ATSAMA5D27C-D5M-CUR - SAMA5D2 Cortex-A5 MPU 500MHz 512Mb DDR2 | Microchip
料号： ATSAMA5D27C-D5M-CUR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $36.5 | $36.50 |
| 10 | $33.2 | $332.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.1 | $23,100.00 |
ATSAMA5D27C-D5M-CUR 概述
A microprocessor (MPU) is the central processing unit of an embedded system, capable of running full operating systems such as Linux. The SAMA5D2 family sits within Microchip's hierarchy of ARM Cortex-A application processors, sitting above Cortex-M microcontrollers but below higher-end Cortex-A cores, targeting industrial IoT, gateway, and human-machine interface (HMI) applications.
Key features include an integrated Peripheral Touch Controller, a hardware crypto accelerator supporting AES, SHA, and TRNG, ARM TrustZone security, and an embedded audio subsystem. The integrated 512 Mbit DDR2 memory reduces system BOM cost and PCB complexity, while the 0.8 mm ball pitch further simplifies layout design.
Architecturally, the SAMA5D27C uses a single-issue, in-order ARM Cortex-A5 core with a Memory Management Unit (MMU), hardware floating-point, and a multi-layer AHB bus matrix. Low-power design techniques include an extensive clock-gating network and multiple power domains to support deep-sleep modes for battery-powered applications. The SiP design mitigates signal-integrity risk associated with discrete DRAM integration.
Typical applications include industrial HMI panels, IoT gateways, smart energy meters, building automation controllers, and connected point-of-sale terminals. The combination of ARM TrustZone, secure boot, and hardware crypto accelerators makes the MPU suitable for security-sensitive endpoints.
When designing with this device, ensure the four-layer (or higher) PCB stack-up has matched 50-ohm impedance for the DDR2 interface and that the decoupling network follows Microchip's reference design. Industrial-grade parts (-40C to +85C) require thermal management only at the system enclosure level rather than the chip level.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： ATSAMA5D27C-D5M-CUR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAMA5D27C-D5M-CUR （相同外形与封装尺寸） ——差异在于 Ethernet, Package, USB, Operating Temperature, CAN.
快速对比工具——选择替代料号进行并排对比：
ATSAMA5D27C-D5M-CU
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$18.4 / 个
查看数据手册 →ATSAMA5D27C-D1G-CUR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$12.05 / 个
查看数据手册 →ATSAMA5D27C-D1G-CU
✅ 直接替换✓ 有现货
$19.1 / 个
查看数据手册 →ATSAMA5D27A-CNR
✅ 直接替换✓ 有现货
$10.95 / 个
查看数据手册 →ATSAMA5D27B-CUR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$11.85 / 个
查看数据手册 →ATSAMA5D27C-D5M-CUR 最大额定值与电气特性
| Core Architecture | ARM Cortex-A5 |
| Number of Cores | 1 |
| 数据总线宽度 | 32-bit |
| 最大时钟频率 | 500 MHz |
| Integrated Memory | 512 Mbit DDR2 SDRAM (SIP) |
| Operating Voltage Range | 1.14 V to 1.3 V (core) |
| Memory Bus Width | 16-bit |
| 封装 | 289-LFBGA (14x14 mm), 0.8 mm ball pitch |
| 安装类型 | Surface Mount |
| 工作温度范围 | -40C to +85C (Industrial) |
| Peripheral Touch Controller | Integrated |
| Embedded Audio Subsystem | Integrated |
| Security Features | ARM TrustZone, Secure Boot, Tamper |
| Hardware Crypto Accelerators | AES, SHA, TRNG |
| RoHS 状态 | Compliant |
ATSAMA5D27C-D5M-CUR 289-lfbga (14x14 mm), 0.8 mm ball pitch 引脚配置指南
ATSAMA5D27C-D5M-CUR（289-lfbga (14x14 mm), 0.8 mm ball pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： ATSAMA5D27C-D5M-CUR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
ATSAMA5D27C-D5M-CUR 适用于 6 应用s: Industrial HMI Touch Panels, IoT Edge Gateways, Smart Energy Meters, Building Automation Controllers, Connected POS Terminals, Industrial Printers and Label Makers.
Industrial HMI Touch Panels
The ATSAMA5D27C-D5M-CUR powers industrial-grade human-machine interface panels where the integrated Peripheral Touch Controller, embedded audio subsystem, and 512 Mbit DDR2 reduce system BOM. The 500 MHz Cortex-A5 core runs Linux with Qt or LVDS graphics stacks, while the integrated DDR2 SiP removes high-speed memory routing constraints that typically challenge 4-layer HMI PCBs. ARM TrustZone and hardware crypto accelerators enable secure access control on factory-floor operator panels.
推荐
IoT Edge Gateways
For industrial IoT edge gateways, the ATSAMA5D27C-D5M-CUR combines Linux-capable processing with low-power deep-sleep modes and hardware crypto for TLS/VPN termination. The integrated DDR2 SiP supports local buffering of sensor data before cloud upload, while the Cortex-A5 MMU enables full containerized workloads. Its industrial -40C to +85C range fits outdoor enclosure deployments without additional thermal management.
推荐
Smart Energy Meters
Smart electricity, water, or gas meters benefit from the ATSAMA5D27C-D5M-CUR's ARM TrustZone, secure boot, tamper detection, and hardware AES/SHA crypto for signed meter readings and encrypted communications. The integrated 512 Mbit DDR2 holds metering logs locally, while the Cortex-A5 Linux stack supports DLMS/COSEM or proprietary protocols. Low-power modes extend battery life in wirelessly-connected meter deployments.
推荐
Building Automation Controllers
Building automation systems using the ATSAMA5D27C-D5M-CUR leverage multiple connectivity peripherals (USB, Ethernet, CAN, UART) to bridge HVAC, lighting, and access-control subsystems. The integrated Peripheral Touch Controller supports room-control keypads, while the audio subsystem enables PA/intercom integration. Linux support for BACnet, KNX, or Modbus stacks is provided via mainline BSP packages from Microchip.
推荐
Connected POS Terminals
Point-of-sale terminals using the ATSAMA5D27C-D5M-CUR benefit from the hardware crypto accelerators (AES, SHA, TRNG) for PCI-PTS compliant transaction processing and key storage. ARM TrustZone isolates payment code from general Linux workloads, while the integrated DDR2 holds transaction buffers during network outages. The Peripheral Touch Controller drives signature capture and operator displays.
推荐
Industrial Printers and Label Makers
Industrial printers using the ATSAMA5D27C-D5M-CUR leverage USB host, Ethernet, and high-speed serial interfaces to drive print heads and process label data. The integrated DDR2 SiP simplifies PCB layout, and the Cortex-A5 core handles image rendering, font engines, and barcode algorithms in Linux. ARM TrustZone protects signed firmware updates across long field deployments.
推荐
推荐产品汇总
工程参考数据： ATSAMA5D27C-D5M-CUR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAMA5D27C-D5M-CU | ATSAMA5D27C-D1G-CUR | ATSAMA5D27C-D1G-CU | ATSAMA5D27A-CNR | ATSAMA5D27B-CUR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same |
| Integrated DRAM | 512 Mbit DDR2 | 512 Mbit DDR2 | 1 Gbit DDR2 | 1 Gbit DDR2 | External (no SiP) | External (no SiP) |
| Core Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Silicon Revision | C | C | C | C | A | B |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
关键差异点
- Integrated 512 Mbit DDR2 in SiP eliminates external DRAM routing （对比 ATSAMA5D27A-CNR)
- Same 289-LFBGA pinout as the 1Gb upgrade path ATSAMA5D27C-D1G-CUR （对比 ATSAMA5D27C-D1G-CUR)
- C silicon revision includes the latest security and low-power optimizations （对比 ATSAMA5D27A-CNR / ATSAMA5D27B-CUR)
设计说明
The 289-LFBGA package has a 0.8 mm ball pitch requiring a 4-layer PCB stack-up with matched 50-ohm impedance on the DDR2 interface. Use Microchip's reference PCB stack-up from the SAMA5D2 evaluation kit as a starting point. Via-in-pad is recommended for the 0.8 mm pitch BGA fanout to maintain signal integrity on the DDR2 clock and DQS nets.
The ATSAMA5D27C-D5M-CUR requires multiple rails: 1.14V to 1.3V core, 1.8V DDR2 supply for the integrated DRAM, and 3.3V for I/O. Decoupling must follow Microchip's reference design with bulk capacitors on each rail and high-frequency ceramic capacitors placed within 100 mil of each BGA ball row. Power sequencing on the core and DDR2 rails is handled internally.
At 500 MHz with typical industrial workloads, junction temperature rise in a 14x14 mm BGA with proper PCB thermal via array stays well below the 85C ambient limit. For sealed enclosures without airflow, follow Microchip's thermal design guide and use at least 4 thermal vias under the central BGA balls, stitched to inner ground planes for heatsinking.
Do not assume the ATSAMA5D27C-D5M-CUR is interchangeable with the non-SIP ATSAMA5D27C-CUR at the PCB level: the SiP variant eliminates the external DDR2 routing but the DRAM power supply rail is still required. Always download the SAMA5D2 SiP-specific BSP for the Linux kernel and device tree, not the generic SAMA5D2 BSP, to ensure proper DRAM initialization.
合规信息
RoHS compliance confirmed via LCSC and Microchip product pages. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified (industrial, not automotive).
