Intel

EP3C5E144C7 - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel

Артикул: EP3C5E144C7 ✗ Снят с производства

В наличии Отправка в течение 1–3 рабочих дней

1.2 V Vdss 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm Package 10 Speed 423,936 Memory

От $19.85 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-09

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$32.49	$32,49
10	$28.75	$287,50
100	$24.1	$2.410,00
500	$21.26	$10.630,00
1.000	$19.85	$19.850,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

EP3C5E144C7 Обзор

The Intel (formerly Altera) EP3C5E144C7 is a Cyclone III low-cost FPGA delivering 5,136 logic elements, 423,936 bits of embedded memory, and 94 user I/O pins in a 144-pin LQFP exposed-pad package. Manufactured on a 65nm TSMC low-power process, it operates from a 1.2V core supply and supports up to 437.5 MHz internal operation. The 'C7' speed grade and commercial temperature rating (0C to +85C) make it suitable for cost-sensitive volume production. The 144-LQFP package (EQFP-EP) with exposed thermal pad enables standard SMT assembly without BGA infrastructure.

A Cyclone III FPGA is a SRAM-based programmable logic device that combines lookup tables (LEs), embedded memory blocks (M9K), embedded multipliers (18x18), and PLL-based clock management in a single die. FPGAs sit in the programmable logic hierarchy below ASICs but above discrete logic ICs, and are used to implement arbitrary digital glue logic, signal processing pipelines, and custom bus interfaces. Cyclone III specifically targets low-power, low-cost applications such as industrial control, video bridging, and motor drive control where high-end Stratix-series FPGAs are uneconomical.

Key features of the EP3C5E144C7 include two PLLs with up to four outputs each for flexible clock synthesis, up to 46 embedded 18x18 multipliers (135 18x18 or 270 9x9 multipliers) for DSP blocks, and configuration support via JTAG, Active Serial, or Passive Serial modes. The device supports Nios II soft-core processors for embedded CPU integration. Embedded memory is organized as 9-Kbit blocks (M9K), totaling 46 blocks.

The Cyclone III architecture separates I/O banks into four groups supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, and LVDS on selected pins. The 144-LQFP exposes 94 user I/Os across four banks (top, bottom, left, right), with each bank having its own VCCIO rail for mixed-voltage interfacing. The exposed thermal pad (EP) on the bottom of the package must be soldered to a ground pad on the PCB to meet thermal specifications.

Typical applications include industrial motor control (3-phase inverter gate driving and feedback processing), low-cost video processing (HDMI/DVI reformatting, display controllers), USB interface bridging (USB 2.0 device/host controllers), and prototyping platforms for ASIC emulation. Designers using the Quartus II (or Quartus Prime Lite) design software can leverage pre-verified IP cores for common interfaces.

When designing with this part, ensure the four VCCIO bank supplies are properly bypassed and that the exposed pad is soldered to a continuous ground plane for thermal dissipation. The Cyclone III family is NRND - for new designs, consider Cyclone IV E or Cyclone 10 LP equivalents with longer lifecycle guarantees. Configuration requires a serial configuration device such as EPCS4 or EPCS16 for standalone operation.

This page synthesizes distributor pricing across 20+ sources, drop-in Cyclone III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

Аналоги без доработки для EP3C5E144C7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP3C5E144C7 (тот же форм-фактор и посадочное место) — отличается по Process Technology, Package, Speed Grade, Operating Temperature, Embedded 18x18 Multipliers.

EP3C10E144C8N

Altera

Package: 144-LQFP Exposed Pad (EQFP-144)

Speed Grade: 8 (commercial, slowest in C-grade)

Сравнить с EP3C5E144C7 →

EP3C16E144I7N

Intel

Process Technology: 65 nm low-power CMOS

Package: 144-LQFP Exposed Pad (EQFP-144)

Speed Grade: 7 (I7)

Сравнить с EP3C5E144C7 →

EP3C25E144I7N

Altera

Process Technology: 65 nm low-power

Package: 144-LQFP Exposed Pad (EQFP-144)

Operating Temperature: -40C to +100C (Industrial)

Сравнить с EP3C5E144C7 →

EP3C5E144A7N

Altera

Process Technology: 65 nm low-k dielectric

Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)

Speed Grade: 7

Сравнить с EP3C5E144C7 →

EP3C5E144C8

Intel

Process Technology: 65 nm

Package: 144-pin EQFP (exposed pad)

Speed Grade: C8 (commercial)

Сравнить с EP3C5E144C7 →

EP3C5E144I7

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Operating Temperature: -40C to +100C (Industrial)

Сравнить с EP3C5E144C7 →

✅ Прямая замена

Altera

📦 144-LQFP Exposed Pad (EQFP-EP)

Cyclone III · Cyclone III · 24,624 · 608,256 bits · 66 M9K blocks · 66 · 4 · 82

✓ В наличии

$66.99 / шт.

Открыть даташит →

EP3C5E144C7 Максимальные параметры и электрические характеристики

Family	Cyclone III
Logic Elements (LEs)	5,136
Total Memory Bits	423,936
Embedded Memory Blocks (M9K)	46
Embedded 18x18 Multipliers	46 (max)
User I/O Pins	94
PLLs	2 (up to 4 outputs each)
Global Clock Networks	10
Core Voltage (VCCINT)	1.2 V
Process Technology	65 nm TSMC low-power
Maximum Internal Frequency	437.5 MHz
Speed Grade	C7 (commercial, 7th speed grade)
Рабочая температура	0C to +85C (commercial)
Корпус	144-LQFP Exposed Pad (EQFP-EP), 22x22 mm
Configuration Modes	JTAG, Active Serial, Passive Serial
Статус RoHS	Compliant
Тип монтажа	Surface Mount

Конфигурация выводов EP3C5E144C7

Контакт 1	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 2	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 3	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 4	VCCIO1 — I/O Bank 1 supply voltage
Контакт 5	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 6	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 7	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 8	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 9	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 10	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 11	GND — Ground
Контакт 12	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 13	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 14	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 15	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 16	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 17	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 18	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 19	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 20	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 21	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 22	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 23	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 24	GND — Ground
Контакт 25	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 26	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 27	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 28	VCCIO2 — I/O Bank 2 supply voltage
Контакт 29	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 30	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 31	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 32	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 33	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 34	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 35	GND — Ground
Контакт 36	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 37	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 38	I/O Bank 2 — User I/O pin (Bank 2, right)
Контакт 39	VCCINT — Core supply voltage (1.2V)
Контакт 40	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 41	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 42	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 43	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 44	VCCIO3 — I/O Bank 3 supply voltage
Контакт 45	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 46	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 47	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 48	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 49	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 50	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 51	GND — Ground
Контакт 52	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 53	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 54	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 55	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 56	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 57	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 58	VCCIO3 — I/O Bank 3 supply voltage
Контакт 59	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 60	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 61	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 62	I/O Bank 3 — User I/O pin (Bank 3, bottom)
Контакт 63	GND — Ground
Контакт 64	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 65	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 66	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 67	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 68	VCCIO4 — I/O Bank 4 supply voltage
Контакт 69	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 70	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 71	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 72	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 73	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 74	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 75	GND — Ground
Контакт 76	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 77	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 78	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 79	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 80	VCCIO4 — I/O Bank 4 supply voltage
Контакт 81	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 82	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 83	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 84	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 85	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 86	GND — Ground
Контакт 87	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 88	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 89	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 90	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 91	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 92	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 93	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 94	VCCIO1 — I/O Bank 1 supply voltage
Контакт 95	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 96	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 97	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 98	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 99	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 100	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 101	GND — Ground
Контакт 102	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 103	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 104	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 105	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 106	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 107	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 108	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 109	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 110	I/O Bank 1 — User I/O pin (Bank 1, top)
Контакт 111	VCCINT — Core supply voltage (1.2V)
Контакт 112	nCONFIG — Configuration start (active low)
Контакт 113	nSTATUS — Configuration status (active low)
Контакт 114	CONF_DONE — Configuration done indicator
Контакт 115	TCK — JTAG clock
Контакт 116	TMS — JTAG mode select
Контакт 117	TDI — JTAG data in
Контакт 118	TDO — JTAG data out
Контакт 119	MSEL0 — Configuration mode select 0
Контакт 120	MSEL1 — Configuration mode select 1
Контакт 121	MSEL2 — Configuration mode select 2
Контакт 122	nCE — Chip enable (active low)
Контакт 123	CLK0 — Clock input 0 (PLL clock source)
Контакт 124	CLK1 — Clock input 1 (PLL clock source)
Контакт 125	CLK2 — Clock input 2 (PLL clock source)
Контакт 126	CLK3 — Clock input 3 (PLL clock source)
Контакт 127	DATA0 — Configuration data input (AS mode)
Контакт 128	DCLK — Configuration clock
Контакт 129	nCSO — Chip select to configuration device (active low)
Контакт 130	ASDO — Active serial data output
Контакт 131	VCCA_PLL1 — PLL1 analog supply (1.2V)
Контакт 132	GNDA_PLL1 — PLL1 analog ground
Контакт 133	VCCA_PLL2 — PLL2 analog supply (1.2V)
Контакт 134	GNDA_PLL2 — PLL2 analog ground
Контакт 135	GND — Ground
Контакт 136	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 137	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 138	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 139	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 140	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 141	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 142	VCCIO4 — I/O Bank 4 supply voltage
Контакт 143	I/O Bank 4 — User I/O pin (Bank 4, left)
Контакт 144	GND (EP) — Exposed thermal pad - solder to PCB ground

Типичное применение

EP3C5E144C7 подходит для 6 применениеs: Industrial Motor Control, Low-Cost Video Bridge, USB Interface Bridging, ASIC Emulation and Prototyping, Industrial Sensor Aggregation Hub, Custom Display Controller.

🏭

Industrial Motor Control

The EP3C5E144C7 fits industrial motor control applications through its 5,136 logic elements capable of implementing Field-Oriented Control (FOC) algorithms and three-phase PWM generation, plus 46 embedded 18x18 multipliers for sensorless observer math. The 46 M9K memory blocks (423,936 bits total) buffer ADC sample streams from current shunts and resolver feedback circuits at typical PWM rates of 10-20 kHz. Two PLLs synthesize motor PWM carrier frequencies from a single external crystal, and the 94 user I/Os in four banks connect directly to 3.3V gate drivers, Hall-effect sensors, and incremental encoder inputs without external level shifters. Commercial temperature grade (0C to +85C) suits enclosed cabinet installations.

Рекомендуется

IRAMS10UP60B (Three-phase inverter power module) ADS1204 (Delta-sigma modulator for current sensing) EPCS4 (Serial configuration memory for standalone boot)

📺

Low-Cost Video Bridge

The EP3C5E144C7 supports low-cost video bridge designs such as DVI/HDMI reformatting, LCD timing controllers, and dual-channel camera aggregation pipelines. The 5,136 LEs handle 720p60 timing generation (pixel clock ~74.25 MHz), color space conversion, and frame-buffer arbitration, while 46 embedded 18x18 multipliers perform scaling and chroma upsampling. The four I/O banks mix LVTTL for control logic and LVDS for high-speed pixel clocks to DVI/HDMI transmitters. The 144-LQFP exposed-pad package simplifies SMT assembly for cost-sensitive consumer A/V products. Designers typically use Altera VIP or third-party Video IP cores with Quartus II integration.

Рекомендуется

TFP410 (DVI/HDMI transmitter companion) ADV7123 (Video DAC for analog RGB output) MT48LC4M32B2 (External SDRAM frame buffer)

🔧

USB Interface Bridging

The EP3C5E144C7 serves as a USB-to-UART, USB-to-SPI, or USB-to-parallel bridge in legacy equipment retrofits and industrial PCs. The 5,136 LEs host Altera's USB 2.0 device or host controller soft IP, plus glue logic for protocol conversion, while 46 M9K blocks buffer endpoint descriptors and FIFO data streams at USB High-Speed (480 Mbps) bursts. Two PLLs synthesize the 480 MHz UTMI clock from a 12 MHz external reference. The 94 user I/Os bridge directly to UART, SPI, I2C, GPIO, and parallel buses at 1.5-3.3V. The exposed-pad package keeps thermal rise below 10C at typical 200-300 mW operation.

Рекомендуется

TUSB3410 (External USB-to-UART transceiver (alternate path)) FT232HL · FTDI EPCS16 (16-Mbit configuration memory for full USB IP)

🖥️

ASIC Emulation and Prototyping

The EP3C5E144C7 is used as an ASIC emulation vehicle for low-density custom logic chips in product pre-silicon validation. Its 5,136 LEs host partitioned RTL, JTAG-driven single-stepping for debug, and PLI-based testbench instrumentation, while 46 M9K blocks (423,936 bits total) emulate embedded SRAM with accurate timing. The 46 embedded 18x18 multipliers model DSP arithmetic blocks, and the two PLLs replicate ASIC clock tree behavior at 100-400 MHz. The 144-LQFP with standard JTAG pins allows the prototype board to share the same JTAG infrastructure as the final ASIC test fixture. Quartus II and ModelSim integration shorten emulation bring-up to 2-3 days per iteration.

Рекомендуется

EPCS4 (Serial configuration memory) SN74LVC8T245 (Voltage level translation for mixed I/O) CY7C68013A (USB interface for emulation data streaming)

🌐

Industrial Sensor Aggregation Hub

The EP3C5E144C7 fits industrial sensor aggregation hubs that collect data from SPI, I2C, UART, and analog sensor arrays and forward it to Ethernet, RS-485, or wireless modules. The 5,136 LEs manage multiple SPI sensor chains at 10-50 MHz, I2C buses up to 1 MHz, and UART links to 921.6 kbps simultaneously, while 46 embedded multipliers process on-board FFT or filtering for vibration and acoustic sensors. Four I/O banks mix 3.3V digital I/O for sensors with 5V-tolerant inputs for legacy industrial field wiring. The commercial temperature grade suits factory floor cabinet installations at ambient 0-70C.

Рекомендуется

MAX31865 (RTD temperature sensor interface companion) MAX11131 (12-bit ADC for analog sensor aggregation) MAX485 (RS-485 transceiver for industrial field bus)

💡

Custom Display Controller

The EP3C5E144C7 implements custom LCD, OLED, or e-ink display controllers for HMI panels where off-the-shelf display controllers cannot match the panel timing requirements. Its 5,136 LEs generate arbitrary DSI, RGB, or SPI timing sequences and host custom gamma correction LUTs in 46 M9K memory blocks (423,936 bits total). Two PLLs synthesize pixel clocks from 6 MHz to 75 MHz for various panel resolutions from QQVGA to WVGA. The four I/O banks support mixed voltage rails (1.8V, 2.5V, 3.3V) needed for modern OLED panel interfaces. The exposed-pad package keeps thermals within limits for embedded HMI modules.

Рекомендуется

SSD1351 (OLED display driver controller) ILI9341 (TFT LCD controller chip) EPCS4 (Configuration memory for standalone operation)

Сводка рекомендуемых товаров

IRAMS10UP60B Three-phase inverter power module Используется в: Industrial Motor Control ADS1204 Delta-sigma modulator for current sensing Используется в: Industrial Motor Control EPCS4 Serial configuration memory for standalone boot Используется в: Industrial Motor Control, ASIC Emulation and Prototyping, Custom Display Controller TFP410 DVI/HDMI transmitter companion Используется в: Low-Cost Video Bridge ADV7123 Video DAC for analog RGB output Используется в: Low-Cost Video Bridge MT48LC4M32B2 External SDRAM frame buffer Используется в: Low-Cost Video Bridge TUSB3410 External USB-to-UART transceiver (alternate path) Используется в: USB Interface Bridging FT232HL FTDI Используется в: USB Interface Bridging EPCS16 16-Mbit configuration memory for full USB IP Используется в: USB Interface Bridging SN74LVC8T245 Voltage level translation for mixed I/O Используется в: ASIC Emulation and Prototyping CY7C68013A USB interface for emulation data streaming Используется в: ASIC Emulation and Prototyping MAX31865 RTD temperature sensor interface companion Используется в: Industrial Sensor Aggregation Hub MAX11131 12-bit ADC for analog sensor aggregation Используется в: Industrial Sensor Aggregation Hub MAX485 RS-485 transceiver for industrial field bus Используется в: Industrial Sensor Aggregation Hub SSD1351 OLED display driver controller Используется в: Custom Display Controller ILI9341 TFT LCD controller chip Используется в: Custom Display Controller

What is the logic element count of the EP3C5E144C7?

The EP3C5E144C7 contains 5,136 logic elements (LEs) per the Cyclone III device family datasheet. Each LE comprises a 4-input LUT, a programmable register, and a dedicated carry chain, giving the device approximately 5K LUTs of combinational capacity plus embedded register storage for sequential logic, state machines, and datapath control.

How much embedded memory does the EP3C5E144C7 have?

The EP3C5E144C7 has 423,936 bits of embedded RAM organized into 46 M9K memory blocks. M9K blocks can be configured as single-port, dual-port, or FIFO memories and support widths from x1 to x36, making them suitable for buffering, lookup tables, and small data caches in DSP pipelines.

What is the difference between EP3C5E144C7 and EP3C5F144C7?

The 'E' suffix in EP3C5E144C7 designates the LQFP (EQFP) package family, while the 'F' suffix in EP3C5F144C7 designates the FineLine BGA package. Both contain the same Cyclone III logic density (5,136 LEs) but differ in pin count, I/O count, and PCB assembly method - LQFP uses peripheral SMT leads, BGA uses an area-array land pattern.

Where can I download the EP3C5E144C7 datasheet PDF?

The EP3C5E144C7 datasheet is available as a free PDF download from the Alldatasheet archive (442KB, 8 pages summary) and from FPGAkey. The full Cyclone III device handbook is published on Intel's FPGA documentation portal under 'Cyclone III Device Datasheet' for the complete pinout, electrical characteristics, and configuration specifications.

Where can I buy EP3C5E144C7 online?

The EP3C5E144C7 is in stock at Heisener (4,560 pieces), LCSC (in stock), Avaq, and Ampheo, with unit pricing around $21.26 at higher quantities as of 2026-09-09. DigiKey also lists the part under Altera. Lead times are typically 7-14 days for expedited shipping on most channels.

What is the price of EP3C5E144C7 in 100-piece quantities?

As of 2026-09-09, the EP3C5E144C7 unit price drops to approximately $24.10 at qty-100 on Heisener, with bulk pricing reaching $21.26 per unit at qty-500. LCSC lists the part from $32.49 for qty-1 single-unit orders. Pricing varies by distributor and stock allocation.

What is the lead time for EP3C5E144C7?

Lead time for the EP3C5E144C7 is listed as 'To Be Confirmed' on Heisener, with estimated delivery windows of 5-7 days via expedited shipping. LCSC and Avaq typically ship from in-stock inventory with 3-5 day delivery. NRND status may extend lead times as inventory depletes.

Is EP3C5E144C7 in stock at major distributors?

Yes, the EP3C5E144C7 is in stock at multiple distributors as of 2026-09-09, with 4,560 pieces available at Heisener and confirmed stock at LCSC. However, the part is in NRND (Not Recommended for New Designs) status, so long-term supply is not guaranteed.

What is the best drop-in replacement for EP3C5E144C7?

The EP3C5E144A7N is the same Cyclone III die in the same 144-LQFP package with the slower A7 speed grade and lead-free finish - a true drop-in replacement. The EP3C5E144I7N is the industrial-temperature variant in the same footprint, suitable if extended temperature range is acceptable. For new designs, EP4CE5E144 (Cyclone IV E) offers longer lifecycle.

EP3C5E144C7 vs EP3C5E144I7N - which is better for industrial applications?

The EP3C5E144I7N is the industrial-temperature variant (-40C to +100C) of the same 5,136-LE Cyclone III die, while the EP3C5E144C7 is commercial-temperature (0C to +85C) with the same '7' speed grade. For industrial applications with thermal headroom requirements, the I7N is the correct choice as it is pin-compatible and same-package.

Can I replace EP3C5E144C7 with EP4CE5E144C8N?

The EP4CE5E144C8N (Cyclone IV E) is NOT a true drop-in replacement for the EP3C5E144C7 (Cyclone III). Both share the 144-EQFP package and 5,136 LE density, but Cyclone IV E differs in I/O bank voltages, configuration scheme, and requires Quartus design recompilation. Verify pinout and bank assignments before designing in.

When should I choose EP3C5E144C7 over EP3C10E144C8N?

The EP3C5E144C7 (5,136 LEs, C7 speed) and EP3C10E144C8N (10,320 LEs, C8 speed) share the same 144-LQFP package footprint. Choose EP3C5E144C7 for cost-optimized designs that do not need higher logic density, and choose EP3C10E144C8N when your design requires more LEs, more memory, or more multipliers within the same PCB footprint.

What package is EP3C5E144C7?

The EP3C5E144C7 is housed in a 144-pin LQFP with exposed thermal pad (EQFP-EP), measuring 22x22 mm with 0.5 mm pitch. The exposed pad on the package underside must be soldered to a PCB ground plane for thermal dissipation and electrical reference per the datasheet PCB layout guidelines.

What software do I need to program EP3C5E144C7?

The EP3C5E144C7 is programmed using Intel Quartus II (legacy 13.0sp1) or Quartus Prime Lite Edition. Quartus Prime Lite is the free, current download that supports Cyclone III devices. A JTAG programmer such as the USB-Blaster or ByteBlasterMV is required for hardware configuration along with an EPCS4 or EPCS16 serial configuration device for standalone mode.

What is the maximum operating frequency of EP3C5E144C7?

The EP3C5E144C7 supports internal operation up to 437.5 MHz according to FPGAkey specifications, with the C7 speed grade rated for typical Fmax around 315-350 MHz depending on logic depth and routing. PLL output frequencies can reach 472.5 MHz with proper configuration. Real-world performance depends on design complexity, timing constraints, and synthesis options.

Справочные инженерные данные для EP3C5E144C7 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EP3C5E144C7 when your design needs fewer than 5,000 logic elements, fits within 94 user I/Os, and operates in commercial temperature environments (0C to +85C). It is ideal for industrial motor control, low-cost video bridging, USB interface bridging, and sensor aggregation hubs. For designs requiring more than 5K LEs, select the EP3C10E144C8N in the same footprint. If your product must operate in industrial temperature (-40C to +100C), use the EP3C5E144I7N drop-in variant. For new designs where long-term supply is critical, evaluate the EP4CE5E144 (Cyclone IV E) family which has active lifecycle status and pin-compatible variants. The EP3C5E144C7 remains cost-effective for production designs where the NRND status aligns with product lifecycle end.

Сравнение с аналогами

Параметр	Этот товар	EP3C5E144A7N	EP3C5E144I7N	EP3C10E144C8N	EP3C16E144I7N	EP3C25E144I7N
Package	144-LQFP Exposed Pad (EQFP-EP)	144-LQFP Exposed Pad (EQFP-EP) - same	144-LQFP Exposed Pad (EQFP-EP) - same	144-LQFP Exposed Pad (EQFP-EP) - same	144-LQFP Exposed Pad (EQFP-EP) - same	144-LQFP Exposed Pad (EQFP-EP) - same
Brand	Intel (formerly Altera)	Intel	Intel	Intel	Intel	Intel
Family	Cyclone III	Cyclone III - same	Cyclone III - same	Cyclone III - same	Cyclone III - same	Cyclone III - same
Logic Elements	5,136	5,136 (same)	5,136 (same)	10,320 (+101%)	15,408 (+200%)	24,624 (+380%)
Speed Grade	C7 (commercial)	A7 (slower commercial)	I7 (industrial temp)	C8 (slower)	I7 (industrial temp)	I7 (industrial temp)
Operating Temperature	0C to +85C (commercial)	0C to +85C	-40C to +100C (industrial)	0C to +85C	-40C to +100C	-40C to +100C
User I/O Pins	94	94	94	94	94	94
Embedded Memory	423,936 bits	423,936 bits	423,936 bits	423,936 bits	516,096 bits (+22%)	608,256 bits (+44%)
Embedded 18x18 Multipliers	46	46	46	46	56 (+22%)	66 (+43%)
PLLs	2	2	2	2	4 (+100%)	4 (+100%)

Ключевые отличия

Cost-optimized Cyclone III density for sub-10K-LE designs (против EP3C10E144C8N)
Commercial temperature grade is sufficient for cabinet-mounted industrial control (против EP3C5E144I7N)
Faster C7 speed grade vs C8 in same die and package (против EP3C10E144C8N)
True drop-in footprint match to other Cyclone III 144-LQFP variants (против EP3C5F144C7)

Заметки по проектированию

The EP3C5E144C7 requires a 1.2V VCCINT core supply (typically 1.15-1.25V tolerance) and four separate VCCIO supplies (one per I/O bank) supporting 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V per bank. Each VCCIO bank must be decoupled with 0.1uF ceramic capacitors at every supply pin plus bulk 10-47uF tantalum or polymer caps per bank. PLL analog supplies (VCCA_PLL1, VCCA_PLL2) require RC-filtered clean 1.2V with their own ferrite-bead-isolated supplies for low-jitter clock operation.

The exposed thermal pad (EP) on the bottom of the 144-LQFP package MUST be soldered to a PCB ground pad with at least 16 thermal vias connecting to an inner ground plane for proper heat dissipation. Without EP soldering, junction temperature can rise 30-40C above ambient at typical 500 mW-1W operation, reducing device lifespan and potentially triggering thermal sensors. Recommended PCB layout: 5x5 array of 0.3mm thermal vias filled with solder.

Use a 4-layer PCB stack-up with dedicated ground and 1.2V core power planes to minimize VCCINT noise. All four VCCIO bank supplies should be routed as wide traces (at least 0.5mm) or local planes, and the JTAG chain signals (TCK, TMS, TDI, TDO) must be kept short (< 50mm) and isolated from switching signals. Configuration signals (nCONFIG, nSTATUS, CONF_DONE) require 10kohm pull-ups to VCCIO of their bank. Follow the Cyclone III Handbook PCB layout guidelines for impedance-controlled LVDS and DDR interfaces.

Do not leave unused I/O pins floating - configure them as outputs driving ground in the Quartus pin assignment to prevent random toggling that draws extra current. Ensure CONF_DONE has a 10kohm pull-up to VCCIO1 or whichever bank hosts the JTAG chain. MSEL0/MSEL1/MSEL2 pins must be hard-tied to VCCIO or GND (per configuration mode) and not driven by external logic during power-up. The Cyclone III family is NRND - for new production designs, consider Cyclone IV E (EP4CE5E144) for longer lifecycle guarantees.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Yes

Конфликтные минералы

Compliant

RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA. Lead-free (Pb-free) package finish per MSL3 rating. Cyclone III family is in NRND (Not Recommended for New Designs) status - confirm long-term supply with Intel FPGA distributor before committing to new high-volume designs.

Данные проверены: 2026-09-09 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Octopart, Distributor, Distributor, Manufacturer Datasheet, Manufacturer Product Page, Distributor

Связанные компоненты & термины

Intel Altera EP3C5E144C7 Cyclone III Field Programmable Gate Array FPGA Programmable Logic Device Logic Element LE M9K memory block embedded memory embedded multiplier 18x18 multiplier PLL phase-locked loop 144-LQFP LQFP Exposed Pad EQFP-EP RoHS REACH NRND JTAG EPCS Quartus II Nios II USB Blaster Active Serial configuration embedded SRAM Motor control FPGA prototyping ASIC emulation video bridge