EPF6016ATC100-2N - 16K Gates FLEX 6000 FPGA, 100-TQFP | Altera/Intel
Référence : EPF6016ATC100-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.75 | $2 175,00 |
| 500 | $18.4 | $9 200,00 |
| 1 000 | $15.95 | $15 950,00 |
EPF6016ATC100-2N Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the flexibility of software-configurable hardware with the integration density of a custom ASIC. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs and gate arrays in the programmable logic category, providing higher logic density than CPLDs and faster time-to-market than mask-programmed gate arrays. The FLEX 6000 series specifically occupies the low-density, cost-sensitive tier of Altera's FPGA portfolio, optimized for glue logic, bus interfacing, and moderate-complexity state-machine designs.
Key features of the EPF6016ATC100-2N include 132 Logic Array Blocks (LABs), 5V-tolerant I/O with multi-voltage support (3.3V/5V), in-system programmability via a JTAG/IEEE 1149.1 interface, and a 4-input Look-Up Table (LUT) architecture. The -2 speed grade denotes a mid-tier performance bin, while the 'C' package code indicates the commercial 0°C to 85°C operating range. The 'N' suffix denotes lead-free / Pb-free assembly.
From a technical architecture perspective, the device uses a SRAM-based configuration memory (requiring an external configuration EPROM or microcontroller for standalone operation) and provides rich interconnect via FastTrack continuous routing channels. The 100-TQFP package exposes 81 user I/Os while reserving the remainder for JTAG, configuration, power, and ground, enabling compact PCB designs without BGA reflow complexity.
Typical applications include telecommunications interface bridging, industrial control logic, glue-logic consolidation around microprocessors, and prototyping of low-volume ASIC replacement designs. The FLEX 6000 family also sees use in legacy test equipment and instrumentation where 5V tolerance is required to interface with older TTL bus structures.
When designing with this part, engineers should note that the EPF6016ATC100-2N has been classified as obsolete / End-of-Life by Intel/Altera, so any new design should target a modern Cyclone or MAX family equivalent. For legacy board repair or production continuation, plan for last-time-buy stock acquisition through franchised distributors.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on standalone datasheet portals, giving procurement and engineering teams a single consolidated reference for the EPF6016ATC100-2N.
Alternatives de remplacement direct pour EPF6016ATC100-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016ATC100-2N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Speed Grade, Logic Array Blocks (LABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016ATC100-1
✅ Remplacement direct✓ En stock
$28.83 / unité
Voir la fiche technique →EPF6016ATC100-2
✅ Remplacement direct✓ En stock
$22.49 / unité
Voir la fiche technique →EPF6016ATI100-2
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →EPF6016AQC208-2
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →EPF6010ATC100-2
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPF6016ATC100-2N Valeurs maximales et caractéristiques électriques
| Series | FLEX 6000 |
| Logic Elements / Cells | 1,320 |
| Total Gates | 16,000 |
| Logic Array Blocks (LABs) | 132 |
| Number of I/O | 81 user I/O |
| Maximum Internal Frequency | 172 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 3.3 V or 5 V tolerant |
| Configuration Memory | SRAM-based (volatile) |
| Boîtier | 100-pin TQFP |
| Package Code | C (100-TQFP) |
| Speed Grade | -2 |
| Température de fonctionnement | 0 °C to +85 °C (Commercial) |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) |
| JTAG / IEEE 1149.1 | Yes |
| LUT Inputs per Logic Element | 4 |
Configuration des broches de EPF6016ATC100-2N
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O (bank 2) |
| Broche 13 | I/O — User I/O (bank 2) |
| Broche 14 | I/O — User I/O (bank 2) |
| Broche 15 | I/O — User I/O (bank 2) |
| Broche 16 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | I/O — User I/O (bank 2) |
| Broche 20 | I/O — User I/O (bank 2) |
| Broche 21 | I/O — User I/O (bank 2) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O (bank 3) |
| Broche 24 | I/O — User I/O (bank 3) |
| Broche 25 | I/O — User I/O (bank 3) |
| Broche 26 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 27 | I/O — User I/O (bank 3) |
| Broche 28 | I/O — User I/O (bank 3) |
| Broche 29 | I/O — User I/O (bank 3) |
| Broche 30 | I/O — User I/O (bank 3) |
| Broche 31 | I/O — User I/O (bank 3) |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O (bank 4) |
| Broche 34 | I/O — User I/O (bank 4) |
| Broche 35 | I/O — User I/O (bank 4) |
| Broche 36 | I/O — User I/O (bank 4) |
| Broche 37 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 38 | I/O — User I/O (bank 4) |
| Broche 39 | I/O — User I/O (bank 4) |
| Broche 40 | I/O — User I/O (bank 4) |
| Broche 41 | I/O — User I/O (bank 4) |
| Broche 42 | GND — Ground |
| Broche 43 | nCONFIG — Configuration control (active-low) |
| Broche 44 | nSTATUS — Configuration status (active-low) |
| Broche 45 | CONF_DONE — Configuration complete (active-low) |
| Broche 46 | DCLK — Configuration clock input |
| Broche 47 | DATA0 — Configuration data input |
| Broche 48 | TCK — JTAG test clock |
| Broche 49 | TMS — JTAG test mode select |
| Broche 50 | TDI — JTAG test data input |
| Broche 51 | TDO — JTAG test data output |
| Broche 52 | VCCINT — Core supply voltage (3.3V) |
| Broche 53 | GND — Ground |
| Broche 54 | CLK0 — Dedicated clock input 0 |
| Broche 55 | CLK1 — Dedicated clock input 1 |
| Broche 56 | CLK2 — Dedicated clock input 2 |
| Broche 57 | CLK3 — Dedicated clock input 3 |
| Broche 58 | I/O — User I/O (bank 5) |
| Broche 59 | I/O — User I/O (bank 5) |
| Broche 60 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 61 | I/O — User I/O (bank 5) |
| Broche 62 | I/O — User I/O (bank 5) |
| Broche 63 | I/O — User I/O (bank 5) |
| Broche 64 | GND — Ground |
| Broche 65 | I/O — User I/O (bank 6) |
| Broche 66 | I/O — User I/O (bank 6) |
| Broche 67 | I/O — User I/O (bank 6) |
| Broche 68 | I/O — User I/O (bank 6) |
| Broche 69 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 70 | I/O — User I/O (bank 6) |
| Broche 71 | I/O — User I/O (bank 6) |
| Broche 72 | I/O — User I/O (bank 6) |
| Broche 73 | I/O — User I/O (bank 6) |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O (bank 7) |
| Broche 76 | I/O — User I/O (bank 7) |
| Broche 77 | I/O — User I/O (bank 7) |
| Broche 78 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 79 | I/O — User I/O (bank 7) |
| Broche 80 | I/O — User I/O (bank 7) |
| Broche 81 | I/O — User I/O (bank 7) |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O (bank 8) |
| Broche 84 | I/O — User I/O (bank 8) |
| Broche 85 | I/O — User I/O (bank 8) |
| Broche 86 | I/O — User I/O (bank 8) |
| Broche 87 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 88 | I/O — User I/O (bank 8) |
| Broche 89 | I/O — User I/O (bank 8) |
| Broche 90 | I/O — User I/O (bank 8) |
| Broche 91 | I/O — User I/O (bank 8) |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — User I/O (bank 9) |
| Broche 94 | I/O — User I/O (bank 9) |
| Broche 95 | I/O — User I/O (bank 9) |
| Broche 96 | VCCIO9 — I/O bank 9 supply voltage |
| Broche 97 | I/O — User I/O (bank 9) |
| Broche 98 | I/O — User I/O (bank 9) |
| Broche 99 | I/O — User I/O (bank 9) |
| Broche 100 | I/O — User I/O (bank 9) |
Applications typiques
EPF6016ATC100-2N convient pour 6 applications: Telecommunications Interface Bridging, Industrial Control Logic, Glue-Logic Consolidation Around Microprocessors, ASIC Replacement / Low-Volume Production, Legacy Test & Measurement Instrumentation, Prototyping & Educational Development.
Telecommunications Interface Bridging
The EPF6016ATC100-2N's 5V-tolerant I/O and 81 user pins make it well-suited for bridging between legacy 5V telecom bus structures (such as E1/T1 framers or HDLC controllers) and modern 3.3V processors. Its 132 LABs and 1,320 logic elements provide sufficient capacity to implement protocol-conversion glue logic, FIFO controllers, and clock-domain crossing in a single device. The 172 MHz internal fMAX ensures that bit-parallel conversion paths operate without throughput bottlenecks, while the JTAG interface enables in-system programming for prototype turn-around.
Recommandé
Industrial Control Logic
For industrial PLC-style control designs, the EPF6016ATC100-2N delivers 16,000 gates suitable for state machines, encoder/decoder logic, and PWM control. The 0 to 85 °C commercial temperature range covers most factory-floor environments, and the SRAM-based configuration allows firmware updates via JTAG without re-manufacturing. The device's 5V I/O tolerance simplifies interfacing with legacy sensor and actuator drivers operating at TTL logic levels. For harsher industrial environments requiring -40 to +100 °C, consider the EPF6016ATI100-2 industrial variant.
Recommandé
Glue-Logic Consolidation Around Microprocessors
Replacing dozens of 74-series TTL packages with a single EPF6016ATC100-2N reduces board area, BOM cost, and design risk. The device's 1,320 logic elements easily absorb address-decoding, wait-state generation, bus arbitration, and interrupt-control logic common in 80C186, 68k, or 8051-based designs. The 100-TQFP package is hand-solderable for prototypes and reflow-compatible for production, simplifying assembly compared to BGA alternatives. Configuration can be loaded from a low-cost serial-configuration EPROM in standalone designs.
Recommandé
ASIC Replacement / Low-Volume Production
For low-to-medium volume designs (under 10K units annually), the EPF6016ATC100-2N provides mask-programmed-ASIC functionality with zero NRE charges and instant design iteration. The device's 16K gates accommodate moderate-complexity controllers, custom peripherals, and proprietary protocol engines. Lead-time advantage is dramatic versus ASIC (weeks vs 6-12 months), and engineering changes are implemented via JTAG reprogramming rather than respinning masks. For high-volume migration, port the verified RTL to a structured ASIC or Cyclone family.
Recommandé
Legacy Test & Measurement Instrumentation
The FLEX 6000 family including EPF6016ATC100-2N is widely deployed in legacy oscilloscopes, logic analyzers, and protocol testers where 5V I/O tolerance interfaces with older measurement ASICs. Engineers maintaining installed bases continue to use this part for board-level repair and replacement. The 172 MHz internal bandwidth supports real-time signal-processing paths up to 50 MHz on LUT-heavy designs, sufficient for many measurement pre-processing functions. Refurbishment projects typically source through franchised distributors or approved aftermarket channels.
Recommandé
Prototyping & Educational Development
Universities, research labs, and design-training programs favor the EPF6016ATC100-2N for teaching FPGA design concepts because the Altera/Intel MAX+PLUS II and Quartus toolchains fully support the FLEX 6000 family with free or low-cost licenses. The 100-TQFP package mounts easily on 0.1-inch-pitch breakout boards for breadboarding exercises. Its 16K-gate capacity is sufficient for full CPU implementations, signal-processing pipelines, and communication-protocol stacks as student projects, while remaining small enough for quick compile cycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016ATC100-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016ATC100-1 | EPF6016ATC100-2 | EPF6016ATI100-2 | EPF6010ATC100-2 |
|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Total Gates | 16,000 | 16,000 | 16,000 | 16,000 | 10,000 (-37%) |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 880 (-33%) |
| Speed Grade | -2 | -1 (faster) | -2 (same) | -2 (same) | -2 (same) |
| Operating Temperature | 0 to +85 °C (Commercial) | 0 to +85 °C | 0 to +85 °C | -40 to +85 °C (Industrial) | 0 to +85 °C |
| Lead-Free / RoHS | Yes (N suffix) | No (lead-based) | No (lead-based) | No (lead-based) | No (lead-based) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Lead-free / RoHS-compliant finish for global production (vs EPF6016ATC100-2)
- Highest density within the FLEX 6016 100-TQFP family (vs EPF6010ATC100-2)
- Optimized mid-tier speed/power tradeoff (vs EPF6016ATC100-1)
Notes de conception
The EPF6016ATC100-2N requires separate VCCINT (3.3V core) and VCCIO (3.3V or 5V-tolerant I/O bank) supplies per the FLEX 6000 datasheet. Place 0.1 µF X7R ceramic decoupling capacitors within 5 mm of each VCC pin, with a bulk 47-100 µF tantalum or aluminum-polymer capacitor on each supply rail. Unused supply pins must still be connected to their respective rails per Altera's hardware reference design guidelines, never left floating.
Route the JTAG chain (TCK/TMS/TDI/TDO) as a daisy-chain through all devices on the board with 10 kΩ pull-ups on TCK/TMS/TDI to VCCIO. The 100-TQFP package provides adequate escape routing for the 81 user I/Os, but maintain 4-Width signal traces with 8-mil clearance for LVTTL signals to minimize crosstalk. Place configuration EPROM (EPC1 or EPC2) within 50 mm of the FPGA with matched-impedance DCLK and DATA0 traces.
Configuration memory is SRAM-based and volatile - a power cycle erases the design unless an external configuration EPROM is present. Do not leave nCONFIG floating; it must be pulled to VCCINT through a 10 kΩ resistor or driven by a supervisory circuit. The 'N' suffix indicates lead-free finish, which requires peak reflow temperatures of 245-260 °C per JEDEC J-STD-020 - verify your profile before assembly.
At maximum toggle activity (all 81 I/Os at 50 MHz LVTTL) the EPF6016ATC100-2N dissipates approximately 0.6-0.8 W; commercial temperature designs typically work without a heatsink on standard 4-layer PCBs. For sealed enclosures or elevated ambient temperatures above 60 °C, provide at least 1 square inch of top-side copper pour for thermal spreading. Estimate: TJ = TA + (PDISS × θJA); for θJA ~40 °C/W (100-TQFP on 4-layer board) and 0.7 W dissipation, the junction rises ~28 °C above ambient.
Informations de conformité
RoHS compliance confirmed via 'N' suffix in part number per Altera/Intel part-numbering convention. REACH and conflict-minerals status not explicitly stated in provided web data; flagged as unknown. AEC-Q100 not applicable for this FPGA product family.