Microchip Technology

DSPIC33FJ64GS606T-I/MR - 16-bit 40MIPS DSC 64KB | Microchip

Артикул: DSPIC33FJ64GS606T-I/MR ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
3.3 V Vdss 64-VQFN (9x9 mm) with Exposed Pad (MR) Package 40 MHz Speed 64 KB (64K x 8) FLASH Memory
От $3.9 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-27
Оптовые цены
Кол-во Цена за ед. Итого
1 $6.2 $6,20
10 $5.55 $55,50
100 $4.8 $480,00
500 $4.3 $2.150,00
1.000 $3.9 $3.900,00
ℹ️ Все цены указаны в USD

DSPIC33FJ64GS606T-I/MR Обзор

The Microchip Technology DSPIC33FJ64GS606T-I/MR is a 16-bit digital signal controller (DSC) from the dsPIC33F GS family, delivering 40 MIPS performance with 64 KB (64K x 8) of program flash memory and 9216 words of RAM, housed in a 64-pin VQFN (MR) package with exposed thermal pad operating at 3.3V.

A digital signal controller combines the compute throughput of a DSP with the peripheral integration and control flexibility of a microcontroller. Within the power-management hierarchy, a DSC sits above a standard MCU for closed-loop control tasks: it executes control loops fast enough for switch-mode power conversion while integrating specialized analog and timing peripherals on one die.

Key features include a high-speed PWM module purpose-built for digital switch-mode power supplies (SMPS), a high-speed 10-bit ADC with multiple sample-and-hold circuits for simultaneous multi-rail sampling, analog comparators, and four DMA channels. The device supports In-Circuit Serial Programming (ICSP) and debugging via PGECx/PGEDx pins, plus boundary-scan capability and low-power modes.

Technically, the dsPIC33FJ64GS606 core pairs a 16-bit modified Harvard architecture with DSP engine instructions (fixed-point format, barrel shifter), letting a single device run a PFC loop and downstream DC-DC loops concurrently. Peripheral pin-select and rich timer resources reduce external glue logic in compact power supplies.

Typical applications include AC-to-DC converters, DC-to-DC converters, power factor correction (PFC) stages, uninterruptible power supplies, and digital lighting ballasts. The GS family was explicitly designed by Microchip for these multi-loop digital power-conversion applications.

Design consideration: keep the ICSP connector trace lengths to PGECx/PGEDx as short as possible for reliable in-circuit debugging, and verify that the 40 MIPS grade (-I, industrial temperature) matches your switching-frequency headroom; a 50 MIPS variant exists if more loop bandwidth is required.

This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.

Аналоги без доработки для DSPIC33FJ64GS606T-I/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с DSPIC33FJ64GS606T-I/MR (тот же форм-фактор и посадочное место) — отличается по Core, Supply Voltage, Operating Temperature, Package, Packaging.

Microchip Technology
Core: dsPIC33F, 16-bit DSC
Operating Temperature: -40C to +85C (I grade)
Package: 64-VQFN (9x9 mm) Exposed Pad
Microchip Technology
Core: dsPIC33 16-bit RISC
Supply Voltage: 3 V to 3.6 V
Operating Temperature: -40C to +125C

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

DSPIC33FJ64GS606T-E/MR

✅ Прямая замена
📦 64-VQFN (9x9, MR)
extended temperature grade (-40C to +125C vs -40C to +85C), otherwise identical 40 MIPS / 64 KB device, pin-to-pin

📋 Справочный аналог (нет в каталоге)

DSPIC33FJ64GS606T-50I/MR

✅ Прямая замена
📦 64-VQFN (9x9, MR)
50 MIPS performance grade vs 40 MIPS (+25% core speed), same flash, RAM, and peripherals, pin-to-pin

📋 Справочный аналог (нет в каталоге)

DSPIC33FJ64GS406-E/MR

✅ Прямая замена
Microchip Technology
📦 64-VQFN (9x9, MR)
dsPIC33 16-bit RISC · 40 MIPS · 40 MHz · 64 KB Flash · 8 KB · 3 V to 3.6 V · 21 · 4

✓ В наличии

$4.02 / шт.

Открыть даташит →

DSPIC33FJ32GS606-I/MR

✅ Прямая замена ⚠️ Характеристики не проверены
📦 64-VQFN (9x9, MR)
32 KB program flash vs 64 KB (-50% memory), same 40 MIPS core, peripherals, and 64-MR footprint

📋 Справочный аналог (нет в каталоге)

DSPIC33FJ32GS406-I/MR

✅ Прямая замена ⚠️ Характеристики не проверены
📦 64-VQFN (9x9, MR)
32 KB flash and GS406 reduced peripheral set vs GS606 64 KB, industrial grade, same 64-MR footprint

📋 Справочный аналог (нет в каталоге)

DSPIC33FJ64GS606T-I/MR Максимальные параметры и электрические характеристики

Core dsPIC33F 16-bit DSC
Series dsPIC33F GS
Max Clock Frequency 40 MHz
Performance 40 MIPS
Program Memory Size 64 KB (64K x 8) FLASH
RAM Size 9216 words
Напряжение питания 3.3 V
DMA Channels 4
Special Peripherals High-Speed PWM, High-Speed ADC, Comparators
Programming Interface ICSP via PGECx/PGEDx
Debug Features Boundary scan, on-chip debug
DSP Features Fixed-point DSP engine, barrel shifter
Temperature Range -40C to +85C (I grade, industrial)
Корпус 64-VQFN (9x9 mm) with Exposed Pad (MR)
Тип монтажа Surface Mount
Packaging Tube (Factory Pack Quantity: 40)
Статус RoHS Compliant
Typical Applications SMPS, AC-DC, DC-DC, PFC, UPS

Руководство по цоколевке DSPIC33FJ64GS606T-I/MR в корпусе 64-vqfn (9x9 mm) with exposed pad (mr)

Цоколевка для DSPIC33FJ64GS606T-I/MR (корпус 64-vqfn (9x9 mm) with exposed pad (mr)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 64-vqfn (9x9 mm) with exposed pad (mr) для DSPIC33FJ64GS606T-I/MR

Нет подробных данных о распиновке для DSPIC33FJ64GS606T-I/MR.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

DSPIC33FJ64GS606T-I/MR подходит для 6 применениеs: AC-to-DC Converters, Power Factor Correction (PFC), DC-to-DC Converters, Uninterruptible Power Supplies (UPS), Digital Lighting Ballasts and LED Drivers, Embedded Industrial Control with DSP Processing.

⚡

AC-to-DC Converters

The DSPIC33FJ64GS606T-I/MR directly controls offline AC-to-DC converter stages, where Microchip designed the GS family specifically for digital power conversion. Its high-speed PWM provides cycle-by-cycle duty control of the primary switch, while the high-speed ADC samples input voltage, input current, and output voltage fast enough to close inner current loops within each switching period. The four DMA channels offload ADC result transfers so the 40 MIPS core spends its time on control math rather than data movement. In a typical flyback or forward topology, the controller regulates the 3.3 V-to-5 V housekeeping rail with full brown-out and fault handling in firmware, eliminating several analog control ICs.

⚡

Power Factor Correction (PFC)

For power factor correction, the DSPIC33FJ64GS606T-I/MR executes the average-current-mode PFC control loop that Microchip demonstrated in its interleaved PFC reference design for SMPS dsPIC digital signal controllers. The high-speed ADC simultaneously samples the rectified line voltage and inductor current, and the high-speed PWM updates duty cycle every switching cycle to force input current to track line voltage, achieving near-unity power factor. Analog comparators provide hardware cycle-by-cycle overcurrent protection without waiting on firmware latency, a critical safety behavior in boost-PFC stages. With 64 KB of flash, firmware for PFC plus a downstream LLC or phase-shifted full-bridge controller fits in a single 64-VQFN device.

⚡

DC-to-DC Converters

In DC-to-DC converter applications such as telecom rectifier bricks and point-of-load brick modules, the DSPIC33FJ64GS606T-I/MR replaces multiple analog PWM controllers with one programmable device. The high-speed PWM supports complementary outputs with dead-time insertion for synchronous buck or boost topologies, while the high-speed ADC closes the voltage loop with firmware PID compensation. Software-defined control laws allow adaptive gain scheduling across load ranges that fixed analog compensation cannot match. The 3.3 V supply, industrial temperature rating of -40C to +85C, and 40 MIPS throughput comfortably support switching frequencies in the hundreds of kilohertz range typical of these designs, with the exposed-pad QFN package aiding heat removal.

🖥️

Uninterruptible Power Supplies (UPS)

The DSPIC33FJ64GS606T-I/MR is explicitly listed by Microchip as supporting uninterruptible power supply applications. A line-interactive or double-conversion UPS requires simultaneous control of an AC input bridge, battery charger, and inverter output stage - precisely the multi-loop problem the GS family was architected for. The high-speed ADC samples battery voltage, bus voltage, and output waveform together, and the high-speed PWM generates the inverter's sinusoidal PWM drive while the 40 MIPS core handles state machines for transfer logic and fault management. The four DMA channels keep sample streams flowing during interrupts, and 64 KB of flash accommodates complex transfer-control firmware with room for field updates.

💡

Digital Lighting Ballasts and LED Drivers

High-intensity discharge (HID) ballasts and high-power LED drivers benefit from the DSPIC33FJ64GS606T-I/MR's combination of high-speed PWM and precise ADC feedback. Ballast control requires ignition, warm-up, and run phases with different frequency and duty profiles - trivially implemented as firmware states on the 40 MIPS core but requiring external sequencing circuits with analog controllers. For LED drivers, the controller closes a fast current loop per channel while managing dimming via PWM or analog dimming signals. The comparators provide per-cycle overcurrent shutdown for shorted-load protection. The 64-VQFN MR package's compact 9x9 mm footprint fits the constrained board space of lighting ballast enclosures.

🏭

Embedded Industrial Control with DSP Processing

Beyond power conversion, the DSPIC33FJ64GS606T-I/MR serves general embedded control that benefits from DSP capability: motor control front-ends, sensor conditioning, and signal-processing-intensive industrial nodes. The core's fixed-point DSP engine and barrel shifter accelerate FIR filtering and FFT calculations, while conventional MCU peripherals handle communication and housekeeping. ICSP debugging through PGECx/PGEDx pins enables iterative firmware development directly on the production board - Microchip's datasheet recommends short ICSP trace lengths for reliable debugging. With 9216 words of RAM and four DMA channels, the device sustains concurrent control and communication tasks, making it a consolidation point that reduces system BOM cost versus separate MCU plus DSP solutions.

Сводка рекомендуемых товаров

DSPIC33FJ64GS606T-50I/MR Higher-speed pin-compatible variant for tighter loop bandwidth Используется в: AC-to-DC Converters, Embedded Industrial Control with DSP Processing MCP1702 3.3V LDO for controller supply rail Используется в: AC-to-DC Converters DSPIC33FJ64GS606T-I/PT Microchip Technology Используется в: Power Factor Correction (PFC) MCP9700A Temperature monitoring for thermal fault protection Используется в: Power Factor Correction (PFC) DSPIC33FJ32GS606-I/MR Pin-compatible cost-reduced variant with 32 KB flash Используется в: DC-to-DC Converters MCP7940N RTC for runtime event logging Используется в: DC-to-DC Converters DSPIC33FJ64GS606T-E/MR Extended-temperature drop-in for harsh-environment UPS Используется в: Uninterruptible Power Supplies (UPS) MCP3202 Auxiliary 12-bit ADC for supervisory measurements Используется в: Uninterruptible Power Supplies (UPS) DSPIC33FJ64GS406-E/MR Microchip Technology Используется в: Digital Lighting Ballasts and LED Drivers MCP1541 Voltage reference for ADC accuracy Используется в: Digital Lighting Ballasts and LED Drivers MCP2562 CAN transceiver for industrial networking Используется в: Embedded Industrial Control with DSP Processing
What is the DSPIC33FJ64GS606T-I/MR?
The DSPIC33FJ64GS606T-I/MR is a 16-bit dsPIC33F GS family digital signal controller from Microchip Technology. According to the manufacturer product page, it integrates 64 KB of flash, 9216 words of RAM, a 40 MHz / 40 MIPS core, high-speed PWM, a high-speed ADC, and comparators in a 64-pin VQFN (MR) package with exposed pad, targeting digital switch-mode power supply control.
What is the price of DSPIC33FJ64GS606T-I/MR?
XAIPART lists the DSPIC33FJ64GS606T-I/MR at 6.20 USD for quantity 1 as of 2026-09-27, with quantity breaks at 10 units (5.55 USD), 100 units (4.80 USD), 500 units (4.30 USD), and 1000 units (3.90 USD). Distributor pricing varies by stock position; Octopart reports multiple distributors carrying this part, so compare bulk tiers before ordering.
Where to buy DSPIC33FJ64GS606T-I/MR online?
You can buy the DSPIC33FJ64GS606T-I/MR on XAIPART, and it is also listed by distributors such as DigiKey Electronics, Hotenda, and Jotrin Electronics, with availability tracked on Octopart. The tape-and-reel suffix (T) part is supplied in tube factory packs of 40 units; for volume production orders, request quote-based pricing on quantities above 1000 units.
What is the difference between DSPIC33FJ64GS606T-I/MR and DSPIC33FJ64GS606T-50I/MR?
The key difference is performance grade: the DSPIC33FJ64GS606T-50I/MR runs at up to 50 MIPS while the DSPIC33FJ64GS606T-I/MR runs at 40 MIPS. Both use the same 64-VQFN (9x9) MR package, the same 64 KB flash, and the same GS family peripherals, so they are functionally interchangeable when your control-loop timing fits within 40 MIPS.
Can DSPIC33FJ64GS606T-E/MR replace DSPIC33FJ64GS606T-I/MR?
Yes. The DSPIC33FJ64GS606T-E/MR is the extended-temperature variant of the same device: identical 16-bit 40 MHz core, 64 KB flash, 9216-word RAM, and identical 64-VQFN (MR) footprint. The -E suffix covers a wider operating temperature range than the -I industrial grade, making it a direct drop-in with additional environmental margin.
Is DSPIC33FJ64GS606T-I/MR the same as DSPIC33FJ64GS606T-I/PT?
They are the same die and functionality but different packages: the /MR suffix is a 64-VQFN (9x9 mm) with exposed pad, while the /PT suffix is a 64-TQFP (10x10 mm). Both are listed in the GS family datasheet as drop-in functional equivalents, but the footprints differ, so a PCB redesign is needed to switch between them.
What is the best Microchip drop-in replacement for DSPIC33FJ64GS606T-I/MR?
The best drop-in replacement is DSPIC33FJ64GS606T-E/MR (same 64-VQFN MR package, same specs, extended temperature) or DSPIC33FJ64GS606T-50I/MR (same package, higher 50 MIPS grade). If you can accept half the program memory, the DSPIC33FJ32GS606-I/MR is pin-compatible in the same 64-MR footprint and suits cost-optimized builds.
What is the best cross-brand equivalent for DSPIC33FJ64GS606T-I/MR?
There is no true cross-brand pin-to-pin equivalent verified in the available cross-reference data: the GS family's integrated high-speed PWM/ADC combination in the 64-VQFN MR package is Microchip-specific. DigiKey's cross-reference tool returns only parametrically similar (not pin-compatible) options. For SMPS control migration, evaluate TI C2000 or STMicroelectronics STM32 digital-power parts, which require PCB and firmware rework.
When should I choose DSPIC33FJ64GS606T-I/MR over DSPIC33FJ64GS406?
Choose the DSPIC33FJ64GS606T-I/MR when you need the full 64 KB of program flash; choose the DSPIC33FJ64GS406 (e.g., DSPIC33FJ64GS406-E/MR in the same 64-MR package) when your control firmware fits in the smaller memory of the GS406 variant and you want the lowest-cost option. Both share the GS family PWM/ADC peripherals, so porting effort between them is minimal.
Is the DSPIC33FJ64GS606T-I/MR suitable for power factor correction applications?
Yes. According to Microchip's product page, the dsPIC33F GS family with high-speed PWM, high-speed ADC, and comparators explicitly supports power factor correction (PFC), including interleaved PFC reference designs. The 40 MIPS core has adequate headroom for a PFC inner current loop plus an outer voltage loop running concurrently with DC-DC control loops in the same device.
Where to download the DSPIC33FJ64GS606T-I/MR datasheet PDF?
Download the datasheet from Microchip's document server at ww1.microchip.com (document 70000591f.pdf), which covers the dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 family including the GS606. The same PDF is reachable through the Microchip product page for dsPIC33FJ64GS606 and mirror sites like alldatasheet.com.
Where can I find the pinout of DSPIC33FJ64GS606T-I/MR?
The full 64-pin VQFN (MR) pin assignment diagram appears in the GS family datasheet (Microchip document 70000591f.pdf), in the pin diagrams section. Key pins include VDD/VSS pairs around the ring, PGECx/PGEDx pairs for ICSP programming and debugging, PWM output pins, and analog inputs shared with the high-speed ADC. Always cross-check the MR package table, as TQFP pin numbering differs.
What are the key specifications of DSPIC33FJ64GS606T-I/MR that engineers should know?
Key specifications: 16-bit dsPIC33F core at 40 MHz / 40 MIPS; 64 KB (64K x 8) program flash and 9216 words of RAM; 3.3 V supply; high-speed PWM, high-speed ADC, and analog comparators for digital power control; 4 DMA channels; ICSP debug via PGECx/PGEDx; 64-VQFN (9x9 mm) exposed-pad MR package; industrial temperature range of -40C to +85C; RoHS compliant.
What power supply decoupling does the DSPIC33FJ64GS606T-I/MR need?
The device operates from a 3.3 V rail, and per Microchip's standard dsPIC33F layout practice, each VDD/VSS pair should have a 0.1 uF ceramic capacitor placed within 2-3 mm of the pins, with a bulk 4.7-10 uF capacitor near the package. Because the exposed pad is thermally conductive, solder it to a grounded copper pour to improve both heat spreading and supply integrity.
How do I program and debug the DSPIC33FJ64GS606T-I/MR?
Programming and debugging use In-Circuit Serial Programming (ICSP) through the PGECx and PGEDx pin pairs with Microchip development tools such as the PICkit or ICD families. According to the GS family datasheet, trace lengths between the ICSP connector and the PGECx/PGEDx pins should be kept as short as possible for reliable in-circuit serial programming and debugging.

Справочные инженерные данные для DSPIC33FJ64GS606T-I/MR — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the DSPIC33FJ64GS606T-I/MR when you need the full GS606 peripheral set and 64 KB flash at the standard industrial temperature range and lowest GS606 cost - the typical choice for AC-DC, PFC, and UPS control boards. Choose DSPIC33FJ64GS606T-E/MR when ambient temperature can exceed 85C or you want derating margin, at a modest premium, with zero layout change. Choose DSPIC33FJ64GS606T-50I/MR when your control loops need more than 40 MIPS, for example high-frequency LLC control with fast inner loops - it is pin-to-pin identical. Choose DSPIC33FJ32GS606-I/MR or the GS406 variants only when firmware demonstrably fits in 32 KB or the reduced peripheral set, capturing cost savings on cost-optimized products. All five parts share the same 64-VQFN (9x9) MR footprint, so a single PCB layout supports the entire range.

Сравнение с аналогами

Параметр Этот товар DSPIC33FJ64GS606T-E/MR DSPIC33FJ64GS606T-50I/MR DSPIC33FJ64GS406-E/MR DSPIC33FJ32GS606-I/MR
Package 64-VQFN (9x9, MR) exposed pad 64-VQFN (9x9, MR) - same 64-VQFN (9x9, MR) - same 64-VQFN (9x9, MR) - same 64-VQFN (9x9, MR) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Performance 40 MIPS 40 MIPS 50 MIPS 40 MIPS 40 MIPS
Temperature Range -40C to +85C (I) -40C to +125C (E, extended) -40C to +85C (I) -40C to +125C (E) -40C to +85C (I)
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Key Peripherals High-Speed PWM, High-Speed ADC, Comparators Same GS606 peripherals Same GS606 peripherals GS406 reduced set Same GS606 peripherals

Ключевые отличия

  • Cost-optimized industrial grade (против DSPIC33FJ64GS606T-E/MR)
  • Full 64 KB flash headroom (против DSPIC33FJ32GS606-I/MR)
  • Performance ceiling (против DSPIC33FJ64GS606T-50I/MR)
  • GS606 full peripheral set (против DSPIC33FJ64GS406-E/MR)

Заметки по проектированию

Solder the exposed thermal pad of the 64-VQFN (9x9) MR package to a grounded copper pour with an array of thermal vias. This pad is the primary heat removal path for the die; an unsoldered or poorly wetted pad can raise junction temperature significantly during continuous 40 MIPS operation and high PWM duty cycles. Microchip package outline drawings in the GS family datasheet specify the recommended land pattern and stencil aperture design for reliable pad wetting.

Keep ICSP traces short: per the GS family datasheet, trace length between the ICSP connector and the PGECx/PGEDx pins should be kept as short as possible for reliable in-circuit serial programming and debugging. In dense SMPS layouts, route PGECx/PGEDx away from PWM output nets and gate-driver loops, since switching-edge coupling on debug pins can cause erratic erase/program behavior during field firmware updates.

Decouple every VDD/VSS pair with a 0.1 uF ceramic capacitor placed within 2-3 mm of the pins, plus a bulk 4.7-10 uF capacitor near the package. In digital power applications, the controller's own supply often shares a rail with noisy gate-driver circuitry; consider an RC filter or small LDO for the 3.3 V controller supply to keep ADC reference noise out of your control-loop measurements.

Verify the performance grade matches your control-loop budget before committing the layout: the -I/MR variant tops out at 40 MIPS while the -50I/MR grade reaches 50 MIPS in the identical 64-MR footprint. Firmware written with minimal cycle margin at 40 MIPS may miss switching-period deadlines at high PWM frequencies; choose the 50 MIPS variant when loop bandwidth is tight, since it is a pin-to-pin upgrade requiring no PCB change.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

Per Abacus Technologies listing for the GS606 family: EU RoHS Compliant, REACH Compliant, DRC Conflict Free. AEC-Q100 qualification is not stated in the provided data.

Данные проверены: 2026-09-27 — данные проверены и курируются командой компонентной инженерии XAIPART

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