EP2AGX125EF35I5N - Arria II GX FPGA 118K LE, 6x 3.125G Transceivers | Intel
부품 번호: EP2AGX125EF35I5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1390 | $1,390,000.00 |
EP2AGX125EF35I5N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing programmable logic blocks, interconnect, and I/O cells that can be reconfigured by the designer after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are distinguished from ASICs by their post-fabrication reconfigurability, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The Arria II GX family specifically targets mid-range applications that require embedded transceivers and DSP blocks without the cost of high-end Stratix-class parts.
Key features include 124,100 combinational logic blocks (CLBs) organized as 4,964 LABs, 8.4 Mbits of embedded memory (M9K + MLAB blocks), 252 dedicated 18x18 hardware multipliers for DSP, 6 full-duplex 3.125 Gbps CDR-based transceivers with embedded PCI Express hard IP, and 4 phase-locked loops (PLLs). The transceiver hard IP supports protocols including PCI Express Gen1, Gbps, Serial RapidIO, and Custom Ethernet, eliminating the need for external PHY silicon in many designs.
The Arria II architecture uses an 8-input adaptive logic module (ALM) and multi-track interconnect routing that significantly improves logic utilization versus the older 4-input LUT-based Stratix families. The hard PCI Express Gen1 endpoint block and 6x 3.125 Gbps transceivers are integrated directly into the silicon, reducing BOM count and PCB complexity for serial connectivity.
Typical applications include high-volume broadcast video processing, wireless baseband processing (W-CDMA, LTE PHY), test and measurement equipment with high-speed serial I/O, military radar signal processing, and cost-sensitive industrial imaging pipelines. The I5 speed grade provides the fastest timing closure at the cost of higher power than I3 / I7 grades.
When designing with this device, allocate sufficient PCB area for the 35x35 mm package and follow Altera's recommended decoupling scheme with 1 uF and 0.1 uF capacitors per power pin. Use the Quartus II design software (13.0 or later) for synthesis, place-and-route, and timing analysis.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, plus comparison context against other Arria II GX speed/package variants.
드롭인 대체품: EP2AGX125EF35I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX125EF35I5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Logic Elements, Embedded Memory, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX125EF35I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1190 / 개
데이터시트 보기 →EP2AGX125EF35I3G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$410.39 / 개
데이터시트 보기 →EP2AGX125EF35C6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGX125EF35C5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGX125EF35C4G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1290 / 개
데이터시트 보기 →EP2AGX125DF25I5G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$295 / 개
데이터시트 보기 →EP2AGX260FF35I5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1325 / 개
데이터시트 보기 →EP2AGX125EF35I5N 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Device Logic Elements | 118,143 |
| Combinational Logic Blocks (CLBs) | 124,100 |
| Logic Array Blocks (LABs) | 4,964 |
| User I/Os | 452 |
| Embedded Memory | 8.4 Mbit (M9K + MLAB) |
| DSP Blocks (18x18 Multipliers) | 252 |
| Transceivers | 6 (up to 3.125 Gbps) |
| PLLs | 4 |
| Process Technology | 40 nm CMOS |
| Core Supply Voltage | 0.9 V |
| Speed Grade | I5 (industrial, fastest) |
| 동작 온도 | -40C to +100C (industrial) |
| 패키지 | 1152-ball FC-FBGA, 35 x 35 mm |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | Lead-Free per MS-034 |
| PCI Express Hard IP | Gen1 x1/x4 endpoint |
| Configuration Schemes | AS, PS, JTAG, FPP |
EP2AGX125EF35I5N 1152-ball fc-fbga, 35 x 35 mm 핀 구성 가이드
EP2AGX125EF35I5N(1152-ball fc-fbga, 35 x 35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX125EF35I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX125EF35I5N 적합 용도: 6 애플리케이션s: Wireless Baseband Processing (LTE / W-CDMA PHY), Broadcast Video Processing and Encoding, Test and Measurement Equipment, Industrial Imaging and Machine Vision, Military Radar and Electronic Warfare, Cost-Optimized Serial Connectivity Bridge.
Wireless Baseband Processing (LTE / W-CDMA PHY)
The EP2AGX125EF35I5N's combination of 252 dedicated 18x18 hardware multipliers and 8.4 Mbit of embedded memory is a strong match for LTE PHY and W-CDMA baseband processing where hundreds of complex FIR filters must run in parallel. The 6 integrated 3.125 Gbps transceivers connect the FPGA directly to RF front-end ADCs/DACs and to CPRI/OBSAI links to the baseband card, eliminating external PHY silicon. With the I5 industrial speed grade, timing closure is achievable for 122.88 MHz LTE clocking across the full -40C to +100C industrial range. Quartus II's DSP Builder also accelerates model-based development for these algorithms.
추천
Broadcast Video Processing and Encoding
Broadcast video pipelines require multi-channel SDI ingest, real-time scaling, and codec acceleration - all of which the EP2AGX125EF35I5N supports in a single device. The 452 user I/Os provide enough LVDS pairs for 4x 3G-SDI inputs plus 4x 3G-SDI outputs simultaneously, and the 8.4 Mbit of line buffers comfortably holds multiple 1080p60 frame slices. The embedded memory bandwidth and 252 DSP blocks enable 4K real-time upscaling and deinterlacing at sub-frame latency. The industrial temperature grade ensures reliable operation in outdoor broadcast head-end equipment and satellite-air-air uplink installations.
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Test and Measurement Equipment
High-speed logic analyzers, protocol analyzers, and BERT platforms rely on the EP2AGX125EF35I5N for parallel sample capture and real-time pattern matching at multi-gigabit rates. The 6 transceivers can each tap a 3.125 Gbps serial lane for protocol-aware triggering on PCIe, SATA, USB 3.0, or 10 GbE links. The 252 18x18 multipliers accelerate FFT-based spectrum analysis, while the 452 user I/Os provide ample LVDS pairs for parallel ADC/DAC interfacing. Industrial temperature grading is essential for portable instruments used in field deployment and military/aerospace test racks.
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Industrial Imaging and Machine Vision
Multi-camera machine vision systems require simultaneous high-bandwidth image ingest, real-time preprocessing, and deterministic GPIO control for triggers and lighting - all natively supported by the EP2AGX125EF35I5N. The 452 user I/Os handle parallel Camera Link, CoaXPress, or LVDS image sensors, while the 8.4 Mbit embedded memory holds multiple image lines and the 252 multipliers accelerate convolution, edge detection, and defect-classification kernels. The industrial -40C to +100C rating ensures reliable operation on the factory floor next to motors and power electronics. Hard PCIe Gen1 IP also enables direct connection to host PCs for high-throughput inspection pipelines.
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Military Radar and Electronic Warfare
Phased-array radar and electronic-countermeasure systems demand the deterministic latency and high DSP throughput that the EP2AGX125EF35I5N provides, with industrial temperature grading ensuring reliable field deployment. The 252 18x18 multipliers run pulse-Doppler, MTI, and CFAR detection algorithms in real time, while the 8.4 Mbit embedded memory holds range-Doppler maps across thousands of range bins. The 6 transceivers connect directly to digital receivers/exciters at 3.125 Gbps per channel, and the 452 user I/Os handle legacy parallel ADC interfaces for retrofit applications.
추천
Cost-Optimized Serial Connectivity Bridge
Many embedded designs need to convert between PCIe, SATA, USB 3.0, Gbps Ethernet, and parallel interfaces without paying for a discrete PHY per protocol - exactly the use case the EP2AGX125EF35I5N was designed for. The hard PCI Express Gen1 endpoint IP and 6x 3.125 Gbps transceivers run PCIe x4 plus two SATA ports plus Gbps Ethernet simultaneously, all bridged through user logic. Compared to an ASSP bridge chip, the FPGA approach allows firmware-defined protocol updates and custom packet processing. Industrial temperature grading suits in-vehicle, outdoor telecom, and factory-floor deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX125EF35I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX125EF35I5G | EP2AGX125EF35I3G | EP2AGX125EF35C6G | EP2AGX125EF35C5G | EP2AGX260FF35I5N |
|---|---|---|---|---|---|---|
| Package | FBGA-1152 (35x35 mm) | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same | FBGA-1152 (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 244,000 (+107%) | |
| Speed Grade | I5 (industrial, fastest) | I5 (same) | I3 (slower, lower power) | C6 (slower commercial) | C5 (faster commercial) | |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | |
| Transceivers (3.125 Gbps) | 6 | 6 | 6 | 12 (+100%) | ||
| DSP 18x18 Multipliers | 252 | 252 | 252 | 384 (+52%) | ||
| Embedded Memory | 8.4 Mbit | 8.4 Mbit | 8.4 Mbit | 12.7 Mbit (+51%) | ||
| User I/Os | 452 | 452 | 452 | 452 (same) |
주요 차별점
- Highest Fmax at industrial temperature range (vs EP2AGX125EF35I3G)
- Industrial temperature grading (-40C to +100C) (vs EP2AGX125EF35C5G)
- Pin-compatible upgrade path to higher-density device (vs EP2AGX260FF35I5N)
설계 노트
Estimated: at typical utilization (~70% logic, ~50% transceivers, all 6 transceivers running at 3.125 Gbps) the EP2AGX125EF35I5N draws roughly 8-10 W from the 0.9 V core rail plus transceiver analog supplies. Provide at least 4 power planes (0.9 V core, 1.1 V PLL analog, 1.5 V/2.5 V/3.3 V I/O banks, and 3.3 V configuration) and place 1 uF + 0.1 uF + 0.01 uF decoupling on every power pin per Altera's recommended footprint. Use the dedicated PLL analog supply pin; sharing it with digital 1.1 V will inject jitter into transceiver PLLs.
The 35x35 mm FC-FBGA-1152 package has a theta_JA around 8-10 C/W with the recommended thermal via array under the central ground balls. Industrial applications targeting +100C ambient should use a heatsink or thermal pad on top of the package lid, plus full-array thermal vias on the PCB bottom layer tied to a copper pour. Run the Altera PowerPlay early-power estimator before layout to size your thermal solution accurately.
Follow Intel's recommended PCB stackup with at least 8 layers to provide continuous VCC and GND planes for the 1152-ball BGA breakout. Microvia/stacked-via technology is essential for the inner-row balls; pitch is 1.0 mm ball-to-ball. Match differential pair lengths within 150 mils for 3.125 Gbps transceiver channels and route 100 ohm differential impedance per the Arria II GX handbook chapter on high-speed board design.
Do not confuse the N-suffix (lead-free but no halogen-free declaration) with the G-suffix (RoHS-compliant, halogen-free Pb-free) - both have the same die and pinout, but some end-customer specs require G. Also note that Arria II GX parts require Quartus II software version 13.0 or later; older Quartus II versions do not include the device database for this family. The hard PCIe Gen1 IP block must be instantiated through the Altera PCIe Compiler megacore, not written from scratch in user logic.
규정 준수 정보
N-suffix parts are lead-free per JEDEC MS-034. G-suffix parts additionally declare halogen-free Pb-free per Intel FPGA product compliance datasheet. Not AEC-Q100 qualified; for automotive designs consult Intel FPGA automotive-grade part numbers (typically CY/CN suffixes).
