10M04DCU324C8G - MAX 10 FPGA, 4K LE, 246 I/O, 324-UBGA | Intel
Артикул: 10M04DCU324C8G ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $21.85 | $218,50 |
| 100 | $18.4 | $1.840,00 |
| 500 | $15.95 | $7.975,00 |
| 1.000 | $13.8 | $13.800,00 |
10M04DCU324C8G Обзор
An FPGA (Field Programmable Gate Array) is a programmable semiconductor in which an array of configurable logic blocks (LUTs, flip-flops, DSP blocks, and embedded memory) is connected by a programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic -> logic ICs -> integrated circuits, and the MAX 10 family specifically targets low-cost, low-power, non-volatile glue-logic applications with integrated analog blocks (ADCs) and instant-on capability.
Key features of the 10M04DCU324C8G include 4,000 LE, 1.2 V core operation, an integrated 1 Msps 12-bit ADC block (typically with up to 17 analog inputs on U324), up to 246 general-purpose I/O, embedded Flash and SRAM, two PLLs, and a hardened Nios II soft-core support path. The device is built around a logic-rich architecture where every I/O is programmable for LVCMOS, LVTTL, LVDS, SSTL, and other single-ended and differential standards, while internal Multipliers and DSP blocks accelerate common arithmetic pipelines.
From an architecture perspective, the MAX 10 die integrates dual-configuration Flash plus 1.4 Mbit of user Flash memory, allowing on-chip storage of user data, firmware, or configuration parameters. The 324-UBGA (U324) package exposes the maximum I/O count of the 10M04 family, making this the highest-pin-count variant of the 10M04 silicon and an ideal target for I/O-intensive glue-logic and parallel sensor or motor-control interface boards.
Typical applications include industrial machine vision, motor control with integrated ADC feedback, IoT edge nodes requiring instant-on configuration, communications protocol bridging (UART/SPI/I2C/Ethernet), and portable test and measurement. The integrated 12-bit ADC simplifies mixed-signal front ends by eliminating an external converter IC.
When designing with this part, plan the PCB layout for the U324 BGA with a 0.8 mm ball pitch; use the Quartus Prime Lite toolchain (free) and verify timing with TimeQuest. Pay attention to bank-based I/O supply voltage grouping so that mixed-voltage interfaces share common VCCIO rails.
This page synthesizes distributor pricing, vertical-migration alternatives, and Quartus design-flow considerations not collected in a single datasheet excerpt.
Аналоги без доработки для 10M04DCU324C8G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10M04DCU324C8G (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Configuration Memory, Process Technology, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10M04DCU324A7G
✅ Прямая замена✓ В наличии
$9.85 / шт.
Открыть даташит →10M04DAU324I7G
✅ Прямая замена✓ В наличии
$13.5 / шт.
Открыть даташит →10M04DAU324C8G
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →10M04DCF256A7G
✅ Прямая замена✓ В наличии
$11.1 / шт.
Открыть даташит →10M04DCU324C8G Максимальные параметры и электрические характеристики
| Series | MAX 10 |
| Family | MAX 10 (10M04 density) |
| Logic Elements (LE) | 4,000 |
| User I/O Count | 246 |
| Embedded Memory (block RAM) | 246 Kbit (M9K blocks) |
| Embedded Block RAM bits | 193,536 |
| Embedded Multiplier (18x18) | 16 |
| Process Technology | 55 nm embedded NOR Flash + CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Configuration | Internal Flash (instant-on, single-chip) |
| Analog-to-Digital Converter | Integrated 12-bit, up to 1 Msps (typ. 17 analog inputs on U324) |
| PLLs | 2 |
| Корпус | 324-pin UBGA (U324), 0.8 mm pitch |
| Тип монтажа | Surface Mount (BGA) |
| Operating Temperature (C8G speed/temp grade) | 0 C to +85 C (commercial) |
| Speed Grade | 8 (slower speed grade) |
| Статус RoHS | Compliant |
Руководство по цоколевке 10M04DCU324C8G в корпусе 324-pin ubga (u324), 0.8 mm pitch
Цоколевка для 10M04DCU324C8G (корпус 324-pin ubga (u324), 0.8 mm pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10M04DCU324C8G.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10M04DCU324C8G подходит для 6 применениеs: Industrial Machine Vision and Sensor Aggregation, BLDC and Servo Motor Control with ADC Feedback, IoT Edge Gateway with Instant-On Configuration, Communications Protocol Bridging, Portable Test and Measurement Instrumentation, Display and Video Interface Aggregation.
Industrial Machine Vision and Sensor Aggregation
The 10M04DCU324C8G's 4,000 LE and 246 user I/O let it aggregate several parallel image sensors, encoder streams, or GPIO banks onto a single processing pipeline without external mux ICs. The integrated 12-bit ADC samples feedback signals such as lighting current or temperature directly, eliminating an external ADC and shrinking the BOM. Quartus Prime Lite handles the image-data buffer pipeline using the device's M9K block RAM (246 Kbit), and instant-on Flash configuration means the vision node is ready within 10 ms of power-up, important for line-scan synchronization in factory automation. Choose this part when multiple parallel-bus sensors must be merged on a low-power, low-cost platform.
Рекомендуется
BLDC and Servo Motor Control with ADC Feedback
The 10M04DCU324C8G is well-suited for BLDC and servo motor control where PWM generation, Hall-sensor decoding, and current/voltage feedback must be handled in real time. Its 16 embedded 18x18 multipliers compute the Park/Clark transforms and PI controllers without loading a host MCU, while the integrated 12-bit ADC samples phase currents directly from the inverting amplifiers at up to 1 Msps. The 2 PLLs synthesize jitter-free PWM carrier frequencies from a single external oscillator. The U324 package's 246 I/O expose up to 6 encoder interfaces plus 3-phase PWM channels simultaneously, making this part ideal for multi-axis motion controllers.
Рекомендуется
IoT Edge Gateway with Instant-On Configuration
The MAX 10's embedded Flash gives the 10M04DCU324C8G instant-on capability, which is critical for battery-powered IoT gateways that wake on interrupt and must service sensor traffic within milliseconds. The 246 I/O expose multiple UART, SPI, I2C, and SDIO interfaces for connecting radios, sensors, and storage without external mux logic. Up to 1.4 Mbit of user Flash (family-typical) stores Wi-Fi credentials and OTA staging images, allowing field updates without external EEPROM. Choose this FPGA when latency-sensitive wake-up and multi-protocol bridging are required at the network edge.
Рекомендуется
Communications Protocol Bridging
The 10M04DCU324C8G can act as a multi-protocol bridge, converting between UART, SPI, I2C, RS-422/RS-485, LVDS, and Ethernet MII/RMII interfaces in industrial networking equipment. Its 246 I/O and on-chip block RAM buffer packets at line rate, while the 16 DSP blocks can perform whitening, encryption pre-processing, or Manchester encoding. Because the MAX 10 family integrates Flash, no external boot memory is needed, simplifying the BOM for compact protocol-converter modules in building automation and process control networks.
Рекомендуется
Portable Test and Measurement Instrumentation
Handheld oscilloscope and logic-analyzer front ends benefit from the 10M04DCU324C8G's combination of high I/O count, integrated ADC, and instant-on Flash. The U324 package exposes hundreds of single-ended and differential LVDS-capable pins for probing parallel buses, while the on-chip ADC samples analog test points up to 1 Msps. The FPGA also performs trigger logic, deep acquisition buffering in block RAM, and USB/PCIe data upload to a host processor. Choose this part when a portable instrument needs instant readiness and mixed-signal acquisition in a compact, low-power design.
Рекомендуется
Display and Video Interface Aggregation
The 10M04DCU324C8G can aggregate multiple camera or display data streams (parallel RGB, MIPI-CSI via LVDS, or proprietary interfaces) and convert timing, color depth, or resolution on-the-fly. Its 246 I/O accommodate wide parallel video buses, while the M9K block RAM tiles provide line buffering without external SDRAM for low-resolution video. The integrated PLL generates pixel clocks from any reference, and instant-on Flash means the display subsystem initializes at the same instant as the host SoC. Choose this part for human-machine interface (HMI) panels and digital signage controllers.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10M04DCU324C8G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10M04DCU324A7G | 10M04DAU324I7G | 10M04DAU324C8G |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 324-UBGA (U324), 0.8 mm pitch | 324-UBGA (U324) - same footprint | 324-UBGA (U324) - same footprint | 324-UBGA (U324) - same footprint |
| Logic Elements | 4,000 LE | 4,000 LE | 4,000 LE | 4,000 LE |
| User I/O | 246 | 246 | 246 | 246 |
| Speed Grade | 8 | 7 (faster Fmax) | 7 (faster Fmax) | 8 (same as target) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Embedded Block RAM | 246 Kbit | 246 Kbit | 246 Kbit | 246 Kbit |
| Embedded Multipliers (18x18) | 16 | 16 | 16 | 16 |
| Integrated 12-bit ADC | Yes (typ. 17 analog inputs) | Yes (same ADC block) | Yes (same ADC block) | Yes (same ADC block) |
| Configuration Method | Internal Flash (instant-on) | Internal Flash (instant-on) | Internal Flash (instant-on) | Internal Flash (instant-on) |
Ключевые отличия
- Highest-density 10M04 variant in the 324-UBGA package, exposing the maximum I/O count (против 10M04DCF256A7G (256-FBGA))
- Integrated 12-bit ADC plus instant-on Flash eliminates external converter and boot PROM (против Discrete MCU + external ADC + boot SPI Flash)
- Non-volatile configuration with dual-boot Flash supports field-reliable OTA updates (против SRAM-based FPGAs requiring external boot PROM)
Заметки по проектированию
The 324-UBGA uses a 0.8 mm ball pitch and requires HDI PCB fabrication with laser-drilled micro-vias. Follow Intel's MAX 10 hardware design guide for via-in-pad geometry: capture pad 0.40 mm, solder mask defined (SMD) or non-solder mask defined (NSMD) land 0.45 mm. Use at least 4 PCB layers with a dedicated ground plane directly under the BGA to provide low-impedance return paths for the high-frequency I/O switching. Decoupling: place 100 nF X7R capacitors within 2 mm of every VCCINT and VCCIO ball, plus bulk 10 uF X5R per power rail at the edge of the BGA footprint.
The 10M04DCU324C8G requires three supply rails: VCCINT (1.2 V core), VCCIO (per bank, 1.2-3.3 V), and VCCA (2.5 V analog for the integrated ADC). A common mistake is to skip ferrite-bead isolation between VCCA and the digital 2.5 V rail; doing so couples switching noise into the ADC reference and degrades effective resolution below 10 bits. According to Intel's MAX 10 power management guide, VCCA must be filtered with a 10 ohm ferrite bead and a 10 uF + 100 nF cap network. Estimate power consumption with the Quartus PowerPlay early-power estimator before committing to a regulator choice; typical 10M04 designs draw 0.5-1.5 W total depending on toggle rate and I/O utilization.
Do not leave JTAG TCK floating during configuration - pull it high through a 10 kohm resistor to VCCIO of the JTAG bank, otherwise transient noise can corrupt Flash programming. Do not exceed the maximum allowed VCCIO bank count (8 banks on U324) when mixing 1.8 V and 3.3 V interfaces; group same-voltage interfaces into the same VCCIO bank to avoid level-shifter overhead. Finally, the 'C' commercial temperature grade is not suitable for outdoor or industrial deployments - choose the 10M04DAU324I7G (industrial -40C to +100C) for those environments without changing the PCB layout.
Информация о соответствии
RoHS and REACH compliance per the 'G' suffix trailer per Intel's MAX 10 product declaration. AEC-Q100 not applicable - this is an industrial/consumer FPGA, not an automotive-qualified part. For automotive, consider the MAX 10 automotive grade variants if available in your design's package.
