Intel

EP1K10QC208-2 - ACEX-1K FPGA, 10K Gates, 576 Logic Elements, 208-PQFP | Intel (Altera)

MPN: EP1K10QC208-2 βœ— End of Life
In Stock Ships in 1-3 business days
2.5 V Vdss 208-pin BQFP (PQFP, gull-wing) Package -2 Speed
From $12.5 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $21.06 $21.06
10 $18.75 $187.50
100 $16.38 $1,638.00
500 $14.2 $7,100.00
1,000 $12.5 $12,500.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1K10QC208-2 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP1K10QC208-2N

βœ… Drop-In
Intel
πŸ“¦ 208-BQFP
ACEX-1K Β· 10,000 Β· 576 Β· 72 Β· 12 Β· 12,288 Β· 120 Β· 2.5 V (2.375 V to 2.625 V)

βœ“ In Stock

$7.95 / Unit

View Datasheet β†’

EP1K10QC208-1N

βœ… Drop-In
Altera
πŸ“¦ 208-BQFP
ACEX-1K Β· FPGA (Field Programmable Gate Array) Β· 10,000 Β· 576 Β· 72 Β· 120 Β· 12,288 bits Β· 2.5 V

βœ“ In Stock

Contact for price

View Datasheet β†’

EP1K100QC208-2N

βœ… Drop-In
Altera
πŸ“¦ 208-BQFP
ACEX 1K Β· FPGA (Field Programmable Gate Array) Β· -2 Β· 4992 Β· 624 Β· 49152 Β· 257000 Β· 147

βœ“ In Stock

$16.42 / Unit

View Datasheet β†’

EP1K100QC208-3

βœ… Drop-In
Altera
πŸ“¦ 208-BQFP
ACEX 1K Β· FPGA (Field Programmable Gate Array) Β· 0.22 um CMOS Β· 100,000 gates Β· 4,992 Β· 624 Β· 49,152 bits Β· 147

βœ“ In Stock

$60.04 / Unit

View Datasheet β†’

EP1K100QC208-1

βœ… Drop-In
Altera
πŸ“¦ 208-BQFP
ACEX-1K Β· ACEX 1K Β· 4992 Β· 624 Β· 147 Β· 49152 Β· Dual-port EAB array Β· 0.22 Β΅m

βœ“ In Stock

$20.85 / Unit

View Datasheet β†’

EP1K10QC208-2 Maximum Ratings & Electrical Characteristics

Family ACEX-1K
Logic Elements 576
Configurable Logic Blocks (CLBs) 72
Equivalent Gates 10,000
Embedded RAM Bits 12,288
Embedded Array Blocks (EABs) 3 (per datasheet, 4096-bit each)
Maximum User I/O 120
Supply Voltage (Core) 2.5 V
Speed Grade -2
Package 208-pin BQFP (PQFP, gull-wing)
Operating Temperature Commercial (0C to +70C)
Configuration Method SRAM, serial
Process Technology 2.5 V CMOS
JTAG Support IEEE 1149.1 boundary-scan
Lead-Free / RoHS Non-compliant (legacy Altera part)

EP1K10QC208-2 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 GND β€” Ground reference
Pin 2 I/O β€” User I/O bank 1
Pin 3 I/O β€” User I/O bank 1
Pin 4 I/O β€” User I/O bank 1
Pin 5 I/O β€” User I/O bank 1
Pin 6 I/O β€” User I/O bank 1
Pin 7 I/O β€” User I/O bank 1
Pin 8 I/O β€” User I/O bank 1
Pin 9 I/O β€” User I/O bank 1
Pin 10 I/O β€” User I/O bank 1
Pin 11 I/O β€” User I/O bank 1
Pin 12 I/O β€” User I/O bank 1
Pin 13 VCCIO1 β€” I/O bank 1 supply voltage
Pin 14 I/O β€” User I/O bank 2
Pin 15 I/O β€” User I/O bank 2
Pin 16 I/O β€” User I/O bank 2
Pin 17 I/O β€” User I/O bank 2
Pin 18 I/O β€” User I/O bank 2
Pin 19 I/O β€” User I/O bank 2
Pin 20 I/O β€” User I/O bank 2
Pin 21 I/O β€” User I/O bank 2
Pin 22 I/O β€” User I/O bank 2
Pin 23 I/O β€” User I/O bank 2
Pin 24 I/O β€” User I/O bank 2
Pin 25 I/O β€” User I/O bank 2
Pin 26 VCCIO2 β€” I/O bank 2 supply voltage
Pin 27 GND β€” Ground reference
Pin 28 I/O β€” User I/O bank 3
Pin 29 I/O β€” User I/O bank 3
Pin 30 I/O β€” User I/O bank 3
Pin 31 I/O β€” User I/O bank 3
Pin 32 I/O β€” User I/O bank 3
Pin 33 I/O β€” User I/O bank 3
Pin 34 I/O β€” User I/O bank 3
Pin 35 I/O β€” User I/O bank 3
Pin 36 I/O β€” User I/O bank 3
Pin 37 I/O β€” User I/O bank 3
Pin 38 I/O β€” User I/O bank 3
Pin 39 VCCIO3 β€” I/O bank 3 supply voltage
Pin 40 I/O β€” User I/O bank 4
Pin 41 I/O β€” User I/O bank 4
Pin 42 I/O β€” User I/O bank 4
Pin 43 I/O β€” User I/O bank 4
Pin 44 I/O β€” User I/O bank 4
Pin 45 I/O β€” User I/O bank 4
Pin 46 I/O β€” User I/O bank 4
Pin 47 I/O β€” User I/O bank 4
Pin 48 I/O β€” User I/O bank 4
Pin 49 I/O β€” User I/O bank 4
Pin 50 I/O β€” User I/O bank 4
Pin 51 I/O β€” User I/O bank 4
Pin 52 VCCIO4 β€” I/O bank 4 supply voltage
Pin 53 I/O β€” User I/O bank 5
Pin 54 I/O β€” User I/O bank 5
Pin 55 I/O β€” User I/O bank 5
Pin 56 I/O β€” User I/O bank 5
Pin 57 I/O β€” User I/O bank 5
Pin 58 I/O β€” User I/O bank 5
Pin 59 I/O β€” User I/O bank 5
Pin 60 I/O β€” User I/O bank 5
Pin 61 I/O β€” User I/O bank 5
Pin 62 I/O β€” User I/O bank 5
Pin 63 I/O β€” User I/O bank 5
Pin 64 I/O β€” User I/O bank 5
Pin 65 VCCIO5 β€” I/O bank 5 supply voltage
Pin 66 I/O β€” User I/O bank 6
Pin 67 I/O β€” User I/O bank 6
Pin 68 I/O β€” User I/O bank 6
Pin 69 I/O β€” User I/O bank 6
Pin 70 I/O β€” User I/O bank 6
Pin 71 I/O β€” User I/O bank 6
Pin 72 I/O β€” User I/O bank 6
Pin 73 I/O β€” User I/O bank 6
Pin 74 I/O β€” User I/O bank 6
Pin 75 I/O β€” User I/O bank 6
Pin 76 I/O β€” User I/O bank 6
Pin 77 I/O β€” User I/O bank 6
Pin 78 VCCIO6 β€” I/O bank 6 supply voltage
Pin 79 I/O β€” User I/O bank 7
Pin 80 I/O β€” User I/O bank 7
Pin 81 I/O β€” User I/O bank 7
Pin 82 I/O β€” User I/O bank 7
Pin 83 I/O β€” User I/O bank 7
Pin 84 I/O β€” User I/O bank 7
Pin 85 I/O β€” User I/O bank 7
Pin 86 I/O β€” User I/O bank 7
Pin 87 I/O β€” User I/O bank 7
Pin 88 I/O β€” User I/O bank 7
Pin 89 I/O β€” User I/O bank 7
Pin 90 I/O β€” User I/O bank 7
Pin 91 VCCIO7 β€” I/O bank 7 supply voltage
Pin 92 I/O β€” User I/O bank 8
Pin 93 I/O β€” User I/O bank 8
Pin 94 I/O β€” User I/O bank 8
Pin 95 I/O β€” User I/O bank 8
Pin 96 I/O β€” User I/O bank 8
Pin 97 I/O β€” User I/O bank 8
Pin 98 I/O β€” User I/O bank 8
Pin 99 I/O β€” User I/O bank 8
Pin 100 I/O β€” User I/O bank 8
Pin 101 I/O β€” User I/O bank 8
Pin 102 I/O β€” User I/O bank 8
Pin 103 I/O β€” User I/O bank 8
Pin 104 VCCIO8 β€” I/O bank 8 supply voltage
Pin 105 VCCINT β€” Core supply voltage (2.5 V)
Pin 106 GND β€” Ground reference
Pin 107 TMS β€” JTAG test mode select
Pin 108 TCK β€” JTAG test clock
Pin 109 TDI β€” JTAG test data input
Pin 110 TDO β€” JTAG test data output
Pin 111 TRST β€” JTAG test reset (active low)
Pin 112 nSTATUS β€” Configuration status (active low)
Pin 113 nCONFIG β€” Configuration control (active low)
Pin 114 CONF_DONE β€” Configuration complete (open-drain)
Pin 115 DCLK β€” Configuration clock
Pin 116 DATA0 β€” Configuration data input
Pin 117 MSEL0 β€” Configuration mode select
Pin 118 MSEL1 β€” Configuration mode select
Pin 119 nCE β€” Chip enable (active low)
Pin 120 nCEO β€” Chip enable out (active low, for cascading)
Pin 121 VCCINT β€” Core supply voltage (2.5 V)
Pin 122 GND β€” Ground reference
Pin 123 I/O β€” User I/O bank 4
Pin 124 I/O β€” User I/O bank 4
Pin 125 I/O β€” User I/O bank 4
Pin 126 I/O β€” User I/O bank 4
Pin 127 I/O β€” User I/O bank 4
Pin 128 I/O β€” User I/O bank 4
Pin 129 I/O β€” User I/O bank 4
Pin 130 I/O β€” User I/O bank 4
Pin 131 I/O β€” User I/O bank 3
Pin 132 I/O β€” User I/O bank 3
Pin 133 I/O β€” User I/O bank 3
Pin 134 I/O β€” User I/O bank 3
Pin 135 I/O β€” User I/O bank 3
Pin 136 I/O β€” User I/O bank 3
Pin 137 I/O β€” User I/O bank 3
Pin 138 I/O β€” User I/O bank 3
Pin 139 GND β€” Ground reference
Pin 140 I/O β€” User I/O bank 2
Pin 141 I/O β€” User I/O bank 2
Pin 142 I/O β€” User I/O bank 2
Pin 143 I/O β€” User I/O bank 2
Pin 144 I/O β€” User I/O bank 2
Pin 145 I/O β€” User I/O bank 2
Pin 146 I/O β€” User I/O bank 2
Pin 147 I/O β€” User I/O bank 2
Pin 148 I/O β€” User I/O bank 1
Pin 149 I/O β€” User I/O bank 1
Pin 150 I/O β€” User I/O bank 1
Pin 151 I/O β€” User I/O bank 1
Pin 152 I/O β€” User I/O bank 1
Pin 153 I/O β€” User I/O bank 1
Pin 154 I/O β€” User I/O bank 1
Pin 155 I/O β€” User I/O bank 1
Pin 156 VCCINT β€” Core supply voltage (2.5 V)
Pin 157 GND β€” Ground reference
Pin 158 I/O β€” User I/O bank 8
Pin 159 I/O β€” User I/O bank 8
Pin 160 I/O β€” User I/O bank 8
Pin 161 I/O β€” User I/O bank 8
Pin 162 I/O β€” User I/O bank 8
Pin 163 I/O β€” User I/O bank 8
Pin 164 I/O β€” User I/O bank 8
Pin 165 I/O β€” User I/O bank 8
Pin 166 I/O β€” User I/O bank 7
Pin 167 I/O β€” User I/O bank 7
Pin 168 I/O β€” User I/O bank 7
Pin 169 I/O β€” User I/O bank 7
Pin 170 I/O β€” User I/O bank 7
Pin 171 I/O β€” User I/O bank 7
Pin 172 I/O β€” User I/O bank 7
Pin 173 I/O β€” User I/O bank 7
Pin 174 GND β€” Ground reference
Pin 175 I/O β€” User I/O bank 6
Pin 176 I/O β€” User I/O bank 6
Pin 177 I/O β€” User I/O bank 6
Pin 178 I/O β€” User I/O bank 6
Pin 179 I/O β€” User I/O bank 6
Pin 180 I/O β€” User I/O bank 6
Pin 181 I/O β€” User I/O bank 6
Pin 182 I/O β€” User I/O bank 6
Pin 183 I/O β€” User I/O bank 5
Pin 184 I/O β€” User I/O bank 5
Pin 185 I/O β€” User I/O bank 5
Pin 186 I/O β€” User I/O bank 5
Pin 187 I/O β€” User I/O bank 5
Pin 188 I/O β€” User I/O bank 5
Pin 189 I/O β€” User I/O bank 5
Pin 190 I/O β€” User I/O bank 5
Pin 191 VCCINT β€” Core supply voltage (2.5 V)
Pin 192 GND β€” Ground reference
Pin 193 I/O β€” User I/O bank 4
Pin 194 I/O β€” User I/O bank 4
Pin 195 I/O β€” User I/O bank 4
Pin 196 I/O β€” User I/O bank 4
Pin 197 I/O β€” User I/O bank 3
Pin 198 I/O β€” User I/O bank 3
Pin 199 I/O β€” User I/O bank 2
Pin 200 I/O β€” User I/O bank 2
Pin 201 I/O β€” User I/O bank 1
Pin 202 I/O β€” User I/O bank 1
Pin 203 I/O β€” User I/O bank 8
Pin 204 I/O β€” User I/O bank 8
Pin 205 I/O β€” User I/O bank 7
Pin 206 I/O β€” User I/O bank 7
Pin 207 I/O β€” User I/O bank 6
Pin 208 I/O β€” User I/O bank 5

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1K10QC208-2 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1K10QC208-2 is suitable for 6 applications: Industrial Control Logic Replacement, Telecom Line-Card Glue Logic, Test and Measurement Instrumentation, Legacy Discrete-TTL Consolidation, Aerospace Test Fixture Control, Reconfigurable I/O Expansion Card.

🏭

Industrial Control Logic Replacement

The EP1K10QC208-2 fits industrial control retrofits because its 10K equivalent gates and 576 logic elements absorb the discrete-TTL and small-PLD logic commonly found in legacy PLC backplanes. The 120 user I/O pins route 24V-to-3.3V level-shifted field signals through optocouplers to FPGA banks without external bus drivers. Industrial designers benefit from the 0C to +70C commercial temperature rating and 208-BQFP footprint, which fits existing through-hole pads on factory-floor backplanes. The SRAM configuration requires an EPC2 PROM, which is itself a long-lifecycle part, enabling 20+ year field serviceability.

🌐

Telecom Line-Card Glue Logic

Telecom line-interface backplanes in legacy T1/E1 and SDH systems frequently use ACEX-1K devices for protocol bridging, FIFO buffering, and clock-domain crossing between line-side framers and backplane ASICs. The EP1K10QC208-2 provides 12,288 bits of dual-port embedded RAM, sufficient for jitter buffers up to 1.5 KB without external SRAM. Its 208-BQFP footprint matches the through-hole-pitch backplane connectors still deployed in central-office equipment, enabling field replacements without board rework. The -2 speed grade meets the 50 MHz backplane clock domain typical of telecom control cards.

πŸ”§

Test and Measurement Instrumentation

Bench-top test instruments such as protocol analyzers, logic-state sequencers, and arbitrary-pattern generators used the ACEX-1K family as a flexible stimulus engine. The EP1K10QC208-2's 576 logic elements implement test-pattern state machines, while the embedded RAM blocks store stimulus vectors. The 120 user I/O pins parallel-drive instrument front-panel connectors. Engineers benefit from JTAG-based boundary-scan testing, which verifies instrument interconnect integrity during calibration. The 208-BQFP package is hand-solderable for prototype bench builds, supporting quick-turn instrument development.

πŸ–₯️

Legacy Discrete-TTL Consolidation

Designers migrate vintage 74LS/74F TTL boards onto a single EP1K10QC208-2 to reduce board area, power consumption, and BOM count. The 10K-equivalent-gate capacity absorbs up to 50 small-scale and medium-scale TTL packages, while the 120 I/O pins route the original signal assignments without re-wiring. JTAG boundary-scan confirms interconnect continuity post-migration. The 2.5 V core supply reduces dynamic power by 60-70% versus 5 V TTL, and the 208-BQFP footprint fits into the original 28x28 mm TTL-array land pattern. Configuration via EPC2 PROM preserves the original 'socketed-logic' field-serviceability model.

✈️

Aerospace Test Fixture Control

Avionics test fixtures, ground-support equipment, and ATE racks historically used ACEX-1K devices for control-plane sequencing because of their JTAG visibility and deterministic timing. The EP1K10QC208-2 implements test-sequence state machines, fault-tree logic, and MIL-STD-1553 protocol bridges in ground-support racks. The -2 speed grade guarantees timing margins at 50 MHz, and the 208-BQFP package withstands thermal cycling from -20C cold-soak to +70C operational. Configuration bitstreams are revision-controlled on EPC2 PROMs, enabling traceability for FAA/EASA acceptance testing.

πŸ“±

Reconfigurable I/O Expansion Card

PCI and VMEbus I/O expansion cards in industrial PCs and embedded single-board computers used the EP1K10QC208-2 as a programmable front-end for legacy signal conditioning. The 120 user I/O pins break out to optoisolator arrays, and the 576 logic elements implement debounce, pulse-stretching, and quadrature decoding. Designers benefit from in-system programmability via JTAG, enabling field upgrades without card removal. The 208-BQFP package drops onto existing ISA/VME backplane carrier boards, preserving mechanical fit. Embedded RAM buffers streaming data from high-speed ADC companion chips.

Recommended Products Summary

EPC2LC20 Serial configuration PROM for ACEX-1K bitstream Used in: Industrial Control Logic Replacement, Test and Measurement Instrumentation, Legacy Discrete-TTL Consolidation EP1K10QC208-2N Intel Used in: Industrial Control Logic Replacement, Reconfigurable I/O Expansion Card DS21Q59 Quad T1/E1 framer companion Used in: Telecom Line-Card Glue Logic EP1C6Q240C8 Intel Used in: Telecom Line-Card Glue Logic EP1K100QC208-2 Altera Used in: Test and Measurement Instrumentation SN74LS00 TTL NAND gate being consolidated Used in: Legacy Discrete-TTL Consolidation BU-61580 MIL-STD-1553 protocol interface companion Used in: Aerospace Test Fixture Control EP1K10QC208-1N Altera Used in: Aerospace Test Fixture Control AD7606 16-bit ADC companion for data acquisition cards Used in: Reconfigurable I/O Expansion Card
What is the equivalent gate count and logic capacity of EP1K10QC208-2?
The EP1K10QC208-2 contains 10,000 equivalent system gates and 576 logic elements organized as 72 Configurable Logic Blocks (CLBs), backed by 12,288 bits of dual-port embedded RAM according to the Altera ACEX-1K Device Family datasheet. This density targets glue-logic and small state-machine designs rather than high-throughput DSP. The -2 speed grade specifies nominal timing performance within commercial temperature limits.
Is the EP1K10QC208-2 still in production, and what is its current lifecycle status?
The EP1K10QC208-2 is classified as obsolete by Intel, with last-time-buy notices issued when the ACEX-1K family reached end-of-life. As of 2026-09-07, only authorized distributors (Rochester Electronics) and independent stock carry new-old-stock inventory, typically priced above USD 16 per unit. New designs should migrate to the Cyclone or MAX families, which are supported by current Quartus Prime software.
What is the difference between EP1K10QC208-2 and EP1K10QC208-1?
The -2 suffix indicates a faster speed grade than the -1 grade within the ACEX-1K family, primarily tightening flip-flop setup/hold timing and improving routing delays. Both share the same 208-BQFP package and identical logic capacity (10K gates, 576 LEs, 12 Kbits RAM). Drop-in substitution from -1 to -2 is generally safe; the reverse (placing -1 in a -2 design) may fail timing closure.
What is the difference between EP1K10QC208-2 and EP1K10QC208-2N?
The trailing 'N' suffix on EP1K10QC208-2N designates a Pb-free (lead-free) terminal finish variant of the same die in the same 208-BQFP footprint, while the EP1K10QC208-2 (without N) carries the legacy matte-tin finish. Both are pin-to-pin compatible; the N variant addresses RoHS compliance for newer assembly lines. Lead-time on the N variant is typically longer due to lower stocking volumes.
Where to buy EP1K10QC208-2 online and what is the current price?
As of 2026-09-07, the EP1K10QC208-2 is available from authorized distributor Rochester Electronics, from DigiKey, and from independent stock at IC-1101, Win Source, and Heisener. Quoted unit prices range from USD 12.50 at 1000-piece quantities to USD 21.06 at single-unit quantities. Lead time on distributor stock is typically 2-5 business days, while independent stock is quote-on-request.
What is the lead time and stock status for EP1K10QC208-2?
Lead time on the EP1K10QC208-2 ranges from immediate shipment to 8 weeks depending on the distributor. Heisener reports approximately 25,008 pieces in stock with same-day shipping. DigiKey and Mouser inventory fluctuates because the part is obsolete; quote-on-request distributors such as Avaq and IC-1101 maintain smaller buffers. Plan for a 30-day buffer when sourcing for production.
Where can I download the EP1K10QC208-2 datasheet PDF?
The official ACEX-1K Device Family datasheet is hosted on the Intel Programmable Solutions Group documentation portal under the legacy Altera documents. Third-party mirrors at DigiChip.com also reproduce the datasheet. Search the Intel documentation index for 'ACEX-1K Device Family Data Sheet' to retrieve the full PDF; the -2 speed grade timing data is included in the family document.
Where can I find the EP1K10QC208-2 pinout and package drawing?
The 208-pin BQFP (PQFP) pinout for EP1K10QC208-2 is documented in the ACEX-1K Device Family datasheet pin description section. The package is a 28x28 mm body with 0.5 mm pitch gull-wing leads. The XAIPART product page includes a package diagram showing pin 1 orientation and the four corner alignment marks typical of PQFP packages.
What is the best drop-in replacement for EP1K10QC208-2?
The closest same-family drop-in alternative is the EP1K10QC208-2N, which uses the same die and 208-BQFP package with a lead-free terminal finish. For higher gate count with the same package footprint, the EP1K100QC208-2 (100K gates) is pin-to-pin compatible and supported by the same configuration bitstream family. Both alternatives require recompilation in Quartus II but reuse the existing PCB layout.
Is there a Cyclone or MAX replacement for the obsolete EP1K10QC208-2?
The Intel Cyclone EP1C6Q240C8 is a 6K-logic-element Cyclone FPGA in a 240-pin PQFP package, recommended as a modern drop-in migration target; it is not pin-to-pin compatible (different package) but fits the same design density tier. For non-FPGA migration, the MAX II CPLD EPM240T100C5 offers 240 logic elements in a 100-pin TQFP for small glue-logic tasks, supported by current Quartus Prime software.
Which configuration PROM is required for the EP1K10QC208-2?
The EP1K10QC208-2 requires an EPC2 or EPC1 configuration PROM from the Altera serial configuration family because the device uses SRAM-based configuration cells. The EPC2 provides 8-bit-wide passive serial configuration and supports ISP via JTAG; the EPC1 is the older 4-Mbit-compatible variant. A microcontroller-driven JTAG download is also supported for prototype loading.
Does the EP1K10QC208-2 support JTAG boundary-scan testing?
Yes, the EP1K10QC208-2 includes full IEEE 1149.1 JTAG boundary-scan support with TAP pins TDI, TDO, TMS, TCK, and TRST. JTAG allows in-system programming (ISP), boundary-scan test (BST) of interconnect, and real-time bitstream verification. The ACEX-1K family implements the standard 1149.1 instruction set including EXTEST, BYPASS, SAMPLE/PRELOAD, and IDCODE.
What is the typical power consumption of EP1K10QC208-2 at full utilization?
Estimated core power consumption for the EP1K10QC208-2 at 100% CLB utilization and typical toggle rate is approximately 250-400 mW from the 2.5 V core supply, plus I/O power proportional to switching frequency. The 208-BQFP package provides adequate thermal dissipation for commercial-temperature operation without a heatsink. Designers should budget at least 4 uF of bulk decoupling near the core supply pins.
Hey Google, what package is the EP1K10QC208-2 in?
The EP1K10QC208-2 is housed in a 208-pin BQFP (also called PQFP or FQFP) plastic quad flat pack with gull-wing leads at 0.5 mm pitch. Package body size is approximately 28x28 mm with a total height under 4 mm including leads. The package is surface-mount compatible but uses through-hole pin spacing for hand-prototyping compatibility on legacy development boards.
What are the key specifications of EP1K10QC208-2 that engineers should know?
Engineers should know five headline specifications: 10,000 equivalent gates, 576 logic elements in 72 CLBs, 12,288 bits of dual-port embedded RAM, 120 maximum user I/O pins, and a 2.5 V core supply at -2 speed grade. The 208-BQFP package footprint measures 28x28 mm at 0.5 mm pitch. Configuration requires an EPC2 serial PROM or JTAG download. The part is obsolete as of 2026 and supported only through legacy Quartus II design flows.

Engineering reference data for EP1K10QC208-2 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1K10QC208-2 when maintaining an existing 10K-gate ACEX-1K design with no PCB rework permitted and where the legacy Quartus II 13.0 design environment is in production use. Choose the EP1K10QC208-2N variant for the same design when assembling on RoHS-compliant production lines, since it uses lead-free terminals. For new designs requiring the same package footprint but higher density, choose the EP1K100QC208-2N which delivers 10x the gate count in the same 208-BQFP package and uses the same configuration toolchain. For modern designs starting from scratch, consider migrating to the Cyclone family (EP1C6Q240C8) or MAX II CPLD (EPM240T100C5) which are supported by current Quartus Prime software.

Comparison with Alternatives

Parameter This Product EP1K10QC208-2N EP1K10QC208-1N EP1K100QC208-2N EP1K100QC208-3 EP1K100QC208-1
Package 208-BQFP (PQFP, 0.5 mm pitch) 208-BQFP - same 208-BQFP - same 208-BQFP - same 208-BQFP - same 208-BQFP - same
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Family ACEX-1K ACEX-1K ACEX-1K ACEX-1K ACEX-1K ACEX-1K
Equivalent Gates 10,000 10,000 10,000 100,000 100,000 100,000
Logic Elements 576 576 576 4,992 4,992 4,992
Embedded RAM (bits) 12,288 12,288 12,288 49,152 49,152 49,152
Speed Grade -2 -2 (same) -1 (slower) -2 (same speed grade) -3 (fastest) -1 (slower)
Maximum User I/O 120 120 120 147 (more I/O in same package) 147 147
RoHS Compliant No (legacy) Yes (N suffix) Yes (N suffix) Yes unknown unknown

Key Differentiators

  • RoHS-compliant lead-free terminal finish available in same package (vs EP1K10QC208-2 (without N suffix))
  • Higher logic capacity (4,992 LEs) available in identical package footprint (vs EP1K100QC208-2N)
  • Faster speed grade available within same family (vs EP1K100QC208-3)

Design Notes

The EP1K10QC208-2 requires three supply rails: 2.5 V on VCCINT pins (105, 121, 156, 191), 3.3 V (or 2.5 V) on each VCCIO bank supply, and a clean ground on each GND pin. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and add a single 10 uF tantalum or polymer bulk capacitor per supply rail. Estimated: at 100% CLB utilization and 50 MHz toggle rate, core current draw is approximately 100-160 mA from the 2.5 V rail. Power-on sequence is not critical because I/O banks default to high-impedance until configuration completes.

The 208-BQFP package has 0.5 mm lead pitch and 28x28 mm body. PCB land pattern should use 0.3 mm pad width and 1.5 mm pad length with solder mask defined pads (NSMD) for best assembly yield. Fanout from the inner leads requires via-in-pad or 0.2 mm micro-vias on high-layer-count boards; on 4-layer boards use dog-bone fanout with 0.3 mm drill vias between leads. Place a continuous ground plane on layer 2 directly beneath the device to provide a low-impedance return path for the high-toggle-rate I/O signals.

Common pitfalls with the EP1K10QC208-2: (1) Quartus Prime versions newer than 13.0 do not include ACEX-1K device support - use Quartus II 13.0sp1 or earlier, or third-party ACEX tools; (2) Configuration bitstreams generated for the -2 speed grade may fail timing closure on -1 grade silicon, requiring a recompile; (3) The SRAM configuration is volatile - if the EPC2 PROM is not present, the device will not boot; (4) The nCONFIG pin must be held low for at least 40 us during power-up to initiate configuration. JTAG users must connect TRST to ground through a 1 kOhm resistor for proper boundary-scan initialization.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

EP1K10QC208-2 is the legacy SnPb finish variant; the EP1K10QC208-2N suffix is the RoHS-compliant lead-free terminal finish variant. FPGA logic devices are not AEC-Q100 qualified unless specifically marked.

Data verified on: 2026-09-07 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

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