EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel
料号： EP2AGX260FF35I3G ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2420 | $242,000.00 |
| 500 | $2190 | $1,095,000.00 |
| 1,000 | $1985 | $1,985,000.00 |
EP2AGX260FF35I3G 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers and memory blocks. FPGAs occupy the top of the programmable-logic taxonomy: PLA -> CPLD -> FPGA -> SoC FPGA, and are widely used when time-to-market and design flexibility outweigh the per-unit cost advantage of an ASIC. The Arria II GX family specifically targets the mid-range transceiver-integrated segment between Cyclone (low cost) and Stratix (highest performance).
Key features include embedded transceivers, hard PCI Express Gen2 IP cores, embedded memory blocks with byte-enable parity, dedicated DSP blocks for high-throughput signal processing, and configuration support via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes. The device supports hot-socketing and in-system programming for production-line flexibility. Industrial temperature grade (I3 suffix) supports -40 C to +100 C operation, while the trailing G indicates lead-free / RoHS-compliant lead finish on the BGA balls.
Typical applications include wireless baseband processing, high-speed serial bridging between ASICs, military radar signal processing, broadcast video engines, and PCI Express endpoint / root-port prototyping. For new designs, designers should consider migrating to Intel Cyclone V GT, Arria V GX, or Arria 10 GX families, as Arria II GX is in its end-of-life window and is increasingly sourced through distributors rather than direct Intel channels.
A practical design tip: Arria II GX transceivers require careful attention to reference-clock jitter and PCB stack-up for the channel. Use the Quartus II transceiver toolkit to characterize link margin, and de-rate the line rate by at least 10-15% during board bring-up to absorb manufacturing tolerance.
This page synthesizes distributor stock and pricing, parametric alternatives, and design notes not found in the Altera Arria II GX Device Handbook, providing an at-a-glance procurement reference for engineers and NPI buyers evaluating this legacy high-density FPGA.
直接替换替代料： EP2AGX260FF35I3G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX260FF35I3G （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Process Technology, Family.
快速对比工具——选择替代料号进行并排对比：
EP2AGX260FF35I5N
✅ 直接替换✓ 有现货
$1325 / 个
查看数据手册 →EP2AGX260FF35C6N
✅ 直接替换✓ 有现货
$1320 / 个
查看数据手册 →EP2AGX260FF35C5G
✅ 直接替换✓ 有现货
$1395 / 个
查看数据手册 →EP2AGX260FF35C4G
✅ 直接替换✓ 有现货
$1420 / 个
查看数据手册 →EP2AGX260EF29I3G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1480 / 个
查看数据手册 →EP2AGX190FF35I3G
✅ 直接替换✓ 有现货
$1840 / 个
查看数据手册 →EP2AGX260FF35I3G 最大额定值与电气特性
| Device Family | Arria II GX |
| Logic Elements | 244188 |
| Embedded Memory Bits | 12038144 |
| Maximum User I/O | 612 |
| 封装 | 1152-BBGA, FCBGA |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| Speed Grade | I3 |
| 工作温度 | -40 C to +100 C (Industrial) |
| 安装类型 | Surface Mount |
| Configuration | JTAG / Active Serial / Passive Serial / FPP |
| Lead-Free (RoHS) | Yes (G suffix indicates Pb-free finish) |
EP2AGX260FF35I3G 1152-bbga, fcbga 引脚配置指南
EP2AGX260FF35I3G（1152-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX260FF35I3G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX260FF35I3G 适用于 7 应用s: Wireless Baseband Processing, PCI Express Endpoint and Root Port, High-Speed Serial Bridging, Broadcast Video Processing Engine, Military Radar Signal Processing, Industrial Camera Frame Grabber, Embedded Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX260FF35I3G's 244K logic elements and integrated transceivers up to 6.375 Gbps support CPRI / OBSAI baseband processing for picocell and small-cell base stations. Designers partition the PHY layer into the FPGA's hard transceiver channels and use the abundant logic and embedded memory for symbol-rate processing, encryption acceleration, and framer/deframer logic. The 1152-FBGA 'FF35' package provides 612 user I/O for parallel interface to RF front ends and backhaul Ethernet PHYs. Industrial temperature grade (I3 suffix) supports outdoor and environmentally exposed deployment. For new designs, consider migrating to Arria 10 GX which offers higher logic density and transceivers up to 28 Gbps.
推荐
PCI Express Endpoint and Root Port
Arria II GX devices integrate a hard PCI Express Gen2 IP core, enabling the EP2AGX260FF35I3G to implement Gen2 x4 or x8 endpoints in industrial and embedded computing applications such as DSP accelerator cards, frame grabbers, and signal-acquisition modules. The hard IP core consumes minimal logic, freeing the 244K LEs and DSP blocks for application-specific processing. The 1152-FBGA 'FF35' package routes the high-speed serial lanes with controlled-impedance differential pairs, simplifying PCB layout. Designers use Quartus II IP Compiler to instantiate the hard core and configure BAR mapping.
推荐
High-Speed Serial Bridging
With multi-gigabit transceiver channels, the EP2AGX260FF35I3G serves as a bridge between incompatible serial protocols such as Serial RapidIO, Aurora, and proprietary multi-gigabit links. Common bridging scenarios include ASIC-to-ASIC connectivity across board boundaries, FPGA-fabric expansion links, and protocol-conversion test fixtures. The 244K logic elements support full state-machine depth for link-layer arbitration, while the embedded memory blocks provide elastic buffering across clock domains. Industrial temperature grade allows deployment in chassis-mounted line cards without thermal derating.
推荐
Broadcast Video Processing Engine
The EP2AGX260FF35I3G handles real-time broadcast video workloads including SDI de-embedding / embedding, color-space conversion, and frame-rate conversion. The dedicated DSP blocks accelerate FIR filters and chroma resampling, while the abundant embedded memory (12 Mbit) holds multiple video frames for pipelined processing. Serial transceiver channels accept SDI (Serial Digital Interface) at 270 Mbps / 1.5 Gbps / 3 Gbps without external deserializer. The 1152-FBGA 'FF35' package routes the high-speed SDI inputs alongside HDMI / DVI parallel interfaces. Designers use the Altera Video and Image Processing Suite IP cores to accelerate time-to-market.
推荐
Military Radar Signal Processing
The Arria II GX family is widely deployed in military radar and electronic-warfare systems because the industrial temperature grade (I3 suffix) and lead-free RoHS-compliant finish (G suffix) meet MIL-STD and IPC Class 3 assembly requirements. The 244K logic elements and DSP blocks perform pulse compression, moving-target-indication (MTI) filtering, and FFT-based beam forming on digitized IF samples. Serial transceiver channels digitize phased-array antenna data at multi-gigabit rates. The 1152-FBGA 'FF35' package supports chip-on-board and PCB-embedded assembly common in aerospace hardware. Note that Arria II GX requires ITAR review for export.
推荐
Industrial Camera Frame Grabber
Machine-vision and industrial inspection cameras use the EP2AGX260FF35I3G to capture Camera Link, CoaXPress, or GigE Vision streams and pre-process them before forwarding to a host CPU. The transceiver channels handle CoaXPress uplink/downlink, while parallel LVDS pairs accept Camera Link Full/Medium/Base data. The 244K logic elements implement format conversion, defect detection, and compression offload, while embedded memory buffers full frames for image processing pipelines. Industrial temperature grade and lead-free finish suit factory-floor deployment.
推荐
Embedded Test and Measurement Instrumentation
High-end protocol analyzers and bit-error-rate testers use the EP2AGX260FF35I3G as a flexible pattern generator and analyzer across multiple serial standards. Designers re-purpose the transceiver channels to monitor or generate PCI Express, SATA, USB 3.0, or custom protocols from a single instrument. The 244K logic elements implement protocol-aware decoding and event timestamping. The 1152-FBGA 'FF35' package provides ample I/O for trigger signals and front-panel controls. Industrial temperature grade supports bench and field deployment without thermal design compromises.
推荐
推荐产品汇总
工程参考数据： EP2AGX260FF35I3G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX260FF35I5N | EP2AGX260FF35C6N | EP2AGX260FF35C5G | EP2AGX260FF35C4G | EP2AGX190FF35I3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (FF35) | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same |
| Speed Grade | I3 | I5 (slower) | C6 | C5 | C4 (fastest) | I3 |
| Temperature Grade | Industrial -40 to +100 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +100 C |
| RoHS Compliance | Yes (G suffix, Pb-free) | No (N suffix, tin-lead) | No (N suffix, tin-lead) | Yes (G suffix, Pb-free) | Yes (G suffix, Pb-free) | Yes (G suffix, Pb-free) |
| Lifecycle Status | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL |
关键差异点
- Highest-density Arria II GX member in the FF35 package （对比 EP2AGX190FF35I3G)
- Industrial temperature grade with lead-free finish （对比 EP2AGX260FF35C6N)
- Speed grade I3 balances timing margin and max frequency （对比 EP2AGX260FF35I5N)
设计说明
Estimated: The EP2AGX260FF35I3G in the 1152-FBGA 'FF35' package typically dissipates 6-12 W depending on transceiver utilisation and clock rate. Designers should compute worst-case power using the Altera Early Power Estimator (EPE) in Quartus II and provide a thermally enhanced PCB land pattern with at least 16 thermal vias under the central BGA ball array. For sealed enclosures, derate junction temperature by 15 C below the absolute maximum of 125 C to preserve long-term reliability.
The 1152-FBGA 'FF35' package requires a high-density PCB stack-up with microvia technology. Use 4-6 mil core dielectric and 1 oz copper layers. Maintain 100 ohm differential impedance for the transceiver lanes with length matching within 5 mil. Keep the reference-clock traces less than 1 inch and isolated from noisy digital signals. Altera's pin connection guidelines recommend AC-coupling capacitors of 100 nF on each transceiver lane adjacent to the FPGA.
Do not confuse speed grade suffix conventions: I3 and I5 are industrial, C4/C5/C6 are commercial; lower number indicates faster timing. The G/N suffix indicates lead-free vs tin-lead ball finish respectively. When sourcing on the secondary market, verify the date code to avoid counterfeit parts. Arria II GX is in last-time-buy, so long-term production requires either a lifecycle buy or migration to Arria V GX / Arria 10 GX.
Place configuration memory (EPCS) within 1 inch of the FPGA data lines to avoid signal-integrity issues during configuration. Provide separate decoupling for each power rail: 100 uF bulk + 10 uF + 1 uF + 100 nF per rail per region. Use the Quartus II pin planner to assign transceiver pins and validate PCB layout with the Altera Transceiver Toolkit before tape-out.
合规信息
RoHS compliance indicated by G suffix per Intel/Altera product naming convention. Not AEC-Q100 qualified (FPGA is not an automotive-grade part). Arria II GX family is in last-time-buy; long-term production planning should account for end-of-life transition to Arria V GX or Arria 10 GX.