A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip
MPN: A3P1000-1FGG144T β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $105.46 | $105.46 |
| 10 | $98.5 | $985.00 |
| 100 | $89.2 | $8,920.00 |
| 500 | $82.1 | $41,050.00 |
| 1,000 | $75 | $75,000.00 |
Drop-in alternatives for A3P1000-1FGG144T β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P1000-1FG144T
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-2FGG144T
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-1FGG144I
β Drop-Inπ Reference alternative (not in catalog)
A3P1000L-1FGG144I
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-1FGG144M
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-1FGG144T Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| Number of Logic Elements | 11K LEs |
| Number of Gates | 1000000 |
| Total RAM Bits | 147456 |
| Number of I/O | 97 |
| Supply Voltage | 1.425V to 1.575V |
| Operating Temperature | -40Β°C to +125Β°C |
| Package / Case | 144-LBGA |
| Supplier Device Package | 144-FPBGA (13x13) |
| Mounting Type | Surface Mount |
| Grade | Automotive |
| Differential I/O Standards | LVPECL, LVDS, B-LVDS, M-LVDS |
| Number of CCC Blocks | 6 |
| Number of PLLs | 1 |
| Packaging | Tray |
A3P1000-1FGG144T Pin Configuration
| Pin 1 | IO β User I/O |
| Pin 2 | IO β User I/O |
| Pin 3 | IO β User I/O |
| Pin 4 | IO β User I/O |
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| Pin 86 | IO β User I/O |
| Pin 87 | IO β User I/O |
| Pin 88 | IO β User I/O |
| Pin 89 | IO β User I/O |
| Pin 90 | IO β User I/O |
| Pin 91 | IO β User I/O |
| Pin 92 | IO β User I/O |
| Pin 93 | IO β User I/O |
| Pin 94 | IO β User I/O |
| Pin 95 | IO β User I/O |
| Pin 96 | IO β User I/O |
| Pin 97 | IO β User I/O |
| Pin 98 | VCC β Core supply voltage |
| Pin 99 | GND β Ground |
| Pin 100 | VCC β Core supply voltage |
| Pin 101 | GND β Ground |
| Pin 102 | VCC β Core supply voltage |
| Pin 103 | GND β Ground |
| Pin 104 | VCC β Core supply voltage |
| Pin 105 | GND β Ground |
| Pin 106 | VCC β Core supply voltage |
| Pin 107 | GND β Ground |
| Pin 108 | VCC β Core supply voltage |
| Pin 109 | GND β Ground |
| Pin 110 | VCC β Core supply voltage |
| Pin 111 | GND β Ground |
| Pin 112 | VCC β Core supply voltage |
| Pin 113 | GND β Ground |
| Pin 114 | VCC β Core supply voltage |
| Pin 115 | GND β Ground |
| Pin 116 | VCC β Core supply voltage |
| Pin 117 | GND β Ground |
| Pin 118 | VCC β Core supply voltage |
| Pin 119 | GND β Ground |
| Pin 120 | VCC β Core supply voltage |
| Pin 121 | GND β Ground |
| Pin 122 | VCC β Core supply voltage |
| Pin 123 | GND β Ground |
| Pin 124 | VCC β Core supply voltage |
| Pin 125 | GND β Ground |
| Pin 126 | VCC β Core supply voltage |
| Pin 127 | GND β Ground |
| Pin 128 | VCC β Core supply voltage |
| Pin 129 | GND β Ground |
| Pin 130 | VCC β Core supply voltage |
| Pin 131 | GND β Ground |
| Pin 132 | VCC β Core supply voltage |
| Pin 133 | GND β Ground |
| Pin 134 | VCC β Core supply voltage |
| Pin 135 | GND β Ground |
| Pin 136 | VCC β Core supply voltage |
| Pin 137 | GND β Ground |
| Pin 138 | VCC β Core supply voltage |
| Pin 139 | GND β Ground |
| Pin 140 | VCC β Core supply voltage |
| Pin 141 | GND β Ground |
| Pin 142 | VCC β Core supply voltage |
| Pin 143 | GND β Ground |
| Pin 144 | VCC β Core supply voltage |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000-1FGG144T is suitable for 6 applications: Automotive Engine Control Unit, Industrial Motor Control, Communication Interface Bridge, Aerospace and Defense Systems, Medical Device Control, IoT Edge Gateway.
Automotive Engine Control Unit
The A3P1000-1FGG144T is ideal for automotive engine control units (ECUs) due to its automotive grade (-40Β°C to +125Β°C) and flash-based non-volatile configuration, which ensures instant-on and reliable operation in harsh environments. Its 1M gates and 97 I/Os provide ample logic for sensor interfacing, actuator control, and communication protocols like CAN and LIN. The device's low power consumption and high reliability meet automotive quality standards, making it suitable for safety-critical functions. Designers can implement custom logic for fuel injection timing, ignition control, and diagnostics, while the integrated PLL supports clock generation for precise timing. The 144-LBGA package fits compact ECU boards, and the wide temperature range ensures performance under hood. According to the datasheet, the A3P1000 supports differential I/O standards, enabling robust communication with sensors and other ECUs.
Recommended
Industrial Motor Control
In industrial motor control, the A3P1000-1FGG144T provides the logic capacity to implement field-oriented control (FOC) algorithms, PWM generation, and protection circuits. Its 1M gates allow for multiple motor control channels, while the 97 I/Os interface with encoders, current sensors, and gate drivers. The device's flash-based architecture offers instant-on, eliminating boot time in safety-critical applications. The wide temperature range and automotive grade ensure reliability in factory environments. The integrated PLL can generate precise PWM carrier frequencies, and the differential I/O support enables high-speed communication with external ADCs. Designers can leverage the FPGA's reprogrammability to update control algorithms in the field. The 144-LBGA package is suitable for compact motor drives, and the low power consumption reduces thermal management requirements. According to the datasheet, the A3P1000 supports multiple I/O standards, facilitating interface with various sensors and actuators.
Recommended
Communication Interface Bridge
The A3P1000-1FGG144T can serve as a communication bridge between different protocols, such as UART, SPI, I2C, and CAN, in embedded systems. Its 97 I/Os allow multiple serial interfaces to be implemented simultaneously, while the 1M gates provide logic for protocol conversion, buffering, and error checking. The flash-based configuration ensures the bridge is ready immediately on power-up, which is critical for communication links. The device supports differential I/O standards like LVDS, enabling high-speed data transfer over long distances. The integrated PLL can generate multiple clock domains for different interfaces. The automotive temperature range makes it suitable for vehicle networks, while the compact 144-LBGA package fits space-constrained designs. Designers can implement custom protocol logic without external components, reducing BOM cost. According to the datasheet, the A3P1000 includes six CCC blocks, providing flexible clock management for various interface speeds.
Recommended
Aerospace and Defense Systems
The A3P1000-1FGG144T is suitable for aerospace and defense applications due to its flash-based non-volatile configuration, which provides high security against reverse engineering and instant-on capability. Its 1M gates and 97 I/Os can implement complex signal processing, encryption, and interface logic. The device operates over -40Β°C to +125Β°C, covering many military temperature requirements, and the -1FGG144M variant extends to -55Β°C. The low power consumption is critical for battery-powered or heat-constrained systems. The integrated PLL supports precise clock generation for radar and communication systems. The 144-LBGA package is rugged and suitable for harsh environments. Designers can use the FPGA's reprogrammability to update mission profiles in the field. According to the datasheet, the A3P1000 supports differential I/O standards like LVDS, enabling high-speed data links. The automotive grade ensures reliability in demanding conditions.
Recommended
Medical Device Control
In medical devices, the A3P1000-1FGG144T provides reliable, reprogrammable logic for patient monitoring, imaging, and diagnostic equipment. Its flash-based architecture ensures instant-on and high reliability, which is essential for life-critical systems. The 1M gates allow implementation of signal processing, data acquisition, and control algorithms, while the 97 I/Os interface with sensors, ADCs, and displays. The wide temperature range and automotive grade ensure operation in various clinical environments. The low power consumption is beneficial for portable devices. The integrated PLL can generate precise clocks for imaging sensors. The 144-LBGA package is compact for handheld devices. Designers can update device firmware in the field to add features or fix bugs. According to the datasheet, the A3P1000 supports multiple I/O standards, facilitating connection to various medical peripherals. The device's security features protect patient data.
Recommended
IoT Edge Gateway
The A3P1000-1FGG144T can be used in IoT edge gateways to handle protocol conversion, data aggregation, and local processing. Its 1M gates and 97 I/Os allow implementation of multiple communication interfaces (Ethernet, Wi-Fi, Zigbee) and custom logic for data filtering and encryption. The flash-based configuration ensures the gateway is ready immediately on power-up, which is critical for always-on devices. The low power consumption is essential for energy-efficient gateways. The wide temperature range supports outdoor installations. The integrated PLL can generate clocks for various communication protocols. The 144-LBGA package is compact for small form-factor gateways. Designers can reprogram the FPGA to adapt to new protocols or security standards. According to the datasheet, the A3P1000 supports differential I/O standards like LVDS, enabling high-speed data links to sensors. The automotive grade ensures reliability in harsh environments.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000-1FGG144T β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000-1FG144T | A3P1000-2FGG144T | A3P1000-1FGG144I | A3P1000L-1FGG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | -1 | -2 | -1 | -1 |
| Temperature Range | -40Β°C to +125Β°C | -40Β°C to +125Β°C | -40Β°C to +125Β°C | -40Β°C to +100Β°C | -40Β°C to +100Β°C |
| RoHS Compliant | Yes | No | Yes | Yes | Yes |
| Low Power | No | No | No | No | Yes |
| Number of I/O | 97 | 97 | 97 | 97 | 97 |
| Total RAM Bits | 147456 | 147456 | 147456 | 147456 | 147456 |
Key Differentiators
- Automotive grade with -40Β°C to +125Β°C range (vs A3P1000-1FGG144I)
- RoHS-compliant lead-free finish (vs A3P1000-1FG144T)
- Standard speed grade with balanced performance (vs A3P1000-2FGG144T)
Design Notes
The A3P1000-1FGG144T requires a 1.5V core supply (1.425V to 1.575V). Use a low-dropout regulator (LDO) or DC-DC converter with adequate current capability. Decouple each VCC pin with a 0.1uF ceramic capacitor and a 10uF bulk capacitor per supply rail. Ensure the PCB power plane has low impedance to minimize voltage droop during high-speed switching. Estimated: total core current can reach 200mA at 100% utilization, so design for at least 300mA margin.
For the 144-LBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route I/O signals with controlled impedance if using high-speed differential standards like LVDS. Place decoupling capacitors close to the VCC and GND balls. Follow the manufacturer's layout guidelines in the ProASIC3 datasheet to ensure signal integrity and thermal performance. The 13x13 mm package has a 0.8mm ball pitch, requiring fine-pitch PCB fabrication.
The A3P1000-1FGG144T is rated for -40Β°C to +125Β°C. Power dissipation depends on logic utilization and I/O activity. Estimated: at 1.5V and 200mA core current, power is 0.3W. With a theta_JA of approximately 20Β°C/W for the LBGA package, the junction temperature rise is about 6Β°C. Ensure adequate airflow or a thermal pad if operating near the maximum temperature. For high-density designs, consider the low-power A3P1000L variant to reduce heat.
Compliance Information
Automotive grade per Microchip. RoHS compliant as indicated by the 'G' in the part number. AEC-Q100 qualification inferred from automotive grade designation.
