Intel

EP3C16F484I7 - Cyclone III FPGA, 16K LE, 484-BGA | Intel

Артикул: EP3C16F484I7 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
484-ball FineLine BGA (F484) Package 7 (fastest commercial/industrial) Speed 516,096 bits (63 KB) Memory
От $58.1 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-08
Оптовые цены
Кол-во Цена за ед. Итого
1 $92.77 $92,77
10 $88.5 $885,00
100 $76.2 $7.620,00
500 $65.4 $32.700,00
1.000 $58.1 $58.100,00
ℹ️ Все цены указаны в USD

EP3C16F484I7 Обзор

The Intel (formerly Altera) EP3C16F484I7 is a low-power Cyclone III Field Programmable Gate Array delivering 15,408 logic elements, 516,096 bits of embedded RAM, and 346 user I/Os in a 484-ball FineLine BGA package, operating across the industrial -40C to +100C temperature range.

What is a Cyclone III FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic, glue logic, DSP pipelines, or even soft-processor systems-on-chip. Cyclone III sits at the low-power, cost-optimized end of Intel's FPGA portfolio, fabricated on a 60 nm TSMC process and tailored for high-volume, power-sensitive designs.

Key features include 15,408 logic elements organized into 963 LABs, 504 Kbit of dedicated M9K embedded memory blocks (totaling 516,096 bits), 56 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and Cyclone III's signature low-power architecture that consumes roughly half the static current of the prior Cyclone II generation. The 484-FBGA package exposes 346 user I/Os supporting LVDS, SSTL, HSTL, and LVCMOS standards at up to 640 Mbps LVDS.

Cyclone III devices are configured via passive serial, fast passive parallel, active serial, fast active parallel, or JTAG modes using industry-standard Altera/Intel Quartus II or Quartus Prime design software. Bitstream encryption with AES is supported on Cyclone III LS variants, and the family uses SRAM-based configuration cells requiring an external boot PROM or JTAG source.

Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, low-cost software-defined radio front-ends, USB/Ethernet bridging, medical imaging pre-processing, and automotive infotainment prototypes. The combination of low unit cost and a robust Quartus toolchain makes Cyclone III a common choice for both prototypes and production runs of 10K-100K units.

When designing with this device, ensure your power budget accounts for both static (always-on) consumption and dynamic toggle power, and follow Intel's cyclone III pin connection guidelines to leave unused I/Os properly biased. Bitstream configuration time at 40 MHz DCLK with a serial EPCS flash is typically under 50 ms for a full 16K LE design.

This page synthesizes distributor pricing, drop-in Cyclone III speed-grade alternatives, and practical PCB and configuration design notes that complement the manufacturer datasheet.

Аналоги без доработки для EP3C16F484I7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP3C16F484I7 (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Embedded Memory, Speed Grade, Logic Array Blocks (LABs).

Intel
Process Technology: 65 nm
Embedded Memory: 3,981,312 bits
Сравнить с EP3C16F484I7 →
Intel
Package: 484-FBGA (FBGA-484) 23 x 23 mm, 1.0 mm pitch
Process Technology: 65 nm
Speed Grade: 7 (commercial/industrial)
Сравнить с EP3C16F484I7 →
Intel
Package: 484-ball FineLine BGA (FBGA)
Process Technology: 65 nm TSMC
Embedded Memory: 516,096 bits (504 Kbits)
Сравнить с EP3C16F484I7 →
Intel
Package: 484-ball FBGA
Process Technology: 65 nm TSMC low-power
Embedded Memory: 504 Kbits (M9K blocks)
Сравнить с EP3C16F484I7 →
Intel
Package: 484-BGA (FineLine BGA)
Process Technology: 60 nm low-power CMOS
Embedded Memory: 504 Kbit (M9K blocks)
Сравнить с EP3C16F484I7 →
Altera
Package: 484-FBGA (FineLine BGA, 1.0 mm pitch)
Process Technology: 65 nm
Сравнить с EP3C16F484I7 →
Intel
Package: 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Process Technology: TSMC 65 nm low-power CMOS
Embedded Memory: 608,256 bits (594 Kbits M9K blocks)
Сравнить с EP3C16F484I7 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EP3C16F484C7N

✅ Прямая замена
Intel
📦 484-ball FBGA (F484)
Cyclone III · 15,408 · 504 Kbits (M9K blocks) · 56 (18x18) · 4 · 346 · 65 nm TSMC low-power · 1.2 V (1.15 V to 1.25 V)

✓ В наличии

$30.1 / шт.

Открыть даташит →

EP3C16F484C8N

✅ Прямая замена
Intel
📦 484-ball FBGA (F484)
Cyclone III · Intel (formerly Altera) · 15,408 LE · 963 ALM · 963 LAB · 504 Kbit (M9K blocks) · 56 · 4

✓ В наличии

$29.95 / шт.

Открыть даташит →

EP3C16F484C6N

✅ Прямая замена
Intel
📦 484-ball FBGA (F484)
Cyclone III · Cyclone III · 15,408 · 963 ALMs · 516,096 bits (504 Kbits) · 56 · 346 · 4

✓ В наличии

$338.75 / шт.

Открыть даташит →

EP3C120F484I7N

✅ Прямая замена
Intel
📦 484-ball FBGA (F484)
Cyclone III · FPGA · 119,088 · 7,443 · 432 · 3,981,312 (approx. 4 Mbits) · 288 · 283

✓ В наличии

$84.7 / шт.

Открыть даташит →

EP3C120F484I7

✅ Прямая замена
Intel
📦 484-ball FBGA (F484)
Cyclone III · Intel (formerly Altera) · 119,088 · 3,981,312 bits · 283 · 484 · 484-FBGA (FineLine BGA, 23x23 mm, 1.0 mm pitch)

✓ В наличии

$595.8 / шт.

Открыть даташит →

EP3C16F484I7 Максимальные параметры и электрические характеристики

Family Cyclone III
Manufacturer Intel (formerly Altera)
Logic Elements 15,408
Logic Array Blocks (LABs) 963
Total Embedded Memory 516,096 bits (63 KB)
Embedded Memory Blocks M9K x 56
Embedded 18x18 Multipliers 56
User I/Os 346
General-Purpose PLLs 4
Корпус 484-ball FineLine BGA (F484)
Рабочая температура -40C to +100C (industrial)
Speed Grade 7 (fastest commercial/industrial)
Process Node 60 nm TSMC low-power
Configuration Method Passive Serial, Fast Passive Parallel, Active Serial, JTAG
Статус RoHS Compliant
Тип монтажа Surface Mount

Руководство по цоколевке EP3C16F484I7 в корпусе 484-ball fineline bga (f484)

Цоколевка для EP3C16F484I7 (корпус 484-ball fineline bga (f484)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 484-ball fineline bga (f484) для EP3C16F484I7

Нет подробных данных о распиновке для EP3C16F484I7.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

EP3C16F484I7 подходит для 6 применениеs: Industrial Motor Control, Video Surveillance / Image Processing, Software-Defined Radio Front-End, USB / Ethernet Bridging Gateways, Medical Imaging Pre-Processing, Automotive Infotainment Prototyping.

🏭

Industrial Motor Control

The EP3C16F484I7's 56 embedded 18x18 multipliers and 4 PLLs make it a strong fit for industrial motor control loops where field-oriented control (FOC) algorithms demand deterministic DSP throughput. Its 346 user I/Os accept multiple encoder and resolver feedback channels, plus PWM outputs for three-phase inverter bridges, while the industrial -40C to +100C temperature range tolerates factory-floor thermal stress. Power consumption is lower than Cyclone II by roughly half at the same clock rate, enabling fanless enclosures. Designers typically instantiate soft IP such as the Altera Nios II processor to run commutation logic alongside hardware-accelerated Park/Clarke transforms in fabric.

🎥

Video Surveillance / Image Processing

With 516 Kbit embedded RAM distributed across 56 M9K blocks, the EP3C16F484I7 supports line-buffer memory for mid-resolution video pipelines (CIF to 720p) without external SRAM. The 56 multipliers handle real-time 2D convolution, Sobel edge detection, and motion-vector estimation at 30-60 fps. Its 346 I/Os comfortably accommodate parallel ITU-R BT.656 / OV7670 sensor interfaces plus a soft LCD controller, and the Cyclone III low-power architecture keeps board thermals manageable in sealed outdoor dome cameras. Quartus Prime provides free VIP reference designs accelerating time-to-market.

📻

Software-Defined Radio Front-End

The EP3C16F484I7's combination of 56 multipliers and 4 PLLs enables moderate-bandwidth SDR implementations such as FM demodulation, narrow-band digital voice, or experimental LTE downlink receivers below 5 MHz bandwidth. PLLs provide flexible sample-rate conversion for ADC interfaces, and the 346 I/Os accept parallel LVDS data from high-speed ADCs. While Cyclone III lacks the transceivers of higher-end families, its DSP throughput is well-matched to sub-100 MHz IF processing and it integrates cleanly with external RF front-ends. Hobbyists use it with the Altera DE0-Nano board for amateur-radio experimentation.

🌐

USB / Ethernet Bridging Gateways

Bridging USB 2.0 high-speed to 10/100 Ethernet is a classic Cyclone III use case that fits comfortably within 15,408 logic elements. The device's 4 PLLs generate the 480 MHz USB ULPI clock and the 25/50 MHz Ethernet PHY clocks, while 56 M9K blocks buffer packet FIFOs at wire speed. Soft IP cores such as the Altera USB device controller and Ethernet MAC reduce firmware burden, and the 346 I/Os leave headroom for additional UART, SPI, or GPIO bridging channels. Industrial temperature operation permits use in factory-floor protocol converters and serial-server appliances.

💊

Medical Imaging Pre-Processing

Mid-resolution ultrasound front-ends and portable patient monitors use Cyclone III devices like the EP3C16F484I7 for pre-processing prior to a host CPU or DSP. The device's 56 multipliers implement real-time FIR filtering and beamforming on small-array transducers, while its 4 PLLs synchronize ADC sampling across multiple channels with sub-nanosecond jitter. Low static power dissipation simplifies IEC 60601 patient-isolation thermal budgets. Designers pair the FPGA with a low-power soft-core such as Nios II/e to handle control-plane tasks while the fabric accelerates signal-path math.

🚗

Automotive Infotainment Prototyping

Engineers prototyping head-unit platforms for CAN/LIN gateway, LVDS display aggregation, and surround-view camera stitching use the EP3C16F484I7 as a flexible pre-silicon development target. The 346 user I/Os expose multiple LVDS pairs to drive 800x480 WVGA panels, and 56 multipliers handle basic H.264 decode assist or 360-degree image warping at low frame rates. While Cyclone III itself is not AEC-Q100 qualified, it accelerates software/firmware development before migration to production automotive-grade FPGAs. The industrial -40C to +100C temperature range tolerates dashboard thermal environments during lab and vehicle trials.

What is the logic element count of EP3C16F484I7?
The EP3C16F484I7 contains 15,408 logic elements organized into 963 Logic Array Blocks (LABs) per the Intel Cyclone III Device Handbook. Each LAB contains 16 Logic Elements, and the device also provides 56 M9K memory blocks for 516 Kbit total embedded RAM, giving mid-range capacity suitable for industrial glue logic and video pipelines.
Where can I buy EP3C16F484I7 online?
EP3C16F484I7 is stocked at distributors including DigiKey (p/n 4161165), Mouser, LCSC, Octopart-indexed suppliers, and Bettlink as of 2026-09-09. Reference pricing observed on ICComponents was approximately $92.77 at 60-piece quantity, with LCSC listing from $23.33. Lead times vary by distributor; LCSC shows immediate stock while legacy distributors may quote 8-12 weeks.
What is the current price of EP3C16F484I7?
According to distributor data retrieved 2026-09-09, EP3C16F484I7 reference pricing is approximately $92.77 at 60-piece quantities (ICComponents), with LCSC listing from $23.33 and Octopart aggregating quotes from two authorized distributors. Volume pricing improves substantially at 1000 pieces; consult DigiKey and Mouser for live qty-break quotes as FPGA pricing fluctuates with foundry allocation.
What is the lead time for EP3C16F484I7?
Lead time for EP3C16F484I7 is approximately 8-12 weeks from authorized distributors as of 2026-09-09, because Cyclone III is a mature family still in production but no longer the newest node. LCSC and Bettlink list the part in stock for immediate shipment, while DigiKey and Mouser typically quote factory lead times when distributor stock is depleted.
Is EP3C16F484I7 still in stock?
Yes, EP3C16F484I7 is in stock at multiple distributors as of 2026-09-09, including LCSC, Bettlink, and DigiKey (p/n 4161165). Because Cyclone III remains in active production rather than EOL, allocation is generally stable; however, large 10K+ unit orders may trigger factory lead times of 8-12 weeks.
EP3C16F484I7 vs EP3C16E144I7N - which is better for compact designs?
Choose EP3C16E144I7N when PCB area matters most: it places the same 15,408 logic elements and 56 multipliers in a much smaller 144-pin EQFP package, but only exposes 84 user I/Os versus 346 on the EP3C16F484I7. Choose EP3C16F484I7 when you need high I/O count for parallel video buses, multiple memory interfaces, or dense sensor aggregation.
What is the difference between EP3C16F484I7 and EP3C16F484C8N?
Both parts share the same 484-ball FBGA package and 15,408 logic element Cyclone III silicon, but the EP3C16F484I7 is the faster industrial-temperature speed grade 7 (top-bin), while EP3C16F484C8N is the slower commercial temperature speed grade 8 variant. For designs needing full industrial -40C to +100C operation at maximum Fmax, the EP3C16F484I7 is the correct choice.
When should I choose EP3C16F484I7 over a Cyclone IV EP4CE6?
Choose EP3C16F484I7 when you need more logic capacity (15,408 LE versus 6,272 LE on the EP4CE6) and require the proven low-power Cyclone III silicon for industrial designs. Choose EP4CE6 when your design fits within 6K LE, you want the slightly lower static power of Cyclone IV, and you prefer a fresher long-term supply commitment from Intel.
What is the best drop-in replacement for EP3C16F484I7?
The best drop-in replacement is EP3C16F484C8N: identical 484-ball FBGA package and 15,408 LE silicon, differing only in temperature range (commercial 0-85C versus industrial -40C to +100C) and speed grade (8 versus 7). It is pin-compatible for designs whose junction temperature stays within commercial limits. For cost reduction EP3C16F484C7N is the same die in speed grade 7 commercial.
Where to download EP3C16F484I7 datasheet PDF?
The official EP3C16F484I7 datasheet is the Cyclone III Device Handbook, a 274-page document originally published by Altera Corporation and now maintained by Intel. Download it from alldatasheet.com (search part number EP3C16F484I7) or from Intel's cyclone III documentation archive; the handbook contains full pinout tables, electrical characteristics, and configuration timing specifications.
Where can I find the EP3C16F484I7 pinout?
The complete 484-ball FBGA pinout for EP3C16F484I7 is documented in chapter 4 of the Cyclone III Device Handbook, with ball coordinates (rows A-AA, columns 1-22) and per-bank I/O standard assignments. Use Intel's Pin-Out Files (EP3C16F484) within Quartus Prime for machine-readable pin name lists; XAIPART also publishes a rendered pin diagram for this part on its product page.
Is EP3C16F484I7 the same as EP3C16F484I7N?
Yes, functionally EP3C16F484I7 and EP3C16F484I7N refer to the same industrial-temperature 484-FBGA Cyclone III device. The 'N' suffix on Intel/Altera ordering part numbers indicates lead-free terminal finish and is the modern ordering code for the same silicon; the underlying die, pinout, and electrical characteristics are identical.
What is the best Lattice equivalent for EP3C16F484I7?
The closest Lattice Semiconductor drop-in alternative is the ECP5 family LFE5U-85F in a similar high-I/O BGA package, which delivers approximately 84K LUTs versus 15K LE on the EP3C16F484I7. Pinout and bitstream are not compatible, so the swap requires a board respin and re-implementation in Lattice Diamond, but it offers lower static power and a fresher long-term supply commitment.
What are the key specifications of EP3C16F484I7 that engineers should know?
EP3C16F484I7 key specifications are: 15,408 logic elements in 963 LABs, 516,096 bits of embedded M9K RAM, 56 18x18 multipliers, 346 user I/Os, 4 general-purpose PLLs, 484-ball FineLine BGA package, industrial -40C to +100C temperature range, speed grade 7, 60 nm low-power TSMC process, and Quartus II/Prime configuration via serial or JTAG. These specs determine DSP throughput, I/O fan-out, and operating envelope.

Справочные инженерные данные для EP3C16F484I7 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose EP3C16F484I7 when you need a proven, cost-effective FPGA with 15K logic elements, 346 user I/Os, and industrial -40C to +100C operation in a 484-FBGA package - typical for industrial motor control, video surveillance, and bridging gateways. Choose EP3C16F484C7N or EP3C16F484C8N if your cabinet environment stays within commercial 0C to +85C and you want faster speed grade 7 or lower-cost speed grade 8. Step up to EP3C120F484I7N when your design exceeds 16K logic elements and you can accept 296 I/Os. For fresh long-term supply commitments, evaluate Lattice ECP5 LFE5U series or Intel Cyclone 10 LP, noting bitstream and toolchain re-design is required.

Сравнение с аналогами

Параметр Этот товар EP3C16F484C7N EP3C16F484C8N EP3C16F484C6N EP3C120F484I7N EP3C120F484I7
Brand Intel (Cyclone III) Intel (Cyclone III) Intel (Cyclone III) Intel (Cyclone III) Intel (Cyclone III) Intel (Cyclone III)
Package 484-ball FBGA (F484) 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same
Logic Elements 15,408 15,408 15,408 15,408 119,088 119,088
Embedded RAM (bits) 516,096 516,096 516,096 516,096 3,888,096 3,888,096
18x18 Multipliers 56 56 56 56 288 288
User I/Os 346 346 346 346 296 296
Speed Grade 7 (fastest) 7 8 (slower) 6 (slowest) 7 7
Temperature Range Industrial -40C to +100C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Industrial -40C to +100C Industrial -40C to +100C

Ключевые отличия

  • Highest speed grade in industrial temperature range (против EP3C16F484C8N)
  • Seven-fold density headroom within the same package (против EP3C120F484I7N)
  • Lowest static power in the Cyclone III family (против Lattice ECP5 LFE5U-85F (cross-brand))

Заметки по проектированию

Cyclone III EP3C16F484I7 static current at 25C is approximately 60-80 mA core plus I/O leakage; dynamic power scales with toggle rate. Decouple each VCCINT/VCCA/VCCPD plane with 0.1 uF X7R ceramics placed within 5 mm of the BGA balls, and provide at least one bulk 47 uF tantalum per supply rail. Sequence VCCINT before VCCA/VCCPD by at least 1 ms to avoid latch-up during hot-plug events.

The 484-ball FBGA has a 1.0 mm pitch; use a 4+ layer PCB with continuous VCCINT/GND planes and microvia-in-pad stackup for breakout routing. All eight I/O banks require dedicated VCCIO supplies; do not tie them together unless your design uses a single I/O standard across all banks. Match JTAG TCK trace length to within 25 mm of TMS/TDI/TDO to keep programming reliable at 30 MHz.

Do not leave unused configuration pins floating - tie MSEL[3:0] to VCCPD or GND through 10 kohm resistors to select the desired configuration mode. Confirm the boot PROM (typically EPCS16 or EPCS64) is rated for the target junction temperature; industrial -40C to +100C operation requires the -I7 PROM suffix. Cyclone III SRAM configuration cells are volatile - design must include an external flash for production.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS and lead-free per Intel product page; Cyclone III is not AEC-Q100 qualified - for automotive production choose Cyclone IV or Cyclone 10 automotive variants.

Данные проверены: 2026-09-09 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Intel Altera Cyclone III EP3C16F484I7 EP3C16F484C7N EP3C16F484C8N EP3C16F484C6N EP3C120F484I7N EP3C120F484I7 FPGA field programmable gate array logic element logic array block LAB M9K memory block embedded RAM DSP multiplier 18x18 multiplier PLL phase-locked loop FineLine BGA FBGA surface mount RoHS AEC-Q100 Quartus Prime Nios II JTAG EPCS flash industrial temperature range motor control video image processing USB Ethernet bridging software-defined radio
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