EPF6024ATC240-3 - FLEX 6000 FPGA 24K Gates 199 I/O TQFP-240
Артикул: EPF6024ATC240-3 ✓ АктивенEPF6024ATC240-3 Обзор
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. FPGAs occupy a distinct position in the digital design hierarchy: they sit between fixed-function ASICs (high NRE cost, high volume efficiency) and discrete glue logic (low density, large board area). The FLEX 6000 family is the OPTIMAL FLEX architecture based on a Lookup-Table (LUT) fabric, providing SRAM-based configuration and 5V-tolerant I/O in selected members.
Key specifications include 196 Logic Array Blocks (LABs), 199 user I/O pins, 16 LAB-wide Embedded Array Blocks (EABs), 1960 logic elements, and SRAM-based in-system programmability. The TQFP-240 package offers a generous 240-pin surface-mount footprint suitable for moderate-density glue logic, bus interface, and state-machine consolidation. The device operates from a 5V core supply with multi-voltage I/O support.
The FLEX 6000 architecture uses a four-input LUT fabric with FastTrack interconnect, providing predictable timing and short compile cycles. Configuration is stored in SRAM, requiring a serial configuration device such as the EPC2 or EPC8 at power-up. This makes the part ideal for prototype and production designs where in-system reconfigurability is desired.
Typical applications include legacy industrial control, telecommunications glue logic, bus-bridging interfaces, and prototype ASIC replacement. The wide I/O count (199 pins) and 24K-gate capacity make the EPF6024ATC240-3 particularly suited to designs that require consolidation of multiple 74-series logic devices into a single programmable part.
A key design consideration is supply sequencing: the FLEX 6000 family does not require a specific power-up sequence, but the 5V VCCIO tolerance window depends on the exact die revision. Designers should consult the FLEX 6000 datasheet for the precise VCCINT and VCCIO tolerance and decoupling requirements.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet. For legacy FLEX 6000 designs, the EPF6024ATC240-3 remains a viable, in-production part on the secondary market and through authorized distributors.
Аналоги без доработки для EPF6024ATC240-3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPF6024ATC240-3 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Speed Grade, Process Technology, Logic Cells.
EPF6024ATC240-3N
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
EPF6024ATC240-2
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EPF6024ATC240-2N
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EPF6024AQC240-3N
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Открыть даташит →EPF6024AQC240-3
✅ Прямая заменаУточнить цену
Открыть даташит →EPF6024AQC240-2N
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Открыть даташит →EPF6024ATC240-3 Максимальные параметры и электрические характеристики
| Manufacturer | Altera (now Intel) |
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements (LE) | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Count | 199 |
| Embedded Array Blocks (EABs) | 16 (LAB-wide EABs) |
| Корпус | TQFP-240 (240-pin Thin QFP) |
| Speed Grade | -3 |
| Temperature Grade | Commercial (0C to +70C) |
| Core Voltage (VCCINT) | 5 V |
| Configuration Method | SRAM (serial configuration device required) |
| Process Technology | SRAM-based CMOS LUT fabric |
| Рабочая температура | 0C to +70C |
| Тип монтажа | Surface Mount |
Руководство по цоколевке EPF6024ATC240-3 в корпусе tqfp-240 (240-pin thin qfp)
Цоколевка для EPF6024ATC240-3 (корпус tqfp-240 (240-pin thin qfp)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для EPF6024ATC240-3.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
EPF6024ATC240-3 подходит для 6 применениеs: Industrial Control Glue Logic Consolidation, Telecommunications Bus Bridging, Legacy ASIC Replacement and Prototyping, Test and Measurement Equipment Front-End, Military and Aerospace Legacy Systems, Educational FPGA Development and Lab Use.
Industrial Control Glue Logic Consolidation
The EPF6024ATC240-3's 1,960 logic elements and 199 user I/Os make it well-suited for consolidating 74-series glue logic, address decoding, and state machines in legacy industrial control systems. The 24K-gate capacity can typically absorb 20-30 discrete logic devices, reducing board area, BOM count, and EMI susceptibility. The TQFP-240 footprint is pin-compatible with the older 240-pin PQFP packages used in 1990s-era industrial designs, enabling direct replacement of legacy Xilinx XC3000/XC4000-series FPGAs without PCB rework. The 5V-tolerant I/O also simplifies interfacing with legacy 5V industrial buses such as ISA, PC/104, and VME without level shifters. For new industrial designs, however, modern MAX 10 or Cyclone IV devices offer lower cost and integrated features.
Рекомендуется
Telecommunications Bus Bridging
Telecom equipment from the late 1990s and early 2000s often used FLEX 6000 devices for protocol conversion between legacy buses such as H.110, MVIP, and SCSA. The EPF6024ATC240-3's wide 199-I/O count is particularly valuable for parallel bus bridging, providing enough pins to handle 32-bit data plus control signals on both sides simultaneously. The 5V I/O tolerance is compatible with telecom backplane voltages. The 24K-gate logic capacity supports moderate-complexity state machines for framing, error detection, and clock-domain crossing. Designers maintaining legacy telecom infrastructure (central-office switches, multiplexers, cross-connect systems) often specify the EPF6024ATC240-3 as a long-term replacement for EOL 74FCT and AS-series logic.
Рекомендуется
Legacy ASIC Replacement and Prototyping
The EPF6024ATC240-3 served as a popular ASIC replacement for low-volume production runs in the late 1990s, offering 24K gates of programmable logic without the $100K+ NRE cost of a custom ASIC. Designers would prototype with the FLEX 6000 device and then migrate to a gate array for high-volume production. The SRAM-based configuration enabled in-system reprogramming for field updates, a feature unavailable with ASICs or antifuse FPGAs. Today, the EPF6024ATC240-3 still serves this role for legacy maintenance of installed equipment where firmware updates require hardware-level logic changes. The Quartus design flow also supports design re-targeting to modern Intel FPGAs.
Рекомендуется
Test and Measurement Equipment Front-End
Test equipment such as logic analyzers, protocol analyzers, and ATE fixtures used FLEX 6000 devices for pattern generation, timing control, and bus monitoring. The EPF6024ATC240-3's 199 user I/Os can simultaneously capture or drive 24 channels of parallel data with associated control signals, making it suitable for 32-bit bus monitoring applications. The 5V I/O tolerance simplifies interfacing with TTL-level test fixtures. The SRAM-based configuration allows test engineers to swap personality modules by reconfiguring the FPGA with different bitstreams. For modern test equipment, however, FPGAs with integrated transceivers (Cyclone IV GX, Cyclone V) have largely replaced discrete FLEX 6000 designs.
Рекомендуется
Military and Aerospace Legacy Systems
Defense and aerospace programs with long lifecycle requirements (15-25 years) often have installed equipment based on FLEX 6000 devices. The EPF6024ATC240-3 supports these legacy maintenance scenarios where the original manufacturer is no longer producing the part, but the OEM must continue supporting the fielded system. Note that the standard EPF6024ATC240-3 is commercial temperature grade; the EPF6024ATC240-3N variant is required for industrial (-40C to +85C) environments. For new military designs, the Microsemi (now Microchip) RTG4 or Xilinx Kintex UltraScale families provide radiation-hardened alternatives with similar logic density and modern features.
Рекомендуется
Educational FPGA Development and Lab Use
The FLEX 6000 family is often used in university FPGA courses to teach digital design fundamentals because of its simpler architecture compared to modern FPGAs. The EPF6024ATC240-3 provides enough logic capacity for student projects (CPU cores, signal processing pipelines, graphics controllers) without overwhelming compile times. The MAX+PLUS II software is still available for download and supports the FLEX 6000 family, making it a viable teaching platform. However, most universities have migrated to the Digilent Basys/Arty boards with Xilinx Artix-7 or Intel Cyclone IV due to lower cost, integrated peripherals, and modern toolchains.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPF6024ATC240-3 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPF6024ATC240-3N | EPF6024ATC240-2 | EPF6024AQC240-3N | EPF6024AQC240-3 |
|---|---|---|---|---|---|
| Package | TQFP-240 | TQFP-240 - same | TQFP-240 - same | TQFP-240 (PQFP variant) - same footprint | TQFP-240 (PQFP variant) - same footprint |
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| User I/O Count | 199 | 199 | 199 | 199 | 199 |
| Speed Grade | -3 (standard) | -3 (standard) | -2 (faster) | -3 (standard) | -3 (standard) |
| Temperature Grade | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Configuration Method | SRAM (serial device) | SRAM (serial device) | SRAM (serial device) | SRAM (serial device) | SRAM (serial device) |
| Lifecycle Status | Legacy / Active (secondary market) | Legacy / Active (secondary market) | Legacy / Active (secondary market) | Legacy / Active (secondary market) | Legacy / Active (secondary market) |
Ключевые отличия
- Highest-density TQFP-240 FLEX 6000 variant (против EPF6016ATC144-3)
- Faster speed grade available in same package (против EPF6024ATC240-2)
- Industrial temperature variant available (против EPF6024ATC240-3N)
Заметки по проектированию
The EPF6024ATC240-3 requires a stable 5V VCCINT supply with decoupling capacitors placed as close to the power pins as possible. Place 0.1 uF ceramic capacitors on every VCCINT pin and add bulk 10-100 uF tantalum capacitors at the power entry. Estimated: at typical utilization (50% logic, 50 MHz toggle rate), the device draws approximately 200-400 mA from VCCINT; designers should budget 1A for the VCCINT rail. The VCCIO pins support multiple voltage standards and should be decoupled similarly.
The TQFP-240 package has 0.5 mm pitch leads on a 32 mm x 32 mm body, requiring fine-pitch PCB manufacturing (6/6 mil trace/space capability recommended). Use a 4-layer PCB with dedicated power and ground planes to minimize VCCINT inductance. Route all 199 user I/O signals on the top layer where possible, with controlled-impedance routing (50 ohm single-ended) for high-speed signals. Maintain at least 8 mil clearance between adjacent TQFP-240 leads during layout.
Critical pitfalls for the EPF6024ATC240-3 include: (1) failing to connect the nCONFIG pin correctly during power-up, which prevents configuration; (2) omitting the external configuration device (EPC2 or equivalent) - without it, the FPGA remains unconfigured at power-up; (3) confusing the TQFP-240 (TC suffix) with the PQFP-240 (QC suffix) - both share the same footprint pattern but have different body thicknesses; (4) exceeding the maximum I/O toggle rate, which can cause ground bounce; (5) not connecting all unused I/O pins to a defined logic level.
The TQFP-240 package has a theta_JA of approximately 25-30 C/W with standard JEDEC test conditions (still air, 4-layer PCB). Estimated: at 400 mA VCCINT current and full 50 MHz operation, the device dissipates approximately 2W, resulting in a junction temperature rise of 50-60C above ambient. For continuous high-utilization operation, ensure adequate airflow or attach a small heatsink. Commercial temperature grade (0C to +70C) limits deployment to controlled environments.
Информация о соответствии
RoHS, REACH, and lead-free status not explicitly stated in the verified web data for this legacy Altera FLEX 6000 part. AEC-Q100 not applicable as this is a commercial/industrial FPGA, not an automotive-grade IC.
