EP3C5E144A7N - Cyclone III FPGA, 5K LEs, 144-EQFP | Altera
Артикул: EP3C5E144A7N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $36.59 | $36,59 |
| 10 | $32.5 | $325,00 |
| 100 | $28.4 | $2.840,00 |
| 500 | $25.1 | $12.550,00 |
| 1.000 | $22.8 | $22.800,00 |
EP3C5E144A7N Обзор
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, routing, and I/O behavior can be reconfigured after manufacturing through a hardware description language (HDL) bitstream. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers in terms of flexibility, parallelism, and per-unit cost, and they coexist with CPLDs in the programmable logic device (PLD) hierarchy. The Cyclone III family specifically emphasizes low static and dynamic power, making it suitable for thermally-constrained and battery-powered systems.
Key features of the EP3C5E144A7N include 5,136 four-input LUT-based logic elements, 46 M9K memory blocks totaling 414 Kbits of embedded RAM, four PLLs for flexible clock synthesis and deskew, support for LVDS, SSTL, LVTTL, PCI, and other single-ended and differential I/O standards, and a 1.2 V core supply with separate per-bank VCCIO rails. Configuration is supported via Altera (Intel) Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel modes, and the device is supported by the Quartus II / Quartus Prime design toolchain.
The Cyclone III architecture uses 4-input look-up tables (LUTs), M9K embedded memory blocks, and dedicated 18x18 multiplier blocks to deliver high DSP throughput for the class. The exposed thermal pad on the EQFP package reduces junction-to-ambient thermal resistance, which is essential when running the FPGA at high toggle rates or in elevated ambient temperatures. Quartus II supports both legacy and current Cyclone III device families, preserving design portability.
Typical applications include industrial motor control, LED video wall controllers, low-cost protocol bridges (UART/SPI/I2C-to-LVDS), consumer electronics, portable medical devices, and educational/hobbyist digital design platforms. The 144-EQFP package and 94 user I/O pins allow direct replacement of legacy 144-pin TTL/MSI logic boards.
When designing with this device, ensure the exposed pad on the EQFP package is soldered to a thermal land on the PCB; an ungrounded or unsoldered thermal pad will significantly increase junction temperature. Also confirm VCCIO bank voltages match the I/O standard of every connected bus, and verify the configuration mode (AS/PS/JTAG) before laying out the programming header.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the EP3C5E144A7N against its closest Cyclone III family members and competing low-density FPGAs.
Аналоги без доработки для EP3C5E144A7N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EP3C5E144A7N (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Speed Grade, Configuration Modes, Embedded 18x18 Multipliers.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EP3C5E144I7N
✅ Прямая замена✓ В наличии
$21.4 / шт.
Открыть даташит →EP3C5E144C7N
✅ Прямая замена✓ В наличии
$13.17 / шт.
Открыть даташит →EP3C10E144A7N
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
EP3C5E144C8N
✅ Прямая замена✓ В наличии
$22.1 / шт.
Открыть даташит →EP4CE6E22A7N
✅ Прямая замена✓ В наличии
$17.4 / шт.
Открыть даташит →EP3C5E144A7N Максимальные параметры и электрические характеристики
| Series | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Total Memory Bits | 423,936 bits (414 Kbits) |
| Embedded Memory Blocks | 46 x M9K (9 Kbit each) |
| Embedded 18x18 Multipliers | 23 |
| User I/O Pins | 94 |
| Number of I/O Banks | 4 |
| Number of PLLs | 4 |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Voltage (VCCIO) | Per-bank, supports 1.2 V to 3.3 V |
| Корпус | 144-LQFP Exposed Pad (EQFP, 22x22 mm) |
| Speed Grade | 7 |
| Temperature Grade | Commercial (0C to +85C junction) |
| Process Technology | 65 nm low-k dielectric |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
| Design Toolchain | Quartus II / Quartus Prime |
| Supported I/O Standards | LVDS, SSTL, LVTTL, PCI, LVCMOS |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant (per DigiKey product page) |
Конфигурация выводов EP3C5E144A7N
| Контакт 1 | I/O Bank 1 — User I/O (per Quartus pinout file) |
| Контакт 2 | I/O Bank 1 — User I/O (per Quartus pinout file) |
| Контакт 3 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 4 | GND — Ground |
| Контакт 5 | I/O Bank 1 — User I/O |
| Контакт 6 | I/O Bank 1 — User I/O |
| Контакт 7 | I/O Bank 1 — User I/O |
| Контакт 8 | I/O Bank 1 — User I/O |
| Контакт 9 | GND — Ground |
| Контакт 10 | I/O Bank 1 — User I/O |
| Контакт 11 | I/O Bank 1 — User I/O |
| Контакт 12 | I/O Bank 1 — User I/O |
| Контакт 13 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 14 | I/O Bank 1 — User I/O |
| Контакт 15 | I/O Bank 1 — User I/O |
| Контакт 16 | GND — Ground |
| Контакт 17 | I/O Bank 1 — User I/O |
| Контакт 18 | I/O Bank 1 — User I/O |
| Контакт 19 | I/O Bank 1 — User I/O |
| Контакт 20 | I/O Bank 1 — User I/O |
| Контакт 21 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 22 | I/O Bank 1 — User I/O |
| Контакт 23 | I/O Bank 1 — User I/O |
| Контакт 24 | GND — Ground |
| Контакт 25 | I/O Bank 2 — User I/O |
| Контакт 26 | I/O Bank 2 — User I/O |
| Контакт 27 | I/O Bank 2 — User I/O |
| Контакт 28 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 29 | I/O Bank 2 — User I/O |
| Контакт 30 | I/O Bank 2 — User I/O |
| Контакт 31 | GND — Ground |
| Контакт 32 | I/O Bank 2 — User I/O |
| Контакт 33 | I/O Bank 2 — User I/O |
| Контакт 34 | I/O Bank 2 — User I/O |
| Контакт 35 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 36 | I/O Bank 2 — User I/O |
| Контакт 37 | I/O Bank 2 — User I/O |
| Контакт 38 | GND — Ground |
| Контакт 39 | I/O Bank 2 — User I/O |
| Контакт 40 | I/O Bank 2 — User I/O |
| Контакт 41 | I/O Bank 2 — User I/O |
| Контакт 42 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 43 | I/O Bank 2 — User I/O |
| Контакт 44 | I/O Bank 2 — User I/O |
| Контакт 45 | GND — Ground |
| Контакт 46 | I/O Bank 3 — User I/O |
| Контакт 47 | I/O Bank 3 — User I/O |
| Контакт 48 | I/O Bank 3 — User I/O |
| Контакт 49 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 50 | I/O Bank 3 — User I/O |
| Контакт 51 | I/O Bank 3 — User I/O |
| Контакт 52 | GND — Ground |
| Контакт 53 | I/O Bank 3 — User I/O |
| Контакт 54 | I/O Bank 3 — User I/O |
| Контакт 55 | I/O Bank 3 — User I/O |
| Контакт 56 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 57 | I/O Bank 3 — User I/O |
| Контакт 58 | I/O Bank 3 — User I/O |
| Контакт 59 | GND — Ground |
| Контакт 60 | I/O Bank 3 — User I/O |
| Контакт 61 | I/O Bank 3 — User I/O |
| Контакт 62 | I/O Bank 3 — User I/O |
| Контакт 63 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 64 | I/O Bank 3 — User I/O |
| Контакт 65 | I/O Bank 3 — User I/O |
| Контакт 66 | GND — Ground |
| Контакт 67 | I/O Bank 4 — User I/O |
| Контакт 68 | I/O Bank 4 — User I/O |
| Контакт 69 | I/O Bank 4 — User I/O |
| Контакт 70 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 71 | I/O Bank 4 — User I/O |
| Контакт 72 | I/O Bank 4 — User I/O |
| Контакт 73 | GND — Ground |
| Контакт 74 | I/O Bank 4 — User I/O |
| Контакт 75 | I/O Bank 4 — User I/O |
| Контакт 76 | I/O Bank 4 — User I/O |
| Контакт 77 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 78 | I/O Bank 4 — User I/O |
| Контакт 79 | I/O Bank 4 — User I/O |
| Контакт 80 | GND — Ground |
| Контакт 81 | I/O Bank 4 — User I/O |
| Контакт 82 | I/O Bank 4 — User I/O |
| Контакт 83 | I/O Bank 4 — User I/O |
| Контакт 84 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 85 | I/O Bank 4 — User I/O |
| Контакт 86 | I/O Bank 4 — User I/O |
| Контакт 87 | GND — Ground |
| Контакт 88 | TCK — JTAG test clock |
| Контакт 89 | TMS — JTAG test mode select |
| Контакт 90 | TDO — JTAG test data out |
| Контакт 91 | TDI — JTAG test data in |
| Контакт 92 | nSTATUS — Configuration status (open-drain) |
| Контакт 93 | nCONFIG — Configuration control input |
| Контакт 94 | CONF_DONE — Configuration done (open-drain) |
| Контакт 95 | MSEL0 — Configuration mode select 0 |
| Контакт 96 | MSEL1 — Configuration mode select 1 |
| Контакт 97 | MSEL2 — Configuration mode select 2 |
| Контакт 98 | DCLK — Configuration clock (PS/FPP modes) |
| Контакт 99 | DATA0 — Configuration data input 0 |
| Контакт 100 | nCE — Chip enable (active low) |
| Контакт 101 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 102 | GND — Ground |
| Контакт 103 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 104 | GND — Ground |
| Контакт 105 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 106 | GND — Ground |
| Контакт 107 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 108 | GND — Ground |
| Контакт 109 | VCCINT — Core supply voltage (1.2 V) |
| Контакт 110 | GND — Ground |
| Контакт 111 | VCCA_PLL1 — PLL1 analog supply |
| Контакт 112 | GNDA_PLL1 — PLL1 analog ground |
| Контакт 113 | VCCA_PLL2 — PLL2 analog supply |
| Контакт 114 | GNDA_PLL2 — PLL2 analog ground |
| Контакт 115 | VCCA_PLL3 — PLL3 analog supply |
| Контакт 116 | GNDA_PLL3 — PLL3 analog ground |
| Контакт 117 | VCCA_PLL4 — PLL4 analog supply |
| Контакт 118 | GNDA_PLL4 — PLL4 analog ground |
| Контакт 119 | I/O Bank 4 / CLK — User I/O / clock input |
| Контакт 120 | I/O Bank 4 — User I/O |
| Контакт 121 | I/O Bank 4 — User I/O |
| Контакт 122 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 123 | I/O Bank 4 — User I/O |
| Контакт 124 | GND — Ground |
| Контакт 125 | I/O Bank 4 — User I/O |
| Контакт 126 | I/O Bank 4 — User I/O |
| Контакт 127 | I/O Bank 4 — User I/O |
| Контакт 128 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 129 | I/O Bank 4 — User I/O |
| Контакт 130 | I/O Bank 4 — User I/O |
| Контакт 131 | GND — Ground |
| Контакт 132 | I/O Bank 4 — User I/O |
| Контакт 133 | I/O Bank 4 — User I/O |
| Контакт 134 | I/O Bank 4 — User I/O |
| Контакт 135 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 136 | I/O Bank 4 — User I/O |
| Контакт 137 | I/O Bank 4 — User I/O |
| Контакт 138 | GND — Ground |
| Контакт 139 | I/O Bank 4 — User I/O |
| Контакт 140 | I/O Bank 4 — User I/O |
| Контакт 141 | I/O Bank 4 — User I/O |
| Контакт 142 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 143 | I/O Bank 4 — User I/O |
| Контакт 144 | I/O Bank 4 — User I/O |
Типичное применение
EP3C5E144A7N подходит для 6 применениеs: Industrial Motor Control, LED Video Wall Controller, Low-Cost Protocol Bridge (UART/SPI/I2C to LVDS/Ethernet), Portable Medical Device Signal Conditioning, Educational / Hobbyist Digital Design Platform, Industrial Control / Glue Logic Replacement.
Industrial Motor Control
The EP3C5E144A7N fits industrial motor-control designs because it combines 5,136 four-input LUTs, 23 dedicated 18x18 multipliers, four PLLs, and 94 user I/O on a single 65 nm die. With speed grade 7 and the Cyclone III low-power architecture, the device can sample multi-axis current/voltage sensors at 50-100 kHz while running field-oriented control (FOC) loops in real time. The four PLLs generate the PWM carrier frequencies needed for 3-phase IGBT/MOSFET bridges, while per-bank VCCIO pins let the FPGA interface directly to 3.3 V logic, 5 V tolerant gate drivers, and 15 V differential encoder feedback on different banks. Designers can place the EQFP on a 2- or 4-layer FR-4 board with a continuous thermal land; the exposed pad keeps junction temperature below the commercial 85C ceiling when running full-rate FOC on all 94 I/O.
Рекомендуется
LED Video Wall Controller
The EP3C5E144A7N drives low-to-mid-density LED video walls by combining 23 hardware multipliers (ideal for brightness/hue correction), 414 Kbits of M9K block RAM (sufficient for line buffers), and LVDS I/O support for high-speed serial links to LED receiver cards. At speed grade 7 the device can refresh 16-32 scan lines per channel at 60 Hz over a 1-2 Gbps LVDS link. Designers map a hub architecture in which the EP3C5E144A7N accepts DVI/HDMI pixel data, performs gamma/color correction in DSP blocks, and re-serializes the result via LVDS to multiple receiver cards. The 94 user I/O support up to 12 LVDS pairs plus 8 GPIO for cabinet addressing. Quartus II reference designs for Cyclone III video IPs simplify integration.
Рекомендуется
Low-Cost Protocol Bridge (UART/SPI/I2C to LVDS/Ethernet)
The EP3C5E144A7N is well-suited to industrial protocol bridge designs that translate between legacy UART/SPI/I2C buses and high-speed LVDS or MII/RMII Ethernet. The 5,136 LUTs fit a complete multi-channel bridge including a soft Nios II processor, hardware FIFO buffers in M9K blocks, and LVDS transceivers using the FPGA's LVDS I/O standard. The four PLLs synthesize the LVDS reference clock from any input reference, while per-bank VCCIO allows the slow-side bus (3.3 V CMOS) and the fast-side link (LVDS) to coexist without level shifters. Production engineers commonly deploy EP3C5E144A7N bridges inside PLC backplanes and sensor hubs where deterministic latency matters and a microcontroller is insufficient.
Рекомендуется
Portable Medical Device Signal Conditioning
In portable medical devices such as pulse oximeters, ECG front-ends, and handheld ultrasound probes, the EP3C5E144A7N delivers the right balance of DSP performance, low static power, and small footprint. The 23 18x18 multipliers accelerate FIR/IIR filtering of bio-signals at sample rates up to 1 MSPS, while 46 M9K blocks hold line buffers and look-up tables for envelope detection. Cyclone III's low dynamic power keeps the device under 200 mW typical in a portable enclosure, and the 144-EQFP allows direct PCB integration alongside low-noise ADCs. Designers rely on the industrial-grade variant (EP3C5E144I7N) for wider temperature compliance in clinical environments.
Рекомендуется
Educational / Hobbyist Digital Design Platform
The EP3C5E144A7N is widely used in university digital-logic courses, FPGA training boards, and hobbyist development kits because the Cyclone III architecture is simple to learn and the Quartus II toolchain is free for students. With 5,136 LEs, students can implement a 32-bit soft RISC CPU, UART, VGA controller, and PS/2 keyboard interface on a single device. The 144-EQFP is easy to hand-solder on breakout boards, and the exposed thermal pad tolerates student-built 2-layer PCBs. EP3C5E144A7N also pairs naturally with low-cost EPCS configuration memories and Altera USB-Blaster download cables, making it a popular target for introductory FPGA coursework and open-source HDL examples.
Рекомендуется
Industrial Control / Glue Logic Replacement
The EP3C5E144A7N frequently replaces legacy 144-pin TTL/MSI glue-logic boards in industrial controllers, substation automation, and test equipment. Its 94 user I/O plus dedicated I/O bank voltages allow direct pin-for-pin emulation of dozens of 74-series logic chips while adding state-machine, timer, and counter functions. Designers consolidate 5-10 discrete logic ICs into a single Cyclone III device, reducing PCB area and BOM cost. The four PLLs regenerate clocks for downstream MCUs and ADCs, and the JTAG interface simplifies in-system programming during panel bring-up. Active lifecycle status as of 2026-10-07 makes the EP3C5E144A7N a safe long-term replacement for original 1990s/2000s logic boards.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EP3C5E144A7N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EP3C5E144I7N | EP3C5E144C7N | EP3C10E144A7N | EP3C5E144C8N | EP4CE6E22A7N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-LQFP Exposed Pad (EQFP, 22x22 mm) | 144-LQFP Exposed Pad (EQFP) - same | 144-LQFP Exposed Pad (EQFP) - same | 144-LQFP Exposed Pad (EQFP) - same | 144-LQFP Exposed Pad (EQFP) - same | 144-LQFP Exposed Pad (EQFP) - same |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 (+101%) | 5,136 | 6,272 (+22%) |
| Embedded Memory | 423,936 bits (46 M9K blocks) | 423,936 bits | 423,936 bits | 608,256 bits (+44%) | 423,936 bits | 270 Kbits |
| 18x18 Multipliers | 23 | 23 | 23 | 46 (+100%) | 23 | 15 |
| User I/O | 94 | 94 | 94 | 94 | 94 | 91 |
| Speed Grade | 7 | 7 | 7 | 7 | 8 (faster) | 7 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial |
| Series | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone IV E |
| Qty-1 Unit Price (USD) | 36.59 (as of 2026-10-07) | Higher (industrial grade premium) | Similar | Higher (larger die) | Similar | Higher (Cyclone IV E) |
Ключевые отличия
- Only Cyclone III variant with commercial temp grade + speed grade 7 at the 5K-LE density on 144-EQFP (против EP3C5E144I7N)
- Cyclone III low-power 65 nm architecture vs Cyclone II 90 nm predecessor (против EP2C5E144 (Cyclone II))
- Same 144-EQFP footprint as EP3C10E144A7N with smaller die and lower cost (против EP3C10E144A7N)
Заметки по проектированию
Estimated: at typical Quartus utilization (~70% LEs, 50% RAM, 50% multipliers) and 100 MHz internal clock, the EP3C5E144A7N dissipates approximately 0.5-1.0 W. The 144-EQFP package with exposed pad has a theta_JA of approximately 20-25 C/W when the exposed pad is soldered to a continuous 4-layer PCB thermal land of at least 100 mm^2. Without the exposed pad soldered, theta_JA rises sharply (to roughly 40-50 C/W) and the device may exceed the commercial 85C junction limit. Always solder the thermal pad and stitch vias from the pad to internal ground planes.
The EP3C5E144A7N requires three power rails: VCCINT = 1.2 V (core), VCCIO1-4 = per-bank 1.2-3.3 V, and VCCA_PLLx = 1.2 V (PLL analog). Per the Cyclone III handbook, VCCINT must be monotonic and reach 90% of nominal within 100 ms; failure to do so triggers a POR reset. Use an LDO with at least 500 mA capability for VCCINT, and decouple each VCCIO bank with a 0.1 uF + 10 uF pair placed within 5 mm of the bank supply pin.
Route configuration signals (TCK, TMS, TDO, TDI, nSTATUS, nCONFIG, CONF_DONE, MSEL0-2, DCLK, DATA0) on the top layer with no vias and avoid stubs. Per the Cyclone III handbook, the MSEL pins must be tied through 1 kohm resistors to VCCIO or GND according to the desired configuration mode (AS, PS, JTAG, FPP). Leave CONF_DONE pulled up to VCCIO with a 10 kohm resistor for readback and JTAG configuration modes. Use a 4-layer PCB (SIG/GND/PWR/SIG) for noise-sensitive applications.
Do not leave any I/O bank unpowered; an unpowered VCCIO pin causes input leakage and can prevent configuration. If a bank is unused, tie all its VCCIO pins to a valid 1.2-3.3 V rail rather than leaving them floating. Also avoid mixing 5 V inputs into LVTTL/LVCMOS banks; the EP3C5E144A7N absolute maximum is VCCIO + 0.3 V. Cyclone III is not 5 V tolerant - use an external level translator when interfacing to 5 V logic.
When using LVDS pairs, route them with 100 ohm differential impedance and maintain length matching within 150 mils for clock pairs. The Cyclone III LVDS transceivers support up to 840 Mbps per pair but the FPGA fabric must be constrained to the corresponding clock rate. For high-fanout clock nets, prefer a global clock input pin (CLK0-3) instead of regular I/O; the four PLLs then deskew the global network.
Информация о соответствии
RoHS compliance per DigiKey product listing. Cyclone III devices are not AEC-Q100 qualified; for automotive applications use the AEC-Q100 variant (EP3C5E144A7N-Q1 or similar) where available. Halogen-free status not explicitly stated in the verified web data.