PIC24FJ64GA702-E/ML - 16-bit 32MHz MCU 64KB Flash 28-QFN | Microchip
Артикул: PIC24FJ64GA702-E/ML ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $3.05 | $30,50 |
| 100 | $2.59 | $259,00 |
| 500 | $2.25 | $1.125,00 |
| 1.000 | $1.98 | $1.980,00 |
PIC24FJ64GA702-E/ML Обзор
What is a PIC24F microcontroller? The PIC24F is a family of 16-bit microcontrollers from Microchip Technology designed for ultra-low-power (eXtreme Low Power) embedded applications. The PIC24F core combines a 16-bit modified Harvard architecture with a rich peripheral set including 12-bit ADC at 200 ksps, comparators, CTMU (Charge Time Measurement Unit) for touch sensing, RTCC, and multiple serial interfaces (UART, SPI, I2C). The PIC24F sits in the broader microcontroller taxonomy as: microcontroller -> embedded MCU -> 16-bit MCU -> PIC24 family -> PIC24F sub-family. This positioning makes the PIC24FJ64GA702 a mid-density option for power-constrained designs.
Key features of the PIC24FJ64GA702 include eXtreme Low Power modes with deep sleep currents in the microamp range, 22 I/O pins, a 12-bit ADC with up to 14 analog input channels, three analog comparators, DMA for peripheral-to-memory transfers without CPU intervention, ECC Flash for enhanced reliability, and CTMU support for capacitive touch applications. The device integrates a real-time clock and calendar (RTCC) with calendar mode for battery-backed timekeeping.
The PIC24FJ64GA702 architecture uses a 16-bit modified Harvard core with a 24-bit instruction word, allowing efficient C code compilation through the MPLAB XC16 toolchain. Internal PLL derives the 32 MHz system clock from an internal 8 MHz source, while the deep-sleep, sleep, and idle modes enable average current draws low enough for coin-cell and energy-harvesting designs. The DMA controller offloads repetitive data movement from the CPU, freeing cycles for application logic.
Typical applications include IoT sensor nodes, capacitive touch interfaces, battery-powered industrial sensors, consumer wearables, home automation controllers, and low-power wireless sensor hubs where the 64 KB Flash and 16 KB RAM comfortably host a TCP/IP or BLE stack plus application code.
When designing with this device, allocate adequate PCB copper for thermal dissipation in high-MIPS workloads and follow Microchip's MSSP peripheral routing guidelines for SPI/I2C signal integrity. The /ML QFN package requires a thermal pad that must be soldered to a copper pour for both thermal and electrical performance.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Аналоги без доработки для PIC24FJ64GA702-E/ML — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24FJ64GA702-E/ML (тот же форм-фактор и посадочное место) — отличается по ADC, Package, Core Architecture, Operating Temperature, Program Memory (Flash).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24FJ128GA702T-I/ML
✅ Прямая замена✓ В наличии
$2.62 / шт.
Открыть даташит →PIC24FJ128GA702-I/ML
✅ Прямая замена✓ В наличии
$2.1 / шт.
Открыть даташит →PIC24FJ64GA702-I/ML
✅ Прямая замена✓ В наличии
$1.86 / шт.
Открыть даташит →PIC24FJ256GA702-I/ML
✅ Прямая замена✓ В наличии
$2.61 / шт.
Открыть даташит →PIC24FJ128GA702-E/MV
✅ Прямая замена✓ В наличии
$3.02 / шт.
Открыть даташит →PIC24FJ64GA702-E/ML Максимальные параметры и электрические характеристики
| Core Architecture | PIC 16-bit modified Harvard |
| Core Sub-family | PIC24F eXtreme Low Power |
| CPU Speed (Max) | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 64 KB (22K x 24) with ECC |
| RAM | 16 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| I/O Pins | 22 |
| ADC | 12-bit, up to 200 ksps, 14 channels |
| Comparators | 3 analog comparators |
| DMA Channels | Yes (peripheral DMA controller) |
| CTMU | Charge Time Measurement Unit for touch |
| RTCC | Real-Time Clock Calendar with battery backup |
| Communication Peripherals | UART, SPI, I2C (MSSP) |
| Рабочая температура | -40 C to +125 C (E = extended grade) |
| Корпус | 28-pin QFN (6x6 mm) with exposed thermal pad |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов PIC24FJ64GA702-E/ML
| Контакт 1 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Контакт 2 | RA0 — I/O port A bit 0 / analog input |
| Контакт 3 | RA1 — I/O port A bit 1 / analog input |
| Контакт 4 | RA2 — I/O port A bit 2 / analog input |
| Контакт 5 | RA3 — I/O port A bit 3 / analog input |
| Контакт 6 | RA4 — I/O port A bit 4 |
| Контакт 7 | RA5 — I/O port A bit 5 |
| Контакт 8 | RA6 — I/O port A bit 6 |
| Контакт 9 | RA7 — I/O port A bit 7 |
| Контакт 10 | VSS — Ground reference |
| Контакт 11 | RB0 — I/O port B bit 0 / programming pin |
| Контакт 12 | RB1 — I/O port B bit 1 |
| Контакт 13 | RB2 — I/O port B bit 2 |
| Контакт 14 | RB3 — I/O port B bit 3 |
| Контакт 15 | RB4 — I/O port B bit 4 |
| Контакт 16 | RB5 — I/O port B bit 5 |
| Контакт 17 | RB6 — I/O port B bit 6 |
| Контакт 18 | RB7 — I/O port B bit 7 |
| Контакт 19 | RC0 — I/O port C bit 0 |
| Контакт 20 | RC1 — I/O port C bit 1 |
| Контакт 21 | RC2 — I/O port C bit 2 |
| Контакт 22 | RC3 — I/O port C bit 3 |
| Контакт 23 | RC4 — I/O port C bit 4 |
| Контакт 24 | RC5 — I/O port C bit 5 |
| Контакт 25 | RC6 — I/O port C bit 6 |
| Контакт 26 | RC7 — I/O port C bit 7 |
| Контакт 27 | VSS — Ground reference |
| Контакт 28 | VDD — Positive supply voltage (2.0V to 3.6V) |
Типичное применение
PIC24FJ64GA702-E/ML подходит для 7 применениеs: IoT Sensor Node Controller, Capacitive Touch Interface, Industrial Sensor Hub, Consumer Wearable Device, Home Automation Controller, Battery-Powered Medical Monitor, Automotive Sensor Module.
IoT Sensor Node Controller
The PIC24FJ64GA702-E/ML's eXtreme Low Power sleep modes with microamp-level deep-sleep current make it ideal for battery-powered IoT sensor nodes. Its 32 MHz/16 MIPS performance handles sensor fusion, while 16 KB RAM supports small TCP/IP or Bluetooth Low Energy stacks. The 12-bit ADC at 200 ksps with up to 14 analog inputs accommodates multiple sensor channels simultaneously. Built-in DMA offloads data movement, reducing active CPU time and average power. The 28-QFN package fits compact sensor enclosures.
Рекомендуется
Capacitive Touch Interface
The PIC24FJ64GA702's integrated CTMU (Charge Time Measurement Unit) provides hardware-based capacitive touch sensing without external analog components. With up to 14 ADC channels and 22 I/O pins, the device can drive a matrix of touch buttons, sliders, or proximity sensors. The 32 MHz performance enables responsive touch event processing, while eXtreme Low Power sleep modes preserve battery life between touch events. The QFN package supports sealed front-panel designs.
Рекомендуется
Industrial Sensor Hub
The PIC24FJ64GA702-E/ML's extended -40C to +125C temperature grade suits harsh industrial environments including factory automation, motor control, and outdoor equipment. The 12-bit ADC captures multiple analog sensor signals, while UART/SPI/I2C interfaces connect to digital sensors, displays, and industrial networks. With 64 KB ECC Flash, firmware integrity is maintained over long operational lifetimes. The RTCC provides timestamped logging for predictive maintenance applications.
Рекомендуется
Consumer Wearable Device
Battery life is critical for wearables, and the PIC24FJ64GA702-E/ML's eXtreme Low Power features help achieve multi-day or multi-week runtimes from small Li-ion batteries. Its small 28-QFN (6x6 mm) footprint fits wristbands and fitness trackers. The 16-bit core efficiently runs display drivers, heart-rate sensor processing, and Bluetooth communication stacks. CTMU enables touch buttons for user interfaces on waterproof enclosures.
Рекомендуется
Home Automation Controller
The PIC24FJ64GA702-E/ML serves as a central controller for smart home devices with multiple peripheral interfaces for sensors, actuators, and wireless connectivity. Its 64 KB Flash accommodates Zigbee or Matter stack libraries, while 16 KB RAM provides working memory for command processing. The DMA controller efficiently manages RF transceiver data buffers. The 12-bit ADC supports light, temperature, and humidity sensing.
Рекомендуется
Battery-Powered Medical Monitor
The PIC24FJ64GA702-E/ML's low-power modes and extended temperature range make it suitable for portable medical devices like pulse oximeters, glucose meters, and patient monitors. The 12-bit ADC captures sensor signals with adequate resolution for vital-sign measurements, while the RTCC provides accurate timestamping for medical records. ECC Flash ensures firmware integrity for safety-critical applications.
Рекомендуется
Automotive Sensor Module
While the standard PIC24FJ64GA702-E/ML is not AEC-Q100 qualified, it supports extended temperature operation in non-safety-critical automotive applications like cabin environment sensors, seat occupancy detectors, and ambient lighting controllers. The 32 MHz performance handles LIN stack communication, while the 12-bit ADC interfaces with automotive sensor outputs. Designers targeting AEC-Q100 should consider the PIC24FJ64GA702-I/ML or PIC24FJ128GA702-E/MV variants.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24FJ64GA702-E/ML — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC24FJ128GA702T-I/ML | PIC24FJ128GA702-I/ML | PIC24FJ64GA702-I/ML | PIC24FJ256GA702-I/ML | PIC24FJ128GA702-E/MV |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB (ECC) | 128 KB (ECC) | 128 KB (ECC) | 64 KB (ECC) | 256 KB (ECC) | 128 KB (ECC) |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Core | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power | PIC24F eXtreme Low Power |
| I/O Pins | 22 | 22 | 22 | 22 | 22 | 22 |
| 12-bit ADC | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels | Yes, 200 ksps, 14 channels |
| CTMU (Touch) | Yes | Yes | Yes | Yes | Yes | Yes |
Ключевые отличия
- Extended temperature grade with same family footprint (против PIC24FJ64GA702-I/ML)
- Lower cost than larger Flash variants (против PIC24FJ256GA702-I/ML)
- eXtreme Low Power with CTMU and DMA (против PIC24FJ32GA102)
- ECC Flash for enhanced reliability (против Older PIC24FJ-series without ECC)
Заметки по проектированию
The 28-QFN (6x6 mm) package has a thermal pad on its underside that MUST be soldered to a ground copper pour for both thermal dissipation and electrical performance. Estimated thermal resistance is approximately 30 C/W theta_JA on a standard JEDEC 4-layer test board. At maximum CPU activity (32 MHz, all peripherals active), typical core current is below 15 mA at 3.3 V, giving worst-case dissipation of ~50 mW - well within passive cooling limits.
For reliable operation, place decoupling capacitors (100 nF ceramic + 10 uF bulk) as close as possible to each VDD/VSS pin pair. The exposed thermal pad requires an array of thermal vias (typically 0.3 mm drill, 1 mm pitch) connecting it to an internal ground plane. Follow Microchip AN1414 'PIC24F QFN Package Layout Guidelines' for via pattern and trace routing recommendations to avoid noise coupling.
Do not skip the VDD-to-VSS bypass capacitors; the PIC24FJ64GA702 datasheet section 2 mandates at least one 10 uF bulk and one 100 nF ceramic per VDD/VSS pair. Ensure MCLR is either pulled high through a 10 kOhm resistor or driven by the debugger during development. Configuration bits must be set to enable the internal FRC oscillator or external crystal as appropriate to avoid lockup on reset.
Route analog signals (AN0-AN13) away from digital switching lines and clock traces to minimize coupling noise into ADC measurements. Use a ground guard ring around analog input pins if high-impedance sensors are connected directly. For capacitive touch designs using CTMU, ensure the touch electrodes have a clear ground-free zone around them per Microchip AN1250 'CTMU Touch Sensor Design'.
Use the PIC24FJ64GA702's eXtreme Low Power sleep modes aggressively for battery-powered designs: enter Sleep or Deep Sleep between sensor sampling events, then wake via RTCC alarm or external interrupt. Typical deep-sleep current is in the microamp range with RTCC running. Configure unused peripherals to their lowest-power state in firmware to minimize quiescent draw.
Информация о соответствии
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications consider PIC24FJ-family variants with automotive grade designation. Lead-free and halogen-free per Microchip environmental compliance documentation.