ATSAMA5D27C-D5M-CUR - SAMA5D2 Cortex-A5 MPU 500MHz 512Mb DDR2 | Microchip
Артикул: ATSAMA5D27C-D5M-CUR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $36.5 | $36,50 |
| 10 | $33.2 | $332,00 |
| 100 | $29.8 | $2.980,00 |
| 500 | $26.5 | $13.250,00 |
| 1.000 | $23.1 | $23.100,00 |
ATSAMA5D27C-D5M-CUR Обзор
A microprocessor (MPU) is the central processing unit of an embedded system, capable of running full operating systems such as Linux. The SAMA5D2 family sits within Microchip's hierarchy of ARM Cortex-A application processors, sitting above Cortex-M microcontrollers but below higher-end Cortex-A cores, targeting industrial IoT, gateway, and human-machine interface (HMI) applications.
Key features include an integrated Peripheral Touch Controller, a hardware crypto accelerator supporting AES, SHA, and TRNG, ARM TrustZone security, and an embedded audio subsystem. The integrated 512 Mbit DDR2 memory reduces system BOM cost and PCB complexity, while the 0.8 mm ball pitch further simplifies layout design.
Architecturally, the SAMA5D27C uses a single-issue, in-order ARM Cortex-A5 core with a Memory Management Unit (MMU), hardware floating-point, and a multi-layer AHB bus matrix. Low-power design techniques include an extensive clock-gating network and multiple power domains to support deep-sleep modes for battery-powered applications. The SiP design mitigates signal-integrity risk associated with discrete DRAM integration.
Typical applications include industrial HMI panels, IoT gateways, smart energy meters, building automation controllers, and connected point-of-sale terminals. The combination of ARM TrustZone, secure boot, and hardware crypto accelerators makes the MPU suitable for security-sensitive endpoints.
When designing with this device, ensure the four-layer (or higher) PCB stack-up has matched 50-ohm impedance for the DDR2 interface and that the decoupling network follows Microchip's reference design. Industrial-grade parts (-40C to +85C) require thermal management only at the system enclosure level rather than the chip level.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для ATSAMA5D27C-D5M-CUR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с ATSAMA5D27C-D5M-CUR (тот же форм-фактор и посадочное место) — отличается по Ethernet, Package, USB, Operating Temperature, CAN.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
ATSAMA5D27C-D5M-CU
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$18.4 / шт.
Открыть даташит →ATSAMA5D27C-D1G-CUR
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$12.05 / шт.
Открыть даташит →ATSAMA5D27C-D1G-CU
✅ Прямая замена✓ В наличии
$19.1 / шт.
Открыть даташит →ATSAMA5D27A-CNR
✅ Прямая замена✓ В наличии
$10.95 / шт.
Открыть даташит →ATSAMA5D27B-CUR
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$11.85 / шт.
Открыть даташит →ATSAMA5D27C-D5M-CUR Максимальные параметры и электрические характеристики
| Core Architecture | ARM Cortex-A5 |
| Number of Cores | 1 |
| Разрядность шины данных | 32-bit |
| Максимальная тактовая частота | 500 MHz |
| Integrated Memory | 512 Mbit DDR2 SDRAM (SIP) |
| Operating Voltage Range | 1.14 V to 1.3 V (core) |
| Memory Bus Width | 16-bit |
| Корпус | 289-LFBGA (14x14 mm), 0.8 mm ball pitch |
| Тип монтажа | Surface Mount |
| Диапазон рабочих температур | -40C to +85C (Industrial) |
| Peripheral Touch Controller | Integrated |
| Embedded Audio Subsystem | Integrated |
| Security Features | ARM TrustZone, Secure Boot, Tamper |
| Hardware Crypto Accelerators | AES, SHA, TRNG |
| Статус RoHS | Compliant |
Руководство по цоколевке ATSAMA5D27C-D5M-CUR в корпусе 289-lfbga (14x14 mm), 0.8 mm ball pitch
Цоколевка для ATSAMA5D27C-D5M-CUR (корпус 289-lfbga (14x14 mm), 0.8 mm ball pitch). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для ATSAMA5D27C-D5M-CUR.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
ATSAMA5D27C-D5M-CUR подходит для 6 применениеs: Industrial HMI Touch Panels, IoT Edge Gateways, Smart Energy Meters, Building Automation Controllers, Connected POS Terminals, Industrial Printers and Label Makers.
Industrial HMI Touch Panels
The ATSAMA5D27C-D5M-CUR powers industrial-grade human-machine interface panels where the integrated Peripheral Touch Controller, embedded audio subsystem, and 512 Mbit DDR2 reduce system BOM. The 500 MHz Cortex-A5 core runs Linux with Qt or LVDS graphics stacks, while the integrated DDR2 SiP removes high-speed memory routing constraints that typically challenge 4-layer HMI PCBs. ARM TrustZone and hardware crypto accelerators enable secure access control on factory-floor operator panels.
Рекомендуется
IoT Edge Gateways
For industrial IoT edge gateways, the ATSAMA5D27C-D5M-CUR combines Linux-capable processing with low-power deep-sleep modes and hardware crypto for TLS/VPN termination. The integrated DDR2 SiP supports local buffering of sensor data before cloud upload, while the Cortex-A5 MMU enables full containerized workloads. Its industrial -40C to +85C range fits outdoor enclosure deployments without additional thermal management.
Рекомендуется
Smart Energy Meters
Smart electricity, water, or gas meters benefit from the ATSAMA5D27C-D5M-CUR's ARM TrustZone, secure boot, tamper detection, and hardware AES/SHA crypto for signed meter readings and encrypted communications. The integrated 512 Mbit DDR2 holds metering logs locally, while the Cortex-A5 Linux stack supports DLMS/COSEM or proprietary protocols. Low-power modes extend battery life in wirelessly-connected meter deployments.
Рекомендуется
Building Automation Controllers
Building automation systems using the ATSAMA5D27C-D5M-CUR leverage multiple connectivity peripherals (USB, Ethernet, CAN, UART) to bridge HVAC, lighting, and access-control subsystems. The integrated Peripheral Touch Controller supports room-control keypads, while the audio subsystem enables PA/intercom integration. Linux support for BACnet, KNX, or Modbus stacks is provided via mainline BSP packages from Microchip.
Рекомендуется
Connected POS Terminals
Point-of-sale terminals using the ATSAMA5D27C-D5M-CUR benefit from the hardware crypto accelerators (AES, SHA, TRNG) for PCI-PTS compliant transaction processing and key storage. ARM TrustZone isolates payment code from general Linux workloads, while the integrated DDR2 holds transaction buffers during network outages. The Peripheral Touch Controller drives signature capture and operator displays.
Рекомендуется
Industrial Printers and Label Makers
Industrial printers using the ATSAMA5D27C-D5M-CUR leverage USB host, Ethernet, and high-speed serial interfaces to drive print heads and process label data. The integrated DDR2 SiP simplifies PCB layout, and the Cortex-A5 core handles image rendering, font engines, and barcode algorithms in Linux. ARM TrustZone protects signed firmware updates across long field deployments.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для ATSAMA5D27C-D5M-CUR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | ATSAMA5D27C-D5M-CU | ATSAMA5D27C-D1G-CUR | ATSAMA5D27C-D1G-CU | ATSAMA5D27A-CNR | ATSAMA5D27B-CUR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same |
| Integrated DRAM | 512 Mbit DDR2 | 512 Mbit DDR2 | 1 Gbit DDR2 | 1 Gbit DDR2 | External (no SiP) | External (no SiP) |
| Core Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Silicon Revision | C | C | C | C | A | B |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Ключевые отличия
- Integrated 512 Mbit DDR2 in SiP eliminates external DRAM routing (против ATSAMA5D27A-CNR)
- Same 289-LFBGA pinout as the 1Gb upgrade path ATSAMA5D27C-D1G-CUR (против ATSAMA5D27C-D1G-CUR)
- C silicon revision includes the latest security and low-power optimizations (против ATSAMA5D27A-CNR / ATSAMA5D27B-CUR)
Заметки по проектированию
The 289-LFBGA package has a 0.8 mm ball pitch requiring a 4-layer PCB stack-up with matched 50-ohm impedance on the DDR2 interface. Use Microchip's reference PCB stack-up from the SAMA5D2 evaluation kit as a starting point. Via-in-pad is recommended for the 0.8 mm pitch BGA fanout to maintain signal integrity on the DDR2 clock and DQS nets.
The ATSAMA5D27C-D5M-CUR requires multiple rails: 1.14V to 1.3V core, 1.8V DDR2 supply for the integrated DRAM, and 3.3V for I/O. Decoupling must follow Microchip's reference design with bulk capacitors on each rail and high-frequency ceramic capacitors placed within 100 mil of each BGA ball row. Power sequencing on the core and DDR2 rails is handled internally.
At 500 MHz with typical industrial workloads, junction temperature rise in a 14x14 mm BGA with proper PCB thermal via array stays well below the 85C ambient limit. For sealed enclosures without airflow, follow Microchip's thermal design guide and use at least 4 thermal vias under the central BGA balls, stitched to inner ground planes for heatsinking.
Do not assume the ATSAMA5D27C-D5M-CUR is interchangeable with the non-SIP ATSAMA5D27C-CUR at the PCB level: the SiP variant eliminates the external DDR2 routing but the DRAM power supply rail is still required. Always download the SAMA5D2 SiP-specific BSP for the Linux kernel and device tree, not the generic SAMA5D2 BSP, to ensure proper DRAM initialization.
Информация о соответствии
RoHS compliance confirmed via LCSC and Microchip product pages. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified (industrial, not automotive).
