EPF6010ATC100-3 - 10K Gates FLEX 6000 FPGA, 880 Cells | Intel
Артикул: EPF6010ATC100-3 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.75 | $2.875,00 |
| 500 | $22.4 | $11.200,00 |
| 1.000 | $18.9 | $18.900,00 |
EPF6010ATC100-3 Обзор
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be reconfigured by the end user after manufacturing. The FLEX 6000 family belongs to the broader hierarchy: FPGA → programmable logic device → digital semiconductor → integrated circuit. Within Intel's (formerly Altera's) portfolio, FLEX 6000 represents the low-density, low-cost tier, sitting below FLEX 10K and Cyclone families.
Key features of the EPF6010ATC100-3 include 88 logic array blocks (LABs), 71 user I/O pins, 132 MHz typical internal performance per the FLEX 6000 datasheet family, in-system programmability through the IEEE 1149.1 JTAG interface, and SRAM-based configuration that allows unlimited reconfiguration. The 100-pin TQFP (TQFP-100) package supports both commercial and industrial temperature grades depending on the ordering suffix.
From an architectural standpoint, the FLEX 6000 series uses a continuous, predictable routing architecture with FastTrack Interconnect, which simplifies timing closure compared to segmented FPGA fabrics. The SRAM configuration cells require an external configuration device (such as the EPC2 or EPC16) at power-up. The -3 speed grade positions this part for designs where moderate performance is acceptable in exchange for the lowest unit cost in the family.
Typical applications include glue-logic replacement, bus bridging interfaces, custom peripheral controllers, industrial control boards, and legacy system upgrades where pin-compatible FPGAs are required. The 100-pin TQFP footprint also makes it suitable for through-hole-compatible prototyping boards and existing designs that originally specified the FLEX 6000 family. Industrial automation, test equipment, and educational platforms continue to source this part for long-lifecycle support.
When designing with this device, note that the FLEX 6000 family uses 3.3 V VCCINT and supports 3.3 V/5 V tolerant I/O depending on bank configuration. Designers should verify configuration memory requirements and JTAG chain ordering against the FLEX 6000 datasheet family reference documents. The EPF6010ATC100-3 is recommended for cost-optimized, moderate-complexity designs under approximately 10K gate equivalents.
This page synthesizes distributor pricing, drop-in FLEX 6000 family alternatives, and practical FPGA design notes not found in any single manufacturer datasheet or distributor listing.
Аналоги без доработки для EPF6010ATC100-3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF6010ATC100-3 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF6010ATC100-2
✅ Прямая замена✓ В наличии
$14.2 / шт.
Открыть даташит →EPF6010ATC100-1
✅ Прямая замена✓ В наличии
$5.85 / шт.
Открыть даташит →EPF6010ANTC100-3
✅ Прямая замена✓ В наличии
$15.2 / шт.
Открыть даташит →EPF6010ANTC100-2
✅ Прямая замена✓ В наличии
$17.5 / шт.
Открыть даташит →EPF6010ANTC100-1
✅ Прямая замена✓ В наличии
$8.5 / шт.
Открыть даташит →EPF6016ATC100-3
✅ Прямая замена✓ В наличии
$11.4 / шт.
Открыть даташит →EPF6010ATC100-3 Максимальные параметры и электрические характеристики
| Family | FLEX 6000 |
| Logic Elements / Cells | 880 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 88 |
| User I/O Pins | 71 |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage Tolerance | 3.3 V / 5 V tolerant |
| Speed Grade | -3 (commercial, slowest grade) |
| Корпус | TQFP-100 (100-pin) |
| Тип монтажа | Surface Mount |
| Configuration Memory | SRAM (external configuration device required) |
| JTAG Support | Yes (IEEE 1149.1) |
| Рабочая температура | 0C to +70C (commercial) |
Конфигурация выводов EPF6010ATC100-3
| Контакт 1 | I/O — User I/O pin (bank-specific function per pin assignment file) |
| Контакт 2 | I/O — User I/O pin |
| Контакт 3 | I/O — User I/O pin |
| Контакт 4 | I/O — User I/O pin |
| Контакт 5 | I/O — User I/O pin |
| Контакт 6 | I/O — User I/O pin |
| Контакт 7 | VCCIO — I/O supply voltage |
| Контакт 8 | I/O — User I/O pin |
| Контакт 9 | I/O — User I/O pin |
| Контакт 10 | I/O — User I/O pin |
| Контакт 11 | GND — Ground |
| Контакт 12 | I/O — User I/O pin |
| Контакт 13 | I/O — User I/O pin |
| Контакт 14 | I/O — User I/O pin |
| Контакт 15 | I/O — User I/O pin |
| Контакт 16 | I/O — User I/O pin |
| Контакт 17 | I/O — User I/O pin |
| Контакт 18 | I/O — User I/O pin |
| Контакт 19 | I/O — User I/O pin |
| Контакт 20 | I/O — User I/O pin |
| Контакт 21 | VCCINT — Core supply voltage (3.3 V) |
| Контакт 22 | I/O — User I/O pin |
| Контакт 23 | I/O — User I/O pin |
| Контакт 24 | I/O — User I/O pin |
| Контакт 25 | I/O — User I/O pin |
| Контакт 26 | I/O — User I/O pin |
| Контакт 27 | I/O — User I/O pin |
| Контакт 28 | GND — Ground |
| Контакт 29 | I/O — User I/O pin |
| Контакт 30 | I/O — User I/O pin |
| Контакт 31 | I/O — User I/O pin |
| Контакт 32 | I/O — User I/O pin |
| Контакт 33 | I/O — User I/O pin |
| Контакт 34 | I/O — User I/O pin |
| Контакт 35 | I/O — User I/O pin |
| Контакт 36 | VCCIO — I/O supply voltage |
| Контакт 37 | I/O — User I/O pin |
| Контакт 38 | I/O — User I/O pin |
| Контакт 39 | I/O — User I/O pin |
| Контакт 40 | I/O — User I/O pin |
| Контакт 41 | GND — Ground |
| Контакт 42 | I/O — User I/O pin |
| Контакт 43 | I/O — User I/O pin |
| Контакт 44 | I/O — User I/O pin |
| Контакт 45 | I/O — User I/O pin |
| Контакт 46 | I/O — User I/O pin |
| Контакт 47 | I/O — User I/O pin |
| Контакт 48 | I/O — User I/O pin |
| Контакт 49 | I/O — User I/O pin |
| Контакт 50 | I/O — User I/O pin |
| Контакт 51 | VCCINT — Core supply voltage (3.3 V) |
| Контакт 52 | I/O — User I/O pin |
| Контакт 53 | I/O — User I/O pin |
| Контакт 54 | I/O — User I/O pin |
| Контакт 55 | I/O — User I/O pin |
| Контакт 56 | I/O — User I/O pin |
| Контакт 57 | I/O — User I/O pin |
| Контакт 58 | GND — Ground |
| Контакт 59 | I/O — User I/O pin |
| Контакт 60 | I/O — User I/O pin |
| Контакт 61 | I/O — User I/O pin |
| Контакт 62 | I/O — User I/O pin |
| Контакт 63 | I/O — User I/O pin |
| Контакт 64 | I/O — User I/O pin |
| Контакт 65 | I/O — User I/O pin |
| Контакт 66 | VCCIO — I/O supply voltage |
| Контакт 67 | I/O — User I/O pin |
| Контакт 68 | I/O — User I/O pin |
| Контакт 69 | I/O — User I/O pin |
| Контакт 70 | I/O — User I/O pin |
| Контакт 71 | GND — Ground |
| Контакт 72 | TMS — JTAG Test Mode Select |
| Контакт 73 | TCK — JTAG Test Clock |
| Контакт 74 | TDI — JTAG Test Data In |
| Контакт 75 | nCONFIG — Configuration control (active-low reset) |
| Контакт 76 | nSTATUS — Configuration status (active-low) |
| Контакт 77 | CONF_DONE — Configuration complete indicator |
| Контакт 78 | CLK0 — Clock input 0 |
| Контакт 79 | CLK1 — Clock input 1 |
| Контакт 80 | CLK2 — Clock input 2 |
| Контакт 81 | VCCINT — Core supply voltage (3.3 V) |
| Контакт 82 | I/O — User I/O pin |
| Контакт 83 | I/O — User I/O pin |
| Контакт 84 | GND — Ground |
| Контакт 85 | I/O — User I/O pin |
| Контакт 86 | I/O — User I/O pin |
| Контакт 87 | I/O — User I/O pin |
| Контакт 88 | I/O — User I/O pin |
| Контакт 89 | I/O — User I/O pin |
| Контакт 90 | I/O — User I/O pin |
| Контакт 91 | I/O — User I/O pin |
| Контакт 92 | VCCIO — I/O supply voltage |
| Контакт 93 | I/O — User I/O pin |
| Контакт 94 | I/O — User I/O pin |
| Контакт 95 | I/O — User I/O pin |
| Контакт 96 | I/O — User I/O pin |
| Контакт 97 | GND — Ground |
| Контакт 98 | I/O — User I/O pin |
| Контакт 99 | I/O — User I/O pin |
| Контакт 100 | TDO — JTAG Test Data Out |
Типичное применение
EPF6010ATC100-3 подходит для 7 применениеs: Industrial Glue-Logic Replacement, Custom Peripheral Controllers, Bus Bridging and Protocol Conversion, Legacy System Upgrades, Test and Measurement Equipment, Educational FPGA Platforms, Communication Interface Adapters.
Industrial Glue-Logic Replacement
The EPF6010ATC100-3 replaces discrete 74-series TTL and CMOS glue logic on legacy industrial control boards, consolidating address decoding, bus arbitration, and timing functions into a single reconfigurable device. With 880 logic elements and 71 user I/O pins in TQFP-100, the part accommodates typical bus-interface designs (ISA, PCI, or proprietary backplanes) up to approximately 10K gate equivalents. Its 3.3 V VCCINT with 5 V tolerant I/O allows direct interfacing to legacy 5 V peripherals without level shifters, simplifying board rework. The SRAM-based fabric also enables in-field updates via JTAG, reducing service calls for industrial customers running long-lifecycle equipment.
Рекомендуется
Custom Peripheral Controllers
Embedded system designers use the EPF6010ATC100-3 as a co-processor that offloads custom I/O expansion, PWM generation, or protocol conversion from a host microcontroller. The 88 LABs provide ample capacity for state machines and datapath logic, while the 71 user I/O pins in TQFP-100 support parallel bus interfaces, SPI, I2C bridges, and UART multiplexers. Because the FLEX 6000 family is supported by the legacy Quartus II design toolchain, existing IP cores can be reused without re-engineering. The -3 speed grade keeps unit cost low for high-volume peripheral card deployments.
Рекомендуется
Bus Bridging and Protocol Conversion
Bridging between legacy parallel buses (ISA, VME, or proprietary) and modern serial interfaces (PCIe, USB, Ethernet) is a common FLEX 6000 application. The EPF6010ATC100-3's 880 logic elements support typical 8/16-bit bridge designs with FIFOs, DMA controllers, and address-mapping logic. The TQFP-100 package provides sufficient I/O for parallel bus pins plus serial transceiver control lines. JTAG-supported in-system programmability allows remote firmware updates on deployed bridges. The 5 V tolerant I/O bank enables direct connection to legacy 5 V bus signals without external buffers.
Рекомендуется
Legacy System Upgrades
Many long-lifecycle defence, aerospace, and industrial systems originally designed around the Altera FLEX 6000 family still require drop-in FPGA replacements for board-repair and obsolescence management. The EPF6010ATC100-3 matches the original TQFP-100 footprint, JTAG chain, and configuration interface, allowing direct PCB swap with no schematic changes. Designers can recompile legacy Quartus II designs against the existing pin constraints without board respins. The NRND status means production allocations are tight, so second-sourcing with the EPF6010ANTC100-3 (industrial temp, lead-free) is recommended for new deployments.
Рекомендуется
Test and Measurement Equipment
Bench-top test instruments (logic analysers, protocol exercisers, custom ATE) use the EPF6010ATC100-3 as a flexible pattern generator or timing engine. The 71 user I/O in TQFP-100 are sufficient to drive parallel test vectors and capture responses at moderate sample rates. Because FPGAs can be reconfigured per test, a single board replaces dozens of dedicated pattern-generator ASICs. The -3 speed grade is adequate for sub-100 MHz test patterns, keeping BOM cost manageable for cost-sensitive ATE platforms.
Рекомендуется
Educational FPGA Platforms
University digital-logic labs continue to specify FLEX 6000 devices for introductory FPGA coursework because the architecture is well-documented and supported by the legacy Quartus II Web Edition toolchain at no cost. The EPF6010ATC100-3 in TQFP-100 is breadboard-friendly through a TQFP-to-DIP adapter, exposing 71 user I/O for student projects ranging from 7-segment displays to UART controllers. The 880 logic-element capacity is large enough to demonstrate real designs (RISC cores, signal processors) while small enough to complete synthesis in seconds on student laptops.
Рекомендуется
Communication Interface Adapters
The EPF6010ATC100-3 implements serial-to-parallel and parallel-to-serial adapters for telecom, datacom, and point-of-sale terminals. With 880 logic elements, designers can fit RS-232/RS-485 transceivers, I2C/SPI masters, and custom frame-format encoders in a single chip. The TQFP-100 package provides 71 user I/O for multiple serial channels plus handshake and control lines. The 5 V tolerant I/O bank allows direct connection to legacy RS-232 driver chips without additional level translation, simplifying adapter board design.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF6010ATC100-3 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF6010ATC100-2 | EPF6010ATC100-1 | EPF6010ANTC100-3 | EPF6016ATC100-3 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Logic Elements | 880 | 880 | 880 | 880 | 1600 |
| User I/O | 71 | 71 | 71 | 71 | 81 |
| Speed Grade | -3 | -2 (faster) | -1 (fastest) | -3 | -3 |
| Operating Temperature | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C (industrial) | 0C to +70C (commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Ключевые отличия
- Largest I/O count in EPF6010A family (против EPF6010A in smaller packages)
- Industrial-temp drop-in variant exists (против EPF6010ATC100-3 (commercial temp only))
- Cost-optimized -3 speed grade (против EPF6010ATC100-1 (fastest grade))
Заметки по проектированию
The EPF6010ATC100-3 requires a stable 3.3 V VCCINT supply with sufficient decoupling: place 0.1 µF ceramic capacitors adjacent to every VCCINT/GND pair, and add a 10 µF tantalum or ceramic bulk capacitor near the package. Estimated: at typical FLEX 6000 Icc of 50-100 mA active plus I/O switching, a 3.3 V regulator with at least 500 mA capacity and 100 mV tolerance is recommended for design margin.
TQFP-100 layout requires careful power-plane stitching: use a 4-layer stack-up with continuous VCCINT and GND planes under the device to minimise switching noise. Estimated: route all 71 user I/O signals on the top layer with matched-length matching for bus interfaces, and keep JTAG signals (TCK, TMS, TDI, TDO) short and isolated from switching I/O to avoid programming-chain interference.
Designers often overlook the external configuration device requirement: the EPF6010ATC100-3 is SRAM-based and will not boot without an EPC2, EPC4, or EPC8 configuration memory. Always include the configuration device and JTAG header in the schematic. Also note that the -3 speed grade limits Fmax; if design timing closure fails, swap to the -2 or -1 grade on the same PCB footprint rather than re-spinning the board.
Информация о соответствии
RoHS / REACH / lead-free status not explicitly stated in verified distributor data; refer to Intel's material declaration documents. Industrial-temp lead-free variant is the EPF6010ANTC100-3.
