ATSAME53J18A-MFT - 120MHz ARM M4F MCU 256KB Flash | Microchip
Артикул: ATSAME53J18A-MFT ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.28 | $102,80 |
| 100 | $9.12 | $912,00 |
| 500 | $8.21 | $4.105,00 |
| 1.000 | $7.45 | $7.450,00 |
ATSAME53J18A-MFT Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O into one package. The Cortex-M4F is an ARM processor core specifically designed for embedded deterministic real-time control, adding a single-precision IEEE-754 Floating Point Unit and DSP extensions. Within the product hierarchy, this part is classified as a microcontroller -> embedded processor -> integrated circuit -> semiconductor device. The SAM E53 family sits between the smaller SAM D5x series and the larger SAM E5x Cortex-M4 with Ethernet family, offering an optimized balance of Flash, SRAM, and connectivity peripherals.
Key features include 120 MHz core speed with FPU, 256 KB dual-panel Flash with ECC, 256 KB SRAM with ECC, a 10/100 Ethernet MAC, a high-speed USB 2.0 Full-Speed device/host, a 12-bit 1 Msps ADC, a 12-bit DAC, and multiple SERCOM interfaces. The device also integrates a cryptographic engine (TRNG, AES), a segmented LCD controller, and a Peripheral Touch Controller (PTC) for capacitive touch sensing.
The ATSAME53J18A-MFT uses a Harvard-bus Cortex-M4F architecture with single-cycle multiplication and hardware divide, paired with a 4-channel Direct Memory Access controller and a 12-channel Event System for low-latency inter-peripheral signaling without CPU intervention. The integrated SleepWalking peripherals and multiple low-power modes (Idle, Standby, Backup, Off) enable energy-aware designs suitable for battery-powered edge nodes.
Typical applications include industrial IoT gateways with Ethernet, USB-connected Human-Machine Interface (HMI) panels, automotive body and infotainment subsystems, building automation controllers, and consumer audio devices requiring DSP and floating-point math. The combination of Ethernet, USB, and PTC is uniquely suited to connected-touch human-interface products.
When designing with this device, ensure the 64-pin QFN exposed pad is soldered to a sufficient copper pour for thermal dissipation, because at 120 MHz with all peripherals active the part can dissipate meaningful power. Decouple VDDIO and VDDIN with 100 nF X7R capacitors placed within 3 mm of each pin pair.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, optimized for engineers evaluating the ATSAME53J18A-MFT against same-package and same-family Cortex-M4F replacements.
Аналоги без доработки для ATSAME53J18A-MFT — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с ATSAME53J18A-MFT (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, ADC, USB, SRAM.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
ATSAME53J19A-MFT
✅ Прямая замена✓ В наличии
$6.45 / шт.
Открыть даташит →ATSAME53J20A-MFT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
ATSAME53J18A-MF
✅ Прямая замена✓ В наличии
$5.4 / шт.
Открыть даташит →ATSAME53N20A-AFT
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
ATSAMD51J18A-MFT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
ATSAME51J18A-MFT
✅ Прямая замена✓ В наличии
$4.15 / шт.
ATSAME53J18A-MFT Максимальные параметры и электрические характеристики
| Core Architecture | ARM Cortex-M4F with FPU |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 256 KB with ECC |
| SRAM | 256 KB with ECC |
| Корпус | 64-pin QFN (9x9 mm) with exposed pad |
| Operating Voltage (VDDIN) | 3.3 V typical |
| Рабочая температура | -40C to +125C (extended industrial) |
| Ethernet | 10/100 MAC (GMII/RMII interface, external PHY required) |
| USB | USB 2.0 Full-Speed Device and Host |
| ADC | 12-bit, up to 16 channels, 1 Msps |
| DAC | 12-bit, 2 channels |
| SERCOM | 8x SERCOM (configurable UART/SPI/I2C) |
| PTC (Touch Controller) | Yes, Peripheral Touch Controller |
| Cryptographic Engine | AES, TRNG, Integrity Check Module (ICM) |
| DMA Channels | 32 channels |
| Статус RoHS | Compliant |
| Тип монтажа | Surface Mount |
| Уровень MSL | 3 (168 hours) |
| Supply Form | Tape & Reel (-MFT suffix) |
Конфигурация выводов ATSAME53J18A-MFT
| Контакт 1 | PB00 — GPIO PB00 / EIC INT0 |
| Контакт 2 | PB01 — GPIO PB01 / EIC INT1 |
| Контакт 3 | PB02 — GPIO PB02 / SERCOM5 PAD2 / TC4 WO0 |
| Контакт 4 | PB03 — GPIO PB03 / SERCOM5 PAD3 / TC4 WO1 |
| Контакт 5 | VDDIO — Digital I/O supply (3.3 V) |
| Контакт 6 | GND — Ground reference |
| Контакт 7 | PA00 — GPIO PA00 / SERCOM1 PAD0 / TCC2 WO0 |
| Контакт 8 | PA01 — GPIO PA01 / SERCOM1 PAD1 / TCC2 WO1 |
| Контакт 9 | PA02 — GPIO PA02 / SERCOM0 PAD0 / ADC AIN0 |
| Контакт 10 | PA03 — GPIO PA03 / SERCOM0 PAD1 / ADC AIN1 |
| Контакт 11 | PA04 — GPIO PA04 / SERCOM0 PAD2 / VREF |
| Контакт 12 | PA05 — GPIO PA05 / SERCOM0 PAD3 / ADC AIN5 |
| Контакт 13 | PA06 — GPIO PA06 / SERCOM0 PAD2 / ADC AIN6 |
| Контакт 14 | PA07 — GPIO PA07 / SERCOM0 PAD3 / ADC AIN7 |
| Контакт 15 | VDDIN — Main voltage regulator input (3.3 V) |
| Контакт 16 | GND — Ground reference |
| Контакт 17 | PA08 — GPIO PA08 / SERCOM2 PAD0 / I2S MCK0 |
| Контакт 18 | PA09 — GPIO PA09 / SERCOM2 PAD1 / I2S FS0 |
| Контакт 19 | PA10 — GPIO PA10 / SERCOM2 PAD2 / I2S SCK0 |
| Контакт 20 | PA11 — GPIO PA11 / SERCOM2 PAD3 / I2S SDO |
| Контакт 21 | GND — Ground reference |
| Контакт 22 | VDDIO — Digital I/O supply (3.3 V) |
| Контакт 23 | PA12 — GPIO PA12 / SERCOM4 PAD0 |
| Контакт 24 | PA13 — GPIO PA13 / SERCOM4 PAD1 / USB SOF 1kHz |
| Контакт 25 | PA14 — GPIO PA14 / SERCOM4 PAD2 / TC3 WO0 |
| Контакт 26 | PA15 — GPIO PA15 / SERCOM4 PAD3 / TC3 WO1 |
| Контакт 27 | PA16 — GPIO PA16 / SERCOM1 PAD0 / I2S SDI |
| Контакт 28 | PA17 — GPIO PA17 / SERCOM1 PAD1 |
| Контакт 29 | PA18 — GPIO PA18 / SERCOM3 PAD2 / TC0 WO0 |
| Контакт 30 | PA19 — GPIO PA19 / SERCOM3 PAD3 / TC0 WO1 |
| Контакт 31 | PA20 — GPIO PA20 / SERCOM5 PAD2 / TC1 WO0 |
| Контакт 32 | PA21 — GPIO PA21 / SERCOM5 PAD3 / TC1 WO1 |
| Контакт 33 | PA22 — GPIO PA22 / SERCOM3 PAD0 |
| Контакт 34 | PA23 — GPIO PA23 / SERCOM3 PAD1 / USB DM |
| Контакт 35 | PA24 — GPIO PA24 / USB DP |
| Контакт 36 | PA25 — GPIO PA25 / SERCOM1 PAD3 / GMII/RMII CRS_DV |
| Контакт 37 | GND — Ground reference |
| Контакт 38 | PA27 — GPIO PA27 / GMII/RMII RXER |
| Контакт 39 | PA28 — GPIO PA28 / GMII/RMII MDC |
| Контакт 40 | PA29 — GPIO PA29 / GMII/RMII MDIO |
| Контакт 41 | PA30 — GPIO PA30 / SWCLK (programming/debug) |
| Контакт 42 | PA31 — GPIO PA31 / SWDIO (programming/debug) |
| Контакт 43 | PB04 — GPIO PB04 / SERCOM3 PAD2 / TC5 WO0 |
| Контакт 44 | PB05 — GPIO PB05 / SERCOM3 PAD3 / TC5 WO1 |
| Контакт 45 | PB06 — GPIO PB06 / SERCOM4 PAD2 / TC6 WO0 |
| Контакт 46 | PB07 — GPIO PB07 / SERCOM4 PAD3 / TC6 WO1 |
| Контакт 47 | PB08 — GPIO PB08 / SERCOM4 PAD0 |
| Контакт 48 | PB09 — GPIO PB09 / SERCOM4 PAD1 |
| Контакт 49 | PB10 — GPIO PB10 / SERCOM4 PAD2 / TC0 WO0 |
| Контакт 50 | PB11 — GPIO PB11 / SERCOM4 PAD3 / TC0 WO1 |
| Контакт 51 | PB12 — GPIO PB12 / SERCOM4 PAD0 / TCC3 WO0 |
| Контакт 52 | PB13 — GPIO PB13 / SERCOM4 PAD1 / TCC3 WO1 |
| Контакт 53 | PB14 — GPIO PB14 / SERCOM4 PAD2 / TCC4 WO0 |
| Контакт 54 | PB15 — GPIO PB15 / SERCOM4 PAD3 / TCC4 WO1 |
| Контакт 55 | PB16 — GPIO PB16 / SERCOM5 PAD0 / TCC0 WO0 |
| Контакт 56 | PB17 — GPIO PB17 / SERCOM5 PAD1 / TCC0 WO1 |
| Контакт 57 | PB18 — GPIO PB18 / SERCOM3 PAD2 / TC7 WO0 |
| Контакт 58 | PB19 — GPIO PB19 / SERCOM3 PAD3 / TC7 WO1 |
| Контакт 59 | PB20 — GPIO PB20 / SERCOM3 PAD0 / SERCOM7 PAD0 |
| Контакт 60 | PB21 — GPIO PB21 / SERCOM3 PAD1 / SERCOM7 PAD1 |
| Контакт 61 | VDDIO — Digital I/O supply (3.3 V) |
| Контакт 62 | GND — Ground reference |
| Контакт 63 | XIN — Crystal oscillator input |
| Контакт 64 | XOUT — Crystal oscillator output |
Типичное применение
ATSAME53J18A-MFT подходит для 6 применениеs: Industrial IoT Gateway with Ethernet, USB-Connected Human-Machine Interface (HMI), Automotive Body and Infotainment Subsystem, Building Automation Controller, Audio Processing and DSP Front-End, Edge Sensor Node with Local Analytics.
Industrial IoT Gateway with Ethernet
The ATSAME53J18A-MFT fits industrial IoT gateway designs because it integrates a 10/100 Ethernet MAC alongside a 120 MHz Cortex-M4F core and 256 KB Flash. The MAC connects to an external PHY (such as the Microchip KSZ8081) via RMII for a complete TCP/IP node, while the Cortex-M4F runs an embedded IP stack (e.g., lwIP or MPLAB Harmony Net) with deterministic response times. 256 KB Flash holds the TCP/IP stack plus MQTT client and OTA update agent, while 256 KB SRAM supports TLS buffers without external memory. The extended industrial temperature range (-40C to +125C) and integrated crypto engine (AES, TRNG) make the part suited for secured remote telemetry units deployed on factory floors.
Рекомендуется
USB-Connected Human-Machine Interface (HMI)
The ATSAME53J18A-MFT suits USB-connected HMI panels that need a touch interface and a wired host connection. The integrated USB 2.0 Full-Speed device port enumerates as HID or CDC class without an external bridge, while the Peripheral Touch Controller (PTC) drives capacitive buttons or sliders via the Driven Shield Plus feature for noise immunity. The Cortex-M4F with FPU accelerates touch gesture recognition and on-screen UI animation. 256 KB Flash fits a lightweight graphics library such as LVGL, while the 12-bit DAC drives audio feedback for keypress confirmation.
Рекомендуется
Automotive Body and Infotainment Subsystem
The ATSAME53J18A-MFT operates across the extended industrial temperature range required by automotive cabin electronics, such as HVAC controllers, lighting modules, and infotainment secondary displays. The Cortex-M4F + FPU handles audio decoding and CAN/LIN bridging via the SERCOM-configurable UART peripherals. 256 KB Flash is sufficient for audio post-processing algorithms and vehicle network stacks. The PTC enables capacitive touch keys and sliders that replace mechanical buttons on the dashboard. Pair the MCU with an external CAN transceiver such as the MCP2562FD for CAN FD connectivity.
Рекомендуется
Building Automation Controller
The ATSAME53J18A-MFT fits building automation controllers (BACnet, Modbus, KNX gateways) because of its Ethernet MAC and rich serial peripherals. The Cortex-M4F at 120 MHz runs the BACnet/IP stack with deterministic message handling, while the 8 SERCOM interfaces each map to UART, SPI, or I2C for sensor and actuator buses. The integrated PTC supports glass-touch panels for room controllers, and the AES hardware accelerator secures wireless commissioning links. The QFN-64 footprint keeps the controller board compact for in-wall box mounting.
Рекомендуется
Audio Processing and DSP Front-End
The ATSAME53J18A-MFT is well-suited as a digital audio front-end because the Cortex-M4F with single-precision FPU and DSP extensions can run biquad filters, limiters, and basic room-correction algorithms at low latency. The dual 12-bit DACs (1 Msps) output differential audio while the 12-bit ADC captures line-level inputs. The 256 KB SRAM holds audio sample buffers for up to 23 ms at 48 kHz / 32-bit float without external memory. The SERCOM peripherals drive I2S to an external codec if higher fidelity is required.
Рекомендуется
Edge Sensor Node with Local Analytics
The ATSAME53J18A-MFT runs edge analytics on sensor streams at 120 MHz with floating-point precision, eliminating cloud round-trips for simple anomaly detection. The 12-bit 1 Msps ADC samples vibration, temperature, or pressure transducers; SERCOM interfaces drive I2C sensors and SPI displays. The Event System and DMA offload data movement so the CPU stays in low-power Idle between samples, while SleepWalking peripherals monitor thresholds autonomously. The integrated TRNG provides entropy for secure local device identity provisioning.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для ATSAME53J18A-MFT — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | ATSAME53J19A-MFT | ATSAME53J20A-MFT | ATSAMD51J18A-MFT | ATSAME51J18A-MFT | ATSAME53J18A-MF |
|---|---|---|---|---|---|---|
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 256 KB | 512 KB | 1 MB | 256 KB | 256 KB | 256 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | No | No | Yes (10/100) |
| USB | USB 2.0 FS Device+Host | USB 2.0 FS Device+Host | USB 2.0 FS Device+Host | USB 2.0 FS Device+Host | USB 2.0 FS Device+Host | USB 2.0 FS Device+Host |
| Touch (PTC) | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Supply Form | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
Ключевые отличия
- Pin-compatible higher Flash density drop-ins exist within the SAM E53 family (против ATSAME53J19A-MFT)
- Same-package option exists with no Ethernet MAC for cost-sensitive designs (против ATSAME51J18A-MFT)
- Peripheral Touch Controller (PTC) is integrated without an external IC (против STM32F407VGT6)
- Cryptographic engine (AES, TRNG, ICM) is included on-die (против ATSAME53J18A-MF (same silicon))
Заметки по проектированию
The ATSAME53J18A-MFT in a 64-pin QFN relies on the exposed thermal pad (EP) for heat removal. Estimated: at 120 MHz with all peripherals active and 3.3 V supply, the core current consumption is approximately 18 mA (VDDCORE) plus peripheral I/O. With the EP soldered to a 1 sq in copper pour on a 4-layer 1 oz PCB, theta_JA is approximately 30 C/W. At room temperature ambient, the junction rises roughly 2-3 C above ambient under typical loads - well within the 125 C limit. For continuously hot ambient (>85 C), expand the EP copper to 2 sq in.
Decoupling is critical for Cortex-M4F designs at 120 MHz. Place one 100 nF X7R 0402 ceramic capacitor within 3 mm of every VDDIN and VDDIO pin pair, plus one 10 uF X5R bulk capacitor on each supply rail within 10 mm of the IC. The exposed thermal pad must be soldered to a continuous ground pour with at least 8 thermal vias (0.3 mm drill) for low-impedance ground return. Keep the 12 MHz high-speed crystal traces under 5 mm and surrounded by a ground guard ring to suppress radiated EMI.
Do not skip configuration of the NVMCTRL auxiliary bits (BOOTPROT, WDT) before locking the Flash region - locked bits cannot be undone in-circuit. Do not rely on the internal 48 MHz DFLL for USB Full-Speed communication; switch to the 12 MHz crystal + PLL96 configuration to meet the USB 0.25% clock accuracy requirement. When using the Ethernet MAC, the external PHY must share the same 50 MHz RMII reference clock as the MCU; clock skew greater than 4 ns causes CRC errors under load.
Route the USB DP/DM pair (PA24/PA25) as a 90-ohm differential pair with no stubs, length-matched within 150 mil. Route the Ethernet RMII signals (PA23 through PA30) as impedance-controlled 50-ohm single-ended traces, length-matched within 200 mil of the MII clock. Keep PTC capacitive touch traces short (under 50 mm) and surrounded by ground pour, since stray capacitance reduces touch sensitivity. Avoid routing high-frequency signals under the crystal or its loading capacitors.
Информация о соответствии
RoHS and REACH compliant per Microchip product page; lead-free finish with matte tin plating. Not AEC-Q100 qualified - for automotive AEC-Q100 designs, use ATSAMx53 variants with the -AUT or -MFT-VO suffix. Halogen-free per IPC-4101B. Conflict minerals declaration per Section 1502 Dodd-Frank.
