Infineon

BGA7L1N6E6327XTSA1 - 728-960MHz LTE LNA, 0.9dB NF | Infineon

Артикул: BGA7L1N6E6327XTSA1 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.5 V to 3.3 V Vdss 4.4 mA (typical) Id TSNP-6-2 (PG-TSNP-6-2), 0.7 mm x 1.1 mm Package 728 MHz to 960 MHz Speed
От $0.42 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-13
Оптовые цены
Кол-во Цена за ед. Итого
1 $0.95 $0,95
10 $0.86 $8,60
100 $0.74 $74,00
1.000 $0.58 $580,00
5.000 $0.49 $2.450,00
15.000 $0.42 $6.300,00
ℹ️ Все цены указаны в USD

BGA7L1N6E6327XTSA1 Обзор

The Infineon BGA7L1N6E6327XTSA1 is a Silicon Germanium (SiGe) Low Noise Amplifier (LNA) monolithic microwave integrated circuit (MMIC) designed for LTE receiver front-ends covering the 728 MHz to 960 MHz bands (Band 5, Band 8, Band 12, Band 13, Band 17, Band 20 and similar low-band LTE allocations). It integrates a digital on/off switch with 1 V logic high-level threshold, integrates input/output matching networks, and offers an insertion power gain of 13.3 dB while drawing only 4.4 mA from a 1.5 V to 3.3 V supply.

An LNA (Low Noise Amplifier) is the first active gain stage in a wireless receiver chain, placed immediately after the antenna and band-select filter. Its function is to amplify extremely weak radio signals captured at the antenna while adding as little noise of its own as possible, thereby setting the receiver's noise floor and overall sensitivity. The BGA7L1N6E6327XTSA1 belongs to the LNA family -> RF amplifier -> RF front-end IC -> wireless transceiver component chain. Its 0.90 dB noise figure directly determines the signal-to-noise ratio at the input of the downstream mixer.

Key differentiating features include a sub-1 dB noise figure of 0.90 dB, 13.3 dB insertion power gain across the operating band, an integrated power-on switch controllable from a 1 V logic GPIO, and a current consumption of 4.4 mA typical. The integrated 50 ohm input and output matching eliminates the need for external discrete matching components, reducing PCB footprint, BOM cost, and design cycle time in mass-market smartphone designs.

Technically the device uses Infineon's high-frequency SiGe:C process technology, which combines low-noise bipolar HBT (heterojunction bipolar transistor) devices with CMOS control logic on the same die. The internal bias network maintains the LNA's noise figure and linearity across supply, temperature and process variations. The on-chip logic-controlled enable pin allows the LNA to be powered down completely during transmit slots in TDD-LTE systems, saving system current.

Typical applications include LTE smartphone and tablet receiver front-ends, cellular IoT modules, 4G USB dongles and mobile hotspots, and diversity antenna chains where two LNAs share a single antenna filter. The device's small TSNP-6-2 leadless package (footprint 0.7 mm x 1.1 mm) enables placement directly adjacent to the antenna switch module.

When designing with this LNA, route the RF input and output traces as 50 ohm controlled-impedance microstrip or coplanar waveguide directly from the package pads to minimise parasitic inductance. Place the supply decoupling capacitor within 1 mm of the VCC pin to suppress noise injection from the DC bus. The 1 V logic-high EN input allows direct connection to modern baseband or PMIC GPIOs without level shifters.

Аналоги без доработки для BGA7L1N6E6327XTSA1 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с BGA7L1N6E6327XTSA1 (тот же форм-фактор и посадочное место) — отличается по Control Logic, Insertion Power Gain, Package.

Infineon
Control Logic: Digital on/off switch, 1 V logic level
Insertion Power Gain: 13.3 dB
Package: TSNP-6-2 (leadless)
Сравнить с BGA7L1N6E6327XTSA1 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

BGA7L1BN6E6327XTSA1

✅ Прямая замена
📦 TSNP-6-2
same TSNP-6-2 footprint, 716-960 MHz vs 728-960 MHz (-12 MHz low edge), otherwise identical

📋 Справочный аналог (нет в каталоге)

BGA7L1N6

✅ Прямая замена
📦 TSNP-6-2
base part number without -E6327XTSA1 reel code suffix, same die and TSNP-6-2 footprint

📋 Справочный аналог (нет в каталоге)

BGA7H1N6

✅ Прямая замена
📦 TSNP-6-2
high-band variant for 1710-2690 MHz, same package/pinout - NOT a drop-in substitute (different frequency band, only pin-compatible)

📋 Справочный аналог (нет в каталоге)

BGA7L1N6E6327XTSA1 Максимальные параметры и электрические характеристики

Manufacturer Infineon Technologies
Part Number BGA7L1N6E6327XTSA1
Функция RF Low Noise Amplifier (LNA) MMIC
Technology Silicon Germanium (SiGe)
Frequency Range 728 MHz to 960 MHz
Insertion Power Gain 13.3 dB (typical)
Noise Figure 0.90 dB (typical)
Напряжение питания 1.5 V to 3.3 V
Ток потребления 4.4 mA (typical)
Control Logic Digital on/off switch, 1 V logic-high enable
Input/Output Impedance Internally matched to 50 ohm
Корпус TSNP-6-2 (PG-TSNP-6-2), 0.7 mm x 1.1 mm
Рабочая температура -40 C to +85 C
Тип монтажа Surface Mount
Standard Pack Quantity 15,000 (reel)
Статус RoHS Compliant
Target Application LTE low-band (700/800/900 MHz) receiver front-end

Руководство по цоколевке BGA7L1N6E6327XTSA1 в корпусе tsnp-6-2 (pg-tsnp-6-2), 0.7 mm x 1.1 mm

Цоколевка для BGA7L1N6E6327XTSA1 (корпус tsnp-6-2 (pg-tsnp-6-2), 0.7 mm x 1.1 mm). Этот аналоговый компонент имеет выводы входа, выхода и питания. Обратитесь к техническому описанию производителя для конфигураций выводов балансировки нуля, коррекции и разрешения. Идеально подходит для схем обработки сигналов и усилителей.

Схема цоколевки корпуса tsnp-6-2 (pg-tsnp-6-2), 0.7 mm x 1.1 mm для BGA7L1N6E6327XTSA1

Нет подробных данных о распиновке для BGA7L1N6E6327XTSA1.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

BGA7L1N6E6327XTSA1 подходит для 6 применениеs: LTE Smartphone Receiver Front-End, Cellular IoT and M2M Modules, 4G USB Dongles and Mobile Hotspots, Diversity Antenna Chains, Industrial LTE Gateways and Routers, Cellular Signal Boosters and Repeaters.

📱

LTE Smartphone Receiver Front-End

The BGA7L1N6E6327XTSA1 is purpose-built for the low-band LTE receiver path in 4G smartphones and feature phones. Its 0.90 dB noise figure is the dominant contribution to the receiver noise floor at 700-900 MHz and directly determines cell-edge data throughput. The 13.3 dB gain raises the antenna signal above the noise floor of the downstream SAW filter and mixer, while the integrated 50 ohm matching eliminates the discrete inductor/capacitor network normally required, freeing PCB area near the antenna switch module. With 4.4 mA quiescent current and a 1 V logic-high enable pin that allows direct connection to a baseband GPIO, the part supports aggressive power gating during TDD-LTE transmit slots, helping manufacturers hit stringent smartphone battery-life targets.

🧩

Cellular IoT and M2M Modules

For LTE Cat-1, Cat-M1 and NB-IoT modules used in smart meters, asset trackers and industrial sensors, the BGA7L1N6E6327XTSA1 provides the sub-1 dB noise figure required to maintain link margin in weak-signal deployments. Its 0.7 mm x 1.1 mm TSNP-6-2 footprint suits the dense layouts typical of small IoT PCBs, and the 1.5 V to 3.3 V supply range allows direct connection to common Li-ion or USB-derived rails. The 4.4 mA quiescent current is acceptable for most battery-powered IoT duty cycles, and the digital enable pin enables aggressive duty-cycling so the average drain drops well below 1 mA when the receiver is off between page cycles.

📶

4G USB Dongles and Mobile Hotspots

Portable 4G USB dongles and Mi-Fi hotspots integrate an antenna, LTE transceiver, PMIC and the BGA7L1N6E6327XTSA1 as the first active receiver stage. The LNA's 13.3 dB gain across 728-960 MHz compensates for the lossy integrated antenna typical in USB form factors, while the 0.90 dB NF ensures that the dongle maintains a usable link at the cell edge. With the entire 700/800/900 MHz band covered in a single part, designers avoid stocking two or three band-specific LNA variants, simplifying the BOM and reducing inventory cost. The integrated matching keeps the dongle PCB to a single high-density layer.

🌐

Diversity Antenna Chains

Modern LTE smartphones use a primary and a diversity antenna to improve downlink throughput via MIMO. The BGA7L1N6E6327XTSA1 is well-suited for the secondary (diversity) receive path where two LNAs share the same antenna switch network. Its small TSNP-6-2 footprint allows two parts to be placed within millimetres of each other on the diversity antenna feed, minimising trace length and preserving noise figure. Because both LNAs typically operate simultaneously, the 4.4 mA per-channel current must be budgeted against the phone's thermal envelope, but the digital power-down pin allows one chain to be disabled during low-throughput states.

🏭

Industrial LTE Gateways and Routers

Industrial 4G routers, telematics gateways and remote monitoring terminals use the BGA7L1N6E6327XTSA1 to provide reliable low-band LTE connectivity in factories, vehicles and remote installations. The -40 C to +85 C industrial temperature rating allows deployment in uncontrolled environments such as outdoor cabinets, while the 0.90 dB noise figure ensures robust links in weak-signal industrial locations like basements, mines and rural sites. The integrated 50 ohm matching simplifies the RF layout, helping engineers meet EMI/EMC standards without external matching network resonances that could cause certification failures.

📡

Cellular Signal Boosters and Repeaters

Indoor cellular repeaters and signal boosters that re-broadcast the operator's low-band LTE signal within a building use the BGA7L1N6E6327XTSA1 in the donor-antenna receive path. The sub-1 dB NF is critical here because the booster must not degrade the already weak outdoor signal it is trying to amplify. The 13.3 dB gain provides headroom before the downstream SAW filter, and the integrated matching simplifies the donor-antenna filter network design. The digital enable pin allows the booster to power down the LNA during commissioning, easing alignment and reducing standby power in green-building-compliant products.

Сводка рекомендуемых товаров

BGSA14GN10 Antenna switch module companion Используется в: LTE Smartphone Receiver Front-End SAWEN1001 SAW filter for 728-960 MHz band selection Используется в: LTE Smartphone Receiver Front-End BGM113A256V2 Bluetooth module for companion connectivity Используется в: Cellular IoT and M2M Modules TXS0108EPWR Texas Instruments Используется в: Cellular IoT and M2M Modules BGSA12UGLA Antenna tuner companion IC Используется в: 4G USB Dongles and Mobile Hotspots MAX77752 PMIC for USB-powered dongle Используется в: 4G USB Dongles and Mobile Hotspots BGSF14DM20 Diversity antenna switch Используется в: Diversity Antenna Chains BGM11S22F256GA Companion BLE for antenna tuning feedback Используется в: Diversity Antenna Chains MAX22502E Industrial RS-485 companion transceiver Используется в: Industrial LTE Gateways and Routers TPS62932DRLF Wide-Vin buck converter for industrial rail Используется в: Industrial LTE Gateways and Routers ADL5205 Variable-gain amplifier for repeater AGC Используется в: Cellular Signal Boosters and Repeaters HMC1118 5-bit digital attenuator for gain control Используется в: Cellular Signal Boosters and Repeaters
What is the operating frequency range of the BGA7L1N6E6327XTSA1?
The BGA7L1N6E6327XTSA1 operates from 728 MHz to 960 MHz, covering the LTE low-band spectrum that includes Bands 5, 8, 12, 13, 17 and 20. According to Infineon marketing materials, this part is purpose-built for the receive path of 4G smartphones, tablets and cellular IoT modules operating in those sub-1 GHz allocations. The amplifier's 13.3 dB gain is flat across this range, eliminating the need for band-specific tuning.
What is the noise figure of the BGA7L1N6E6327XTSA1?
The BGA7L1N6E6327XTSA1 delivers a typical noise figure of 0.90 dB across its 728 MHz to 960 MHz operating range. A sub-1 dB NF is critical for LTE low-band receivers because the antenna signals at 700-900 MHz are extremely weak and any noise added by the LNA cannot be removed later. Infineon achieves this with a Silicon Germanium process that combines low HBT noise with integrated 50 ohm matching.
Where can I buy the BGA7L1N6E6327XTSA1 online?
The BGA7L1N6E6327XTSA1 can be purchased directly from authorized distributors including DigiKey (sku 5959861), Mouser, Arrow, Octopart-listed resellers and stockists such as Precision Logic and PCB Electronics. Pricing as of 2026-10-13 starts at approximately USD 0.95 per unit at qty 1, dropping to USD 0.42 at full reel quantities of 15,000 pieces.
What is the current lead time for the BGA7L1N6E6327XTSA1?
DigiKey lists the BGA7L1N6E6327XTSA1 as 'ships today' for in-stock reels as of 2026-10-13. For bulk orders above 15,000 pieces (a full reel) the typical factory lead time is 8-14 weeks when the part is ordered directly from Infineon. The part is currently in active production status, so volume orders are not constrained by allocation.
Is the BGA7L1N6E6327XTSA1 in stock?
Yes, the BGA7L1N6E6327XTSA1 is widely in stock at major distributors as of 2026-10-13. DigiKey, Mouser and Arrow all list inventory with same-day shipping for small quantities. The full reel quantity is 15,000 pieces, so distributors carry both cut-tape and full-reel stock for prototype and production volumes.
What is the difference between BGA7L1N6E6327XTSA1 and BGA7L1BN6E6327XTSA1?
Both parts are Infineon LTE LNAs in the TSNP-6-2 package, but the BGA7L1N6 covers 728 MHz to 960 MHz whereas the BGA7L1BN6 covers 716 MHz to 960 MHz (DigiKey sku 7324144). The two parts share identical package pinout, supply voltage (1.5 V to 3.3 V) and current consumption (4.4 mA), making them near-drop-in substitutes. Choose BGA7L1BN6 if your carrier plan includes 700 MHz Band 12/13/17 spectrum below 728 MHz.
BGA7L1N6E6327XTSA1 vs BGA7027,135 - which is better for LTE low-band?
The BGA7L1N6E6327XTSA1 and BGA7027,135 are both Infineon LTE LNAs but target different bands. The BGA7L1N6 covers 728-960 MHz (low-band), while the BGA7027 is a higher-frequency variant. For a low-band-only LTE receiver covering Bands 5/8/20, the BGA7L1N6 is the better fit; for mid-band or high-band designs, the BGA7027 is the appropriate selection. They are not interchangeable.
What is the best drop-in replacement for the BGA7L1N6E6327XTSA1?
The closest drop-in replacement for the BGA7L1N6E6327XTSA1 is the BGA7L1BN6E6327XTSA1 from the same Infineon family - it shares the TSNPG-6-2 footprint, 1.5 V to 3.3 V supply and 4.4 mA current, while extending the lower band edge to 716 MHz. For designs that do not need coverage below 728 MHz the two are functionally interchangeable, but for true pin-and-parametric equivalence within the 728-960 MHz range the original part has no exact equal.
Where to download the BGA7L1N6E6327XTSA1 datasheet PDF?
The official Infineon datasheet PDF for the BGA7L1N6E6327XTSA1 can be downloaded from distributor datasheet portals including datasheets.com (datasheets.com/infineon/bga7l1n6e6327xtsa1/datasheet.pdf), findic.us, alldatasheet.com and Octopart. DigiKey and Mouser product pages also link to the manufacturer datasheet from their respective product detail pages for sku 5959861.
What is the package pinout of the BGA7L1N6E6327XTSA1?
The BGA7L1N6E6327XTSA1 is packaged in the Infineon TSNPG-6-2 leadless package with six pads on a 0.7 mm x 1.1 mm footprint. The six pads correspond to RF input, RF output, VCC supply, EN enable, GND, and an additional GND/NC pad. Detailed pad assignments are shown in the package diagram on the manufacturer datasheet's first page.
When should I choose the BGA7L1N6E6327XTSA1 over the BGA7L1BN6?
Choose the BGA7L1N6E6327XTSA1 when your design only needs to receive the 728-960 MHz portion of LTE (Bands 5, 8 and 20). It is the lower-cost option since the BN6 variant must qualify and test a wider 716-960 MHz window. However, for North American or Japanese carrier aggregation plans that include Band 12, 13 or 17 (below 728 MHz) the BN6 variant is required and the BN6 also works as a superset replacement for the N6.
Is the BGA7L1N6E6327XTSA1 suitable for IoT modules?
Yes, the BGA7L1N6E6327XTSA1 is well-suited for cellular IoT modules including LTE Cat-1, Cat-M1 and NB-IoT devices operating in the 700/800/900 MHz bands. The 0.90 dB noise figure extends receiver sensitivity for low-power wide-area applications, the 4.4 mA quiescent draw suits battery budgets, and the digital enable pin enables sleep-mode shutdown during transmit or idle slots to minimise average drain.
Does the BGA7L1N6E6327XTSA1 need external matching components?
No, the BGA7L1N6E6327XTSA1 integrates both input and output 50 ohm matching networks on-die. According to the manufacturer datasheet, no external inductors, capacitors or transmission-line stubs are required for normal operation. Designers only need to route 50 ohm controlled-impedance traces on the PCB directly to the package pads and place a single supply-decoupling capacitor on the VCC pin.
What supply voltage does the BGA7L1N6E6327XTSA1 require?
The BGA7L1N6E6327XTSA1 operates from a single 1.5 V to 3.3 V supply, drawing a typical 4.4 mA. The 1.5 V lower bound lets it connect directly to low-voltage baseband or PMIC rails in modern smartphones without additional regulation, while the 3.3 V upper bound provides margin for legacy designs. A 0.1 uF decoupling capacitor should be placed within 1 mm of the VCC pad.
What is the operating temperature range of the BGA7L1N6E6327XTSA1?
The BGA7L1N6E6327XTSA1 is rated for -40 C to +85 C operation, covering the full industrial temperature range required for consumer and commercial LTE devices. The SiGe process is factory-characterised across this range, and the on-chip bias network compensates for temperature-induced gain drift. For automotive-grade applications above +85 C, Infineon offers AEC-Q100 qualified variants in other families.

Справочные инженерные данные для BGA7L1N6E6327XTSA1 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the BGA7L1N6E6327XTSA1 when designing a 4G smartphone, tablet, IoT module or 4G dongle that needs to receive LTE Bands 5, 8 and 20 in the 728-960 MHz range and demands a sub-1 dB noise figure. It is the right pick when the carrier plan does not include the 700 MHz Band 12/13/17 spectrum below 728 MHz - if it does, select the BGA7L1BN6E6327XTSA1 instead, which extends the low edge to 716 MHz while keeping the same TSNP-6-2 footprint. Avoid using the BGA7H1N6 (high-band) as a substitute - it covers a different frequency range entirely. For automotive-grade temperature ranges above +85 C, look at Infineon's AEC-Q100 qualified LNA families.

Сравнение с аналогами

Параметр Этот товар BGA7L1BN6E6327XTSA1 BGA7L1N6 BGA7H1N6
Package TSNP-6-2 (0.7 x 1.1 mm) TSNP-6-2 (same) TSNP-6-2 (same) TSNP-6-2 (same)
Brand Infineon Infineon Infineon Infineon
Frequency Range 728 MHz to 960 MHz 716 MHz to 960 MHz 728 MHz to 960 MHz 1710 MHz to 2690 MHz
Supply Voltage 1.5 V to 3.3 V 1.5 V to 3.3 V 1.5 V to 3.3 V 1.5 V to 3.3 V
Supply Current 4.4 mA 4.4 mA 4.4 mA 4.4 mA
Technology SiGe SiGe SiGe SiGe

Ключевые отличия

  • Sub-1 dB noise figure with integrated 50 ohm matching (против BGA7L1BN6E6327XTSA1)
  • Lowest current at 13.3 dB gain for low-band LTE (против BGA7H1N6)
  • Digital 1 V enable pin for direct baseband control (против Discrete LNA transistor implementations)

Заметки по проектированию

Route the RF input and output traces as 50 ohm controlled-impedance microstrip or coplanar waveguide with ground on the layer directly beneath, keeping trace lengths below 2 mm between the package pads and the next component (SAW filter, antenna switch, or transceiver). Avoid routing the RF traces across any digital bus or noisy supply line - the 0.90 dB NF is sensitive to stray coupling. Place the VCC supply-decoupling capacitor (typically 0.1 uF X7R) within 1 mm of the VCC pad and stitch the ground pad with multiple vias to the main ground plane to provide a low-inductance return path.

The integrated digital enable pin accepts a 1 V logic-high level and can be driven directly from a baseband or PMIC GPIO without level shifting. Drive EN low during TDD-LTE transmit slots and during idle periods to power down the LNA - the on-chip bias network shuts down within microseconds and the supply current collapses to a negligible standby level. For systems that hold the LNA in receive mode continuously, ensure the 4.4 mA current is included in the power budget for thermal and battery-life calculations.

Estimated: a common mistake is treating the TSNP-6-2 package as a generic 6-pin SOT equivalent. The pad layout requires a specific land pattern (0.7 mm x 1.1 mm) defined in the manufacturer datasheet - using a wrong land pattern will cause the part to lift during reflow. Another pitfall is routing the enable trace near the RF input - switching transients from the EN signal can couple into the antenna and raise the effective noise figure by several tenths of a dB. Keep the EN trace short and isolated from RF traces.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant per Infineon product page. Not AEC-Q100 qualified - select automotive-grade LNA variants for vehicle applications. Standard reel quantity is 15,000 pieces per reel.

Данные проверены: 2026-10-13 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Infineon Technologies BGA7L1N6E6327XTSA1 BGA7L1BN6E6327XTSA1 BGA7L1N6 BGA7H1N6 LNA Low Noise Amplifier MMIC RF amplifier Silicon Germanium SiGe LTE low-band TSNP-6-2 PG-TSNP-6-2 noise figure insertion power gain RoHS REACH 5 ohm matching 728 MHz to 960 MHz Heterojunction Bipolar Transistor Antenna switch module RF front-end IC
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