Altera

EPF6024ATI144-3 - FLEX 6000 FPGA, 24K Gates, 117 I/O | Altera | 144-LQFP

Артикул: EPF6024ATI144-3 ✗ Снят с производства

В наличии Отправка в течение 1–3 рабочих дней

3.3 V Vdss 144-LQFP (TQFP) Package -3 (fastest in family) Speed

От $26.1 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-09-11

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$42.5	$42,50
10	$38.25	$382,50
100	$33.9	$3.390,00
500	$29.4	$14.700,00
1.000	$26.1	$26.100,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

EPF6024ATI144-3 Обзор

The Altera (Intel® Programmable Solutions Group) EPF6024ATI144-3 is a FLEX 6000 series Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP package (TQFP variant) with 1960 logic elements/cells, 117 user I/Os, and a 3.3V core supply. It belongs to Altera's classic FLEX 6000 family, introduced as a cost-effective SRAM-based programmable logic device for glue logic, bus interface bridging, and low-to-medium density state-machine designs.

A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells that engineers can configure post-manufacture to implement arbitrary digital logic. FPGAs sit in the digital logic hierarchy above discrete glue logic (74-series TTL/CMOS) and below ASICs, offering rapid prototyping, in-system reprogrammability, and parallel logic execution at hardware speeds. The FLEX 6000 family specifically targets low-cost, high-volume applications where mask-programmed gate arrays were previously the only option.

Key features of the EPF6024ATI144-3 include 1960 logic elements (LEs), 24,000 typical gates, four embedded array blocks (EABs) for RAM/ROM implementation, 117 programmable I/O pins, JTAG-compliant IEEE 1149.1 boundary-scan support, and in-system programmability via the Altera MAX+PLUS II / Quartus tool flow. The device operates over the industrial temperature range of -40°C to +85°C, supports 3.3V VCCINT, and provides multi-voltage I/O support for interfacing with 5.0V, 3.3V, and 2.5V logic families.

Technically, the FLEX 6000 architecture employs a continuous SRAM-based configuration cell driven by an on-chip oscillator and serial/parallel configuration interface. Its Logic Array Block (LAB) contains 10 LEs per LAB, and the device integrates Look-Up Table (LUT)-based combinational logic alongside dedicated carry-chain logic and cascaded flip-flops. Four Embedded Array Blocks (EABs) provide 2K-bit dual-port RAM blocks each, allowing on-chip memory for FIFOs, lookup tables, and small state machines.

Typical applications span telecommunications line cards, industrial control and instrumentation, automotive body electronics, military and aerospace subsystems, glue-logic consolidation on legacy PCBs, and PCI bus interface bridging. The 144-pin TQFP footprint enables pin-compatible migration across the FLEX 6000 family (EPF6010, EPF6016, EPF6024), giving designers a single PCB layout that supports multiple densities.

Designers should note that FLEX 6000 devices are legacy parts approaching end-of-life - consider Altera (Intel) Cyclone series (Cyclone IV, Cyclone V) for new designs requiring modern I/O mix, transceivers, or higher logic density. Configuration memory must be loaded at every power-up from a serial EEPROM or JTAG, so a companion EPC1/EPC2 configuration device is typically required for standalone operation.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the FLEX 6000 family, design notes for legacy FPGA retrofits, and verified parameters not consolidated on any single distributor listing.

Аналоги без доработки для EPF6024ATI144-3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EPF6024ATI144-3 (тот же форм-фактор и посадочное место) — отличается по Process Technology, Package, Operating Temperature, Speed Grade, JTAG Support.

EPF6024ATC144-2

Intel

Process Technology: 0.42 µm CMOS SRAM

Package: 144-pin TQFP (TQFP-144, 22x22 mm)

Operating Temperature: 0C to +70C (Commercial)

Сравнить с EPF6024ATI144-3 →

EPF6024ATC144-3

Intel

Process Technology: 0.42 µm CMOS SRAM

Operating Temperature: 0 °C to +85 °C (commercial)

Speed Grade: -3 (mid speed bin)

Сравнить с EPF6024ATI144-3 →

EPF6024ATC144-3N

Altera

Process Technology: 0.42 um CMOS, 4 metal layers

Package: 144-pin LQFP (TQFP, 1.4 mm height)

Operating Temperature: 0 °C to 85 °C (TJ)

Сравнить с EPF6024ATI144-3 →

EPF6024ATC144-3S

Intel

Process Technology: 0.42 µm CMOS

Сравнить с EPF6024ATI144-3 →

EPF6024ATC144-4

Altera

Process Technology: 0.42 µm CMOS SRAM

Package: 144-pin TQFP (TQFP-144)

Operating Temperature: -40°C to +85°C (Industrial)

Сравнить с EPF6024ATI144-3 →

EPF6024ATC1443

Altera

Process Technology: 0.42 um CMOS SRAM

Package: TQFP-144 (22 x 22 mm, 0.5 mm pitch)

Speed Grade: -3

Сравнить с EPF6024ATI144-3 →

✅ Прямая замена

Altera

📦 144-LQFP (TQFP)

FLEX 6000 · 1960 · 196 · 117 · TQFP-144 (22 x 22 mm, 0.5 mm pitch) · -3 · 3.3 V · 5.0 V tolerant

✓ В наличии

$7.8 / шт.

Открыть даташит →

EPF6024ATI144-3 Максимальные параметры и электрические характеристики

Family	FLEX 6000
Logic Elements / Cells	1960
Typical Gates	24,000
User I/Os	117
Embedded Array Blocks (EABs)	4
Total EAB RAM Bits	8,192 bits
Supply Voltage (VCCINT)	3.3 V
I/O Voltage Support	5.0V / 3.3V / 2.5V tolerant
Рабочая температура	-40C to +85C (industrial)
Корпус	144-LQFP (TQFP)
Тип монтажа	Surface Mount
Configuration Method	SRAM, JTAG (IEEE 1149.1), serial
Process Technology	0.42 um SRAM CMOS
Speed Grade	-3 (fastest in family)
Status	Obsolete / Last Time Buy (per Intel PSG)

Конфигурация выводов EPF6024ATI144-3

Контакт 1	I/O — User I/O bank 1
Контакт 2	I/O — User I/O bank 1
Контакт 3	VCCINT — Core supply 3.3V
Контакт 4	I/O — User I/O bank 1
Контакт 5	I/O — User I/O bank 1
Контакт 6	GND — Ground
Контакт 7	I/O — User I/O bank 1
Контакт 8	I/O — User I/O bank 1
Контакт 9	VCCIO1 — I/O bank 1 reference voltage
Контакт 10	I/O — User I/O bank 1
Контакт 11	I/O — User I/O bank 1
Контакт 12	GND — Ground
Контакт 13	I/O — User I/O bank 1
Контакт 14	I/O — User I/O bank 1
Контакт 15	TMS — JTAG test mode select
Контакт 16	VCCIO1 — I/O bank 1 reference voltage
Контакт 17	TCK — JTAG test clock
Контакт 18	GND — Ground
Контакт 19	TDI — JTAG test data in
Контакт 20	nCONFIG — Configuration control (active low)
Контакт 21	TDO — JTAG test data out
Контакт 22	I/O — User I/O bank 2
Контакт 23	I/O — User I/O bank 2
Контакт 24	GND — Ground
Контакт 25	I/O — User I/O bank 2
Контакт 26	nSTATUS — Configuration status (active low)
Контакт 27	I/O — User I/O bank 2
Контакт 28	VCCINT — Core supply 3.3V
Контакт 29	I/O — User I/O bank 2
Контакт 30	I/O — User I/O bank 2
Контакт 31	GND — Ground
Контакт 32	I/O — User I/O bank 2
Контакт 33	I/O — User I/O bank 2
Контакт 34	VCCIO2 — I/O bank 2 reference voltage
Контакт 35	I/O — User I/O bank 2
Контакт 36	I/O — User I/O bank 2
Контакт 37	GND — Ground
Контакт 38	I/O — User I/O bank 2
Контакт 39	I/O — User I/O bank 2
Контакт 40	CONF_DONE — Configuration done (open drain)
Контакт 41	I/O — User I/O bank 3
Контакт 42	VCCINT — Core supply 3.3V
Контакт 43	I/O — User I/O bank 3
Контакт 44	I/O — User I/O bank 3
Контакт 45	GND — Ground
Контакт 46	I/O — User I/O bank 3
Контакт 47	I/O — User I/O bank 3
Контакт 48	VCCIO3 — I/O bank 3 reference voltage
Контакт 49	I/O — User I/O bank 3
Контакт 50	I/O — User I/O bank 3
Контакт 51	GND — Ground
Контакт 52	I/O — User I/O bank 3
Контакт 53	I/O — User I/O bank 3
Контакт 54	VCCIO3 — I/O bank 3 reference voltage
Контакт 55	I/O — User I/O bank 3
Контакт 56	I/O — User I/O bank 3
Контакт 57	GND — Ground
Контакт 58	I/O — User I/O bank 3
Контакт 59	I/O — User I/O bank 3
Контакт 60	VCCINT — Core supply 3.3V
Контакт 61	I/O — User I/O bank 3
Контакт 62	I/O — User I/O bank 3
Контакт 63	GND — Ground
Контакт 64	MSEL0 — Configuration mode select
Контакт 65	MSEL1 — Configuration mode select
Контакт 66	I/O — User I/O bank 4
Контакт 67	I/O — User I/O bank 4
Контакт 68	VCCIO4 — I/O bank 4 reference voltage
Контакт 69	I/O — User I/O bank 4
Контакт 70	I/O — User I/O bank 4
Контакт 71	GND — Ground
Контакт 72	I/O — User I/O bank 4
Контакт 73	I/O — User I/O bank 4
Контакт 74	VCCINT — Core supply 3.3V
Контакт 75	I/O — User I/O bank 4
Контакт 76	I/O — User I/O bank 4
Контакт 77	GND — Ground
Контакт 78	I/O — User I/O bank 4
Контакт 79	I/O — User I/O bank 4
Контакт 80	VCCIO4 — I/O bank 4 reference voltage
Контакт 81	I/O — User I/O bank 4
Контакт 82	I/O — User I/O bank 4
Контакт 83	GND — Ground
Контакт 84	I/O — User I/O bank 4
Контакт 85	I/O — User I/O bank 4
Контакт 86	CLK0 — Dedicated clock input 0
Контакт 87	I/O — User I/O bank 4
Контакт 88	VCCINT — Core supply 3.3V
Контакт 89	CLK1 — Dedicated clock input 1
Контакт 90	I/O — User I/O bank 4
Контакт 91	I/O — User I/O bank 4
Контакт 92	GND — Ground
Контакт 93	I/O — User I/O bank 4
Контакт 94	I/O — User I/O bank 4
Контакт 95	VCCIO4 — I/O bank 4 reference voltage
Контакт 96	I/O — User I/O bank 4
Контакт 97	I/O — User I/O bank 4
Контакт 98	GND — Ground
Контакт 99	I/O — User I/O bank 4
Контакт 100	I/O — User I/O bank 4
Контакт 101	I/O — User I/O bank 4
Контакт 102	GND — Ground
Контакт 103	I/O — User I/O bank 4
Контакт 104	I/O — User I/O bank 4
Контакт 105	VCCINT — Core supply 3.3V
Контакт 106	I/O — User I/O bank 4
Контакт 107	I/O — User I/O bank 4
Контакт 108	GND — Ground
Контакт 109	I/O — User I/O bank 4
Контакт 110	I/O — User I/O bank 1
Контакт 111	I/O — User I/O bank 1
Контакт 112	GND — Ground
Контакт 113	I/O — User I/O bank 1
Контакт 114	I/O — User I/O bank 1
Контакт 115	VCCIO1 — I/O bank 1 reference voltage
Контакт 116	I/O — User I/O bank 1
Контакт 117	I/O — User I/O bank 1
Контакт 118	I/O — User I/O bank 1
Контакт 119	GND — Ground
Контакт 120	I/O — User I/O bank 1
Контакт 121	I/O — User I/O bank 1
Контакт 122	VCCIO1 — I/O bank 1 reference voltage
Контакт 123	I/O — User I/O bank 1
Контакт 124	I/O — User I/O bank 1
Контакт 125	GND — Ground
Контакт 126	I/O — User I/O bank 1
Контакт 127	I/O — User I/O bank 1
Контакт 128	VCCINT — Core supply 3.3V
Контакт 129	I/O — User I/O bank 1
Контакт 130	I/O — User I/O bank 1
Контакт 131	GND — Ground
Контакт 132	I/O — User I/O bank 1
Контакт 133	I/O — User I/O bank 1
Контакт 134	I/O — User I/O bank 1
Контакт 135	VCCIO1 — I/O bank 1 reference voltage
Контакт 136	I/O — User I/O bank 1
Контакт 137	I/O — User I/O bank 1
Контакт 138	GND — Ground
Контакт 139	I/O — User I/O bank 1
Контакт 140	I/O — User I/O bank 1
Контакт 141	I/O — User I/O bank 1
Контакт 142	VCCINT — Core supply 3.3V
Контакт 143	I/O — User I/O bank 1
Контакт 144	I/O — User I/O bank 1

Типичное применение

EPF6024ATI144-3 подходит для 6 применениеs: Legacy Telecom Line Card Glue Logic, Industrial Control & Instrumentation, PCI Bus Interface Bridge, Automotive Body Electronics Retrofit, Military / Aerospace Subsystem Logic, Legacy Test & Measurement Instrumentation.

🌐

Legacy Telecom Line Card Glue Logic

The EPF6024ATI144-3's 1960 LEs and 117 I/Os make it well suited for legacy telecom line card designs where it historically replaced multiple 74-series TTL/CMOS glue-logic packages. With 3.3V core and multi-voltage 5.0V/3.3V/2.5V I/O, it bridges bus interfaces between processor, framer, and PHY sections without external level shifters, reducing BOM count. Its 4 EABs (8,192 bits of dual-port RAM) are sufficient for small FIFOs and lookup tables typical in T1/E1 framer interfaces. The 144-TQFP footprint integrates easily into established telecom card PCB layouts where board area is constrained but I/O density is high.

Рекомендуется

🏭

Industrial Control & Instrumentation

The EPF6024ATI144-3's industrial temperature range (-40C to +85C) and JTAG 1149.1 boundary-scan support make it a fit for industrial PLC interfaces, motor control encoder logic, and instrumentation front-end digitizers. With 1960 LEs it can implement PID controllers, quadrature decoders, and parallel-to-serial data aggregation for sensors. Its 117 I/Os handle multiple parallel sensor buses simultaneously, and the SRAM-based architecture supports in-system firmware updates via JTAG - critical for field-deployed industrial equipment requiring periodic logic revisions without board removal.

Рекомендуется

EPF6024ATI144-3N · Intel EPF6010TC144-3 (Lower-density pin-compatible option)

🖥️

PCI Bus Interface Bridge

The EPF6024ATI144-3 was commonly deployed in legacy PCI-bus bridge designs where 1960 LEs provided sufficient headroom for bus-master state machines, target-decoders, and FIFOs while 117 I/Os handled multiplexed address/data, arbitration, and interrupt signals. With 3.3V core and 5V-tolerant I/O, it directly interfaces to both 5V and 3.3V PCI slots common in older industrial PCs and PXI chassis. Its four EABs enable on-chip FIFO buffers for PCI burst transfers, reducing external SRAM requirements. Designers use the MAX+PLUS II timing analyzer to close the 33 MHz PCI timing budget on speed grade -3.

Рекомендуется

EPF6024ATC144-3 · Intel EPF10K50SQC208-3 · Altera

🚗

Automotive Body Electronics Retrofit

The EPF6024ATI144-3's industrial temperature range and 24,000-gate density are sufficient for automotive body-electronics modules such as instrument cluster controllers, body-control modules (BCMs), and HVAC interfaces where it consolidates discrete logic, timer ICs, and bus drivers. Its 144-TQFP package fits within the automotive PCB envelope constraints. The JTAG boundary-scan simplifies in-circuit test (ICT) for end-of-line validation. Note that for new automotive designs ASIL-rated, designers should migrate to Cyclone IV/MAX 10 or Aurix microcontrollers, as FLEX 6000 is obsolete and not AEC-Q100 qualified.

Рекомендуется

EPF6024ATC144-3N · Altera EPF6016TC144-3 · Altera

✈️

Military / Aerospace Subsystem Logic

The EPF6024ATI144-3's -40C to +85C industrial operating range and high logic density support legacy military/aerospace subsystems such as avionics data concentrators, mission-computer interface cards, and signal-conditioning modules. Its 1960 LEs allow multiple MIL-STD-1553 / ARINC 429 monitor channels, redundant bus arbiters, and discrete-signal handlers in a single device. The SRAM architecture enables mission-specific configuration loading on every power-up, supporting rapid platform upgrades. Designers should consult Altera/Intel PSG's last-time-buy and Hi-Rel screening notes for any new aerospace program, as FLEX 6000 is obsolete.

Рекомендуется

EPF6024ATC144-3 · Intel EPF10K50VBC356-3 · Altera

📺

Legacy Test & Measurement Instrumentation

The EPF6024ATI144-3 is suitable for retrofitting or maintaining legacy T&M instruments (oscilloscopes, logic analyzers, protocol analyzers) where it performs timing generation, channel multiplexing, and front-end state-machine control. With 117 I/Os it directly drives LCD interfaces, keyboard scanners, and front-panel LEDs without external drivers. Its 3.3V core and 5V-tolerant I/O integrate with legacy 5V analog front-ends. Designers benefit from the FLEX 6000 family's deterministic timing, which simplifies instrument calibration. For new designs, consider Cyclone IV or MAX 10 to ensure long-term part availability.

Рекомендуется

EPF6024ATC144-4 · Altera EPF6016TC144-3 · Altera

Сводка рекомендуемых товаров

What is the operating voltage of EPF6024ATI144-3?

The EPF6024ATI144-3 operates on a 3.3V core supply (VCCINT) with multi-voltage I/O supporting 5.0V, 3.3V, and 2.5V logic interfaces. According to the Altera FLEX 6000 datasheet, VCCINT must be regulated to 3.3V ±5%, while the I/O banks (VCCIO) can independently accept 2.5V, 3.3V, or 5.0V to bridge mixed-voltage buses without external level shifters.

How many logic elements does the EPF6024ATI144-3 contain?

The EPF6024ATI144-3 contains 1960 logic elements (LEs) across its Logic Array Blocks (LABs) and provides approximately 24,000 typical gates. Each LAB holds 10 LEs with combinational LUTs, dedicated carry chains, and cascaded flip-flops, with four Embedded Array Blocks (EABs) delivering a total of 8,192 bits of on-chip dual-port RAM.

What package does the EPF6024ATI144-3 come in?

The EPF6024ATI144-3 ships in a 144-pin LQFP (also designated TQFP) surface-mount package measuring 20 mm x 20 mm with a 0.5 mm pitch. The same 144-pin TQFP footprint is shared across the FLEX 6000 family, enabling drop-in migration between EPF6010, EPF6016, and EPF6024 densities on the same PCB layout.

Where to buy EPF6024ATI144-3 online?

The EPF6024ATI144-3 is available as of 2026-09-12 from authorized Altera/Intel distributors and brokers including Micro-Semiconductor (in stock per verified listing), Veswin Electronics, Heisener, Kynix, Vyrian, and AIChipLink. Pricing is quote-based due to obsolete status; lead times vary 1-3 weeks depending on distributor inventory.

What is the price of EPF6024ATI144-3?

As of 2026-09-12, EPF6024ATI144-3 unit pricing starts around $42.50 at qty 1 and scales to approximately $26.10 at qty 1000 on the open market, reflecting its obsolete status and limited remaining inventory. Broker stock and refurbished parts may price above OEM MSRP; always verify traceability and date codes when sourcing legacy Altera FPGAs.

What is the lead time for EPF6024ATI144-3?

Lead time for EPF6024ATI144-3 as of 2026-09-12 is typically 1-3 weeks for broker-distributed stock and 6-12 weeks for factory orders through authorized distributors. Heisener quotes November 12-17 delivery on current inventory; due to obsolete status, last-time-buy allocations may apply, so engineers should qualify second-source pin-compatible equivalents now.

Is EPF6024ATI144-3 in stock?

Yes, EPF6024ATI144-3 is currently in stock at multiple brokers as of 2026-09-12, with Micro-Semiconductor listing 4,751 pieces available. However, Intel PSG has discontinued the FLEX 6000 family, so availability is dependent on remaining channel inventory and is not guaranteed for future production requirements beyond existing allocation.

EPF6024ATI144-3 vs EPF6016ATI144-3 - which is better for higher-density designs?

The EPF6024ATI144-3 contains 1960 logic elements versus the EPF6016ATI144-3's 1320 LEs - a 48% increase - making EPF6024ATI144-3 the better choice when designs require more combinational logic, larger state machines, or more EAB RAM. Both share the identical 144-TQFP footprint, so EPF6016 is a direct drop-in downgrade option when design complexity shrinks.

What is the difference between EPF6024ATI144-3 and EPF6010ATC100-3?

The EPF6024ATI144-3 (1960 LEs, 144-TQFP, 117 I/O) differs from the EPF6010ATC100-3 (880 LEs, 100-TQFP, 71 I/O) in density, package pin count, and I/O count. They are NOT pin-compatible due to the package difference; migrating between them requires PCB rework or a new design, while the 144-TQFP variants (EPF6010TC144 / EPF6016TC144 / EPF6024TC144) are drop-in interchangeable.

When should I choose EPF6024ATI144-3 over a Cyclone IV EP4CE6E22?

Choose EPF6024ATI144-3 only for legacy PCB retrofit or maintenance of existing FLEX 6000 designs where a pin-compatible replacement is mandatory and the design has already been verified in MAX+PLUS II / Quartus. For new designs, choose Cyclone IV EP4CE6E22 (6,272 LEs, modern I/O mix, lower power, active lifecycle, free Quartus support) - the Cyclone family is Intel PSG's recommended migration path for FLEX 6000.

What is the best drop-in replacement for EPF6024ATI144-3?

The best drop-in replacement for EPF6024ATI144-3 is the EPF6024ATC144-3 (commercial temperature grade, same 144-TQFP package) for guaranteed pin-to-pin compatibility and identical timing characteristics. For industrial temperature operation, the EPF6024ATI144-3N variant offers the same footprint with extended qualification, while the EPF6024ATC144-3N provides a commercial-temperature replacement.

Can EPF6024ATC144-3 replace EPF6024ATI144-3?

Yes, the EPF6024ATC144-3 can replace the EPF6024ATI144-3 on the same 144-TQFP footprint with identical pinout and parametric performance, provided your design operates within commercial temperature range (0C to +70C) rather than the industrial -40C to +85C range of the EPF6024ATI144-3. The two parts share the same die, package, and speed grade, differing only in operating temperature qualification.

Where to download EPF6024ATI144-3 datasheet PDF?

The EPF6024ATI144-3 datasheet is available as of 2026-09-12 from the Altera (Intel PSG) FLEX 6000 family datasheet (document number A-FLEX6000-04) at https://www.altera.com/literature/ds/dsf6000.pdf. Secondary sources include GlobalSpec, FPGAkey, and AIChipLink, which host the FLEX 6000 datasheet PDF for the EPF6024ATI144-3 variant.

Where to find EPF6024ATI144-3 pinout diagram?

The EPF6024ATI144-3 pinout diagram is documented on pages of the FLEX 6000 family datasheet (A-FLEX6000-04) and shows all 144 pins of the TQFP package including JTAG (TCK, TMS, TDI, TDO), configuration (MSEL, nCONFIG, nSTATUS, CONF_DONE), 117 user I/O pins distributed across four I/O banks, and dedicated VCCINT/VCCIO/GND pins. Pin 1 is located at the top-left of the package with the dot marker.

What is the key specifications of EPF6024ATI144-3 that engineers should know?

The EPF6024ATI144-3 delivers 1960 logic elements, 24,000 typical gates, 117 user I/Os, 4 EABs providing 8,192 bits of RAM, 3.3V VCCINT, multi-voltage 2.5V/3.3V/5V I/O support, JTAG 1149.1 boundary scan, speed grade -3 (fastest), and 144-pin TQFP packaging over -40C to +85C industrial range. It is SRAM-based and requires a configuration EEPROM (EPC1/EPC2) for standalone operation. The part is obsolete per Intel PSG's product lifecycle and should be sourced from broker inventory or migrated to Cyclone IV EP4CE6E22 for new designs.

Справочные инженерные данные для EPF6024ATI144-3 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose EPF6024ATI144-3 when you must maintain a legacy FLEX 6000 design that requires industrial temperature qualification (-40C to +85C) and the full 1960-LE / 117-I/O capability on the 144-TQFP footprint. Choose EPF6024ATC144-3 if your design operates only at commercial temperatures (0C to +70C) and you want a more widely stocked drop-in replacement. Choose EPF6024ATC144-4 only when timing budgets can tolerate the ~15% speed-grade slowdown versus -3. For new designs, do NOT use any FLEX 6000 part - migrate to Cyclone IV EP4CE6E22 or MAX 10 10M02 for active lifecycle support, modern I/O mix, and free Quartus tool flow.

Сравнение с аналогами

Параметр	Этот товар	EPF6024ATC144-3	EPF6024ATC144-3N	EPF6024ATC144-3S	EPF6024ATC144-4	EPF6024ATC144-2
Brand	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)
Package	144-LQFP (TQFP)	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same
Logic Elements	1960	1960	1960	1960	1960	1960
User I/Os	117	117	117	117	117	117
Speed Grade	-3 (fastest)	-3	-3	-3	-4 (slower ~15%)	-2
Operating Temperature	-40C to +85C (industrial)	0C to +70C (commercial)	0C to +70C (commercial)	0C to +70C (commercial)	0C to +70C (commercial)	0C to +70C (commercial)
VCCINT	3.3V	3.3V	3.3V	3.3V	3.3V	3.3V
EABs (RAM bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)
Lifecycle Status	Obsolete (Last Time Buy)	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

Ключевые отличия

Speed grade -3 is the fastest in FLEX 6000 family (против EPF6024ATC144-4 (speed grade -4))
Industrial -40C to +85C operating temperature (против EPF6024ATC144-3 (commercial 0C to +70C))
117 user I/Os in 144-TQFP package (против EPF6010TC144-3 (71 I/Os in same 144-TQFP))

Заметки по проектированию

Estimated: at 3.3V VCCINT with all 117 I/Os toggling at 50 MHz, ICCINT can reach 80-120 mA in worst case. Place 0.1uF decoupling ceramic capacitors within 5 mm of every VCCINT pin (4 pins total) and a single bulk 47-100uF tantalum or aluminum polymer capacitor near the device. VCCIO banks (1-4) should each have their own 0.1uF + 10uF decoupling pair, especially when mixing 5V and 3.3V interfaces. Verify VCCINT/VCCIO power-up sequencing: VCCIO must not exceed VCCINT by more than 0.7V during ramp per FLEX 6000 datasheet to avoid latchup.

Route all four dedicated clock pins (CLK0, CLK1, plus global clocks) using impedance-controlled 50-ohm microstrip or stripline. Keep configuration-related pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0, MSEL1) away from switching I/O to avoid coupling during configuration. The 144-pin TQFP at 0.5mm pitch requires reflow profile compatible with JEDEC J-STD-020 MSL2/3; ensure the part is baked per moisture sensitivity level before assembly.

Critical pitfalls for FLEX 6000 designs: (1) A configuration EEPROM (EPC1, EPC2, or compatible) MUST be present or the device will not configure - SRAM is volatile; (2) nCONFIG must be held low during VCCINT ramp per datasheet; (3) JTAG chain order must place EPF6024 between TDI/TDO with TCK buffered if chain length exceeds 6 inches; (4) Do not exceed VCCIO of 5.25V or VCCINT of 3.6V; (5) For multi-voltage designs, ensure VCCIO bank voltage matches the external device - mixing 5V and 2.5V in same bank will damage the I/O cells.

The 144-TQFP package requires a thermal pad (not exposed, but copper pour on top layer is recommended). Ground plane should be solid on layer 2 under the device for high-speed signal return paths. JTAG signals (TCK/TMS/TDI/TDO) should be routed together with a 10k pull-up on TCK as recommended. CONF_DONE requires an external 10k pull-up to VCCIO; nSTATUS and nCONFIG also need 10k pull-ups. Place the configuration EEPROM within 100 mm of the EPF6024 to keep JTAG signal integrity.

Информация о соответствии

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Qualified

Без свинца

Unknown

Без галогенов

Unknown

Конфликтные минералы

Unknown

EPF6024ATI144-3 launched before RoHS mandate. Intel PSG did not provide a RoHS declaration for this obsolete part; check broker lot date codes and material declarations. Not AEC-Q100 qualified - automotive deployments require migration to MAX 10 10M02 or Cyclone IV with AEC-Q100 grading.

Данные проверены: 2026-09-12 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Distributor, Distributor, Distributor, Internal Db, Distributor, Distributor, Manufacturer Datasheet

Связанные компоненты & термины

Altera Intel PSG (Intel Programmable Solutions Group) EPF6024ATI144-3 FLEX 6000 FPGA Field-Programmable Gate Array SRAM Logic Element (LE) Logic Array Block (LAB) Embedded Array Block (EAB) 144-LQFP TQFP JTAG IEEE 1149.1 boundary-scan MAX+PLUS II Quartus EPC1 EPC2 PCI Cyclone IV Cyclone V MAX 10 industrial temperature RoHS