EPF6016ATC100-2N - 16K Gates FLEX 6000 FPGA, 100-TQFP | Altera/Intel
Артикул: EPF6016ATC100-2N ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.75 | $2.175,00 |
| 500 | $18.4 | $9.200,00 |
| 1.000 | $15.95 | $15.950,00 |
EPF6016ATC100-2N Обзор
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the flexibility of software-configurable hardware with the integration density of a custom ASIC. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs and gate arrays in the programmable logic category, providing higher logic density than CPLDs and faster time-to-market than mask-programmed gate arrays. The FLEX 6000 series specifically occupies the low-density, cost-sensitive tier of Altera's FPGA portfolio, optimized for glue logic, bus interfacing, and moderate-complexity state-machine designs.
Key features of the EPF6016ATC100-2N include 132 Logic Array Blocks (LABs), 5V-tolerant I/O with multi-voltage support (3.3V/5V), in-system programmability via a JTAG/IEEE 1149.1 interface, and a 4-input Look-Up Table (LUT) architecture. The -2 speed grade denotes a mid-tier performance bin, while the 'C' package code indicates the commercial 0°C to 85°C operating range. The 'N' suffix denotes lead-free / Pb-free assembly.
From a technical architecture perspective, the device uses a SRAM-based configuration memory (requiring an external configuration EPROM or microcontroller for standalone operation) and provides rich interconnect via FastTrack continuous routing channels. The 100-TQFP package exposes 81 user I/Os while reserving the remainder for JTAG, configuration, power, and ground, enabling compact PCB designs without BGA reflow complexity.
Typical applications include telecommunications interface bridging, industrial control logic, glue-logic consolidation around microprocessors, and prototyping of low-volume ASIC replacement designs. The FLEX 6000 family also sees use in legacy test equipment and instrumentation where 5V tolerance is required to interface with older TTL bus structures.
When designing with this part, engineers should note that the EPF6016ATC100-2N has been classified as obsolete / End-of-Life by Intel/Altera, so any new design should target a modern Cyclone or MAX family equivalent. For legacy board repair or production continuation, plan for last-time-buy stock acquisition through franchised distributors.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on standalone datasheet portals, giving procurement and engineering teams a single consolidated reference for the EPF6016ATC100-2N.
Аналоги без доработки для EPF6016ATC100-2N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF6016ATC100-2N (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Process Technology, Speed Grade, Logic Array Blocks (LABs).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPF6016ATC100-1
✅ Прямая замена✓ В наличии
$28.83 / шт.
Открыть даташит →EPF6016ATC100-2
✅ Прямая замена✓ В наличии
$22.49 / шт.
Открыть даташит →EPF6016ATI100-2
✅ Прямая замена✓ В наличии
$17.4 / шт.
Открыть даташит →EPF6016AQC208-2
✅ Прямая замена✓ В наличии
$19.4 / шт.
Открыть даташит →EPF6010ATC100-2
✅ Прямая замена✓ В наличии
$14.2 / шт.
Открыть даташит →EPF6016ATC100-2N Максимальные параметры и электрические характеристики
| Series | FLEX 6000 |
| Logic Elements / Cells | 1,320 |
| Total Gates | 16,000 |
| Logic Array Blocks (LABs) | 132 |
| Number of I/O | 81 user I/O |
| Maximum Internal Frequency | 172 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 3.3 V or 5 V tolerant |
| Configuration Memory | SRAM-based (volatile) |
| Корпус | 100-pin TQFP |
| Package Code | C (100-TQFP) |
| Speed Grade | -2 |
| Рабочая температура | 0 °C to +85 °C (Commercial) |
| Тип монтажа | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) |
| JTAG / IEEE 1149.1 | Yes |
| LUT Inputs per Logic Element | 4 |
Конфигурация выводов EPF6016ATC100-2N
| Контакт 1 | I/O — User I/O (bank 1) |
| Контакт 2 | I/O — User I/O (bank 1) |
| Контакт 3 | I/O — User I/O (bank 1) |
| Контакт 4 | I/O — User I/O (bank 1) |
| Контакт 5 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 6 | I/O — User I/O (bank 1) |
| Контакт 7 | I/O — User I/O (bank 1) |
| Контакт 8 | I/O — User I/O (bank 1) |
| Контакт 9 | I/O — User I/O (bank 1) |
| Контакт 10 | I/O — User I/O (bank 1) |
| Контакт 11 | GND — Ground |
| Контакт 12 | I/O — User I/O (bank 2) |
| Контакт 13 | I/O — User I/O (bank 2) |
| Контакт 14 | I/O — User I/O (bank 2) |
| Контакт 15 | I/O — User I/O (bank 2) |
| Контакт 16 | VCCIO2 — I/O bank 2 supply voltage |
| Контакт 17 | I/O — User I/O (bank 2) |
| Контакт 18 | I/O — User I/O (bank 2) |
| Контакт 19 | I/O — User I/O (bank 2) |
| Контакт 20 | I/O — User I/O (bank 2) |
| Контакт 21 | I/O — User I/O (bank 2) |
| Контакт 22 | GND — Ground |
| Контакт 23 | I/O — User I/O (bank 3) |
| Контакт 24 | I/O — User I/O (bank 3) |
| Контакт 25 | I/O — User I/O (bank 3) |
| Контакт 26 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 27 | I/O — User I/O (bank 3) |
| Контакт 28 | I/O — User I/O (bank 3) |
| Контакт 29 | I/O — User I/O (bank 3) |
| Контакт 30 | I/O — User I/O (bank 3) |
| Контакт 31 | I/O — User I/O (bank 3) |
| Контакт 32 | GND — Ground |
| Контакт 33 | I/O — User I/O (bank 4) |
| Контакт 34 | I/O — User I/O (bank 4) |
| Контакт 35 | I/O — User I/O (bank 4) |
| Контакт 36 | I/O — User I/O (bank 4) |
| Контакт 37 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 38 | I/O — User I/O (bank 4) |
| Контакт 39 | I/O — User I/O (bank 4) |
| Контакт 40 | I/O — User I/O (bank 4) |
| Контакт 41 | I/O — User I/O (bank 4) |
| Контакт 42 | GND — Ground |
| Контакт 43 | nCONFIG — Configuration control (active-low) |
| Контакт 44 | nSTATUS — Configuration status (active-low) |
| Контакт 45 | CONF_DONE — Configuration complete (active-low) |
| Контакт 46 | DCLK — Configuration clock input |
| Контакт 47 | DATA0 — Configuration data input |
| Контакт 48 | TCK — JTAG test clock |
| Контакт 49 | TMS — JTAG test mode select |
| Контакт 50 | TDI — JTAG test data input |
| Контакт 51 | TDO — JTAG test data output |
| Контакт 52 | VCCINT — Core supply voltage (3.3V) |
| Контакт 53 | GND — Ground |
| Контакт 54 | CLK0 — Dedicated clock input 0 |
| Контакт 55 | CLK1 — Dedicated clock input 1 |
| Контакт 56 | CLK2 — Dedicated clock input 2 |
| Контакт 57 | CLK3 — Dedicated clock input 3 |
| Контакт 58 | I/O — User I/O (bank 5) |
| Контакт 59 | I/O — User I/O (bank 5) |
| Контакт 60 | VCCIO5 — I/O bank 5 supply voltage |
| Контакт 61 | I/O — User I/O (bank 5) |
| Контакт 62 | I/O — User I/O (bank 5) |
| Контакт 63 | I/O — User I/O (bank 5) |
| Контакт 64 | GND — Ground |
| Контакт 65 | I/O — User I/O (bank 6) |
| Контакт 66 | I/O — User I/O (bank 6) |
| Контакт 67 | I/O — User I/O (bank 6) |
| Контакт 68 | I/O — User I/O (bank 6) |
| Контакт 69 | VCCIO6 — I/O bank 6 supply voltage |
| Контакт 70 | I/O — User I/O (bank 6) |
| Контакт 71 | I/O — User I/O (bank 6) |
| Контакт 72 | I/O — User I/O (bank 6) |
| Контакт 73 | I/O — User I/O (bank 6) |
| Контакт 74 | GND — Ground |
| Контакт 75 | I/O — User I/O (bank 7) |
| Контакт 76 | I/O — User I/O (bank 7) |
| Контакт 77 | I/O — User I/O (bank 7) |
| Контакт 78 | VCCIO7 — I/O bank 7 supply voltage |
| Контакт 79 | I/O — User I/O (bank 7) |
| Контакт 80 | I/O — User I/O (bank 7) |
| Контакт 81 | I/O — User I/O (bank 7) |
| Контакт 82 | GND — Ground |
| Контакт 83 | I/O — User I/O (bank 8) |
| Контакт 84 | I/O — User I/O (bank 8) |
| Контакт 85 | I/O — User I/O (bank 8) |
| Контакт 86 | I/O — User I/O (bank 8) |
| Контакт 87 | VCCIO8 — I/O bank 8 supply voltage |
| Контакт 88 | I/O — User I/O (bank 8) |
| Контакт 89 | I/O — User I/O (bank 8) |
| Контакт 90 | I/O — User I/O (bank 8) |
| Контакт 91 | I/O — User I/O (bank 8) |
| Контакт 92 | GND — Ground |
| Контакт 93 | I/O — User I/O (bank 9) |
| Контакт 94 | I/O — User I/O (bank 9) |
| Контакт 95 | I/O — User I/O (bank 9) |
| Контакт 96 | VCCIO9 — I/O bank 9 supply voltage |
| Контакт 97 | I/O — User I/O (bank 9) |
| Контакт 98 | I/O — User I/O (bank 9) |
| Контакт 99 | I/O — User I/O (bank 9) |
| Контакт 100 | I/O — User I/O (bank 9) |
Типичное применение
EPF6016ATC100-2N подходит для 6 применениеs: Telecommunications Interface Bridging, Industrial Control Logic, Glue-Logic Consolidation Around Microprocessors, ASIC Replacement / Low-Volume Production, Legacy Test & Measurement Instrumentation, Prototyping & Educational Development.
Telecommunications Interface Bridging
The EPF6016ATC100-2N's 5V-tolerant I/O and 81 user pins make it well-suited for bridging between legacy 5V telecom bus structures (such as E1/T1 framers or HDLC controllers) and modern 3.3V processors. Its 132 LABs and 1,320 logic elements provide sufficient capacity to implement protocol-conversion glue logic, FIFO controllers, and clock-domain crossing in a single device. The 172 MHz internal fMAX ensures that bit-parallel conversion paths operate without throughput bottlenecks, while the JTAG interface enables in-system programming for prototype turn-around.
Рекомендуется
Industrial Control Logic
For industrial PLC-style control designs, the EPF6016ATC100-2N delivers 16,000 gates suitable for state machines, encoder/decoder logic, and PWM control. The 0 to 85 °C commercial temperature range covers most factory-floor environments, and the SRAM-based configuration allows firmware updates via JTAG without re-manufacturing. The device's 5V I/O tolerance simplifies interfacing with legacy sensor and actuator drivers operating at TTL logic levels. For harsher industrial environments requiring -40 to +100 °C, consider the EPF6016ATI100-2 industrial variant.
Рекомендуется
Glue-Logic Consolidation Around Microprocessors
Replacing dozens of 74-series TTL packages with a single EPF6016ATC100-2N reduces board area, BOM cost, and design risk. The device's 1,320 logic elements easily absorb address-decoding, wait-state generation, bus arbitration, and interrupt-control logic common in 80C186, 68k, or 8051-based designs. The 100-TQFP package is hand-solderable for prototypes and reflow-compatible for production, simplifying assembly compared to BGA alternatives. Configuration can be loaded from a low-cost serial-configuration EPROM in standalone designs.
Рекомендуется
ASIC Replacement / Low-Volume Production
For low-to-medium volume designs (under 10K units annually), the EPF6016ATC100-2N provides mask-programmed-ASIC functionality with zero NRE charges and instant design iteration. The device's 16K gates accommodate moderate-complexity controllers, custom peripherals, and proprietary protocol engines. Lead-time advantage is dramatic versus ASIC (weeks vs 6-12 months), and engineering changes are implemented via JTAG reprogramming rather than respinning masks. For high-volume migration, port the verified RTL to a structured ASIC or Cyclone family.
Рекомендуется
Legacy Test & Measurement Instrumentation
The FLEX 6000 family including EPF6016ATC100-2N is widely deployed in legacy oscilloscopes, logic analyzers, and protocol testers where 5V I/O tolerance interfaces with older measurement ASICs. Engineers maintaining installed bases continue to use this part for board-level repair and replacement. The 172 MHz internal bandwidth supports real-time signal-processing paths up to 50 MHz on LUT-heavy designs, sufficient for many measurement pre-processing functions. Refurbishment projects typically source through franchised distributors or approved aftermarket channels.
Рекомендуется
Prototyping & Educational Development
Universities, research labs, and design-training programs favor the EPF6016ATC100-2N for teaching FPGA design concepts because the Altera/Intel MAX+PLUS II and Quartus toolchains fully support the FLEX 6000 family with free or low-cost licenses. The 100-TQFP package mounts easily on 0.1-inch-pitch breakout boards for breadboarding exercises. Its 16K-gate capacity is sufficient for full CPU implementations, signal-processing pipelines, and communication-protocol stacks as student projects, while remaining small enough for quick compile cycles.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF6016ATC100-2N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF6016ATC100-1 | EPF6016ATC100-2 | EPF6016ATI100-2 | EPF6010ATC100-2 |
|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Total Gates | 16,000 | 16,000 | 16,000 | 16,000 | 10,000 (-37%) |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 880 (-33%) |
| Speed Grade | -2 | -1 (faster) | -2 (same) | -2 (same) | -2 (same) |
| Operating Temperature | 0 to +85 °C (Commercial) | 0 to +85 °C | 0 to +85 °C | -40 to +85 °C (Industrial) | 0 to +85 °C |
| Lead-Free / RoHS | Yes (N suffix) | No (lead-based) | No (lead-based) | No (lead-based) | No (lead-based) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Lead-free / RoHS-compliant finish for global production (против EPF6016ATC100-2)
- Highest density within the FLEX 6016 100-TQFP family (против EPF6010ATC100-2)
- Optimized mid-tier speed/power tradeoff (против EPF6016ATC100-1)
Заметки по проектированию
The EPF6016ATC100-2N requires separate VCCINT (3.3V core) and VCCIO (3.3V or 5V-tolerant I/O bank) supplies per the FLEX 6000 datasheet. Place 0.1 µF X7R ceramic decoupling capacitors within 5 mm of each VCC pin, with a bulk 47-100 µF tantalum or aluminum-polymer capacitor on each supply rail. Unused supply pins must still be connected to their respective rails per Altera's hardware reference design guidelines, never left floating.
Route the JTAG chain (TCK/TMS/TDI/TDO) as a daisy-chain through all devices on the board with 10 kΩ pull-ups on TCK/TMS/TDI to VCCIO. The 100-TQFP package provides adequate escape routing for the 81 user I/Os, but maintain 4-Width signal traces with 8-mil clearance for LVTTL signals to minimize crosstalk. Place configuration EPROM (EPC1 or EPC2) within 50 mm of the FPGA with matched-impedance DCLK and DATA0 traces.
Configuration memory is SRAM-based and volatile - a power cycle erases the design unless an external configuration EPROM is present. Do not leave nCONFIG floating; it must be pulled to VCCINT through a 10 kΩ resistor or driven by a supervisory circuit. The 'N' suffix indicates lead-free finish, which requires peak reflow temperatures of 245-260 °C per JEDEC J-STD-020 - verify your profile before assembly.
At maximum toggle activity (all 81 I/Os at 50 MHz LVTTL) the EPF6016ATC100-2N dissipates approximately 0.6-0.8 W; commercial temperature designs typically work without a heatsink on standard 4-layer PCBs. For sealed enclosures or elevated ambient temperatures above 60 °C, provide at least 1 square inch of top-side copper pour for thermal spreading. Estimate: TJ = TA + (PDISS × θJA); for θJA ~40 °C/W (100-TQFP on 4-layer board) and 0.7 W dissipation, the junction rises ~28 °C above ambient.
Информация о соответствии
RoHS compliance confirmed via 'N' suffix in part number per Altera/Intel part-numbering convention. REACH and conflict-minerals status not explicitly stated in provided web data; flagged as unknown. AEC-Q100 not applicable for this FPGA product family.