EP2AGX125EF35I5N - Arria II GX FPGA 118K LE, 6x 3.125G Transceivers | Intel
Артикул: EP2AGX125EF35I5N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1595 | $159.500,00 |
| 500 | $1480 | $740.000,00 |
| 1.000 | $1390 | $1.390.000,00 |
EP2AGX125EF35I5N Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing programmable logic blocks, interconnect, and I/O cells that can be reconfigured by the designer after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are distinguished from ASICs by their post-fabrication reconfigurability, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The Arria II GX family specifically targets mid-range applications that require embedded transceivers and DSP blocks without the cost of high-end Stratix-class parts.
Key features include 124,100 combinational logic blocks (CLBs) organized as 4,964 LABs, 8.4 Mbits of embedded memory (M9K + MLAB blocks), 252 dedicated 18x18 hardware multipliers for DSP, 6 full-duplex 3.125 Gbps CDR-based transceivers with embedded PCI Express hard IP, and 4 phase-locked loops (PLLs). The transceiver hard IP supports protocols including PCI Express Gen1, Gbps, Serial RapidIO, and Custom Ethernet, eliminating the need for external PHY silicon in many designs.
The Arria II architecture uses an 8-input adaptive logic module (ALM) and multi-track interconnect routing that significantly improves logic utilization versus the older 4-input LUT-based Stratix families. The hard PCI Express Gen1 endpoint block and 6x 3.125 Gbps transceivers are integrated directly into the silicon, reducing BOM count and PCB complexity for serial connectivity.
Typical applications include high-volume broadcast video processing, wireless baseband processing (W-CDMA, LTE PHY), test and measurement equipment with high-speed serial I/O, military radar signal processing, and cost-sensitive industrial imaging pipelines. The I5 speed grade provides the fastest timing closure at the cost of higher power than I3 / I7 grades.
When designing with this device, allocate sufficient PCB area for the 35x35 mm package and follow Altera's recommended decoupling scheme with 1 uF and 0.1 uF capacitors per power pin. Use the Quartus II design software (13.0 or later) for synthesis, place-and-route, and timing analysis.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, plus comparison context against other Arria II GX speed/package variants.
Аналоги без доработки для EP2AGX125EF35I5N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP2AGX125EF35I5N (тот же форм-фактор и посадочное место) — отличается по Package, Speed Grade, Logic Elements, Embedded Memory, Mounting Type.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP2AGX125EF35I5G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$1190 / шт.
Открыть даташит →EP2AGX125EF35I3G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$410.39 / шт.
Открыть даташит →EP2AGX125EF35C6G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
Уточнить цену
Открыть даташит →EP2AGX125EF35C5G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
Уточнить цену
Открыть даташит →EP2AGX125EF35C4G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$1290 / шт.
Открыть даташит →EP2AGX125DF25I5G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$295 / шт.
Открыть даташит →EP2AGX260FF35I5N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$1325 / шт.
Открыть даташит →EP2AGX125EF35I5N Максимальные параметры и электрические характеристики
| Family | Arria II GX |
| Device Logic Elements | 118,143 |
| Combinational Logic Blocks (CLBs) | 124,100 |
| Logic Array Blocks (LABs) | 4,964 |
| User I/Os | 452 |
| Embedded Memory | 8.4 Mbit (M9K + MLAB) |
| DSP Blocks (18x18 Multipliers) | 252 |
| Transceivers | 6 (up to 3.125 Gbps) |
| PLLs | 4 |
| Process Technology | 40 nm CMOS |
| Core Supply Voltage | 0.9 V |
| Speed Grade | I5 (industrial, fastest) |
| Рабочая температура | -40C to +100C (industrial) |
| Корпус | 1152-ball FC-FBGA, 35 x 35 mm |
| Тип монтажа | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | Lead-Free per MS-034 |
| PCI Express Hard IP | Gen1 x1/x4 endpoint |
| Configuration Schemes | AS, PS, JTAG, FPP |
Руководство по цоколевке EP2AGX125EF35I5N в корпусе 1152-ball fc-fbga, 35 x 35 mm
Цоколевка для EP2AGX125EF35I5N (корпус 1152-ball fc-fbga, 35 x 35 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP2AGX125EF35I5N.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP2AGX125EF35I5N подходит для 6 применениеs: Wireless Baseband Processing (LTE / W-CDMA PHY), Broadcast Video Processing and Encoding, Test and Measurement Equipment, Industrial Imaging and Machine Vision, Military Radar and Electronic Warfare, Cost-Optimized Serial Connectivity Bridge.
Wireless Baseband Processing (LTE / W-CDMA PHY)
The EP2AGX125EF35I5N's combination of 252 dedicated 18x18 hardware multipliers and 8.4 Mbit of embedded memory is a strong match for LTE PHY and W-CDMA baseband processing where hundreds of complex FIR filters must run in parallel. The 6 integrated 3.125 Gbps transceivers connect the FPGA directly to RF front-end ADCs/DACs and to CPRI/OBSAI links to the baseband card, eliminating external PHY silicon. With the I5 industrial speed grade, timing closure is achievable for 122.88 MHz LTE clocking across the full -40C to +100C industrial range. Quartus II's DSP Builder also accelerates model-based development for these algorithms.
Рекомендуется
Broadcast Video Processing and Encoding
Broadcast video pipelines require multi-channel SDI ingest, real-time scaling, and codec acceleration - all of which the EP2AGX125EF35I5N supports in a single device. The 452 user I/Os provide enough LVDS pairs for 4x 3G-SDI inputs plus 4x 3G-SDI outputs simultaneously, and the 8.4 Mbit of line buffers comfortably holds multiple 1080p60 frame slices. The embedded memory bandwidth and 252 DSP blocks enable 4K real-time upscaling and deinterlacing at sub-frame latency. The industrial temperature grade ensures reliable operation in outdoor broadcast head-end equipment and satellite-air-air uplink installations.
Рекомендуется
Test and Measurement Equipment
High-speed logic analyzers, protocol analyzers, and BERT platforms rely on the EP2AGX125EF35I5N for parallel sample capture and real-time pattern matching at multi-gigabit rates. The 6 transceivers can each tap a 3.125 Gbps serial lane for protocol-aware triggering on PCIe, SATA, USB 3.0, or 10 GbE links. The 252 18x18 multipliers accelerate FFT-based spectrum analysis, while the 452 user I/Os provide ample LVDS pairs for parallel ADC/DAC interfacing. Industrial temperature grading is essential for portable instruments used in field deployment and military/aerospace test racks.
Рекомендуется
Industrial Imaging and Machine Vision
Multi-camera machine vision systems require simultaneous high-bandwidth image ingest, real-time preprocessing, and deterministic GPIO control for triggers and lighting - all natively supported by the EP2AGX125EF35I5N. The 452 user I/Os handle parallel Camera Link, CoaXPress, or LVDS image sensors, while the 8.4 Mbit embedded memory holds multiple image lines and the 252 multipliers accelerate convolution, edge detection, and defect-classification kernels. The industrial -40C to +100C rating ensures reliable operation on the factory floor next to motors and power electronics. Hard PCIe Gen1 IP also enables direct connection to host PCs for high-throughput inspection pipelines.
Рекомендуется
Military Radar and Electronic Warfare
Phased-array radar and electronic-countermeasure systems demand the deterministic latency and high DSP throughput that the EP2AGX125EF35I5N provides, with industrial temperature grading ensuring reliable field deployment. The 252 18x18 multipliers run pulse-Doppler, MTI, and CFAR detection algorithms in real time, while the 8.4 Mbit embedded memory holds range-Doppler maps across thousands of range bins. The 6 transceivers connect directly to digital receivers/exciters at 3.125 Gbps per channel, and the 452 user I/Os handle legacy parallel ADC interfaces for retrofit applications.
Рекомендуется
Cost-Optimized Serial Connectivity Bridge
Many embedded designs need to convert between PCIe, SATA, USB 3.0, Gbps Ethernet, and parallel interfaces without paying for a discrete PHY per protocol - exactly the use case the EP2AGX125EF35I5N was designed for. The hard PCI Express Gen1 endpoint IP and 6x 3.125 Gbps transceivers run PCIe x4 plus two SATA ports plus Gbps Ethernet simultaneously, all bridged through user logic. Compared to an ASSP bridge chip, the FPGA approach allows firmware-defined protocol updates and custom packet processing. Industrial temperature grading suits in-vehicle, outdoor telecom, and factory-floor deployments.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP2AGX125EF35I5N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP2AGX125EF35I5G | EP2AGX125EF35I3G | EP2AGX125EF35C6G | EP2AGX125EF35C5G | EP2AGX260FF35I5N |
|---|---|---|---|---|---|---|
| Package | FBGA-1152 (35x35 mm) | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 244,000 (+107%) | |
| Speed Grade | I5 (industrial, fastest) | I5 (same) | I3 (slower, lower power) | C6 (slower commercial) | C5 (faster commercial) | |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | |
| Transceivers (3.125 Gbps) | 6 | 6 | 6 | 12 (+100%) | ||
| DSP 18x18 Multipliers | 252 | 252 | 252 | 384 (+52%) | ||
| Embedded Memory | 8.4 Mbit | 8.4 Mbit | 8.4 Mbit | 12.7 Mbit (+51%) | ||
| User I/Os | 452 | 452 | 452 | 452 (same) |
Ключевые отличия
- Highest Fmax at industrial temperature range (против EP2AGX125EF35I3G)
- Industrial temperature grading (-40C to +100C) (против EP2AGX125EF35C5G)
- Pin-compatible upgrade path to higher-density device (против EP2AGX260FF35I5N)
Заметки по проектированию
Estimated: at typical utilization (~70% logic, ~50% transceivers, all 6 transceivers running at 3.125 Gbps) the EP2AGX125EF35I5N draws roughly 8-10 W from the 0.9 V core rail plus transceiver analog supplies. Provide at least 4 power planes (0.9 V core, 1.1 V PLL analog, 1.5 V/2.5 V/3.3 V I/O banks, and 3.3 V configuration) and place 1 uF + 0.1 uF + 0.01 uF decoupling on every power pin per Altera's recommended footprint. Use the dedicated PLL analog supply pin; sharing it with digital 1.1 V will inject jitter into transceiver PLLs.
The 35x35 mm FC-FBGA-1152 package has a theta_JA around 8-10 C/W with the recommended thermal via array under the central ground balls. Industrial applications targeting +100C ambient should use a heatsink or thermal pad on top of the package lid, plus full-array thermal vias on the PCB bottom layer tied to a copper pour. Run the Altera PowerPlay early-power estimator before layout to size your thermal solution accurately.
Follow Intel's recommended PCB stackup with at least 8 layers to provide continuous VCC and GND planes for the 1152-ball BGA breakout. Microvia/stacked-via technology is essential for the inner-row balls; pitch is 1.0 mm ball-to-ball. Match differential pair lengths within 150 mils for 3.125 Gbps transceiver channels and route 100 ohm differential impedance per the Arria II GX handbook chapter on high-speed board design.
Do not confuse the N-suffix (lead-free but no halogen-free declaration) with the G-suffix (RoHS-compliant, halogen-free Pb-free) - both have the same die and pinout, but some end-customer specs require G. Also note that Arria II GX parts require Quartus II software version 13.0 or later; older Quartus II versions do not include the device database for this family. The hard PCIe Gen1 IP block must be instantiated through the Altera PCIe Compiler megacore, not written from scratch in user logic.
Информация о соответствии
N-suffix parts are lead-free per JEDEC MS-034. G-suffix parts additionally declare halogen-free Pb-free per Intel FPGA product compliance datasheet. Not AEC-Q100 qualified; for automotive designs consult Intel FPGA automotive-grade part numbers (typically CY/CN suffixes).
