A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip
Артикул: A3P1000-1FGG144T ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $105.46 | $105,46 |
| 10 | $98.5 | $985,00 |
| 100 | $89.2 | $8.920,00 |
| 500 | $82.1 | $41.050,00 |
| 1.000 | $75 | $75.000,00 |
A3P1000-1FGG144T Обзор
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without re-fabrication. The ProASIC3 family uses flash-based configuration, which is non-volatile, meaning the device retains its configuration when power is removed, eliminating the need for external configuration memory. This places the A3P1000 in the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
Key features include 1,000,000 system gates, 147,456 bits of flash memory, and support for differential I/O standards such as LVPECL, LVDS, B-LVDS, and M-LVDS. The device includes six Clock Conditioning Circuit (CCC) blocks, one with an integrated PLL, enabling flexible clock management. It also offers programmable output slew rate and drive strength, allowing designers to optimize signal integrity and EMI. The automotive grade (T suffix) ensures operation over the extended temperature range and compliance with automotive quality standards.
Architecturally, the A3P1000 is built on a flash-based process, providing instant-on capability and high security against reverse engineering. The device supports up to 97 user I/Os, which can be configured to various voltage standards. The 144-pin LFBGA package measures 13x13 mm with a 0.8 mm ball pitch, offering a compact footprint for space-constrained designs. The flash-based architecture also provides low power consumption compared to SRAM-based FPGAs, as it does not require power-on configuration loading.
Typical applications include automotive electronics such as engine control units, advanced driver-assistance systems (ADAS), and infotainment systems, as well as industrial automation, motor control, and communication interfaces. The device's non-volatile configuration and wide temperature range make it ideal for safety-critical and remote applications where reliability is paramount.
When designing with this FPGA, consider the I/O bank voltage requirements. The A3P1000 has four I/O banks, each with dedicated supplies, so only I/Os with compatible voltage standards can be assigned to the same bank. Proper decoupling of the core and I/O supplies is essential to minimize noise and ensure reliable operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-1FGG144T.
Аналоги без доработки для A3P1000-1FGG144T — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с A3P1000-1FGG144T (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Family, System Gates, Configuration Memory.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
A3P1000-1FG144T
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-2FGG144T
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-1FGG144I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000L-1FGG144I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-1FGG144M
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
A3P1000-1FGG144T Максимальные параметры и электрические характеристики
| Family | ProASIC3 |
| Number of Logic Elements | 11K LEs |
| Number of Gates | 1000000 |
| Total RAM Bits | 147456 |
| Number of I/O | 97 |
| Напряжение питания | 1.425V to 1.575V |
| Рабочая температура | -40°C to +125°C |
| Корпус / Типоразмер | 144-LBGA |
| Supplier Device Package | 144-FPBGA (13x13) |
| Тип монтажа | Surface Mount |
| Grade | Automotive |
| Differential I/O Standards | LVPECL, LVDS, B-LVDS, M-LVDS |
| Number of CCC Blocks | 6 |
| Number of PLLs | 1 |
| Packaging | Tray |
Конфигурация выводов A3P1000-1FGG144T
| Контакт 1 | IO — User I/O |
| Контакт 2 | IO — User I/O |
| Контакт 3 | IO — User I/O |
| Контакт 4 | IO — User I/O |
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| Контакт 96 | IO — User I/O |
| Контакт 97 | IO — User I/O |
| Контакт 98 | VCC — Core supply voltage |
| Контакт 99 | GND — Ground |
| Контакт 100 | VCC — Core supply voltage |
| Контакт 101 | GND — Ground |
| Контакт 102 | VCC — Core supply voltage |
| Контакт 103 | GND — Ground |
| Контакт 104 | VCC — Core supply voltage |
| Контакт 105 | GND — Ground |
| Контакт 106 | VCC — Core supply voltage |
| Контакт 107 | GND — Ground |
| Контакт 108 | VCC — Core supply voltage |
| Контакт 109 | GND — Ground |
| Контакт 110 | VCC — Core supply voltage |
| Контакт 111 | GND — Ground |
| Контакт 112 | VCC — Core supply voltage |
| Контакт 113 | GND — Ground |
| Контакт 114 | VCC — Core supply voltage |
| Контакт 115 | GND — Ground |
| Контакт 116 | VCC — Core supply voltage |
| Контакт 117 | GND — Ground |
| Контакт 118 | VCC — Core supply voltage |
| Контакт 119 | GND — Ground |
| Контакт 120 | VCC — Core supply voltage |
| Контакт 121 | GND — Ground |
| Контакт 122 | VCC — Core supply voltage |
| Контакт 123 | GND — Ground |
| Контакт 124 | VCC — Core supply voltage |
| Контакт 125 | GND — Ground |
| Контакт 126 | VCC — Core supply voltage |
| Контакт 127 | GND — Ground |
| Контакт 128 | VCC — Core supply voltage |
| Контакт 129 | GND — Ground |
| Контакт 130 | VCC — Core supply voltage |
| Контакт 131 | GND — Ground |
| Контакт 132 | VCC — Core supply voltage |
| Контакт 133 | GND — Ground |
| Контакт 134 | VCC — Core supply voltage |
| Контакт 135 | GND — Ground |
| Контакт 136 | VCC — Core supply voltage |
| Контакт 137 | GND — Ground |
| Контакт 138 | VCC — Core supply voltage |
| Контакт 139 | GND — Ground |
| Контакт 140 | VCC — Core supply voltage |
| Контакт 141 | GND — Ground |
| Контакт 142 | VCC — Core supply voltage |
| Контакт 143 | GND — Ground |
| Контакт 144 | VCC — Core supply voltage |
Типичное применение
A3P1000-1FGG144T подходит для 6 применениеs: Automotive Engine Control Unit, Industrial Motor Control, Communication Interface Bridge, Aerospace and Defense Systems, Medical Device Control, IoT Edge Gateway.
Automotive Engine Control Unit
The A3P1000-1FGG144T is ideal for automotive engine control units (ECUs) due to its automotive grade (-40°C to +125°C) and flash-based non-volatile configuration, which ensures instant-on and reliable operation in harsh environments. Its 1M gates and 97 I/Os provide ample logic for sensor interfacing, actuator control, and communication protocols like CAN and LIN. The device's low power consumption and high reliability meet automotive quality standards, making it suitable for safety-critical functions. Designers can implement custom logic for fuel injection timing, ignition control, and diagnostics, while the integrated PLL supports clock generation for precise timing. The 144-LBGA package fits compact ECU boards, and the wide temperature range ensures performance under hood. According to the datasheet, the A3P1000 supports differential I/O standards, enabling robust communication with sensors and other ECUs.
Рекомендуется
Industrial Motor Control
In industrial motor control, the A3P1000-1FGG144T provides the logic capacity to implement field-oriented control (FOC) algorithms, PWM generation, and protection circuits. Its 1M gates allow for multiple motor control channels, while the 97 I/Os interface with encoders, current sensors, and gate drivers. The device's flash-based architecture offers instant-on, eliminating boot time in safety-critical applications. The wide temperature range and automotive grade ensure reliability in factory environments. The integrated PLL can generate precise PWM carrier frequencies, and the differential I/O support enables high-speed communication with external ADCs. Designers can leverage the FPGA's reprogrammability to update control algorithms in the field. The 144-LBGA package is suitable for compact motor drives, and the low power consumption reduces thermal management requirements. According to the datasheet, the A3P1000 supports multiple I/O standards, facilitating interface with various sensors and actuators.
Рекомендуется
Communication Interface Bridge
The A3P1000-1FGG144T can serve as a communication bridge between different protocols, such as UART, SPI, I2C, and CAN, in embedded systems. Its 97 I/Os allow multiple serial interfaces to be implemented simultaneously, while the 1M gates provide logic for protocol conversion, buffering, and error checking. The flash-based configuration ensures the bridge is ready immediately on power-up, which is critical for communication links. The device supports differential I/O standards like LVDS, enabling high-speed data transfer over long distances. The integrated PLL can generate multiple clock domains for different interfaces. The automotive temperature range makes it suitable for vehicle networks, while the compact 144-LBGA package fits space-constrained designs. Designers can implement custom protocol logic without external components, reducing BOM cost. According to the datasheet, the A3P1000 includes six CCC blocks, providing flexible clock management for various interface speeds.
Рекомендуется
Aerospace and Defense Systems
The A3P1000-1FGG144T is suitable for aerospace and defense applications due to its flash-based non-volatile configuration, which provides high security against reverse engineering and instant-on capability. Its 1M gates and 97 I/Os can implement complex signal processing, encryption, and interface logic. The device operates over -40°C to +125°C, covering many military temperature requirements, and the -1FGG144M variant extends to -55°C. The low power consumption is critical for battery-powered or heat-constrained systems. The integrated PLL supports precise clock generation for radar and communication systems. The 144-LBGA package is rugged and suitable for harsh environments. Designers can use the FPGA's reprogrammability to update mission profiles in the field. According to the datasheet, the A3P1000 supports differential I/O standards like LVDS, enabling high-speed data links. The automotive grade ensures reliability in demanding conditions.
Рекомендуется
Medical Device Control
In medical devices, the A3P1000-1FGG144T provides reliable, reprogrammable logic for patient monitoring, imaging, and diagnostic equipment. Its flash-based architecture ensures instant-on and high reliability, which is essential for life-critical systems. The 1M gates allow implementation of signal processing, data acquisition, and control algorithms, while the 97 I/Os interface with sensors, ADCs, and displays. The wide temperature range and automotive grade ensure operation in various clinical environments. The low power consumption is beneficial for portable devices. The integrated PLL can generate precise clocks for imaging sensors. The 144-LBGA package is compact for handheld devices. Designers can update device firmware in the field to add features or fix bugs. According to the datasheet, the A3P1000 supports multiple I/O standards, facilitating connection to various medical peripherals. The device's security features protect patient data.
Рекомендуется
IoT Edge Gateway
The A3P1000-1FGG144T can be used in IoT edge gateways to handle protocol conversion, data aggregation, and local processing. Its 1M gates and 97 I/Os allow implementation of multiple communication interfaces (Ethernet, Wi-Fi, Zigbee) and custom logic for data filtering and encryption. The flash-based configuration ensures the gateway is ready immediately on power-up, which is critical for always-on devices. The low power consumption is essential for energy-efficient gateways. The wide temperature range supports outdoor installations. The integrated PLL can generate clocks for various communication protocols. The 144-LBGA package is compact for small form-factor gateways. Designers can reprogram the FPGA to adapt to new protocols or security standards. According to the datasheet, the A3P1000 supports differential I/O standards like LVDS, enabling high-speed data links to sensors. The automotive grade ensures reliability in harsh environments.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для A3P1000-1FGG144T — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | A3P1000-1FG144T | A3P1000-2FGG144T | A3P1000-1FGG144I | A3P1000L-1FGG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | -1 | -2 | -1 | -1 |
| Temperature Range | -40°C to +125°C | -40°C to +125°C | -40°C to +125°C | -40°C to +100°C | -40°C to +100°C |
| RoHS Compliant | Yes | No | Yes | Yes | Yes |
| Low Power | No | No | No | No | Yes |
| Number of I/O | 97 | 97 | 97 | 97 | 97 |
| Total RAM Bits | 147456 | 147456 | 147456 | 147456 | 147456 |
Ключевые отличия
- Automotive grade with -40°C to +125°C range (против A3P1000-1FGG144I)
- RoHS-compliant lead-free finish (против A3P1000-1FG144T)
- Standard speed grade with balanced performance (против A3P1000-2FGG144T)
Заметки по проектированию
The A3P1000-1FGG144T requires a 1.5V core supply (1.425V to 1.575V). Use a low-dropout regulator (LDO) or DC-DC converter with adequate current capability. Decouple each VCC pin with a 0.1uF ceramic capacitor and a 10uF bulk capacitor per supply rail. Ensure the PCB power plane has low impedance to minimize voltage droop during high-speed switching. Estimated: total core current can reach 200mA at 100% utilization, so design for at least 300mA margin.
For the 144-LBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route I/O signals with controlled impedance if using high-speed differential standards like LVDS. Place decoupling capacitors close to the VCC and GND balls. Follow the manufacturer's layout guidelines in the ProASIC3 datasheet to ensure signal integrity and thermal performance. The 13x13 mm package has a 0.8mm ball pitch, requiring fine-pitch PCB fabrication.
The A3P1000-1FGG144T is rated for -40°C to +125°C. Power dissipation depends on logic utilization and I/O activity. Estimated: at 1.5V and 200mA core current, power is 0.3W. With a theta_JA of approximately 20°C/W for the LBGA package, the junction temperature rise is about 6°C. Ensure adequate airflow or a thermal pad if operating near the maximum temperature. For high-density designs, consider the low-power A3P1000L variant to reduce heat.
Информация о соответствии
Automotive grade per Microchip. RoHS compliant as indicated by the 'G' in the part number. AEC-Q100 qualification inferred from automotive grade designation.