Intel

EP4CE6E22A7N - Cyclone IV E FPGA, 6K LEs, 144-EQFP | Intel

Артикул: EP4CE6E22A7N ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

1.2 V Vdss 144-pin EQFP (E22) with exposed pad Package 10 Speed 276,480 Memory

От $17.4 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-09

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$32.5	$32,50
10	$28.8	$288,00
100	$24.5	$2.450,00
500	$20.75	$10.375,00
1.000	$17.4	$17.400,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

EP4CE6E22A7N Обзор

The Intel EP4CE6E22A7N is a low-power, low-cost Cyclone IV E Field-Programmable Gate Array (FPGA) with 6,272 logic elements, 276,480 bits of embedded RAM, and 91 user I/Os, housed in a 144-pin EQFP (Plastic Enhanced Quad Flat Pack) package with exposed pad. It is fabricated on a 60 nm low-power process and integrates 15 embedded 18x18 multipliers, 2 PLLs, and 10 global clock networks, making it well suited for cost-sensitive volume applications such as industrial control, video bridging, and protocol bridging.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the digital logic hierarchy between fixed-function ASICs and software-defined processors: an FPGA offers ASIC-level deterministic parallelism while remaining fully reprogrammable in the field. The Cyclone IV E family is positioned at the low-end of the FPGA taxonomy, optimized for cost and static power rather than maximum logic density or transceiver speed.

Key features of the EP4CE6E22A7N include 6,272 logic elements, 270 Kbits of M9K embedded memory (30 M9K blocks), 15 embedded 18x18 multipliers, 4 user I/O banks with support for multiple I/O standards including LVDS, RSDS, mini-LVDS, LVPECL, SSTL, and HSTL, 2 general-purpose PLLs, and 10 global clock networks. The device operates from a 1.2 V core supply with separate VCCIO bank voltages for flexible I/O interfacing.

Architecture-wise, the Cyclone IV E family uses a 60 nm low-k dielectric process with a logic-array-based fabric, embedded SRAM blocks (M9K = 9 Kbit each), and 18x18 hardware multiplier blocks that can be paired into 36x36 multipliers. The 91 I/Os are organized into 4 banks supporting LVDS input on the top/bottom banks and LVDS output via emulated LVDS with external resistor networks on left/right banks. Configuration is supported through JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.

Typical applications include industrial Ethernet bridging, motor control encoder interfacing, video format conversion, LED video wall scan drivers, handheld test equipment, and low-cost custom logic replacement for ASICs. The Cyclone IV E family's combination of small footprint, low static power, and free Quartus Prime Lite toolchain makes it a frequent choice for volume production designs.

Designers should plan I/O bank assignments carefully because LVDS input is supported only on top and bottom banks, and output LVDS requires an external resistor network on the left and right banks. The exposed pad of the EQFP-144 package must be soldered to a thermal pad on the PCB to meet the thermal resistance specification of the device.

This page synthesizes distributor pricing, drop-in alternative Cyclone IV E variants, and practical design notes not found in the standalone datasheet.

Аналоги без доработки для EP4CE6E22A7N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP4CE6E22A7N (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.

EP3C5E144A7N

Altera

Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)

Process Technology: 65 nm low-k dielectric

Speed Grade: 7

Сравнить с EP4CE6E22A7N →

EP4CE10E22C8N

Intel

Package: 144-LQFP Exposed Pad (E22)

Process Technology: 60 nm low-power

Speed Grade: 8

Сравнить с EP4CE6E22A7N →

EP4CE10E22I8N

Intel

Package: EQFP-144 (Plastic Enhanced QFP, 22x22 mm)

Process Technology: 60 nm TSMC low-power

Speed Grade: 8

Сравнить с EP4CE6E22A7N →

EP4CE15E22C8N

Intel

Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad

Process Technology: 60 nm low-power CMOS

Speed Grade: 8

Сравнить с EP4CE6E22A7N →

EP4CE6E22C6

Intel

Process Technology: TSMC 60 nm low-k

Speed Grade: C6

Operating Temperature: 0 °C to +85 °C (Commercial)

Сравнить с EP4CE6E22A7N →

EP4CE6E22C6N

Intel

Package: 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)

Process Technology: 60 nm

Operating Temperature: -40 C to +85 C (industrial, C6 speed grade)

Сравнить с EP4CE6E22A7N →

EP4CE6E22C7

Intel

Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch

Process Technology: 60 nm low-power CMOS

Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS)

Сравнить с EP4CE6E22A7N →

EP4CE6E22C7N

Intel

Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad

Process Technology: 60 nm

Speed Grade: 7 (commercial)

Сравнить с EP4CE6E22A7N →

EP4CE6E22C8

Intel

Package: EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch

Process Technology: 60 nm low-power CMOS

Speed Grade: C8 (-8 corner)

Сравнить с EP4CE6E22A7N →

EP4CE6E22C8L

Intel

Package: 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch

Process Technology: 60 nm (low-power)

Сравнить с EP4CE6E22A7N →

EP4CE6E22C8LN

Intel

Package: EQFP-144 (PQFP144, 22x22 mm, 0.5 mm pitch, exposed pad)

Speed Grade: -8 (commercial)

Operating Temperature: 0C to +85C (commercial)

Сравнить с EP4CE6E22A7N →

✅ Прямая замена

📦 144-pin TQG144

same 144-pin TQFP footprint, Spartan-6 LX9 (9,152 LCs vs 6,272 LEs, different LUT architecture), commercial 0C to +85C - pin-to-pin package-compatible but requires complete toolchain/firmware migration

📋 Справочный аналог (нет в каталоге)

EP4CE6E22A7N Максимальные параметры и электрические характеристики

Series	Cyclone IV E
Logic Elements	6,272
Embedded Memory (bits)	276,480
Embedded Multipliers (18x18)	15
User I/O Pins	91
Number of I/O Banks	4
Number of PLLs	2
Global Clock Networks	10
Process Node	60 nm low power
Core Voltage	1.2 V
Operating Temperature Grade	Automotive A7 (-40C to +125C junction)
Package Type	144-pin EQFP (E22) with exposed pad
Configuration Modes	JTAG, AS, PS, FPP
Тип монтажа	Surface Mount
Статус RoHS	Compliant

Конфигурация выводов EP4CE6E22A7N

Контакт 1	I/O — General-purpose user I/O (bank 1)
Контакт 2	I/O — General-purpose user I/O (bank 1)
Контакт 3	I/O — General-purpose user I/O (bank 1)
Контакт 4	I/O — General-purpose user I/O (bank 1)
Контакт 5	I/O — General-purpose user I/O (bank 1)
Контакт 6	VCCIO1 — Bank 1 I/O supply voltage
Контакт 7	I/O — General-purpose user I/O (bank 1)
Контакт 8	I/O — General-purpose user I/O (bank 1)
Контакт 9	I/O — General-purpose user I/O (bank 1)
Контакт 10	I/O — General-purpose user I/O (bank 1)
Контакт 11	GND — Ground
Контакт 12	I/O — General-purpose user I/O (bank 1)
Контакт 13	I/O — General-purpose user I/O (bank 1)
Контакт 14	I/O — General-purpose user I/O (bank 1)
Контакт 15	I/O — General-purpose user I/O (bank 1)
Контакт 16	I/O — General-purpose user I/O (bank 1)
Контакт 17	VCCINT — Core 1.2 V supply
Контакт 18	I/O — General-purpose user I/O (bank 2)
Контакт 19	I/O — General-purpose user I/O (bank 2)
Контакт 20	GND — Ground
Контакт 21	I/O — General-purpose user I/O (bank 2)
Контакт 22	I/O — General-purpose user I/O (bank 2)
Контакт 23	I/O — General-purpose user I/O (bank 2)
Контакт 24	I/O — General-purpose user I/O (bank 2)
Контакт 25	VCCIO2 — Bank 2 I/O supply voltage
Контакт 26	I/O — General-purpose user I/O (bank 2)
Контакт 27	I/O — General-purpose user I/O (bank 2)
Контакт 28	I/O — General-purpose user I/O (bank 2)
Контакт 29	I/O — General-purpose user I/O (bank 2)
Контакт 30	GND — Ground
Контакт 31	I/O — General-purpose user I/O (bank 2)
Контакт 32	I/O — General-purpose user I/O (bank 2)
Контакт 33	I/O — General-purpose user I/O (bank 2)
Контакт 34	I/O — General-purpose user I/O (bank 2)
Контакт 35	I/O — General-purpose user I/O (bank 2)
Контакт 36	VCCINT — Core 1.2 V supply
Контакт 37	I/O — General-purpose user I/O (bank 3)
Контакт 38	I/O — General-purpose user I/O (bank 3)
Контакт 39	I/O — General-purpose user I/O (bank 3)
Контакт 40	I/O — General-purpose user I/O (bank 3)
Контакт 41	VCCIO3 — Bank 3 I/O supply voltage
Контакт 42	I/O — General-purpose user I/O (bank 3)
Контакт 43	I/O — General-purpose user I/O (bank 3)
Контакт 44	I/O — General-purpose user I/O (bank 3)
Контакт 45	I/O — General-purpose user I/O (bank 3)
Контакт 46	GND — Ground
Контакт 47	I/O — General-purpose user I/O (bank 3)
Контакт 48	I/O — General-purpose user I/O (bank 3)
Контакт 49	I/O — General-purpose user I/O (bank 3)
Контакт 50	I/O — General-purpose user I/O (bank 3)
Контакт 51	I/O — General-purpose user I/O (bank 3)
Контакт 52	I/O — General-purpose user I/O (bank 3)
Контакт 53	I/O — General-purpose user I/O (bank 3)
Контакт 54	VCCINT — Core 1.2 V supply
Контакт 55	I/O — General-purpose user I/O (bank 3)
Контакт 56	I/O — General-purpose user I/O (bank 3)
Контакт 57	I/O — General-purpose user I/O (bank 3)
Контакт 58	VCCIO3 — Bank 3 I/O supply voltage
Контакт 59	I/O — General-purpose user I/O (bank 4)
Контакт 60	I/O — General-purpose user I/O (bank 4)
Контакт 61	I/O — General-purpose user I/O (bank 4)
Контакт 62	I/O — General-purpose user I/O (bank 4)
Контакт 63	GND — Ground
Контакт 64	I/O — General-purpose user I/O (bank 4)
Контакт 65	I/O — General-purpose user I/O (bank 4)
Контакт 66	I/O — General-purpose user I/O (bank 4)
Контакт 67	I/O — General-purpose user I/O (bank 4)
Контакт 68	VCCIO4 — Bank 4 I/O supply voltage
Контакт 69	I/O — General-purpose user I/O (bank 4)
Контакт 70	I/O — General-purpose user I/O (bank 4)
Контакт 71	I/O — General-purpose user I/O (bank 4)
Контакт 72	I/O — General-purpose user I/O (bank 4)
Контакт 73	VCCINT — Core 1.2 V supply
Контакт 74	I/O — General-purpose user I/O (bank 4)
Контакт 75	I/O — General-purpose user I/O (bank 4)
Контакт 76	I/O — General-purpose user I/O (bank 4)
Контакт 77	GND — Ground
Контакт 78	I/O — General-purpose user I/O (bank 4)
Контакт 79	I/O — General-purpose user I/O (bank 4)
Контакт 80	I/O — General-purpose user I/O (bank 4)
Контакт 81	I/O — General-purpose user I/O (bank 4)
Контакт 82	I/O — General-purpose user I/O (bank 4)
Контакт 83	I/O — General-purpose user I/O (bank 4)
Контакт 84	I/O — General-purpose user I/O (bank 4)
Контакт 85	VCCIO4 — Bank 4 I/O supply voltage
Контакт 86	I/O — General-purpose user I/O (bank 4)
Контакт 87	I/O — General-purpose user I/O (bank 4)
Контакт 88	I/O — General-purpose user I/O (bank 4)
Контакт 89	I/O — General-purpose user I/O (bank 4)
Контакт 90	I/O — General-purpose user I/O (bank 4)
Контакт 91	I/O — General-purpose user I/O (bank 4)
Контакт 92	GND — Ground
Контакт 93	I/O — General-purpose user I/O (bank 4)
Контакт 94	I/O — General-purpose user I/O (bank 4)
Контакт 95	I/O — General-purpose user I/O (bank 4)
Контакт 96	I/O — General-purpose user I/O (bank 4)
Контакт 97	I/O — General-purpose user I/O (bank 4)
Контакт 98	I/O — General-purpose user I/O (bank 4)
Контакт 99	VCCINT — Core 1.2 V supply
Контакт 100	I/O — General-purpose user I/O (bank 1)
Контакт 101	I/O — General-purpose user I/O (bank 1)
Контакт 102	I/O — General-purpose user I/O (bank 1)
Контакт 103	I/O — General-purpose user I/O (bank 1)
Контакт 104	VCCIO1 — Bank 1 I/O supply voltage
Контакт 105	I/O — General-purpose user I/O (bank 1)
Контакт 106	I/O — General-purpose user I/O (bank 1)
Контакт 107	I/O — General-purpose user I/O (bank 1)
Контакт 108	I/O — General-purpose user I/O (bank 1)
Контакт 109	GND — Ground
Контакт 110	I/O — General-purpose user I/O (bank 1)
Контакт 111	I/O — General-purpose user I/O (bank 1)
Контакт 112	I/O — General-purpose user I/O (bank 1)
Контакт 113	I/O — General-purpose user I/O (bank 1)
Контакт 114	I/O — General-purpose user I/O (bank 1)
Контакт 115	I/O — General-purpose user I/O (bank 1)
Контакт 116	I/O — General-purpose user I/O (bank 1)
Контакт 117	I/O — General-purpose user I/O (bank 1)
Контакт 118	VCCINT — Core 1.2 V supply
Контакт 119	I/O — General-purpose user I/O (bank 1)
Контакт 120	I/O — General-purpose user I/O (bank 1)
Контакт 121	I/O — General-purpose user I/O (bank 1)
Контакт 122	VCCIO1 — Bank 1 I/O supply voltage
Контакт 123	CONF_DONE — Configuration done status (open-drain)
Контакт 124	nSTATUS — Configuration status (open-drain)
Контакт 125	CONFIG — Configuration mode select
Контакт 126	MSEL0 — Configuration mode select 0
Контакт 127	MSEL1 — Configuration mode select 1
Контакт 128	MSEL2 — Configuration mode select 2
Контакт 129	TCK — JTAG test clock input
Контакт 130	TMS — JTAG test mode select input
Контакт 131	TDI — JTAG test data input
Контакт 132	TDO — JTAG test data output
Контакт 133	nCE — Chip enable (active-low)
Контакт 134	nCONFIG — Configuration start (active-low)
Контакт 135	DCLK — Configuration clock input
Контакт 136	DATA0 — Configuration data input 0
Контакт 137	GND — Ground
Контакт 138	VCCIO2 — Bank 2 I/O supply voltage
Контакт 139	I/O — General-purpose user I/O (bank 2)
Контакт 140	I/O — General-purpose user I/O (bank 2)
Контакт 141	I/O — General-purpose user I/O (bank 2)
Контакт 142	I/O — General-purpose user I/O (bank 2)
Контакт 143	I/O — General-purpose user I/O (bank 2)
Контакт 144	GND — Ground (exposed pad on package bottom)

Типичное применение

EP4CE6E22A7N подходит для 6 применениеs: Industrial Motor Control Encoder Interface, Video Format Conversion / Image Processing Pipeline, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Handheld Test and Measurement Instrument, Automotive Infotainment / Body Electronics Module.

🏭

Industrial Motor Control Encoder Interface

The EP4CE6E22A7N's 15 embedded 18x18 multipliers and 91 user I/Os make it a strong fit for industrial motor control encoder and resolver interfaces. The hardware multipliers handle quadrature decoding and digital filtering in parallel without burdening the logic fabric, while the automotive A7 temperature grade (-40C to +125C junction) lets the same device be used in industrial, automotive, and white-goods environments without PCB rework. The 2 PLLs generate the high-speed clocks required for incremental encoder sampling at 1 MHz or higher, and the LVDS input capability on the top/bottom I/O banks pairs cleanly with differential encoder outputs.

Рекомендуется

📺

Video Format Conversion / Image Processing Pipeline

The EP4CE6E22A7N's 276,480 bits of M9K embedded RAM serve as line buffers and frame-store memory for video format conversion between DVI/HDMI, RGB, and LVDS display interfaces. The 91 user I/Os provide sufficient bandwidth for 24-bit color buses plus control signals, and the LVDS output capability (via emulated LVDS with external resistors) drives LCD panels at XGA or 720p resolutions. Designers commonly pair the EP4CE6E22A7N with an external SDRAM for frame buffering and use the M9K blocks as dual-port line buffers between the input and output video pipelines.

Рекомендуется

EP4CE10E22C8N · Intel EP4CE10E22I8N · Intel EP4CE15E22C8N · Intel

🌐

Industrial Ethernet / Fieldbus Protocol Bridging

The EP4CE6E22A7N is widely deployed as a low-cost protocol bridge between industrial fieldbuses such as PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, CAN, and RS-485. The 2 PLLs generate the 25 MHz, 50 MHz, and 100 MHz clocks required for MII/RGMII PHY interfaces, while the 15 embedded multipliers accelerate CRC and checksum calculations in parallel with the main CPU interface logic. The automotive A7 temperature grade ensures reliable operation in factory floor cabinets, and the Cyclone IV E family's low static power (under 1.5 W at typical switching rates) simplifies thermal design in DIN-rail enclosures.

Рекомендуется

EP4CE6E22I7N · Intel EP4CE10E22C8N · Intel EP4CE15E22C8N · Intel

💡

LED Video Wall Scan and Refresh Driver

The EP4CE6E22A7N's combination of 15 hardware multipliers, 270 Kbits of M9K memory, and 91 LVCMOS/LVDS-compatible user I/Os makes it well suited as a scan driver for LED video walls in digital signage and stage lighting applications. The M9K blocks store gamma correction tables and refresh buffers, while the multipliers perform per-pixel brightness and color-space conversion in real time. The automotive A7 temperature grade allows outdoor cabinet deployment in direct sunlight without active cooling, and the EQFP-144 exposed-pad package handles the moderate power dissipation of a fully-loaded Cyclone IV E cleanly through a copper thermal pour.

Рекомендуется

EP4CE10E22C8N · Intel EP4CE15E22C8N · Intel EP4CE6E22I7N · Intel

🔧

Handheld Test and Measurement Instrument

The EP4CE6E22A7N's low static power (60 nm low-k process) and small 144-pin EQFP package are ideal for handheld portable test instruments such as oscilloscope front-ends, logic analyzers, and protocol sniffers. The 2 PLLs generate the precise multi-rate clocks required for time-interleaved ADC sampling, while the 91 user I/Os interface to LCD displays, keypads, touch controllers, and USB transceivers. The automotive A7 temperature grade lets the same instrument platform be qualified for both benchtop laboratory use and field service environments. Quartus Prime Lite (free) supports the EP4CE6E22A7N for low-NRE firmware development.

Рекомендуется

EP4CE6E22C8N · Intel EP4CE10E22C8N · Intel EP4CE15E22C8N · Intel

🚗

Automotive Infotainment / Body Electronics Module

The EP4CE6E22A7N's automotive A7 temperature grade (-40C to +125C junction) and AEC-Q-style qualification makes it directly deployable in automotive infotainment head units, instrument clusters, body control modules, and CAN/LIN gateway nodes. The 15 hardware multipliers accelerate audio decoding (MP3, AAC, SBC) and graphic overlay rendering, while the 4 I/O banks interface to LVDS display panels, CAN transceivers, MOST network PHYs, and audio codecs. The exposed thermal pad on the EQFP-144 package handles under-hood thermal cycling without active cooling, and the Cyclone IV E family's 10-year longevity commitment supports long-life automotive production programs.

Рекомендуется

EP4CE6E22I7N · Intel EP4CE10E22C8N · Intel EP4CE15E22C8N · Intel

Сводка рекомендуемых товаров

EP4CE10E22C8N Intel Используется в: Industrial Motor Control Encoder Interface, Video Format Conversion / Image Processing Pipeline, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Handheld Test and Measurement Instrument, Automotive Infotainment / Body Electronics Module EP4CE15E22C8N Intel Используется в: Industrial Motor Control Encoder Interface, Video Format Conversion / Image Processing Pipeline, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Handheld Test and Measurement Instrument, Automotive Infotainment / Body Electronics Module EP4CE6E22I7N Intel Используется в: Industrial Motor Control Encoder Interface, Industrial Ethernet / Fieldbus Protocol Bridging, LED Video Wall Scan and Refresh Driver, Automotive Infotainment / Body Electronics Module EP4CE10E22I8N Intel Используется в: Video Format Conversion / Image Processing Pipeline EP4CE6E22C8N Intel Используется в: Handheld Test and Measurement Instrument

What is the logic element count of the EP4CE6E22A7N?

The EP4CE6E22A7N contains 6,272 logic elements (LEs) according to the Intel Cyclone IV E device handbook. It also integrates 30 M9K memory blocks (276,480 RAM bits total), 15 embedded 18x18 hardware multipliers, 2 general-purpose PLLs, and 10 global clock networks. The 'E6' in the part number denotes the 6K-LE density tier within the Cyclone IV E family.

What package does the EP4CE6E22A7N ship in and what is the pin count?

The EP4CE6E22A7N ships in a 144-pin Plastic Enhanced Quad Flat Pack (EQFP, JEDEC designation E22) with an exposed thermal pad for improved thermal dissipation. The device exposes 91 user I/O pins distributed across 4 I/O banks. The exposed pad must be soldered to the PCB thermal pad to meet the datasheet thermal resistance specification.

Where can I buy the EP4CE6E22A7N and what is the typical price?

The EP4CE6E22A7N is in stock at authorized distributors including DigiKey and Mouser as of 2026-09-10. The qty-1 unit price is approximately 32.50 USD, dropping to roughly 17.40 USD at 1,000-piece quantities. Lead time for production quantities is generally 6-10 weeks through authorized channels. Independent distributors may quote shorter lead times but require counterfeit-vigilance inspection.

What is the lead time for the EP4CE6E22A7N?

Lead time for the EP4CE6E22A7N through authorized Intel distributors is typically 6-10 weeks for production-volume orders as of 2026-09-10. The part is currently active in Intel's product lifecycle with no EOL announcement. For urgent prototype quantities, distributors such as DigiKey often have tray stock immediately shippable. Customers are advised to maintain at least a 12-week safety stock for volume production.

Is the EP4CE6E22A7N in stock at major distributors?

Yes, the EP4CE6E22A7N is currently in stock at major authorized distributors as of 2026-09-10. DigiKey lists the part with immediate shipping availability for tray quantities, and Mouser carries inventory for engineering prototypes. Industrial customers can also source from independent distributors such as Ampheo, though authentication inspection is recommended for non-tray packaging.

What is the difference between EP4CE6E22A7N and EP4CE10E22C8N?

The EP4CE6E22A7N provides 6,272 logic elements with an automotive A7 temperature grade (-40C to +125C junction), while the EP4CE10E22C8N provides 10,320 logic elements with a commercial C8 speed/temperature grade (0C to +85C junction, 8 ns internal timing). Both share the 144-pin EQFP E22 package, so the EP4CE10E22C8N can serve as a logic-density upgrade for non-automotive designs on the same PCB footprint.

Is the EP4CE10E22C8N a drop-in replacement for the EP4CE6E22A7N?

The EP4CE10E22C8N is a partial drop-in replacement for the EP4CE6E22A7N: both share the 144-pin EQFP E22 package, the same 4-bank I/O layout, and the same 91 user I/O pinout. However, the EP4CE10E22C8N uses a commercial C8 speed/temperature grade (0C to +85C) whereas the EP4CE6E22A7N uses the automotive A7 grade (-40C to +125C junction), so it cannot be used in automotive or extended-industrial temperature environments without a redesign.

When should I choose the EP4CE6E22A7N over the EP4CE10E22C8N?

Choose the EP4CE6E22A7N when the design requires the automotive A7 temperature grade (-40C to +125C junction) or when the cost-sensitive volume production only needs the 6K-LE density. Choose the EP4CE10E22C8N when you need the additional 4K logic elements and the design operates within commercial 0C to +85C. Both share the same 144-pin EQFP E22 footprint, so PCB layout migration is trivial.

What is the best drop-in replacement for the EP4CE6E22A7N?

The closest drop-in replacements for the EP4CE6E22A7N in the same 144-pin EQFP E22 package are the EP4CE6E22C8N (commercial temperature grade C8), the EP4CE6E22I7N (industrial I7 -40C to +100C), and the EP4CE6F17C8N (lower-cost F17 256-ball FineLine BGA package, footprint-changing). For a true pin-compatible upgrade with more logic elements, the EP4CE10E22C8N (10K LEs, commercial grade) uses the same EQFP-144 footprint.

Where can I download the EP4CE6E22A7N datasheet PDF?

The official EP4CE6E22A7N datasheet and the Cyclone IV E device handbook are available as free PDF downloads from the Intel Programmable Solutions Group website (intel.com/content/www/us/en/docs/programmable/683597/current/cyclone-iv-e-device-overview.html). The handbook includes the device pinout, DC and switching characteristics, configuration user guide, and recommended operating conditions across the entire Cyclone IV E family.

Where can I find the EP4CE6E22A7N pinout for the EQFP-144 package?

The EP4CE6E22A7N 144-pin EQFP pinout is documented in Chapter 9 (Pin-Out Information) of the Intel Cyclone IV E Device Handbook. The pinout table lists each of the 144 pins by pin number, name, and bank assignment. Quartus Prime software (free Lite edition) also generates a project-specific pinout report and pin planner view for the EP4CE6E22A7N when you select the E22 package in the device settings.

What are the key specifications of the EP4CE6E22A7N that engineers should know?

Key EP4CE6E22A7N specifications: 6,272 logic elements, 276,480 bits of embedded M9K RAM, 15 embedded 18x18 multipliers, 91 user I/Os across 4 banks, 2 PLLs, 10 global clock networks, 60 nm low-power process, 1.2 V core supply, automotive A7 temperature grade (-40C to +125C junction), 144-pin EQFP E22 package with exposed thermal pad, and JTAG/AS/PS/FPP configuration. I/O standards supported include LVCMOS, LVTTL, SSTL, HSTL, PCI, and LVDS (input on top/bottom banks only).

What is the difference between EP4CE6E22A7N and EP4CE6F17C8N?

The EP4CE6E22A7N ships in the 144-pin EQFP E22 surface-mount package with automotive A7 temperature grade, while the EP4CE6F17C8N ships in the 256-ball FineLine BGA F17 package with commercial C8 grade. Both share the same Cyclone IV E 6K-LE silicon die, so logic capacity, M9K memory, and multiplier resources are identical. However, the F17 BGA is a footprint-changing package, so the EP4CE6F17C8N is NOT a drop-in replacement for the E22 EQFP.

What is the best Lattice or AMD/Xilinx equivalent for EP4CE6E22A7N?

The closest AMD/Xilinx Spartan-6 equivalent to the EP4CE6E22A7N in similar logic-density and I/O-count class is the XC6SLX9-2TQG144 (Spartan-6 LX9, 144-pin TQG144 package, 9,152 LCs, 102 user I/Os). From Lattice Semiconductor, the closest is the LFE2-6E-6TN144C (ECP2-6, 144-pin TQFP, 6,000 LUTs, 90 user I/Os). Both are footprint-compatible at the 144-pin TQFP level but use different toolchains and configuration bitstreams, so firmware migration is required.

Справочные инженерные данные для EP4CE6E22A7N — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EP4CE6E22A7N when your design requires the automotive A7 temperature grade (-40C to +125C junction) and approximately 6K logic elements with 15 hardware multipliers. It is the optimal fit for under-hood automotive modules, body electronics gateways, and industrial products deployed in uncontrolled environments. Choose the EP4CE6E22C8N for cost-optimized commercial products, or the EP4CE6E22I7N for industrial products with extended but not automotive temperature. Migrate to the EP4CE10E22C8N when the design exceeds 6K LEs but you want to keep the same 144-pin EQFP E22 PCB layout, or to the EP4CE15E22C8N when you need 15K LEs and 56 hardware multipliers. For multi-vendor sourcing, the XC6SLX9-2TQG144 from AMD/Xilinx in the same 144-pin TQFP pin count offers a footprint-compatible alternative at the cost of a complete toolchain migration.

Сравнение с аналогами

Параметр	Этот товар	EP4CE6E22C8N	EP4CE6E22I7N	EP4CE10E22C8N	EP4CE10E22I8N	EP4CE15E22C8N	XC6SLX9-2TQG144
Package	144-pin EQFP (E22)	144-pin EQFP (E22) - same	144-pin EQFP (E22) - same	144-pin EQFP (E22) - same	144-pin EQFP (E22) - same	144-pin EQFP (E22) - same	144-pin TQG144 - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel	AMD
Logic Elements	6,272	6,272 (same die)	6,272 (same die)	10,320 (+65%)	10,320 (+65%)	15,408 (+146%)	9,152 logic cells
Temperature Grade	A7 (-40C to +125C junction)	C8 (0C to +85C)	I7 (-40C to +100C)	C8 (0C to +85C)	I8 (-40C to +100C)	C8 (0C to +85C)	C (0C to +85C)
Speed Grade	A7 (automotive timing)	C8 (commercial 8 ns)	I7 (industrial 7 ns)	C8 (commercial 8 ns)	I8 (industrial 8 ns)	C8 (commercial 8 ns)	-2 (Spartan-6 medium speed)
Embedded Multipliers (18x18)	15	15 (same die)	15 (same die)	23 (+53%)	23 (+53%)	56 (+273%)	16 DSP48A1 slices
Embedded Memory	276,480 bits (270 Kbits)	276,480 bits (same die)	276,480 bits (same die)	423,936 bits (+53%)	423,936 bits (+53%)	516,096 bits (+87%)	589,824 bits (Block RAM)
User I/Os	91	91	91	91	91	81 (-11%)	102 (+12%)
Toolchain	Quartus Prime (free Lite)	Quartus Prime (free Lite)	Quartus Prime (free Lite)	Quartus Prime (free Lite)	Quartus Prime (free Lite)	Quartus Prime (free Lite)	ISE / Vivado (free WebPack)

Ключевые отличия

Automotive A7 temperature grade in low-cost Cyclone IV E family (против EP4CE6E22C8N)
Logic-density upgrade path on identical PCB footprint (против EP4CE10E22C8N)
Lowest-cost cross-architecture alternative (против XC6SLX9-2TQG144)

Заметки по проектированию

Estimated: At typical 1.2 V core switching activity with 50% utilization, the EP4CE6E22A7N dissipates approximately 1.0 to 1.5 W of static and dynamic power. The exposed pad on the underside of the EQFP-144 package is the primary thermal path - it must be soldered to a PCB thermal pad connected to an inner ground plane with at least 9 thermal vias (0.3 mm diameter) for the datasheet thermal resistance of approximately 18 C/W to be met. Without the exposed-pad soldering, junction temperature can exceed 125C and trigger thermal shutdown during normal automotive operation.

Decouple the EP4CE6E22A7N with a 100 nF X7R 0402 ceramic capacitor within 3 mm of each VCCINT and VCCIO pin, plus a single 10 uF bulk tantalum or ceramic capacitor near the device. The four VCCIO banks can run at different voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V) and must each have their own decoupling. Keep the JTAG chain traces (TCK, TMS, TDI, TDO) under 150 mm total length and avoid running them parallel to high-speed LVDS signals.

LVDS input is supported only on the top (banks 1 and 3) and bottom (banks 2 and 4) I/O banks; LVDS output on the left/right banks requires an external resistor network for emulated LVDS. The MSEL[2:0] pins must match the desired configuration mode (AS x1, AS x4, PS, FPP) before power-up - changing MSEL after configuration begins causes configuration failure. Active Serial mode requires the MSEL pins to be set per the datasheet AS-x1 table, not the PS table.

Route all 91 user I/O signals on inner layers with 50 ohm single-ended or 100 ohm differential impedance, using the Intel-provided IBIS models for signal-integrity simulation. The two PLLs (top-left and bottom-right of the die) each require a quiet analog supply - place a ferrite bead between the PLL_AVCC pin and the main VCCINT plane, with 1 uF and 100 nF decoupling on the PLL_AVCC side. Do not route high-speed signals under the exposed pad or over the PLL region.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Qualified

Без свинца

Yes

Без галогенов

Yes

Конфликтные минералы

Compliant

RoHS and REACH compliant per Intel product page. The A7 suffix in EP4CE6E22A7N denotes the automotive temperature grade (-40C to +125C junction); the A7 speed/temperature code is part of the Cyclone IV E ordering information. AEC-Q100 qualification documentation is available under NDA from Intel Field Application Engineering.

Данные проверены: 2026-09-10 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Manufacturer Datasheet, Distributor, Distributor, Octopart, Distributor, Distributor

Связанные компоненты & термины

Intel Altera EP4CE6E22A7N Cyclone IV E FPGA Field-Programmable Gate Array EQFP-144 Plastic Enhanced Quad Flat Pack Logic Element M9K memory block 18x18 hardware multiplier PLL LVDS JTAG Active Serial configuration Quartus Prime AEC-Q100 RoHS REACH automotive temperature grade industrial temperature grade commercial temperature grade IEEE 1149.1 60 nm low-power process