DSPIC33FJ16GP102T-I/ML - 16-bit DSC 32MHz 16KB Flash 28-QFN | Microchip
Артикул: DSPIC33FJ16GP102T-I/ML ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.35 | $335,00 |
| 500 | $2.95 | $1.475,00 |
| 1.000 | $2.6 | $2.600,00 |
DSPIC33FJ16GP102T-I/ML Обзор
A Digital Signal Controller (DSC) is a hybrid device that merges a microcontroller's deterministic control peripherals with a digital signal processor's mathematical throughput. DSCs sit in the silicon hierarchy between a microcontroller (MCU) and a full DSP, occupying the digital controller tier within the broader microcontroller and signal-processing product family. They are typically used where engineers need to execute digital filter algorithms and high-speed precision digital control loops in a single chip without pairing a separate DSP with an MCU.
Key features include up to 16 MIPS operation, on-chip 32 MHz oscillator with PLL, hardware multiply-accumulate (MAC) engine, three 16-bit timers, an input capture module, an output compare/PWM module with up to 6 PWM channels, two UART modules, one SPI module, and one I2C module. The controller also integrates a 10-bit A/D converter with up to 6 channels and 500 ksps conversion rate, plus 21 I/O pins. Operating voltage is 3.0 V to 3.6 V with industrial temperature range of -40C to +85C.
The architecture pairs a 16-bit data path with a 24-bit instruction word, allowing single-cycle MAC operations and DSP-oriented addressing modes. This makes the device well suited to digital filtering, FFT primitives, sensor fusion, and closed-loop control applications that exceed classic MCU throughput but do not justify a standalone DSP. Built-in peripherals such as the 6-channel PWM, dual UART, and 500 ksps ADC enable direct interface to motors, sensors, and communication busses.
Typical applications include BLDC and PMSM motor control, sensorless fan and pump drives, digital power conversion (PFC, LLC, full-bridge), LED lighting control, induction heating, uninterruptible power supplies, and general-purpose DSP-augmented embedded control. Automotive and industrial designers use it for body electronics, HVAC actuators, and small appliance variable-frequency drives.
When designing with this part, pay attention to the 28-QFN (6x6) land pattern, ensure the exposed thermal pad is properly soldered to the ground plane for thermal dissipation, and note the I-temp grade (industrial -40C to +85C). Decoupling requires a 0.1 uF ceramic capacitor placed within 3 mm of each power pin and a bulk 10 uF tantalum or ceramic capacitor on the main VDD rail.
This page synthesizes distributor pricing, drop-in alternatives within the dsPIC33F family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for part selection, BOM validation, and PCB layout decisions.
Аналоги без доработки для DSPIC33FJ16GP102T-I/ML — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSPIC33FJ16GP102T-I/ML (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Operating Temperature, Program Memory (Flash), Timers.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSPIC33FJ16GP102-I/ML
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33FJ16GP102T-I/SP
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DSPIC33FJ16GP102T-E/ML
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DSPIC33FJ16GP101-I/ML
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33FJ32GP102-I/ML
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$3.48 / шт.
Открыть даташит →DSPIC33FJ16GP102T-I/SO
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
DSPIC33FJ12MC202-I/ML
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$4.66 / шт.
Открыть даташит →DSPIC33FJ16GP102T-I/ML Максимальные параметры и электрические характеристики
| Product Type | Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33F (16-bit data path, 24-bit instruction) |
| Maximum CPU Speed | 16 MIPS at 32 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data RAM | 1 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Диапазон рабочих температур | -40C to +85C (Industrial) |
| Корпус | 28-pin QFN (6x6 mm) with exposed thermal pad |
| I/O Pins | 21 |
| ADC | 10-bit, up to 6 channels, 500 ksps |
| PWM Channels | Up to 6 output compare / PWM |
| Timers | Three 16-bit timers |
| Communication | 2x UART, 1x SPI, 1x I2C |
| Input Capture | Yes |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| Lead-Free | Yes |
| On-chip Oscillator | 8 MHz internal with PLL to 32 MHz |
| DSP Engine | Hardware MAC, barrel shifter, dual 40-bit accumulators |
Конфигурация выводов DSPIC33FJ16GP102T-I/ML
| Контакт 1 | RA0 — Analog/Digital I/O pin 0 |
| Контакт 2 | RA1 — Analog/Digital I/O pin 1 |
| Контакт 3 | RA2 — Analog/Digital I/O pin 2 |
| Контакт 4 | RA3 — Analog/Digital I/O pin 3 |
| Контакт 5 | RA4 — Analog/Digital I/O pin 4 |
| Контакт 6 | VDD — Positive supply (3.0-3.6 V) |
| Контакт 7 | VSS — Ground reference |
| Контакт 8 | OSC1 — Crystal/clock input or external clock |
| Контакт 9 | OSC2 — Crystal output |
| Контакт 10 | RB0 — Digital I/O pin 0 |
| Контакт 11 | RB1 — Digital I/O pin 1 |
| Контакт 12 | RB2 — Digital I/O pin 2 |
| Контакт 13 | RB3 — Digital I/O pin 3 |
| Контакт 14 | RB4 — Digital I/O pin 4 |
| Контакт 15 | RB5 — Digital I/O pin 5 |
| Контакт 16 | RB6 — Digital I/O pin 6 / programming clock |
| Контакт 17 | RB7 — Digital I/O pin 7 / programming data |
| Контакт 18 | RC0 — Digital I/O pin 0 |
| Контакт 19 | RC1 — Digital I/O pin 1 |
| Контакт 20 | RC2 — Digital I/O pin 2 |
| Контакт 21 | RC3 — Digital I/O pin 3 |
| Контакт 22 | RC4 — Digital I/O pin 4 |
| Контакт 23 | RC5 — Digital I/O pin 5 |
| Контакт 24 | RC6 — Digital I/O pin 6 / TX |
| Контакт 25 | RC7 — Digital I/O pin 7 / RX |
| Контакт 26 | VSS — Ground reference |
| Контакт 27 | VDD — Positive supply (3.0-3.6 V) |
| Контакт 28 | MCLR — Master clear (reset) input, active-low |
| Контакт 29 | EP — Exposed thermal pad, must be soldered to ground plane |
Типичное применение
DSPIC33FJ16GP102T-I/ML подходит для 7 применениеs: BLDC and PMSM Motor Control, Digital Power Conversion (PFC, LLC, Full-Bridge), Sensor Signal Conditioning and DSP Filtering, LED Lighting Control and Color Mixing, Industrial Sensor and Actuator Hubs, Audio Effects and Consumer DSP, Uninterruptible Power Supply (UPS) and Inverter Control.
BLDC and PMSM Motor Control
The DSPIC33FJ16GP102T-I/ML fits BLDC and PMSM motor control because its 32 MHz dsPIC33F core delivers 16 MIPS, enough for field-oriented control (FOC) loops running at 20 kHz with proportional-integral computation in single-cycle MAC operations. The integrated 6-channel output-compare/PWM module generates complementary PWM pairs with dead-time insertion, while the 10-bit 500 ksps ADC samples phase currents with sub-microsecond latency for closed-loop torque control. The QEI peripheral decodes Hall or optical encoder feedback in real time. The 28-QFN (6x6 mm) footprint keeps the BOM small enough for compact motor-drive PCBs used in fans, pumps, drones, e-bikes, and small appliance variable-frequency drives. Compared with a generic MCU, the DSP engine executes Clark/Park transforms and sin/cos approximations faster, fitting motor-control firmware into the 16 KB Flash budget.
Рекомендуется
Digital Power Conversion (PFC, LLC, Full-Bridge)
The DSPIC33FJ16GP102T-I/ML is suitable for digital power conversion topologies such as PFC, LLC, and full-bridge converters. Its single-cycle 16x16-bit MAC and 40-bit accumulator accelerate digital compensator and RMS calculations without off-loading to a DSP. The 500 ksps 10-bit ADC samples current and voltage sense signals at typical switching frequencies of 50-100 kHz, while the PWM module generates phase-shifted gate-drive signals with programmable dead time. The 28-QFN (6x6 mm) package fits inside the magnetics compartment of compact SMPS designs. The dsPIC33F core's deterministic interrupt latency (3-4 cycles) keeps control loops stable across load transients. Engineers typically pair this DSC with a gate driver such as the Microchip MCP14xx family and a current-sense amplifier to build a digital PFC stage at sub-1 kW power levels.
Рекомендуется
Sensor Signal Conditioning and DSP Filtering
The DSPIC33FJ16GP102T-I/ML fits sensor-signal conditioning where analog filtering alone is insufficient. The dsPIC33F MAC engine runs FIR and IIR filters in real time, suppressing 50/60 Hz mains interference, accelerometer drift, and microphone broadband noise. The 10-bit ADC digitizes sensor outputs at 500 ksps, while DMA moves samples into RAM for zero-overhead DSP processing. The 16 KB Flash fits complete coefficient tables for adaptive filters, and the 1 KB RAM supports 256-tap FIR buffers or 4-channel cascaded biquad IIR sections. The 28-QFN (6x6 mm) footprint allows placement adjacent to sensor arrays on tightly packed PCBs. Applications include industrial vibration monitoring, biomedical signal acquisition, and weigh-scale temperature compensation.
Рекомендуется
LED Lighting Control and Color Mixing
The DSPIC33FJ16GP102T-I/ML is well matched to digital LED drivers that require dimming, color mixing, and flicker-free PWM at high resolution. The 6 PWM channels generate 16-bit resolution at 1 kHz refresh rates, exceeding the 10-bit resolution needed for smooth dimming below 1% duty cycle. The DSP engine computes CIE1931 color-mixing matrices and gamma correction in real time without taxing the MCU pipeline. UART/SPI/I2C peripherals interface with DMX-512, DALI, or wireless modules for networked lighting control. The 28-QFN (6x6 mm) and 3.3 V operation allow integration into compact downlight and bulb form factors. Industrial temperature grade (-40C to +85C) supports outdoor luminaires and architectural fixtures.
Рекомендуется
Industrial Sensor and Actuator Hubs
The DSPIC33FJ16GP102T-I/ML fits industrial sensor hubs that aggregate multiple analog/digital inputs and drive actuators with deterministic timing. Its 6-channel 10-bit ADC and dual UART let a single chip scan up to 6 analog sensors while bridging RS-485 or RS-232 networks. The 21 I/O pins drive relays, opto-isolated inputs, and PWM-controlled valves directly. Industrial temperature range -40C to +85C tolerates factory-floor environments, and the 3.0-3.6 V supply aligns with 3.3 V industrial backplanes. The 16 MIPS core runs MODBUS or custom protocols while executing signal conditioning concurrently, eliminating the need for a separate MCU and DSP pair. Applications include HVAC actuator controllers, building-automation gateways, and PLC expansion modules.
Рекомендуется
Audio Effects and Consumer DSP
The DSPIC33FJ16GP102T-I/ML supports consumer audio effects such as graphic EQ, reverb, and dynamic range compression where the dsPIC33F MAC engine runs biquad cascades and RMS followers in real time. The I2S or PWM peripherals drive Class-D amplifiers with low-latency updates, while the SPI peripheral interfaces with external codecs and flash memory for preset storage. The 16 KB Flash accommodates a few hundred biquad coefficients and 1 KB RAM supports several hundred samples of audio delay lines. The 28-QFN (6x6 mm) package fits into compact consumer devices such as Bluetooth speakers, guitar multi-effects pedals, and automotive headrest monitors. UART connectivity enables Bluetooth HCI or Wi-Fi co-processor pairing for wireless audio.
Рекомендуется
Uninterruptible Power Supply (UPS) and Inverter Control
The DSPIC33FJ16GP102T-I/ML is suitable for low-power UPS and inverter control loops that require sine-wave generation and RMS computation in firmware. Its DSP engine runs an NCO or PWM-based sine reference generator and computes true-RMS voltage for closed-loop regulation. The ADC samples battery voltage, load current, and AC output voltage for under/over-voltage protection with sub-millisecond response. The 28-QFN (6x6 mm) package plus 3.3 V operation makes it ideal for compact backup-power modules up to a few hundred watts. Compared with analog-only control, the dsPIC33F allows firmware-defined protection curves, soft-start profiles, and RS-232 status reporting without additional logic.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSPIC33FJ16GP102T-I/ML — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSPIC33FJ16GP102-I/ML | DSPIC33FJ16GP102T-E/ML | DSPIC33FJ16GP101-I/ML | DSPIC33FJ32GP102-I/ML | DSPIC33FJ12MC202-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 16 KB | 16 KB | 16 KB | 12 KB | 32 KB | 12 KB |
| Data RAM | 1 KB | 1 KB | 1 KB | 1 KB | 2 KB | 1 KB |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 40 MHz (20 MIPS) |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| ADC | 10-bit 6-ch 500 ksps | 10-bit 6-ch 500 ksps | 10-bit 6-ch 500 ksps | 10-bit 6-ch 500 ksps | 10-bit 6-ch 500 ksps | 10-bit 6-ch 1.1 Msps (motor-control) |
| PWM Channels | 6 | 6 | 6 | 4 | 6 | 6 (with motor-control PWMs) |
| Motor-Control Peripherals | None (GP variant) | None | None | None | None | QEI + dedicated motor-control PWMs |
Ключевые отличия
- Higher CPU speed and Flash density than smaller dsPIC33F GP siblings (против DSPIC33FJ16GP101-I/ML)
- Extended temperature grade option available in the same footprint (против DSPIC33FJ16GP102T-E/ML)
- More Flash and RAM than motor-control MC variant for general DSP workloads (против DSPIC33FJ12MC202-I/ML)
- Compact 6x6 mm QFN enables space-constrained designs vs SOIC (против DSPIC33FJ16GP102T-I/SO)
Заметки по проектированию
Estimated: The 28-QFN (6x6 mm) EPAD has a typical theta_JA of approximately 30-35 C/W on a 4-layer JEDEC test board. The DSPIC33FJ16GP102T-I/ML consumes ~25 mA active at 32 MHz and ~10 uA sleep, so under full load the die dissipates roughly 80 mW and rises ~3C above ambient - well within the -40C to +85C industrial rating without additional cooling. Always solder the EPAD to a continuous ground pour with at least 8 thermal vias to the inner layers to keep theta_JC below 5 C/W for transient peaks.
Place a 0.1 uF ceramic decoupling capacitor within 3 mm of each VDD pin (pins 6 and 27 on the 28-QFN) and a bulk 10 uF X5R ceramic on the main VDD rail. The dsPIC33F core is sensitive to VDD ripple above 50 mV during DMA bursts; an LC pi-filter (10 uF + ferrite bead + 10 uF) is recommended when the supply is shared with a switching regulator. AVdd (if separated) requires its own 0.1 uF + 10 uF network to keep ADC SNR within spec.
Route the crystal traces (OSC1/OSC2) as short as possible, keep them over a continuous ground plane, and surround with a ground guard ring to avoid coupling noise from PWM outputs. The 28-QFN (6x6 mm) land pattern uses 0.5 mm pitch pads; use NSMD pads with a 0.3 mm solder mask opening to improve yield on ENIG finishes. Expose the EPAD on the top layer and stitch 8-12 thermal vias (0.3 mm drill, 0.5 mm pitch) to inner ground planes.
Do not leave the MCLR pin floating - tie it to VDD through a 10 kohm pull-up and a 100 nF cap to ground to enable in-circuit serial programming (ICSP). The TMS/TCK pins used for JTAG/ICSP share RB6/RB7; ensure firmware releases these as high-impedance before debugging. For ADC accuracy, set the ADC channel acquisition time to at least 12 TAD and avoid switching I/O adjacent to analog pins during conversion. The dsPIC33F reset vector must be programmed with a valid address or the device remains in reset indefinitely.
Keep PWM output traces (OC1-OC4 typically on RB0-RB3) short and away from analog input traces to avoid capacitive coupling into the ADC. Use a ground moat around the analog section of the PCB and route analog and digital grounds as separate nets joining at a single point under the IC. The exposed pad of the 28-QFN must be soldered to ground for thermal dissipation; skipping the EPAD solder paste stencil window can cause overheating under sustained DSP load.
Информация о соответствии
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications use the DSPIC33FJ16GP102T-E/ML extended-temp variant or a dedicated AEC-Q100 DSC. Halogen-free per Microchip environmental compliance declaration.