EPF10K200SRC240-2 - FLEX 10KS FPGA, 9984 LEs, 240-RQFP | Intel
Артикул: EPF10K200SRC240-2 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $90.12 | $90,12 |
| 10 | $82.5 | $825,00 |
| 100 | $74.2 | $7.420,00 |
| 500 | $68 | $34.000,00 |
| 1.000 | $62.5 | $62.500,00 |
EPF10K200SRC240-2 Обзор
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect and embedded memory arrays into a single silicon die. Within the broader taxonomy, FPGAs sit under the Programmable Logic Device umbrella -> Integrated Circuit -> Semiconductor. The FLEX 10KS family was the industry’s first FPGA with embedded system blocks, allowing designers to integrate ASIC-like memory, bus controllers, and arithmetic units alongside conventional logic fabric.
Key features include 9984 logic elements distributed across 1248 LABs, 98304 bits of distributed RAM, 182 user I/Os, and a commercial-grade 0C to 70C operating range. The 240-pin RQFP (also referred to as 240-BFQFP with exposed pad) supports surface-mount assembly on standard FR-4 PCB technology, with gull-wing leads on a 32x32 mm body. The device is in-system programmable via the IEEE 1149.1 JTAG interface or the legacy Altera EPC configuration EEPROM family.
The architecture combines four-input look-up table (LUT) based logic elements with embedded array blocks (EABs) that can be configured as RAM, ROM or product-term logic. This hybrid fabric allows the implementation of both datapath pipelines and large memory arrays on a single device, eliminating external memory and reducing board area. The exposed thermal pad provides a low thermal-resistance path to the PCB copper pour, enabling higher sustained logic utilization.
Typical applications include industrial control backplanes, telecommunications line-card glue logic, legacy PCI bridge designs, machine vision pre-processing, and test & measurement instrumentation. The 182 I/Os make the EPF10K200SRC240-2 well-suited for systems that need to consolidate multiple discrete logic devices, ASIC replacement, and rapid-prototyping of new bus architectures.
When designing with this part, ensure that the Quartus II (or MAX+PLUS II for legacy flows) generated bitstream targets the FLEX 10KS device family and the -2 speed grade. Verify that the configuration EEPROM, clock buffers and decoupling network follow the FLEX 10KA/10KS handbook recommendations, and that the exposed pad is soldered to a sufficient ground copper pour for thermal dissipation.
This page synthesizes distributor pricing, drop-in package alternatives within the FLEX 10KS family, and practical design notes not found in the original FLEX 10KS datasheet, enabling engineers to evaluate the EPF10K200SRC240-2 against modern and legacy FPGA alternatives.
Аналоги без доработки для EPF10K200SRC240-2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF10K200SRC240-2 (тот же форм-фактор и посадочное место) — отличается по Process Technology, Operating Temperature, Speed Grade, Family, Package.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF10K200SRC240-1
✅ Прямая замена✓ В наличии
$112 / шт.
Открыть даташит →EPF10K200SRC240-1X
✅ Прямая замена✓ В наличии
$540 / шт.
Открыть даташит →EPF10K200SRC240-1N
✅ Прямая замена✓ В наличии
$68.4 / шт.
Открыть даташит →EPF10K200SRC240-2X
✅ Прямая замена✓ В наличии
$70.05 / шт.
Открыть даташит →EPF10K200SRC240-2 Максимальные параметры и электрические характеристики
| Series | FLEX 10KS |
| Family | FLEX 10KS (FLEX 10KE/10KA generation) |
| Number of Logic Elements (LEs) | 9984 |
| Number of Logic Array Blocks (LABs) | 1248 |
| Total RAM Bits | 98304 |
| Number of User I/Os | 182 |
| Number of Gates | 513000 |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) |
| Рабочая температура | 0C to +70C (Commercial, TA) |
| Корпус / Типоразмер | 240-BFQFP Exposed Pad (240-RQFP, 32x32 mm) |
| Тип монтажа | Surface Mount |
| Terminal Form | GULL WING |
| Number of Terminals | 240 |
| Speed Grade | -2 (~80 MHz internal, typical) |
| Configuration Interface | IEEE 1149.1 JTAG + Altera EPC EEPROM |
| Process Technology | 0.42 micrometer CMOS SRAM |
Конфигурация выводов EPF10K200SRC240-2
| Контакт 1 | I/O — User I/O (bank-dependent VCCIO reference) |
| Контакт 2 | I/O — User I/O |
| Контакт 3 | I/O — User I/O |
| Контакт 4 | VCCINT — Core supply 2.5 V |
| Контакт 5 | GND — Ground |
| Контакт 6 | I/O — User I/O |
| Контакт 7 | I/O — User I/O |
| Контакт 8 | I/O — User I/O |
| Контакт 9 | I/O — User I/O |
| Контакт 10 | VCCIO — I/O bank supply |
| Контакт 11 | I/O — User I/O |
| Контакт 12 | I/O — User I/O |
| Контакт 13 | GND — Ground |
| Контакт 14 | I/O — User I/O |
| Контакт 15 | I/O — User I/O |
| Контакт 16 | TDI — JTAG Test Data In |
| Контакт 17 | TMS — JTAG Test Mode Select |
| Контакт 18 | TCK — JTAG Test Clock |
| Контакт 19 | TDO — JTAG Test Data Out |
| Контакт 20 | TRST — JTAG Test Reset (active-low) |
| Контакт 21 | nSTATUS — Configuration status (active-low) |
| Контакт 22 | CONF_DONE — Configuration done (active-high) |
| Контакт 23 | DCLK — Configuration clock input |
| Контакт 24 | DATA0 — Configuration data input |
| Контакт 25 | MSEL0 — Configuration mode select 0 |
| Контакт 26 | MSEL1 — Configuration mode select 1 |
| Контакт 27 | nCONFIG — Configuration initiate (active-low) |
| Контакт 28 | VCCINT — Core supply 2.5 V |
| Контакт 29 | GND — Ground |
| Контакт 30 | I/O — User I/O |
Типичное применение
EPF10K200SRC240-2 подходит для 6 применениеs: Industrial Control Backplane Glue Logic, Telecommunications Line-Card Interface, Legacy PCI Bridge and Expansion Design, Test & Measurement Instrumentation Front-End, Machine Vision Pre-Processing Pipelines, ASIC Replacement and Rapid Prototyping.
Industrial Control Backplane Glue Logic
The EPF10K200SRC240-2 fits industrial control backplanes because it offers 9984 logic elements and 182 user I/Os in a single 240-RQFP device, replacing multiple 74-series TTL glue-logic chips. Designers implement ISA/PCI bridges, parallel expansion bus decoders, and interrupt controllers in the same device. The 2.5 V core with separate VCCIO banks allows mixed-voltage interfacing to 3.3 V and 5 V peripherals. Trade-off: the 0.42 micrometer SRAM process consumes more power than modern Cyclone IV/10 LP devices, but it remains serviceable in fixed backplane designs where the FLEX 10KS toolchain and existing firmware must be preserved.
Рекомендуется
Telecommunications Line-Card Interface
Telecom line-card designers chose the EPF10K200SRC240-2 for its 98304 bits of embedded RAM combined with 9984 LEs, which together implement HDLC framing, UTOPIA backplane interfaces, and ATM segmentation engines in a single chip. The 182 I/Os comfortably address T1/E1 framers, framer-backplane serializers, and local bus peripherals without external muxing. The -2 speed grade (~80 MHz internal) is sufficient for 155 Mbps UTOPIA Level-2 interfaces. The exposed thermal pad keeps junction temperature in check at full I/O toggle, which is important for fanless indoor line-card shelves.
Рекомендуется
Legacy PCI Bridge and Expansion Design
The EPF10K200SRC240-2 was widely used to implement 32-bit/33 MHz PCI bus bridges between legacy MC68000 or i960 host processors and PCI peripherals, as well as custom expansion backplanes. Its 9984 LEs and 1248 LABs deliver enough logic for full target/initiator state machines plus scatter-gather DMA, while the 182 I/Os cover the 124-pin PCI bus plus local memory and interrupt signals. The 240-RQFP package supports standard surface-mount assembly, and the exposed pad provides a low-impedance ground for PCI signal integrity.
Рекомендуется
Test & Measurement Instrumentation Front-End
The EPF10K200SRC240-2's combination of 9984 LEs, 98304 bits of distributed RAM, and 182 I/Os makes it well-suited to digital storage oscilloscope trigger circuits, logic-analyzer state sequencers, and arbitrary waveform generator pre-processors. Designers implement deep FIFO buffers and parallel-to-serial conversion in the EABs while reserving LABs for timing/measurement state machines. The 2.5 V core and separate VCCIO banks accommodate mixed 3.3 V and 5 V probe-front-end signals without external level shifters.
Рекомендуется
Machine Vision Pre-Processing Pipelines
Pre-processing pipelines for CCD/CMOS machine vision cameras historically used the EPF10K200SRC240-2 to implement Bayer demosaicing, histogram equalization, and Sobel edge detection in real time. The 98304 bits of EAB memory serve as line buffers for 3x3 convolution kernels, while the 9984 LEs handle the arithmetic datapath. The 182 I/Os accept 8/10-bit parallel camera LVDS-deserialized data plus GPIO for lens control and illumination sync, all within the 240-RQFP package footprint compatible with established vision-board layouts.
Рекомендуется
ASIC Replacement and Rapid Prototyping
The EPF10K200SRC240-2 served as a popular ASIC replacement and rapid prototyping vehicle because designers could ship FPGAs in production while developing the final ASIC in parallel. With 9984 LEs, 1248 LABs, and 98304 bits of RAM, the device absorbs complex datapath, control, and small memory functions previously partitioned across multiple CPLDs and gate arrays. JTAG-based in-system programmability and the EPC family of configuration PROMs allow late-stage design changes without board rework, accelerating time-to-market for telecom, industrial, and aerospace prototypes.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF10K200SRC240-2 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF10K200SRC240-1 | EPF10K200SRC240-1X | EPF10K200SRC240-1N | EPF10K200SRC240-2X |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-RQFP (32x32 mm, exposed pad) | 240-RQFP (32x32 mm, exposed pad) - same | 240-RQFP (32x32 mm, exposed pad) - same | 240-RQFP (32x32 mm, exposed pad) - same | 240-RQFP (32x32 mm, exposed pad) - same |
| Speed Grade | -2 (~80 MHz) | -1 (~60 MHz, slower) | -1 (~60 MHz, NiPdAu finish) | -1 (~60 MHz, lead-free) | -2 (~80 MHz, same) |
| Logic Elements | 9984 | 9984 | 9984 | 9984 | 9984 |
| Number of LABs | 1248 | 1248 | 1248 | 1248 | 1248 |
| Total RAM Bits | 98304 | 98304 | 98304 | 98304 | 98304 |
| User I/Os | 182 | 182 | 182 | 182 | 182 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Mid-density FLEX 10KS logic capacity in a 240-RQFP package (против EPF10K130EQC240-3)
- Mid-speed -2 grade for balanced performance and cost (против EPF10K200SRC240-3 (hypothetical same-package -3 speed grade))
- Embedded Array Blocks (EABs) for distributed RAM, ROM and product-term logic (против EPF10K10QC208-4 (lower-density FLEX 10K family member))
Заметки по проектированию
The EPF10K200SRC240-2 requires a stable 2.5 V core supply (VCCINT 2.375 V to 2.625 V) and per-bank VCCIO supplies for mixed-voltage I/O interfacing. Per the FLEX 10KA/10KS handbook, place 0.1 microfarad ceramic decoupling capacitors within 5 mm of every VCCINT/VCCIO pin, plus bulk tantalum or ceramic capacitors on each supply rail. Power-on ramp must follow the recommended 100 microsecond to 100 ms rise time; out-of-spec ramps can trigger configuration failures or brown-out of the configuration logic.
The 240-RQFP exposed thermal pad must be soldered to a PCB ground-copper pour of at least 1 square inch (6.45 cm^2) to keep junction temperature in check under high I/O toggle conditions. Without proper thermal sinking, the 0.42 micrometer CMOS die can exceed 70C ambient limits during sustained logic activity. Designers should follow the FLEX 10KA/10KS thermal management guidelines, including thermal vias under the exposed pad to inner-layer ground planes. Estimated: at full 9984-LE utilization and 100 MHz equivalent toggle activity, expect 1-2 W dissipation; reflow profile must respect JEDEC J-STD-020 for the device MSL classification.
Place the configuration PROM (EPC2, EPC4 or EPC8 family) within 50 mm of the EPF10K200SRC240-2 to avoid signal-integrity issues on the DCLK and DATA0 lines. Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a daisy chain with 10 kilo-ohm pull-ups on TDI/TMS per IEEE 1149.1. The exposed thermal pad requires a continuous ground plane and a 3x3 grid of thermal vias (0.3 mm diameter) to inner-layer ground pours to dissipate heat and provide a low-impedance ground return for high-speed I/O.
Do not confuse the FLEX 10KS part number with the later Cyclone series: the Cyclone family uses different package pinouts, different configuration schemes and different bitstream formats. Quartus II will refuse to load a FLEX 10KS bitstream onto a Cyclone device and vice versa. Always verify the device name in the Quartus II Assignment > Device dialog matches the silicon on the board. Mixing -1, -2 and -3 speed grades in the same JTAG chain is allowed but the Quartus II fitter must be re-run for the slowest device to ensure timing closure.
Информация о соответствии
Compliance status not explicitly stated in the verified distributor data. The EPF10K200SRC240-2X variant is believed to use NiPdAu lead-free finish, but the standard -2 part's lead-free / RoHS status is [DATA_NEEDED]. FPGA is not an automotive-grade component under AEC-Q100.
