EP2AGX95DF25I5N - Arria II GX 95K LEs FPGA, 260 I/O 572-FCBGA
Артикул: EP2AGX95DF25I5N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1060.62 | $1.060,62 |
| 10 | $954.56 | $9.545,60 |
| 100 | $848.5 | $84.850,00 |
| 500 | $742.44 | $371.220,00 |
| 1.000 | $636.37 | $636.370,00 |
EP2AGX95DF25I5N Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated silicon IP blocks (memory, DSP, transceivers, PLLs). In the broader taxonomy, FPGAs belong to the programmable logic device (PLD) family, which itself is a sub-category of digital integrated circuits used for hardware-level parallel processing. Designers select FPGAs over ASICs for low-to-mid volume production, prototyping, and applications requiring post-deployment reconfigurability.
Key differentiators of the Arria II GX family include integrated transceivers that eliminate the need for external PHY chips, embedded PCI Express hard IP blocks, and DSP blocks for high-throughput signal-pipeline acceleration. The EP2AGX95 specifically targets mid-range applications requiring a balance of logic density, memory bandwidth, and serial connectivity. The DF25 package designation indicates a 25 mm x 25 mm FCBGA body with exposed-die lid for thermal management.
Power architecture uses 0.9 V core supply plus separate VCCPD (pre-driver), VCCIO (I/O bank), VCCR_GXB and VCCT_GXB (transceiver analog supplies), and PLL analog rails. Designers must implement a sequencing strategy documented in the Arria II GX Device Handbook to prevent latch-up. The 572-FCBGA package offers a typical theta_JA around 10-14 C/W with adequate airflow, but junction temperatures must stay below 100C for industrial-grade reliability.
Typical applications include wireless baseband processing, software-defined radio (SDR), video broadcast and pro-AV infrastructure, military radar signal chains, test and measurement ASIC prototyping, and PCIe Gen2 endpoint cards. The integrated transceivers make this part especially attractive for protocol-bridge and aggregation designs.
When designing with the EP2AGX95DF25I5N, designers must install the Quartus II design software (legacy support required because the Arria II family is end-of-life on newer Quartus Prime Pro releases). Plan for power-rail sequencing, multiple decoupling capacitor values on every supply, and thermal relief on inner PCB layers tied to the package substrate balls.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Arria II GX 95K logic-density bin, and practical design considerations compiled from Intel/Altera device handbooks and reference designs - information that complements the official datasheet with cross-vendor purchasing guidance.
Аналоги без доработки для EP2AGX95DF25I5N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP2AGX95DF25I5N (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Transceiver Data Rate.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP2AGX95DF25I5G
✅ Прямая замена✓ В наличии
$760 / шт.
Открыть даташит →EP2AGX95DF25C6N
✅ Прямая замена✓ В наличии
$1750 / шт.
Открыть даташит →EP2AGX95DF25C5G
✅ Прямая замена✓ В наличии
$768.9 / шт.
Открыть даташит →EP2AGX95DF25C6G
✅ Прямая замена✓ В наличии
$290 / шт.
Открыть даташит →EP2AGX95DF25C5G
✅ Прямая замена✓ В наличии
$768.9 / шт.
Открыть даташит →EP2AGX95DF25C4G
✅ Прямая замена✓ В наличии
$360 / шт.
Открыть даташит →EP2AGX95DF25I5N Максимальные параметры и электрические характеристики
| Family | Arria II GX |
| Logic Elements | 89,178 |
| Logic Array Blocks (LABs) | 3,747 |
| Embedded Memory (M9K blocks) | 4,486 Kbits |
| Maximum User I/O | 260 |
| Process Node | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Internal Clock Frequency | 500 MHz |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Корпус | 572-ball FCBGA (DF25), 25x25 mm |
| Тип монтажа | Surface Mount |
| Статус RoHS | RoHS Compliant |
| Lead Free Status | Lead Free |
| Design Software | Quartus II (legacy) |
Конфигурация выводов EP2AGX95DF25I5N
| Контакт Bank 1A-1C | User I/O / LVDS — User I/O banks 1A-1C (top side of package, varies by pin) |
| Контакт Bank 2A-2C | User I/O / LVDS — User I/O banks 2A-2C |
| Контакт Bank 3A-3C | User I/O / LVDS — User I/O banks 3A-3C |
| Контакт Bank 4A-4C | User I/O / LVDS — User I/O banks 4A-4C |
| Контакт Bank 5A-5C | User I/O / LVDS — User I/O banks 5A-5C |
| Контакт Bank 6A-6C | User I/O / LVDS — User I/O banks 6A-6C |
| Контакт Bank 7A-7C | User I/O / LVDS — User I/O banks 7A-7C |
| Контакт Bank 8A-8C | User I/O / LVDS — User I/O banks 8A-8C |
| Контакт GXB_TX/RX | Transceiver TX/RX — Multi-gigabit transceiver channel TX/RX pairs (up to 6) |
| Контакт VCC | Core Voltage — 0.9 V core supply |
| Контакт VCCPD | Pre-Driver Voltage — I/O pre-driver supply (2.5V/3.0V/3.3V) |
| Контакт VCCIO | I/O Voltage — I/O bank supply (1.2V to 3.3V depending on I/O standard) |
| Контакт VCCR_GXB | Transceiver RX Analog — Transceiver receiver analog supply (1.1V) |
| Контакт VCCT_GXB | Transceiver TX Analog — Transceiver transmitter analog supply (1.1V) |
| Контакт VCCA_PLL | PLL Analog Supply — PLL analog supply (2.5V) |
| Контакт VCCD_PLL | PLL Digital Supply — PLL digital supply (0.9V) |
| Контакт GND | Ground — Common ground reference |
| Контакт nCONFIG | Configuration Pin — Device configuration control (active-low reset) |
| Контакт nSTATUS | Configuration Status — Configuration status output (active-low) |
| Контакт DCLK | Configuration Clock — Configuration clock input for parallel AS/PS modes |
| Контакт DATA[0..15] | Configuration Data — Configuration data bus for PS/PP modes |
| Контакт MSEL[0..2] | Mode Select — Configuration mode select pins (AS/PS/PP/JTAG) |
| Контакт TCK | JTAG Clock — IEEE 1149.1 JTAG test clock |
| Контакт TMS | JTAG Mode Select — IEEE 1149.1 JTAG mode select |
| Контакт TDI | JTAG Data In — IEEE 1149.1 JTAG test data in |
| Контакт TDO | JTAG Data Out — IEEE 1149.1 JTAG test data out |
| Контакт NC | Not Connected — Not connected (per datasheet) |
| Контакт DNU | Do Not Use — Do not connect (reserved per datasheet) |
Типичное применение
EP2AGX95DF25I5N подходит для 6 применениеs: Wireless Baseband Signal Processing, Software-Defined Radio (SDR) Platforms, PCI Express Endpoint Cards, Video Broadcast and Pro-AV Infrastructure, Test and Measurement ASIC Prototyping, Industrial Automation and Motor Drives.
Wireless Baseband Signal Processing
The EP2AGX95DF25I5N fits wireless baseband designs through its combination of 89K logic elements, embedded DSP blocks, and up to 6 multi-gigabit transceiver channels operating to 3.75 Gbps. Designers use this part to implement CPRI fronthaul aggregation, LTE PHY layer functions, and digital predistortion feedback paths. The 4,486 Kbits of M9K embedded memory buffer incoming IQ samples between the RF front end and the DSP pipeline, while the transceiver channels carry CPRI data at rates compatible with 3G/4G base station links. Industrial temperature grade allows deployment in outdoor base-station cabinets where ambient temperatures can exceed 70C.
Рекомендуется
Software-Defined Radio (SDR) Platforms
The integrated transceivers and high logic density of the EP2AGX95DF25I5N make it a strong fit for software-defined radio platforms where reconfigurability is mandatory. Designers route ADC/DAC data through the FPGA's transceiver channels and perform channelization, modulation/demodulation, and protocol-layer processing in programmable logic. The 40 nm process balances power consumption against the high toggle rates required for wideband SDR processing, while the FCBGA package provides the thermal headroom needed for sustained full-bandwidth operation. Industrial temperature rating extends deployment to field-grade SDR equipment used in electronic warfare and SIGINT.
Рекомендуется
PCI Express Endpoint Cards
The EP2AGX95DF25I5N includes hard PCI Express IP blocks that support PCIe Gen1 x4 and Gen2 x4 endpoint functionality without consuming fabric logic. Designers implement the PCIe transaction layer, DMA engines, and application logic in the 89K LEs while the hard IP block handles the PHY and data link layers. This combination delivers 4 Gbps aggregate bandwidth for high-throughput endpoint applications like data-acquisition cards, FPGA co-processing accelerators, and protocol-bridge cards. The 572-FCBGA package supports the necessary board real-estate for PCIe edge-finger connectors and reference-clock routing.
Рекомендуется
Video Broadcast and Pro-AV Infrastructure
The transceiver-rich architecture of the EP2AGX95DF25I5N supports SMPTE SDI, HDMI, DisplayPort, and other broadcast standards through SerDes and protocol IP. The 89K logic elements enable multi-channel SDI processing (up to 4 HD-SDI or 1 3G-SDI stream with full audio embedding/de-embedding), while the M9K memory blocks act as line buffers for scaling, deinterlacing, and color-space conversion. Industrial temperature grade ensures reliable operation in broadcast studio equipment racks and outdoor event-production vehicles where ambient temperatures vary widely.
Рекомендуется
Test and Measurement ASIC Prototyping
Engineers use the EP2AGX95DF25I5N for ASIC prototyping because it offers 89K logic elements - sufficient to fit many mid-complexity ASIC RTL designs - plus embedded transceivers to mimic high-speed serial ASIC interfaces. Designers map ASIC RTL to FPGA using Quartus II synthesis, then validate functional behavior, firmware, and inter-chip connectivity at near-real-time speeds. The industrial temperature grade allows prototype validation under stress-temperature testing, and the FCBGA package supports the same BGA breakout layout used in production ASIC packages to simplify bring-up.
Рекомендуется
Industrial Automation and Motor Drives
The EP2AGX95DF25I5N suits industrial automation designs that combine deterministic control loops with high-bandwidth communication. Designers implement EtherCAT, PROFINET, or SERCOS III master controllers in the FPGA fabric, while the transceiver channels handle the real-time Ethernet PHY. The 89K logic elements allow multiple motor-control axes to be processed in parallel, and the embedded DSP blocks implement field-oriented control (FOC) algorithms with sub-microsecond loop times. Industrial temperature grade ensures reliable operation in factory-floor cabinets and motor-drive enclosures with ambient temperatures up to 100C.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP2AGX95DF25I5N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP2AGX95DF25I5G | EP2AGX95DF25C6N | EP2AGX95DF25C5G | EP2AGX95DF25C6G | EP2AGX95DF25C5 | EP2AGX95DF25C4G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 572-FCBGA (DF25) 25x25 mm | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same | 572-FCBGA (DF25) - same |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 5 | 5 | 6 | 5 | 6 | 5 | 4 |
| RoHS Compliance | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free | RoHS Compliant, Lead Free |
| Logic Array Blocks (LABs) | 3,747 | 3,747 | 3,747 | 3,747 | 3,747 | 3,747 | 3,747 |
| Embedded Memory (M9K) | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits | 4,486 Kbits |
| Maximum User I/O | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
Ключевые отличия
- Industrial temperature grade with same die and pinout as commercial variants (против EP2AGX95DF25C6N)
- Mid-tier speed grade 5 balances Fmax and power for general-purpose use (против EP2AGX95DF25C6G (speed grade 6))
- Same logic capacity as the smaller Arria II GX EP2AGX65 in larger package (против EP2AGX65DF29I5N (65K LEs in DF29 780-ball))
Заметки по проектированию
The EP2AGX95DF25I5N requires a multi-rail power architecture with separate supplies for VCC (0.9V core), VCCPD (2.5V/3.0V/3.3V pre-driver), VCCIO (per-bank I/O voltage), VCCR_GXB and VCCT_GXB (1.1V transceiver analog), and VCCA_PLL/VCCD_PLL (PLL analog/digital). According to the Arria II GX Device Handbook, supplies must be sequenced to prevent latch-up - typically VCC first, then VCCR_GXB/VCCT_GXB, then VCCA_PLL, then VCCIO/VCCPD. Use a multi-rail sequencer IC and verify ramp rates match the datasheet maximum (typically 100 mV/us for core). Decoupling: place 0402 0.1uF X7R capacitors every 8-10 balls, plus bulk 10-47uF tantalums per supply island.
The 572-FCBGA package dissipates 5-15 W under typical load (varies by toggle rate, transceiver utilization, and I/O switching). Estimated: at 15W dissipation with no airflow and standard 4-layer PCB, theta_JA is approximately 14 C/W yielding a 210C junction rise - far above the 100C industrial limit. Required mitigations: (1) inner-layer copper pours tied to the central ground balls, (2) a top-side heatsink with thermal interface material, or (3) forced-air cooling at 1-2 m/s. Use the Arria II GX PowerPlay Early Power Estimator (EPE) spreadsheet to validate thermal design before PCB layout.
PCB layout for the 572-FCBGA DF25 (25x25 mm, 1.0 mm pitch) requires HDI stackup with laser-drilled microvias and stacked via structures. Use 8+ layer stackup with dedicated ground and power planes adjacent to the outer BGA row. Match trace lengths for transceiver differential pairs to within 150 um and 90 ohm differential impedance per the device handbook. Configure JTAG chain with TCK pull-down, TMS pull-up, TDI pull-up, and TDO left open per IEEE 1149.1.
Common mistakes when designing with the EP2AGX95DF25I5N: (1) using Quartus Prime Pro Edition (does not support Arria II - use Quartus II 13.1 or Quartus Prime Standard); (2) ignoring the 1.0 mm BGA pitch which requires HDI PCB fabrication; (3) failing to power-cycle the device properly when reconfiguration is needed (use nCONFIG pulse); (4) leaving MSEL pins floating - they must be tied to logic 0 or 1 per the configuration mode select table; (5) omitting pull-ups on nCONFIG/nSTATUS when using JTAG-only configuration mode.
Информация о соответствии
RoHS Compliant and Lead Free per DigiKey listing. AEC-Q100 is not applicable for FPGAs - automotive qualification is at the OEM design level. Halogen-free per Intel/Altera product marking. REACH compliance documented via Intel material declaration certificates.
