EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel
Артикул: EP2AGX260FF35I3G ⚠ Последняя закупка| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2680 | $26.800,00 |
| 100 | $2420 | $242.000,00 |
| 500 | $2190 | $1.095.000,00 |
| 1.000 | $1985 | $1.985.000,00 |
EP2AGX260FF35I3G Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers and memory blocks. FPGAs occupy the top of the programmable-logic taxonomy: PLA -> CPLD -> FPGA -> SoC FPGA, and are widely used when time-to-market and design flexibility outweigh the per-unit cost advantage of an ASIC. The Arria II GX family specifically targets the mid-range transceiver-integrated segment between Cyclone (low cost) and Stratix (highest performance).
Key features include embedded transceivers, hard PCI Express Gen2 IP cores, embedded memory blocks with byte-enable parity, dedicated DSP blocks for high-throughput signal processing, and configuration support via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes. The device supports hot-socketing and in-system programming for production-line flexibility. Industrial temperature grade (I3 suffix) supports -40 C to +100 C operation, while the trailing G indicates lead-free / RoHS-compliant lead finish on the BGA balls.
Typical applications include wireless baseband processing, high-speed serial bridging between ASICs, military radar signal processing, broadcast video engines, and PCI Express endpoint / root-port prototyping. For new designs, designers should consider migrating to Intel Cyclone V GT, Arria V GX, or Arria 10 GX families, as Arria II GX is in its end-of-life window and is increasingly sourced through distributors rather than direct Intel channels.
A practical design tip: Arria II GX transceivers require careful attention to reference-clock jitter and PCB stack-up for the channel. Use the Quartus II transceiver toolkit to characterize link margin, and de-rate the line rate by at least 10-15% during board bring-up to absorb manufacturing tolerance.
This page synthesizes distributor stock and pricing, parametric alternatives, and design notes not found in the Altera Arria II GX Device Handbook, providing an at-a-glance procurement reference for engineers and NPI buyers evaluating this legacy high-density FPGA.
Аналоги без доработки для EP2AGX260FF35I3G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP2AGX260FF35I3G (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Speed Grade, Process Technology, Family.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP2AGX260FF35I5N
✅ Прямая замена✓ В наличии
$1325 / шт.
Открыть даташит →EP2AGX260FF35C6N
✅ Прямая замена✓ В наличии
$1320 / шт.
Открыть даташит →EP2AGX260FF35C5G
✅ Прямая замена✓ В наличии
$1395 / шт.
Открыть даташит →EP2AGX260FF35C4G
✅ Прямая замена✓ В наличии
$1420 / шт.
Открыть даташит →EP2AGX260EF29I3G
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$1480 / шт.
Открыть даташит →EP2AGX190FF35I3G
✅ Прямая замена✓ В наличии
$1840 / шт.
Открыть даташит →EP2AGX260FF35I3G Максимальные параметры и электрические характеристики
| Device Family | Arria II GX |
| Logic Elements | 244188 |
| Embedded Memory Bits | 12038144 |
| Maximum User I/O | 612 |
| Корпус | 1152-BBGA, FCBGA |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| Speed Grade | I3 |
| Рабочая температура | -40 C to +100 C (Industrial) |
| Тип монтажа | Surface Mount |
| Configuration | JTAG / Active Serial / Passive Serial / FPP |
| Lead-Free (RoHS) | Yes (G suffix indicates Pb-free finish) |
Руководство по цоколевке EP2AGX260FF35I3G в корпусе 1152-bbga, fcbga
Цоколевка для EP2AGX260FF35I3G (корпус 1152-bbga, fcbga). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EP2AGX260FF35I3G.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EP2AGX260FF35I3G подходит для 7 применениеs: Wireless Baseband Processing, PCI Express Endpoint and Root Port, High-Speed Serial Bridging, Broadcast Video Processing Engine, Military Radar Signal Processing, Industrial Camera Frame Grabber, Embedded Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX260FF35I3G's 244K logic elements and integrated transceivers up to 6.375 Gbps support CPRI / OBSAI baseband processing for picocell and small-cell base stations. Designers partition the PHY layer into the FPGA's hard transceiver channels and use the abundant logic and embedded memory for symbol-rate processing, encryption acceleration, and framer/deframer logic. The 1152-FBGA 'FF35' package provides 612 user I/O for parallel interface to RF front ends and backhaul Ethernet PHYs. Industrial temperature grade (I3 suffix) supports outdoor and environmentally exposed deployment. For new designs, consider migrating to Arria 10 GX which offers higher logic density and transceivers up to 28 Gbps.
Рекомендуется
PCI Express Endpoint and Root Port
Arria II GX devices integrate a hard PCI Express Gen2 IP core, enabling the EP2AGX260FF35I3G to implement Gen2 x4 or x8 endpoints in industrial and embedded computing applications such as DSP accelerator cards, frame grabbers, and signal-acquisition modules. The hard IP core consumes minimal logic, freeing the 244K LEs and DSP blocks for application-specific processing. The 1152-FBGA 'FF35' package routes the high-speed serial lanes with controlled-impedance differential pairs, simplifying PCB layout. Designers use Quartus II IP Compiler to instantiate the hard core and configure BAR mapping.
Рекомендуется
High-Speed Serial Bridging
With multi-gigabit transceiver channels, the EP2AGX260FF35I3G serves as a bridge between incompatible serial protocols such as Serial RapidIO, Aurora, and proprietary multi-gigabit links. Common bridging scenarios include ASIC-to-ASIC connectivity across board boundaries, FPGA-fabric expansion links, and protocol-conversion test fixtures. The 244K logic elements support full state-machine depth for link-layer arbitration, while the embedded memory blocks provide elastic buffering across clock domains. Industrial temperature grade allows deployment in chassis-mounted line cards without thermal derating.
Рекомендуется
Broadcast Video Processing Engine
The EP2AGX260FF35I3G handles real-time broadcast video workloads including SDI de-embedding / embedding, color-space conversion, and frame-rate conversion. The dedicated DSP blocks accelerate FIR filters and chroma resampling, while the abundant embedded memory (12 Mbit) holds multiple video frames for pipelined processing. Serial transceiver channels accept SDI (Serial Digital Interface) at 270 Mbps / 1.5 Gbps / 3 Gbps without external deserializer. The 1152-FBGA 'FF35' package routes the high-speed SDI inputs alongside HDMI / DVI parallel interfaces. Designers use the Altera Video and Image Processing Suite IP cores to accelerate time-to-market.
Рекомендуется
Military Radar Signal Processing
The Arria II GX family is widely deployed in military radar and electronic-warfare systems because the industrial temperature grade (I3 suffix) and lead-free RoHS-compliant finish (G suffix) meet MIL-STD and IPC Class 3 assembly requirements. The 244K logic elements and DSP blocks perform pulse compression, moving-target-indication (MTI) filtering, and FFT-based beam forming on digitized IF samples. Serial transceiver channels digitize phased-array antenna data at multi-gigabit rates. The 1152-FBGA 'FF35' package supports chip-on-board and PCB-embedded assembly common in aerospace hardware. Note that Arria II GX requires ITAR review for export.
Рекомендуется
Industrial Camera Frame Grabber
Machine-vision and industrial inspection cameras use the EP2AGX260FF35I3G to capture Camera Link, CoaXPress, or GigE Vision streams and pre-process them before forwarding to a host CPU. The transceiver channels handle CoaXPress uplink/downlink, while parallel LVDS pairs accept Camera Link Full/Medium/Base data. The 244K logic elements implement format conversion, defect detection, and compression offload, while embedded memory buffers full frames for image processing pipelines. Industrial temperature grade and lead-free finish suit factory-floor deployment.
Рекомендуется
Embedded Test and Measurement Instrumentation
High-end protocol analyzers and bit-error-rate testers use the EP2AGX260FF35I3G as a flexible pattern generator and analyzer across multiple serial standards. Designers re-purpose the transceiver channels to monitor or generate PCI Express, SATA, USB 3.0, or custom protocols from a single instrument. The 244K logic elements implement protocol-aware decoding and event timestamping. The 1152-FBGA 'FF35' package provides ample I/O for trigger signals and front-panel controls. Industrial temperature grade supports bench and field deployment without thermal design compromises.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP2AGX260FF35I3G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP2AGX260FF35I5N | EP2AGX260FF35C6N | EP2AGX260FF35C5G | EP2AGX260FF35C4G | EP2AGX190FF35I3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (FF35) | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same |
| Speed Grade | I3 | I5 (slower) | C6 | C5 | C4 (fastest) | I3 |
| Temperature Grade | Industrial -40 to +100 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +100 C |
| RoHS Compliance | Yes (G suffix, Pb-free) | No (N suffix, tin-lead) | No (N suffix, tin-lead) | Yes (G suffix, Pb-free) | Yes (G suffix, Pb-free) | Yes (G suffix, Pb-free) |
| Lifecycle Status | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL |
Ключевые отличия
- Highest-density Arria II GX member in the FF35 package (против EP2AGX190FF35I3G)
- Industrial temperature grade with lead-free finish (против EP2AGX260FF35C6N)
- Speed grade I3 balances timing margin and max frequency (против EP2AGX260FF35I5N)
Заметки по проектированию
Estimated: The EP2AGX260FF35I3G in the 1152-FBGA 'FF35' package typically dissipates 6-12 W depending on transceiver utilisation and clock rate. Designers should compute worst-case power using the Altera Early Power Estimator (EPE) in Quartus II and provide a thermally enhanced PCB land pattern with at least 16 thermal vias under the central BGA ball array. For sealed enclosures, derate junction temperature by 15 C below the absolute maximum of 125 C to preserve long-term reliability.
The 1152-FBGA 'FF35' package requires a high-density PCB stack-up with microvia technology. Use 4-6 mil core dielectric and 1 oz copper layers. Maintain 100 ohm differential impedance for the transceiver lanes with length matching within 5 mil. Keep the reference-clock traces less than 1 inch and isolated from noisy digital signals. Altera's pin connection guidelines recommend AC-coupling capacitors of 100 nF on each transceiver lane adjacent to the FPGA.
Do not confuse speed grade suffix conventions: I3 and I5 are industrial, C4/C5/C6 are commercial; lower number indicates faster timing. The G/N suffix indicates lead-free vs tin-lead ball finish respectively. When sourcing on the secondary market, verify the date code to avoid counterfeit parts. Arria II GX is in last-time-buy, so long-term production requires either a lifecycle buy or migration to Arria V GX / Arria 10 GX.
Place configuration memory (EPCS) within 1 inch of the FPGA data lines to avoid signal-integrity issues during configuration. Provide separate decoupling for each power rail: 100 uF bulk + 10 uF + 1 uF + 100 nF per rail per region. Use the Quartus II pin planner to assign transceiver pins and validate PCB layout with the Altera Transceiver Toolkit before tape-out.
Информация о соответствии
RoHS compliance indicated by G suffix per Intel/Altera product naming convention. Not AEC-Q100 qualified (FPGA is not an automotive-grade part). Arria II GX family is in last-time-buy; long-term production planning should account for end-of-life transition to Arria V GX or Arria 10 GX.