EP3C16F484I7 - Cyclone III FPGA, 16K LE, 484-BGA | Intel
N.º da peça: EP3C16F484I7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $92.77 | $92,77 |
| 10 | $88.5 | $885,00 |
| 100 | $76.2 | $7.620,00 |
| 500 | $65.4 | $32.700,00 |
| 1.000 | $58.1 | $58.100,00 |
EP3C16F484I7 Visão geral
What is a Cyclone III FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic, glue logic, DSP pipelines, or even soft-processor systems-on-chip. Cyclone III sits at the low-power, cost-optimized end of Intel's FPGA portfolio, fabricated on a 60 nm TSMC process and tailored for high-volume, power-sensitive designs.
Key features include 15,408 logic elements organized into 963 LABs, 504 Kbit of dedicated M9K embedded memory blocks (totaling 516,096 bits), 56 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and Cyclone III's signature low-power architecture that consumes roughly half the static current of the prior Cyclone II generation. The 484-FBGA package exposes 346 user I/Os supporting LVDS, SSTL, HSTL, and LVCMOS standards at up to 640 Mbps LVDS.
Cyclone III devices are configured via passive serial, fast passive parallel, active serial, fast active parallel, or JTAG modes using industry-standard Altera/Intel Quartus II or Quartus Prime design software. Bitstream encryption with AES is supported on Cyclone III LS variants, and the family uses SRAM-based configuration cells requiring an external boot PROM or JTAG source.
Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, low-cost software-defined radio front-ends, USB/Ethernet bridging, medical imaging pre-processing, and automotive infotainment prototypes. The combination of low unit cost and a robust Quartus toolchain makes Cyclone III a common choice for both prototypes and production runs of 10K-100K units.
When designing with this device, ensure your power budget accounts for both static (always-on) consumption and dynamic toggle power, and follow Intel's cyclone III pin connection guidelines to leave unused I/Os properly biased. Bitstream configuration time at 40 MHz DCLK with a serial EPCS flash is typically under 50 ms for a full 16K LE design.
This page synthesizes distributor pricing, drop-in Cyclone III speed-grade alternatives, and practical PCB and configuration design notes that complement the manufacturer datasheet.
Alternativas drop-in para EP3C16F484I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C16F484I7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Embedded Memory, Speed Grade, Logic Array Blocks (LABs).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C16F484C7N
✅ Drop-In✓ Em estoque
$30.1 / unidade
Ver ficha técnica →EP3C16F484C8N
✅ Drop-In✓ Em estoque
$29.95 / unidade
Ver ficha técnica →EP3C16F484C6N
✅ Drop-In✓ Em estoque
$338.75 / unidade
Ver ficha técnica →EP3C120F484I7N
✅ Drop-In✓ Em estoque
$84.7 / unidade
Ver ficha técnica →EP3C120F484I7
✅ Drop-In✓ Em estoque
$595.8 / unidade
Ver ficha técnica →EP3C16F484I7 Classificações máximas e características elétricas
| Family | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 15,408 |
| Logic Array Blocks (LABs) | 963 |
| Total Embedded Memory | 516,096 bits (63 KB) |
| Embedded Memory Blocks | M9K x 56 |
| Embedded 18x18 Multipliers | 56 |
| User I/Os | 346 |
| General-Purpose PLLs | 4 |
| Encapsulamento | 484-ball FineLine BGA (F484) |
| Temperatura de operação | -40C to +100C (industrial) |
| Speed Grade | 7 (fastest commercial/industrial) |
| Process Node | 60 nm TSMC low-power |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do EP3C16F484I7 484-ball fineline bga (f484)
Configuração de pinos para EP3C16F484I7 (pacote 484-ball fineline bga (f484)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C16F484I7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C16F484I7 é adequado para 6 aplicaçãos: Industrial Motor Control, Video Surveillance / Image Processing, Software-Defined Radio Front-End, USB / Ethernet Bridging Gateways, Medical Imaging Pre-Processing, Automotive Infotainment Prototyping.
Industrial Motor Control
The EP3C16F484I7's 56 embedded 18x18 multipliers and 4 PLLs make it a strong fit for industrial motor control loops where field-oriented control (FOC) algorithms demand deterministic DSP throughput. Its 346 user I/Os accept multiple encoder and resolver feedback channels, plus PWM outputs for three-phase inverter bridges, while the industrial -40C to +100C temperature range tolerates factory-floor thermal stress. Power consumption is lower than Cyclone II by roughly half at the same clock rate, enabling fanless enclosures. Designers typically instantiate soft IP such as the Altera Nios II processor to run commutation logic alongside hardware-accelerated Park/Clarke transforms in fabric.
Recomendado
Video Surveillance / Image Processing
With 516 Kbit embedded RAM distributed across 56 M9K blocks, the EP3C16F484I7 supports line-buffer memory for mid-resolution video pipelines (CIF to 720p) without external SRAM. The 56 multipliers handle real-time 2D convolution, Sobel edge detection, and motion-vector estimation at 30-60 fps. Its 346 I/Os comfortably accommodate parallel ITU-R BT.656 / OV7670 sensor interfaces plus a soft LCD controller, and the Cyclone III low-power architecture keeps board thermals manageable in sealed outdoor dome cameras. Quartus Prime provides free VIP reference designs accelerating time-to-market.
Recomendado
Software-Defined Radio Front-End
The EP3C16F484I7's combination of 56 multipliers and 4 PLLs enables moderate-bandwidth SDR implementations such as FM demodulation, narrow-band digital voice, or experimental LTE downlink receivers below 5 MHz bandwidth. PLLs provide flexible sample-rate conversion for ADC interfaces, and the 346 I/Os accept parallel LVDS data from high-speed ADCs. While Cyclone III lacks the transceivers of higher-end families, its DSP throughput is well-matched to sub-100 MHz IF processing and it integrates cleanly with external RF front-ends. Hobbyists use it with the Altera DE0-Nano board for amateur-radio experimentation.
Recomendado
USB / Ethernet Bridging Gateways
Bridging USB 2.0 high-speed to 10/100 Ethernet is a classic Cyclone III use case that fits comfortably within 15,408 logic elements. The device's 4 PLLs generate the 480 MHz USB ULPI clock and the 25/50 MHz Ethernet PHY clocks, while 56 M9K blocks buffer packet FIFOs at wire speed. Soft IP cores such as the Altera USB device controller and Ethernet MAC reduce firmware burden, and the 346 I/Os leave headroom for additional UART, SPI, or GPIO bridging channels. Industrial temperature operation permits use in factory-floor protocol converters and serial-server appliances.
Recomendado
Medical Imaging Pre-Processing
Mid-resolution ultrasound front-ends and portable patient monitors use Cyclone III devices like the EP3C16F484I7 for pre-processing prior to a host CPU or DSP. The device's 56 multipliers implement real-time FIR filtering and beamforming on small-array transducers, while its 4 PLLs synchronize ADC sampling across multiple channels with sub-nanosecond jitter. Low static power dissipation simplifies IEC 60601 patient-isolation thermal budgets. Designers pair the FPGA with a low-power soft-core such as Nios II/e to handle control-plane tasks while the fabric accelerates signal-path math.
Recomendado
Automotive Infotainment Prototyping
Engineers prototyping head-unit platforms for CAN/LIN gateway, LVDS display aggregation, and surround-view camera stitching use the EP3C16F484I7 as a flexible pre-silicon development target. The 346 user I/Os expose multiple LVDS pairs to drive 800x480 WVGA panels, and 56 multipliers handle basic H.264 decode assist or 360-degree image warping at low frame rates. While Cyclone III itself is not AEC-Q100 qualified, it accelerates software/firmware development before migration to production automotive-grade FPGAs. The industrial -40C to +100C temperature range tolerates dashboard thermal environments during lab and vehicle trials.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C16F484I7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C16F484C7N | EP3C16F484C8N | EP3C16F484C6N | EP3C120F484I7N | EP3C120F484I7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Cyclone III) | Intel (Cyclone III) | Intel (Cyclone III) | Intel (Cyclone III) | Intel (Cyclone III) | Intel (Cyclone III) |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 119,088 | 119,088 |
| Embedded RAM (bits) | 516,096 | 516,096 | 516,096 | 516,096 | 3,888,096 | 3,888,096 |
| 18x18 Multipliers | 56 | 56 | 56 | 56 | 288 | 288 |
| User I/Os | 346 | 346 | 346 | 346 | 296 | 296 |
| Speed Grade | 7 (fastest) | 7 | 8 (slower) | 6 (slowest) | 7 | 7 |
| Temperature Range | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
Principais diferenciais
- Highest speed grade in industrial temperature range (vs EP3C16F484C8N)
- Seven-fold density headroom within the same package (vs EP3C120F484I7N)
- Lowest static power in the Cyclone III family (vs Lattice ECP5 LFE5U-85F (cross-brand))
Notas de projeto
Cyclone III EP3C16F484I7 static current at 25C is approximately 60-80 mA core plus I/O leakage; dynamic power scales with toggle rate. Decouple each VCCINT/VCCA/VCCPD plane with 0.1 uF X7R ceramics placed within 5 mm of the BGA balls, and provide at least one bulk 47 uF tantalum per supply rail. Sequence VCCINT before VCCA/VCCPD by at least 1 ms to avoid latch-up during hot-plug events.
The 484-ball FBGA has a 1.0 mm pitch; use a 4+ layer PCB with continuous VCCINT/GND planes and microvia-in-pad stackup for breakout routing. All eight I/O banks require dedicated VCCIO supplies; do not tie them together unless your design uses a single I/O standard across all banks. Match JTAG TCK trace length to within 25 mm of TMS/TDI/TDO to keep programming reliable at 30 MHz.
Do not leave unused configuration pins floating - tie MSEL[3:0] to VCCPD or GND through 10 kohm resistors to select the desired configuration mode. Confirm the boot PROM (typically EPCS16 or EPCS64) is rated for the target junction temperature; industrial -40C to +100C operation requires the -I7 PROM suffix. Cyclone III SRAM configuration cells are volatile - design must include an external flash for production.
Informações de conformidade
RoHS and lead-free per Intel product page; Cyclone III is not AEC-Q100 qualified - for automotive production choose Cyclone IV or Cyclone 10 automotive variants.
