EP1K10QC208-2 - ACEX-1K FPGA, 10K Gates, 576 Logic Elements, 208-PQFP | Intel (Altera)
Артикул: EP1K10QC208-2 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $21.06 | $21,06 |
| 10 | $18.75 | $187,50 |
| 100 | $16.38 | $1.638,00 |
| 500 | $14.2 | $7.100,00 |
| 1.000 | $12.5 | $12.500,00 |
EP1K10QC208-2 Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the user can re-program in-system to implement arbitrary digital functions. FPGAs sit between fixed-function ASICs and microcontrollers: more flexible than ASICs (no mask set, no NRE) and faster/higher-throughput than microcontroller firmware. ACEX-1K sits in the low-density end of the historical Altera product tree: FPGA family > SRAM-based FPGA > low-cost programmable logic > system-on-a-programmable-chip (SOPC) building block.
Key features include on-chip dual-port RAM for FIFO and register-file implementation, embedded array blocks (EABs) for memory-mapped functions, JTAG-based IEEE 1149.1 boundary-scan test support, and dedicated routing resources that preserve timing margins at the -2 speed grade. The 208-BQFP package is a through-hole-compatible gull-wing surface-mount outline, enabling PCB layouts that have been in continuous service in industrial controllers, telecom line cards, and test equipment for two decades.
Typical applications include industrial control and factory automation backplanes, telecom line-interface glue logic, legacy test-and-measurement instrumentation, and migration of older discrete-TTL designs onto a single reconfigurable device. The ACEX-1K family uses SRAM configuration cells, so a configuration PROM (EPC1, EPC2) or a microcontroller-driven download cable is required to load the bitstream at every power-up.
When designing with this part, verify that your Quartus II design flow targets the ACEX-1K device family explicitly; newer Quartus versions do not include the legacy ACEX-1K libraries, so an older release or a third-party toolchain may be required. Plan for the configuration memory requirement: an 8-bit-wide EPC2 or compatible serial PROM is the standard storage device for production boards.
Аналоги без доработки для EP1K10QC208-2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP1K10QC208-2 (тот же форм-фактор и посадочное место) — отличается по Process Technology, Total RAM Bits, Package, Speed Grade, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP1K10QC208-2N
✅ Прямая замена✓ В наличии
$7.95 / шт.
Открыть даташит →EP1K10QC208-1N
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →EP1K100QC208-2N
✅ Прямая замена✓ В наличии
$16.42 / шт.
Открыть даташит →EP1K100QC208-3
✅ Прямая замена✓ В наличии
$60.04 / шт.
Открыть даташит →EP1K100QC208-1
✅ Прямая замена✓ В наличии
$20.85 / шт.
Открыть даташит →EP1K10QC208-2 Максимальные параметры и электрические характеристики
| Family | ACEX-1K |
| Logic Elements | 576 |
| Configurable Logic Blocks (CLBs) | 72 |
| Equivalent Gates | 10,000 |
| Embedded RAM Bits | 12,288 |
| Embedded Array Blocks (EABs) | 3 (per datasheet, 4096-bit each) |
| Maximum User I/O | 120 |
| Supply Voltage (Core) | 2.5 V |
| Speed Grade | -2 |
| Корпус | 208-pin BQFP (PQFP, gull-wing) |
| Рабочая температура | Commercial (0C to +70C) |
| Configuration Method | SRAM, serial |
| Process Technology | 2.5 V CMOS |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Lead-Free / RoHS | Non-compliant (legacy Altera part) |
Конфигурация выводов EP1K10QC208-2
| Контакт 1 | GND — Ground reference |
| Контакт 2 | I/O — User I/O bank 1 |
| Контакт 3 | I/O — User I/O bank 1 |
| Контакт 4 | I/O — User I/O bank 1 |
| Контакт 5 | I/O — User I/O bank 1 |
| Контакт 6 | I/O — User I/O bank 1 |
| Контакт 7 | I/O — User I/O bank 1 |
| Контакт 8 | I/O — User I/O bank 1 |
| Контакт 9 | I/O — User I/O bank 1 |
| Контакт 10 | I/O — User I/O bank 1 |
| Контакт 11 | I/O — User I/O bank 1 |
| Контакт 12 | I/O — User I/O bank 1 |
| Контакт 13 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 14 | I/O — User I/O bank 2 |
| Контакт 15 | I/O — User I/O bank 2 |
| Контакт 16 | I/O — User I/O bank 2 |
| Контакт 17 | I/O — User I/O bank 2 |
| Контакт 18 | I/O — User I/O bank 2 |
| Контакт 19 | I/O — User I/O bank 2 |
| Контакт 20 | I/O — User I/O bank 2 |
| Контакт 21 | I/O — User I/O bank 2 |
| Контакт 22 | I/O — User I/O bank 2 |
| Контакт 23 | I/O — User I/O bank 2 |
| Контакт 24 | I/O — User I/O bank 2 |
| Контакт 25 | I/O — User I/O bank 2 |
| Контакт 26 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 27 | GND — Ground reference |
| Контакт 28 | I/O — User I/O bank 3 |
| Контакт 29 | I/O — User I/O bank 3 |
| Контакт 30 | I/O — User I/O bank 3 |
| Контакт 31 | I/O — User I/O bank 3 |
| Контакт 32 | I/O — User I/O bank 3 |
| Контакт 33 | I/O — User I/O bank 3 |
| Контакт 34 | I/O — User I/O bank 3 |
| Контакт 35 | I/O — User I/O bank 3 |
| Контакт 36 | I/O — User I/O bank 3 |
| Контакт 37 | I/O — User I/O bank 3 |
| Контакт 38 | I/O — User I/O bank 3 |
| Контакт 39 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 40 | I/O — User I/O bank 4 |
| Контакт 41 | I/O — User I/O bank 4 |
| Контакт 42 | I/O — User I/O bank 4 |
| Контакт 43 | I/O — User I/O bank 4 |
| Контакт 44 | I/O — User I/O bank 4 |
| Контакт 45 | I/O — User I/O bank 4 |
| Контакт 46 | I/O — User I/O bank 4 |
| Контакт 47 | I/O — User I/O bank 4 |
| Контакт 48 | I/O — User I/O bank 4 |
| Контакт 49 | I/O — User I/O bank 4 |
| Контакт 50 | I/O — User I/O bank 4 |
| Контакт 51 | I/O — User I/O bank 4 |
| Контакт 52 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 53 | I/O — User I/O bank 5 |
| Контакт 54 | I/O — User I/O bank 5 |
| Контакт 55 | I/O — User I/O bank 5 |
| Контакт 56 | I/O — User I/O bank 5 |
| Контакт 57 | I/O — User I/O bank 5 |
| Контакт 58 | I/O — User I/O bank 5 |
| Контакт 59 | I/O — User I/O bank 5 |
| Контакт 60 | I/O — User I/O bank 5 |
| Контакт 61 | I/O — User I/O bank 5 |
| Контакт 62 | I/O — User I/O bank 5 |
| Контакт 63 | I/O — User I/O bank 5 |
| Контакт 64 | I/O — User I/O bank 5 |
| Контакт 65 | VCCIO5 — I/O bank 5 supply voltage |
| Контакт 66 | I/O — User I/O bank 6 |
| Контакт 67 | I/O — User I/O bank 6 |
| Контакт 68 | I/O — User I/O bank 6 |
| Контакт 69 | I/O — User I/O bank 6 |
| Контакт 70 | I/O — User I/O bank 6 |
| Контакт 71 | I/O — User I/O bank 6 |
| Контакт 72 | I/O — User I/O bank 6 |
| Контакт 73 | I/O — User I/O bank 6 |
| Контакт 74 | I/O — User I/O bank 6 |
| Контакт 75 | I/O — User I/O bank 6 |
| Контакт 76 | I/O — User I/O bank 6 |
| Контакт 77 | I/O — User I/O bank 6 |
| Контакт 78 | VCCIO6 — I/O bank 6 supply voltage |
| Контакт 79 | I/O — User I/O bank 7 |
| Контакт 80 | I/O — User I/O bank 7 |
| Контакт 81 | I/O — User I/O bank 7 |
| Контакт 82 | I/O — User I/O bank 7 |
| Контакт 83 | I/O — User I/O bank 7 |
| Контакт 84 | I/O — User I/O bank 7 |
| Контакт 85 | I/O — User I/O bank 7 |
| Контакт 86 | I/O — User I/O bank 7 |
| Контакт 87 | I/O — User I/O bank 7 |
| Контакт 88 | I/O — User I/O bank 7 |
| Контакт 89 | I/O — User I/O bank 7 |
| Контакт 90 | I/O — User I/O bank 7 |
| Контакт 91 | VCCIO7 — I/O bank 7 supply voltage |
| Контакт 92 | I/O — User I/O bank 8 |
| Контакт 93 | I/O — User I/O bank 8 |
| Контакт 94 | I/O — User I/O bank 8 |
| Контакт 95 | I/O — User I/O bank 8 |
| Контакт 96 | I/O — User I/O bank 8 |
| Контакт 97 | I/O — User I/O bank 8 |
| Контакт 98 | I/O — User I/O bank 8 |
| Контакт 99 | I/O — User I/O bank 8 |
| Контакт 100 | I/O — User I/O bank 8 |
| Контакт 101 | I/O — User I/O bank 8 |
| Контакт 102 | I/O — User I/O bank 8 |
| Контакт 103 | I/O — User I/O bank 8 |
| Контакт 104 | VCCIO8 — I/O bank 8 supply voltage |
| Контакт 105 | VCCINT — Core supply voltage (2.5 V) |
| Контакт 106 | GND — Ground reference |
| Контакт 107 | TMS — JTAG test mode select |
| Контакт 108 | TCK — JTAG test clock |
| Контакт 109 | TDI — JTAG test data input |
| Контакт 110 | TDO — JTAG test data output |
| Контакт 111 | TRST — JTAG test reset (active low) |
| Контакт 112 | nSTATUS — Configuration status (active low) |
| Контакт 113 | nCONFIG — Configuration control (active low) |
| Контакт 114 | CONF_DONE — Configuration complete (open-drain) |
| Контакт 115 | DCLK — Configuration clock |
| Контакт 116 | DATA0 — Configuration data input |
| Контакт 117 | MSEL0 — Configuration mode select |
| Контакт 118 | MSEL1 — Configuration mode select |
| Контакт 119 | nCE — Chip enable (active low) |
| Контакт 120 | nCEO — Chip enable out (active low, for cascading) |
| Контакт 121 | VCCINT — Core supply voltage (2.5 V) |
| Контакт 122 | GND — Ground reference |
| Контакт 123 | I/O — User I/O bank 4 |
| Контакт 124 | I/O — User I/O bank 4 |
| Контакт 125 | I/O — User I/O bank 4 |
| Контакт 126 | I/O — User I/O bank 4 |
| Контакт 127 | I/O — User I/O bank 4 |
| Контакт 128 | I/O — User I/O bank 4 |
| Контакт 129 | I/O — User I/O bank 4 |
| Контакт 130 | I/O — User I/O bank 4 |
| Контакт 131 | I/O — User I/O bank 3 |
| Контакт 132 | I/O — User I/O bank 3 |
| Контакт 133 | I/O — User I/O bank 3 |
| Контакт 134 | I/O — User I/O bank 3 |
| Контакт 135 | I/O — User I/O bank 3 |
| Контакт 136 | I/O — User I/O bank 3 |
| Контакт 137 | I/O — User I/O bank 3 |
| Контакт 138 | I/O — User I/O bank 3 |
| Контакт 139 | GND — Ground reference |
| Контакт 140 | I/O — User I/O bank 2 |
| Контакт 141 | I/O — User I/O bank 2 |
| Контакт 142 | I/O — User I/O bank 2 |
| Контакт 143 | I/O — User I/O bank 2 |
| Контакт 144 | I/O — User I/O bank 2 |
| Контакт 145 | I/O — User I/O bank 2 |
| Контакт 146 | I/O — User I/O bank 2 |
| Контакт 147 | I/O — User I/O bank 2 |
| Контакт 148 | I/O — User I/O bank 1 |
| Контакт 149 | I/O — User I/O bank 1 |
| Контакт 150 | I/O — User I/O bank 1 |
| Контакт 151 | I/O — User I/O bank 1 |
| Контакт 152 | I/O — User I/O bank 1 |
| Контакт 153 | I/O — User I/O bank 1 |
| Контакт 154 | I/O — User I/O bank 1 |
| Контакт 155 | I/O — User I/O bank 1 |
| Контакт 156 | VCCINT — Core supply voltage (2.5 V) |
| Контакт 157 | GND — Ground reference |
| Контакт 158 | I/O — User I/O bank 8 |
| Контакт 159 | I/O — User I/O bank 8 |
| Контакт 160 | I/O — User I/O bank 8 |
| Контакт 161 | I/O — User I/O bank 8 |
| Контакт 162 | I/O — User I/O bank 8 |
| Контакт 163 | I/O — User I/O bank 8 |
| Контакт 164 | I/O — User I/O bank 8 |
| Контакт 165 | I/O — User I/O bank 8 |
| Контакт 166 | I/O — User I/O bank 7 |
| Контакт 167 | I/O — User I/O bank 7 |
| Контакт 168 | I/O — User I/O bank 7 |
| Контакт 169 | I/O — User I/O bank 7 |
| Контакт 170 | I/O — User I/O bank 7 |
| Контакт 171 | I/O — User I/O bank 7 |
| Контакт 172 | I/O — User I/O bank 7 |
| Контакт 173 | I/O — User I/O bank 7 |
| Контакт 174 | GND — Ground reference |
| Контакт 175 | I/O — User I/O bank 6 |
| Контакт 176 | I/O — User I/O bank 6 |
| Контакт 177 | I/O — User I/O bank 6 |
| Контакт 178 | I/O — User I/O bank 6 |
| Контакт 179 | I/O — User I/O bank 6 |
| Контакт 180 | I/O — User I/O bank 6 |
| Контакт 181 | I/O — User I/O bank 6 |
| Контакт 182 | I/O — User I/O bank 6 |
| Контакт 183 | I/O — User I/O bank 5 |
| Контакт 184 | I/O — User I/O bank 5 |
| Контакт 185 | I/O — User I/O bank 5 |
| Контакт 186 | I/O — User I/O bank 5 |
| Контакт 187 | I/O — User I/O bank 5 |
| Контакт 188 | I/O — User I/O bank 5 |
| Контакт 189 | I/O — User I/O bank 5 |
| Контакт 190 | I/O — User I/O bank 5 |
| Контакт 191 | VCCINT — Core supply voltage (2.5 V) |
| Контакт 192 | GND — Ground reference |
| Контакт 193 | I/O — User I/O bank 4 |
| Контакт 194 | I/O — User I/O bank 4 |
| Контакт 195 | I/O — User I/O bank 4 |
| Контакт 196 | I/O — User I/O bank 4 |
| Контакт 197 | I/O — User I/O bank 3 |
| Контакт 198 | I/O — User I/O bank 3 |
| Контакт 199 | I/O — User I/O bank 2 |
| Контакт 200 | I/O — User I/O bank 2 |
| Контакт 201 | I/O — User I/O bank 1 |
| Контакт 202 | I/O — User I/O bank 1 |
| Контакт 203 | I/O — User I/O bank 8 |
| Контакт 204 | I/O — User I/O bank 8 |
| Контакт 205 | I/O — User I/O bank 7 |
| Контакт 206 | I/O — User I/O bank 7 |
| Контакт 207 | I/O — User I/O bank 6 |
| Контакт 208 | I/O — User I/O bank 5 |
Типичное применение
EP1K10QC208-2 подходит для 6 применениеs: Industrial Control Logic Replacement, Telecom Line-Card Glue Logic, Test and Measurement Instrumentation, Legacy Discrete-TTL Consolidation, Aerospace Test Fixture Control, Reconfigurable I/O Expansion Card.
Industrial Control Logic Replacement
The EP1K10QC208-2 fits industrial control retrofits because its 10K equivalent gates and 576 logic elements absorb the discrete-TTL and small-PLD logic commonly found in legacy PLC backplanes. The 120 user I/O pins route 24V-to-3.3V level-shifted field signals through optocouplers to FPGA banks without external bus drivers. Industrial designers benefit from the 0C to +70C commercial temperature rating and 208-BQFP footprint, which fits existing through-hole pads on factory-floor backplanes. The SRAM configuration requires an EPC2 PROM, which is itself a long-lifecycle part, enabling 20+ year field serviceability.
Рекомендуется
Telecom Line-Card Glue Logic
Telecom line-interface backplanes in legacy T1/E1 and SDH systems frequently use ACEX-1K devices for protocol bridging, FIFO buffering, and clock-domain crossing between line-side framers and backplane ASICs. The EP1K10QC208-2 provides 12,288 bits of dual-port embedded RAM, sufficient for jitter buffers up to 1.5 KB without external SRAM. Its 208-BQFP footprint matches the through-hole-pitch backplane connectors still deployed in central-office equipment, enabling field replacements without board rework. The -2 speed grade meets the 50 MHz backplane clock domain typical of telecom control cards.
Рекомендуется
Test and Measurement Instrumentation
Bench-top test instruments such as protocol analyzers, logic-state sequencers, and arbitrary-pattern generators used the ACEX-1K family as a flexible stimulus engine. The EP1K10QC208-2's 576 logic elements implement test-pattern state machines, while the embedded RAM blocks store stimulus vectors. The 120 user I/O pins parallel-drive instrument front-panel connectors. Engineers benefit from JTAG-based boundary-scan testing, which verifies instrument interconnect integrity during calibration. The 208-BQFP package is hand-solderable for prototype bench builds, supporting quick-turn instrument development.
Рекомендуется
Legacy Discrete-TTL Consolidation
Designers migrate vintage 74LS/74F TTL boards onto a single EP1K10QC208-2 to reduce board area, power consumption, and BOM count. The 10K-equivalent-gate capacity absorbs up to 50 small-scale and medium-scale TTL packages, while the 120 I/O pins route the original signal assignments without re-wiring. JTAG boundary-scan confirms interconnect continuity post-migration. The 2.5 V core supply reduces dynamic power by 60-70% versus 5 V TTL, and the 208-BQFP footprint fits into the original 28x28 mm TTL-array land pattern. Configuration via EPC2 PROM preserves the original 'socketed-logic' field-serviceability model.
Рекомендуется
Aerospace Test Fixture Control
Avionics test fixtures, ground-support equipment, and ATE racks historically used ACEX-1K devices for control-plane sequencing because of their JTAG visibility and deterministic timing. The EP1K10QC208-2 implements test-sequence state machines, fault-tree logic, and MIL-STD-1553 protocol bridges in ground-support racks. The -2 speed grade guarantees timing margins at 50 MHz, and the 208-BQFP package withstands thermal cycling from -20C cold-soak to +70C operational. Configuration bitstreams are revision-controlled on EPC2 PROMs, enabling traceability for FAA/EASA acceptance testing.
Рекомендуется
Reconfigurable I/O Expansion Card
PCI and VMEbus I/O expansion cards in industrial PCs and embedded single-board computers used the EP1K10QC208-2 as a programmable front-end for legacy signal conditioning. The 120 user I/O pins break out to optoisolator arrays, and the 576 logic elements implement debounce, pulse-stretching, and quadrature decoding. Designers benefit from in-system programmability via JTAG, enabling field upgrades without card removal. The 208-BQFP package drops onto existing ISA/VME backplane carrier boards, preserving mechanical fit. Embedded RAM buffers streaming data from high-speed ADC companion chips.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP1K10QC208-2 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP1K10QC208-2N | EP1K10QC208-1N | EP1K100QC208-2N | EP1K100QC208-3 | EP1K100QC208-1 |
|---|---|---|---|---|---|---|
| Package | 208-BQFP (PQFP, 0.5 mm pitch) | 208-BQFP - same | 208-BQFP - same | 208-BQFP - same | 208-BQFP - same | 208-BQFP - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 576 | 576 | 576 | 4,992 | 4,992 | 4,992 |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 49,152 | 49,152 | 49,152 |
| Speed Grade | -2 | -2 (same) | -1 (slower) | -2 (same speed grade) | -3 (fastest) | -1 (slower) |
| Maximum User I/O | 120 | 120 | 120 | 147 (more I/O in same package) | 147 | 147 |
| RoHS Compliant | No (legacy) | Yes (N suffix) | Yes (N suffix) | Yes | unknown | unknown |
Ключевые отличия
- RoHS-compliant lead-free terminal finish available in same package (против EP1K10QC208-2 (without N suffix))
- Higher logic capacity (4,992 LEs) available in identical package footprint (против EP1K100QC208-2N)
- Faster speed grade available within same family (против EP1K100QC208-3)
Заметки по проектированию
The EP1K10QC208-2 requires three supply rails: 2.5 V on VCCINT pins (105, 121, 156, 191), 3.3 V (or 2.5 V) on each VCCIO bank supply, and a clean ground on each GND pin. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and add a single 10 uF tantalum or polymer bulk capacitor per supply rail. Estimated: at 100% CLB utilization and 50 MHz toggle rate, core current draw is approximately 100-160 mA from the 2.5 V rail. Power-on sequence is not critical because I/O banks default to high-impedance until configuration completes.
The 208-BQFP package has 0.5 mm lead pitch and 28x28 mm body. PCB land pattern should use 0.3 mm pad width and 1.5 mm pad length with solder mask defined pads (NSMD) for best assembly yield. Fanout from the inner leads requires via-in-pad or 0.2 mm micro-vias on high-layer-count boards; on 4-layer boards use dog-bone fanout with 0.3 mm drill vias between leads. Place a continuous ground plane on layer 2 directly beneath the device to provide a low-impedance return path for the high-toggle-rate I/O signals.
Common pitfalls with the EP1K10QC208-2: (1) Quartus Prime versions newer than 13.0 do not include ACEX-1K device support - use Quartus II 13.0sp1 or earlier, or third-party ACEX tools; (2) Configuration bitstreams generated for the -2 speed grade may fail timing closure on -1 grade silicon, requiring a recompile; (3) The SRAM configuration is volatile - if the EPC2 PROM is not present, the device will not boot; (4) The nCONFIG pin must be held low for at least 40 us during power-up to initiate configuration. JTAG users must connect TRST to ground through a 1 kOhm resistor for proper boundary-scan initialization.
Информация о соответствии
EP1K10QC208-2 is the legacy SnPb finish variant; the EP1K10QC208-2N suffix is the RoHS-compliant lead-free terminal finish variant. FPGA logic devices are not AEC-Q100 qualified unless specifically marked.