DSPIC33FJ64GS606T-I/MR - 16-bit 40MIPS DSC 64KB | Microchip
부품 번호: DSPIC33FJ64GS606T-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.55 | $55.50 |
| 100 | $4.8 | $480.00 |
| 500 | $4.3 | $2,150.00 |
| 1,000 | $3.9 | $3,900.00 |
DSPIC33FJ64GS606T-I/MR 개요
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and control flexibility of a microcontroller. Within the power-management hierarchy, a DSC sits above a standard MCU for closed-loop control tasks: it executes control loops fast enough for switch-mode power conversion while integrating specialized analog and timing peripherals on one die.
Key features include a high-speed PWM module purpose-built for digital switch-mode power supplies (SMPS), a high-speed 10-bit ADC with multiple sample-and-hold circuits for simultaneous multi-rail sampling, analog comparators, and four DMA channels. The device supports In-Circuit Serial Programming (ICSP) and debugging via PGECx/PGEDx pins, plus boundary-scan capability and low-power modes.
Technically, the dsPIC33FJ64GS606 core pairs a 16-bit modified Harvard architecture with DSP engine instructions (fixed-point format, barrel shifter), letting a single device run a PFC loop and downstream DC-DC loops concurrently. Peripheral pin-select and rich timer resources reduce external glue logic in compact power supplies.
Typical applications include AC-to-DC converters, DC-to-DC converters, power factor correction (PFC) stages, uninterruptible power supplies, and digital lighting ballasts. The GS family was explicitly designed by Microchip for these multi-loop digital power-conversion applications.
Design consideration: keep the ICSP connector trace lengths to PGECx/PGEDx as short as possible for reliable in-circuit debugging, and verify that the 40 MIPS grade (-I, industrial temperature) matches your switching-frequency headroom; a 50 MIPS variant exists if more loop bandwidth is required.
This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: DSPIC33FJ64GS606T-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33FJ64GS606T-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Core, Supply Voltage, Operating Temperature, Package, Packaging.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33FJ64GS606T-E/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ64GS606T-50I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ64GS406-E/MR
✅ 드롭인✓ 재고 있음
$4.02 / 개
데이터시트 보기 →DSPIC33FJ32GS606-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ32GS406-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ64GS606T-I/MR 최대 정격 & 전기적 특성
| Core | dsPIC33F 16-bit DSC |
| Series | dsPIC33F GS |
| Max Clock Frequency | 40 MHz |
| Performance | 40 MIPS |
| Program Memory Size | 64 KB (64K x 8) FLASH |
| RAM Size | 9216 words |
| 공급 전압 | 3.3 V |
| DMA Channels | 4 |
| Special Peripherals | High-Speed PWM, High-Speed ADC, Comparators |
| Programming Interface | ICSP via PGECx/PGEDx |
| Debug Features | Boundary scan, on-chip debug |
| DSP Features | Fixed-point DSP engine, barrel shifter |
| Temperature Range | -40C to +85C (I grade, industrial) |
| 패키지 | 64-VQFN (9x9 mm) with Exposed Pad (MR) |
| 실장 유형 | Surface Mount |
| Packaging | Tube (Factory Pack Quantity: 40) |
| RoHS 상태 | Compliant |
| Typical Applications | SMPS, AC-DC, DC-DC, PFC, UPS |
DSPIC33FJ64GS606T-I/MR 64-vqfn (9x9 mm) with exposed pad (mr) 핀 구성 가이드
DSPIC33FJ64GS606T-I/MR(64-vqfn (9x9 mm) with exposed pad (mr) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33FJ64GS606T-I/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33FJ64GS606T-I/MR 적합 용도: 6 애플리케이션s: AC-to-DC Converters, Power Factor Correction (PFC), DC-to-DC Converters, Uninterruptible Power Supplies (UPS), Digital Lighting Ballasts and LED Drivers, Embedded Industrial Control with DSP Processing.
AC-to-DC Converters
The DSPIC33FJ64GS606T-I/MR directly controls offline AC-to-DC converter stages, where Microchip designed the GS family specifically for digital power conversion. Its high-speed PWM provides cycle-by-cycle duty control of the primary switch, while the high-speed ADC samples input voltage, input current, and output voltage fast enough to close inner current loops within each switching period. The four DMA channels offload ADC result transfers so the 40 MIPS core spends its time on control math rather than data movement. In a typical flyback or forward topology, the controller regulates the 3.3 V-to-5 V housekeeping rail with full brown-out and fault handling in firmware, eliminating several analog control ICs.
추천
Power Factor Correction (PFC)
For power factor correction, the DSPIC33FJ64GS606T-I/MR executes the average-current-mode PFC control loop that Microchip demonstrated in its interleaved PFC reference design for SMPS dsPIC digital signal controllers. The high-speed ADC simultaneously samples the rectified line voltage and inductor current, and the high-speed PWM updates duty cycle every switching cycle to force input current to track line voltage, achieving near-unity power factor. Analog comparators provide hardware cycle-by-cycle overcurrent protection without waiting on firmware latency, a critical safety behavior in boost-PFC stages. With 64 KB of flash, firmware for PFC plus a downstream LLC or phase-shifted full-bridge controller fits in a single 64-VQFN device.
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DC-to-DC Converters
In DC-to-DC converter applications such as telecom rectifier bricks and point-of-load brick modules, the DSPIC33FJ64GS606T-I/MR replaces multiple analog PWM controllers with one programmable device. The high-speed PWM supports complementary outputs with dead-time insertion for synchronous buck or boost topologies, while the high-speed ADC closes the voltage loop with firmware PID compensation. Software-defined control laws allow adaptive gain scheduling across load ranges that fixed analog compensation cannot match. The 3.3 V supply, industrial temperature rating of -40C to +85C, and 40 MIPS throughput comfortably support switching frequencies in the hundreds of kilohertz range typical of these designs, with the exposed-pad QFN package aiding heat removal.
추천
Uninterruptible Power Supplies (UPS)
The DSPIC33FJ64GS606T-I/MR is explicitly listed by Microchip as supporting uninterruptible power supply applications. A line-interactive or double-conversion UPS requires simultaneous control of an AC input bridge, battery charger, and inverter output stage - precisely the multi-loop problem the GS family was architected for. The high-speed ADC samples battery voltage, bus voltage, and output waveform together, and the high-speed PWM generates the inverter's sinusoidal PWM drive while the 40 MIPS core handles state machines for transfer logic and fault management. The four DMA channels keep sample streams flowing during interrupts, and 64 KB of flash accommodates complex transfer-control firmware with room for field updates.
추천
Digital Lighting Ballasts and LED Drivers
High-intensity discharge (HID) ballasts and high-power LED drivers benefit from the DSPIC33FJ64GS606T-I/MR's combination of high-speed PWM and precise ADC feedback. Ballast control requires ignition, warm-up, and run phases with different frequency and duty profiles - trivially implemented as firmware states on the 40 MIPS core but requiring external sequencing circuits with analog controllers. For LED drivers, the controller closes a fast current loop per channel while managing dimming via PWM or analog dimming signals. The comparators provide per-cycle overcurrent shutdown for shorted-load protection. The 64-VQFN MR package's compact 9x9 mm footprint fits the constrained board space of lighting ballast enclosures.
추천
Embedded Industrial Control with DSP Processing
Beyond power conversion, the DSPIC33FJ64GS606T-I/MR serves general embedded control that benefits from DSP capability: motor control front-ends, sensor conditioning, and signal-processing-intensive industrial nodes. The core's fixed-point DSP engine and barrel shifter accelerate FIR filtering and FFT calculations, while conventional MCU peripherals handle communication and housekeeping. ICSP debugging through PGECx/PGEDx pins enables iterative firmware development directly on the production board - Microchip's datasheet recommends short ICSP trace lengths for reliable debugging. With 9216 words of RAM and four DMA channels, the device sustains concurrent control and communication tasks, making it a consolidation point that reduces system BOM cost versus separate MCU plus DSP solutions.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33FJ64GS606T-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33FJ64GS606T-E/MR | DSPIC33FJ64GS606T-50I/MR | DSPIC33FJ64GS406-E/MR | DSPIC33FJ32GS606-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9, MR) exposed pad | 64-VQFN (9x9, MR) - same | 64-VQFN (9x9, MR) - same | 64-VQFN (9x9, MR) - same | 64-VQFN (9x9, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Performance | 40 MIPS | 40 MIPS | 50 MIPS | 40 MIPS | 40 MIPS |
| Temperature Range | -40C to +85C (I) | -40C to +125C (E, extended) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Key Peripherals | High-Speed PWM, High-Speed ADC, Comparators | Same GS606 peripherals | Same GS606 peripherals | GS406 reduced set | Same GS606 peripherals |
주요 차별점
- Cost-optimized industrial grade (vs DSPIC33FJ64GS606T-E/MR)
- Full 64 KB flash headroom (vs DSPIC33FJ32GS606-I/MR)
- Performance ceiling (vs DSPIC33FJ64GS606T-50I/MR)
- GS606 full peripheral set (vs DSPIC33FJ64GS406-E/MR)
설계 노트
Solder the exposed thermal pad of the 64-VQFN (9x9) MR package to a grounded copper pour with an array of thermal vias. This pad is the primary heat removal path for the die; an unsoldered or poorly wetted pad can raise junction temperature significantly during continuous 40 MIPS operation and high PWM duty cycles. Microchip package outline drawings in the GS family datasheet specify the recommended land pattern and stencil aperture design for reliable pad wetting.
Keep ICSP traces short: per the GS family datasheet, trace length between the ICSP connector and the PGECx/PGEDx pins should be kept as short as possible for reliable in-circuit serial programming and debugging. In dense SMPS layouts, route PGECx/PGEDx away from PWM output nets and gate-driver loops, since switching-edge coupling on debug pins can cause erratic erase/program behavior during field firmware updates.
Decouple every VDD/VSS pair with a 0.1 uF ceramic capacitor placed within 2-3 mm of the pins, plus a bulk 4.7-10 uF capacitor near the package. In digital power applications, the controller's own supply often shares a rail with noisy gate-driver circuitry; consider an RC filter or small LDO for the 3.3 V controller supply to keep ADC reference noise out of your control-loop measurements.
Verify the performance grade matches your control-loop budget before committing the layout: the -I/MR variant tops out at 40 MIPS while the -50I/MR grade reaches 50 MIPS in the identical 64-MR footprint. Firmware written with minimal cycle margin at 40 MIPS may miss switching-period deadlines at high PWM frequencies; choose the 50 MIPS variant when loop bandwidth is tight, since it is a pin-to-pin upgrade requiring no PCB change.
규정 준수 정보
Per Abacus Technologies listing for the GS606 family: EU RoHS Compliant, REACH Compliant, DRC Conflict Free. AEC-Q100 qualification is not stated in the provided data.
