DSPIC33EV64GM104T-I/ML - 16-bit 5V 70 MIPS DSC | Microchip
Артикул: DSPIC33EV64GM104T-I/ML ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4.51 | $4,51 |
| 10 | $4.2 | $42,00 |
| 100 | $3.88 | $388,00 |
| 500 | $3.6 | $1.800,00 |
| 1.000 | $3.3 | $3.300,00 |
DSPIC33EV64GM104T-I/ML Обзор
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the math capability of a digital signal processor (DSP). Within the power-management hierarchy, a DSC such as this sits above a basic MCU: it executes deterministic control loops (PLL, motor control, power conversion) while providing general-purpose peripherals like CAN, UART and SPI. The dsPIC33EV family belongs to Microchip's 16-bit dsPIC33E architecture and is specifically designed for harsh-environment operation.
Key features include a 5V-tolerant operating range of 4.5V to 5.5V, which removes the need for a separate 3.3V rail in industrial and automotive 12V/24V systems; up to six PWM outputs for motor control; SENT protocol support for automotive sensor interfaces; and on-chip operational amplifiers that reduce external analog component count. The 64KB ECC Flash provides single-bit error correction for functional-safety oriented designs, and the device is listed by Microchip as Functional Safety (FuSa) capable.
Architecturally, the dsPIC33EV core is a modified Harvard 16-bit CMOS engine with DSP multiply-accumulate instructions, four DMA channels and seven timers, enabling deterministic real-time execution. Speed derating applies with temperature: DC to 70 MIPS at 0C to +85C, 60 MIPS at -40C to +125C, and 40 MIPS at up to +150C for the E-grade variants. The -I grade used here covers -40C to +125C.
Typical applications include automotive touch and control units, industrial motor drives and inverters, and appliance control boards where 5V noise immunity and CAN connectivity are required.
Design tip: at 70 MIPS the core runs from an internal PLL fed by a 7.37 MHz FRC oscillator, so verify flash wait-state and ECC settings in the configuration words when migrating speed grades.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для DSPIC33EV64GM104T-I/ML — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSPIC33EV64GM104T-I/ML (тот же форм-фактор и посадочное место) — отличается по Package, Packaging, Operating Temperature, CAN, Core.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSPIC33EV32GM104T-I/ML
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$2.95 / шт.
Открыть даташит →DSPIC33EV64GM104T-H/ML
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
DSPIC33EV128GM104T-I/ML
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$3.51 / шт.
Открыть даташит →DSPIC33EV256GM104T-I/ML
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EV64GM104-I/ML
✅ Прямая замена✓ В наличии
$3.11 / шт.
Открыть даташит →DSPIC33EV64GM104T-I/ML Максимальные параметры и электрические характеристики
| Core Architecture | 16-bit dsPIC33E DSC (modified Harvard) |
| Max MIPS | 70 MIPS |
| Supply Voltage Range | 4.5 V to 5.5 V |
| Flash Memory | 64 KB (22K x 24) with ECC |
| SRAM | 8 KB |
| Корпус | 44-QFN (8x8 mm) exposed pad |
| Рабочая температура | -40C to +125C (I grade) |
| PWM Outputs | Up to 6 |
| CAN | Yes (ECAN) |
| SENT Interface | Yes |
| On-chip Op Amps | Yes |
| DMA Channels | 4 |
| Timers | 7 |
| Process Technology | CMOS |
| Functional Safety Support | FuSa (Functional Safety) capable |
| Тип монтажа | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Target Applications | Automotive, industrial, appliances (harsh environments) |
Руководство по цоколевке DSPIC33EV64GM104T-I/ML в корпусе 44-qfn (8x8 mm) exposed pad
Цоколевка для DSPIC33EV64GM104T-I/ML (корпус 44-qfn (8x8 mm) exposed pad). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для DSPIC33EV64GM104T-I/ML.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
DSPIC33EV64GM104T-I/ML подходит для 6 применениеs: Automotive Control Units, Industrial Motor Drives and Inverters, Power Conversion and Digital Power Supplies, Appliance Control Boards, Automotive Sensor Signal Conditioning, Industrial Automation and CAN Networking.
Automotive Control Units
The DSPIC33EV64GM104T-I/ML fits automotive sensor and control units because it combines a 5V-noise-immune core with SENT protocol support and ECAN networking on a single die. Microchip explicitly positions the dsPIC33EV GM family for automotive touch and control units operating in harsh environments with noise and vibration. The 64KB ECC Flash corrects single-bit memory errors for functional-safety oriented designs, and the -40C to +125C I-grade rating covers under-hood adjacent zones. In a typical node, the SENT module reads digital sensors while the ECAN interface reports to the vehicle bus, with the four DMA channels offloading message handling to keep the 60 MIPS loop deterministic.
Рекомендуется
Industrial Motor Drives and Inverters
This controller suits motor drive applications through up to six PWM outputs, DSP multiply-accumulate instructions for field-oriented control (FOC), and on-chip op amps that amplify shunt-current signals without external amplifier ICs. The 5V supply provides wide noise margins in electrically noisy inverter cabinets, and the 70 MIPS core executes current-loop control at multi-kilohertz rates with deterministic latency. ECC Flash protects the control firmware against bit upsets from switching transients. Designers should use the seven timers for complementary PWM dead-time generation and ADC trigger synchronization, and exploit the four DMA channels to stream ADC current samples directly to RAM, freeing CPU cycles for the speed loop and CAN communications.
Рекомендуется
Power Conversion and Digital Power Supplies
Digital power supplies benefit from this DSC's combination of high-resolution PWM, fast ADC and DSP math in a 5V device. The dsPIC33EV core implements voltage-mode or average-current-mode control loops at switching frequencies of tens to hundreds of kilohertz, while the ECC-protected 64KB Flash safely stores compensation coefficients and fault logs. The on-chip op amps condition current-shunt signals, reducing BOM cost versus an external amplifier. Because the part runs directly from a 5V auxiliary rail common in switch-mode power supplies, no additional LDO is needed. The ECAN module enables digital power supplies in telecom rectifiers to report telemetry on a CAN bus, and the -40C to +125C rating covers outdoor power infrastructure.
Рекомендуется
Appliance Control Boards
Home and commercial appliances demand low-cost controllers with strong EMI immunity, motor-control peripherals and robust I/O - exactly the profile Microchip cites for the dsPIC33EV family (appliances, industrial and automotive harsh environments). Running the core at 5V gives the DSPIC33EV64GM104T-I/ML superior noise immunity on appliance PCBs near relays, triacs and switched motors, compared with 3.3V MCUs. The six PWM outputs drive BLDC compressor or fan motors, the op amps condition NTC or shunt feedback, and 64KB Flash holds UI state machines and fault diagnostics. The 44-QFN 8x8 package keeps board area compact while the exposed pad aids heat dissipation from the 70 MIPS core.
Рекомендуется
Automotive Sensor Signal Conditioning
The SENT interface and on-chip op amps make this DSC a natural fit for automotive sensor acquisition nodes. SENT (Single Edge Nibble Transmission) is the standard point-to-point protocol connecting sensors to ECUs, and hardware support removes software timing burden from the core. The internal op amps amplify resistive-bridge or shunt signals before the ADC, and the DSP MAC instructions implement digital filtering and linearization of thermocouple, pressure or position data. The 5V supply directly powers legacy 5V sensor bridges without level shifting. With -40C to +125C operation, ECC Flash for measurement integrity, and CAN for ECU connectivity, one 44-QFN device replaces an analog front-end plus MCU combination.
Рекомендуется
Industrial Automation and CAN Networking
In factory automation nodes, the ECAN module of the DSPIC33EV64GM104T-I/ML links I/O and actuator boards onto industrial CAN networks, while the 70 MIPS core handles local sequencing, protocol processing and closed-loop control. The 5V I/O directly interfaces with industrial sensors, PLC signals and optocouplers without level translators, improving robustness on long cable runs. Seven timers generate precise gating and measurement intervals, and four DMA channels service UART, SPI and CAN traffic with minimal CPU load. The FuSa capability and ECC Flash support safety-relevant I/O modules, and the -40C to +125C package rating tolerates unventilated control cabinets mounted next to drives and power electronics.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSPIC33EV64GM104T-I/ML — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSPIC33EV32GM104T-I/ML | DSPIC33EV64GM104T-H/ML | DSPIC33EV128GM104T-I/ML | DSPIC33EV256GM104T-I/ML | DSPIC33EV64GM104-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB (22K x 24) ECC | 32 KB ECC | 64 KB ECC | 128 KB ECC | 256 KB ECC | 64 KB ECC |
| RAM | 8 KB | 4 KB | 8 KB | 16 KB | 32 KB | 8 KB |
| Max MIPS | 70 MIPS (0C to +85C) | 70 MIPS | 70 MIPS (40 MIPS to +150C) | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +125C (I grade) | -40C to +125C | -40C to +150C | -40C to +125C | -40C to +125C | -40C to +125C |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Peripherals (CAN/SENT/PWM/OpAmps) | ECAN, SENT, 6x PWM, op amps, 4 DMA, 7 timers | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
Ключевые отличия
- Largest flash in the drop-in footprint at lowest cost point (против DSPIC33EV32GM104T-I/ML)
- Full-speed industrial temperature operation (против DSPIC33EV64GM104T-H/ML)
- Cost-efficient code headroom vs top-of-family (против DSPIC33EV256GM104T-I/ML)
Заметки по проектированию
The dsPIC33EV core requires a regulated 4.5V-5.5V supply. Provide separate VDD/VSS pairs per datasheet grouping with 0.1uF ceramic decoupling at each pair plus one bulk 10uF capacitor near the 44-QFN. On boards with noisy motors or inverters, add a ferrite bead between the 5V rail and VDD to suppress conducted EMI. Note the speed-temperature derating: design the clock configuration for 60 MIPS if the full -40C to +125C I-grade range is used, reserving 70 MIPS for the 0C to +85C window per the family datasheet operating conditions.
The 8x8 mm 44-QFN exposed pad is the primary thermal and ground path. Solder the exposed pad to a ground pour with an array of thermal vias (typically 3x3 or 4x4) to keep junction temperature low at 70 MIPS operation and to provide a low-inductance ground reference for the CAN and PWM outputs. Keep the ICSP programming pins (PGD/PGC) and MCLR routed to a 5-pin header even in production designs to permit in-circuit reprogramming and diagnostics without desoldering the QFN.
Do not substitute the /MR 6x6 mm QFN variant onto a /ML 8x8 mm land pattern - the footprints are mechanically incompatible. Verify configuration words (oscillator source, ECC settings, watchdog) when migrating code between flash-size family members such as the 32KB and 64KB GM104 parts, since memory bounds and config addresses differ. Finally, when using SENT and ECAN simultaneously, check the pin-mapping (RPx remappable pins) in the datasheet I/O table to avoid peripheral pin conflicts during firmware porting.
Информация о соответствии
RoHS/lead-free status inferred from current-production Microchip QFN parts; formal environmental documents should be downloaded from Microchip's product page. AEC-Q100 qualification is not explicitly stated in the provided data for this MPN - verify with Microchip for automotive-grade requirements.