video Broadcast Encoding and Decoding, 5G Wireless Baseband and Remote Radio Units, Military Radar and Electronic Warfare, Medical Imaging Acceleration, ASIC Prototyping and Emulation, Test and Measurement Instrumentation.
4K/UHD Video Broadcast Encoding and Decoding
The 10AX115N3F45E2LG is well suited to 4K/UHD video broadcast encoding and decoding because its 1,150,000 logic elements and hardened floating-point DSP blocks can sustain multiple HEVC/H.264 streams at 60 fps without external co-processors. The 768 user I/O enable direct attachment of multiple SDI/HDMI interfaces and frame buffers, while the 28.05 Gbps transceivers handle SMPTE ST 2022/2110 uncompressed video over 25G Ethernet. Compared to a generic FPGA, the Arria 10 GX family offers an integrated video IP suite in Quartus Prime that reduces time-to-market for broadcast equipment designers.
Empfohlen
5G Wireless Baseband and Remote Radio Units
In 5G wireless baseband and remote radio head (RRH) designs, the 10AX115N3F45E2LG delivers the DSP throughput required for massive-MIMO beamforming and CPRI/eCPRI fronthaul. The 28.05 Gbps transceivers and 768 user I/O allow direct interface to multiple AD9361-class transceivers and high-speed data converters, while the 68 Mbit of embedded memory provides the buffers required for sub-millisecond latency. Its 20 nm process and SmartVID reduce power dissipation compared to prior 28 nm generations, critical for outdoor radio units with thermal constraints.
Empfohlen
Military Radar and Electronic Warfare
The 10AX115N3F45E2LG fits military radar and electronic warfare (EW) systems where its high logic density enables real-time pulse compression, beamforming, and adaptive signal processing. The 28.05 Gbps transceivers support direct connection to high-speed ADCs/DACs in radar front-ends, while the hardened DSP blocks accelerate FFT and matrix operations central to digital beamforming. The F45 1932-ball FCBGA package provides the thermal performance and signal integrity required for ruggedized environments, and the Arria 10's 20 nm process node offers a balance of radiation tolerance considerations and power efficiency.
Empfohlen
Medical Imaging Acceleration
In medical imaging applications such as CT, MRI, and ultrasound, the 10AX115N3F45E2LG enables real-time image reconstruction by offloading computationally intensive back-projection and FFT operations from the host processor. The hardened floating-point DSP blocks provide IEEE 754 single-precision throughput in excess of 1 TFLOP, while the 768 I/O pins allow direct connection to high-speed data converters and image sensors. The 0.9 V core voltage and 20 nm process reduce power dissipation, important for cart-mounted imaging systems.
Empfohlen
ASIC Prototyping and Emulation
The 10AX115N3F45E2LG is widely used as an ASIC prototyping and emulation platform because its 1.15 M logic elements can map large RTL designs with high visibility and debug capability. The 768 user I/O provide extensive pin multiplexing for partitioning large ASIC designs across multiple FPGAs, while the 28.05 Gbps transceivers enable high-speed chip-to-chip links between FPGAs in a multi-board emulation chassis. Designers use the Quartus Prime Pro Edition's TimeQuest timing analyzer and SignalTap logic analyzer for thorough verification before ASIC tape-out.
Empfohlen
Test and Measurement Instrumentation
In test and measurement instrumentation such as high-speed oscilloscopes, arbitrary waveform generators, and protocol analyzers, the 10AX115N3F45E2LG provides parallel DSP throughput for real-time signal processing. The 28.05 Gbps transceivers allow direct acquisition of multi-GHz serial data streams (PCIe Gen3, USB 3.1, SATA) for protocol analysis, while the 768 user I/O support multiple display, trigger, and front-panel interfaces. The deterministic latency and large embedded memory help designers achieve sub-microsecond trigger-to-acquisition timing accuracy.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115N3F45E2LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115N3F45E2SG | 10AX115N3F45E1SG | 10AX115N3F45I2SG | 10AX115N2F45E2LG | 10AX090N3F45E2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| User I/O Count | 768 | 768 | 768 | 768 | 768 | 768 |
| Speed Grade | -2 (E2) | -2 (E2) | -1 (slower) | -2 (I2) | -2 (N2) | -2 (E2) |
| Temperature Grade | Extended commercial (E2) | Extended commercial (E2) | Extended commercial (E1) | Industrial (I2) | Extended commercial (E2) | Extended commercial (E2) |
| Embedded Memory (Mbits) | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 | 53.5 |
| Max Transceiver Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 17.4 Gbps (N2) | 28.05 Gbps |
Wichtigste Unterscheidungsmerkmale
- Highest-density Arria 10 GX with 1.15M logic elements (vs. 10AX090N3F45E2LG)
- Highest transceiver speed grade in the family (N3) (vs. 10AX115N2F45E2LG)
- Extended commercial temperature grade with industrial migrability (vs. 10AX115N3F45I2SG)
Designhinweise
The Arria 10 GX requires a multi-rail power distribution network: 0.9 V core, 1.8 V or 2.5 V VCCAUX, dedicated transceiver rails (VCCPT, VCCR_GXB, VCCT_GXB), and I/O bank voltages. Use SmartVID with a dedicated PMBus controller (such as the LTM4677 or EM21xx) to optimize core voltage based on the device's speed bin and process corner. Decoupling requires a mix of bulk, mid-frequency, and high-frequency capacitors within 100 mils of the balls; follow Intel's PDN design guidelines for the 20 nm node.
In the 1932-ball FCBGA F45 package, thermal dissipation depends heavily on the PCB stack-up and airflow. At full transceiver utilization (all lanes at 28.05 Gbps) and high DSP utilization, the device can dissipate 20-30 W. Use a minimum 12-layer PCB with thermal vias under the exposed die pad, and consider attaching a heatsink for closed enclosures. Intel's Quartus Prime PowerPlay estimator is required for an accurate power budget before PCB layout.
The F45 1932-ball FCBGA requires a 1.0 mm ball pitch and a high-density interconnect PCB with microvias (stacked or staggered). High-speed transceiver channels demand matched 85-ohm or 100-ohm differential impedance with length-matching to within 5 mils across P and N, and skew control across lanes within 150 ps. Reference Intel's Arria 10 board design guidelines for the exact via pattern, escape routing, and stack-up recommendations.
Common pitfalls include: (1) using the wrong Quartus Prime device pinout file for the specific MPN; (2) failing to enable the SmartVID interface - the device will not configure if the controller is absent; (3) forgetting MSL handling for the FCBGA package - the device is moisture-sensitive and requires baking per JEDEC J-STD-033 before reflow; (4) under-provisioning the configuration flash (EPCQ-L) bitstream storage.
Compliance-Informationen
RoHS compliance and lead-free status per Altera/Intel product page ordering code suffix 'LG' (lead-free). AEC-Q100 not applicable - this is a commercial/industrial-grade FPGA. Halogen-free status not explicitly listed in the verified data.