EPF6024ATI144-3 - FLEX 6000 FPGA, 24K Gates, 117 I/O | Altera | 144-LQFP
Référence : EPF6024ATI144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $33.9 | $3 390,00 |
| 500 | $29.4 | $14 700,00 |
| 1 000 | $26.1 | $26 100,00 |
EPF6024ATI144-3 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells that engineers can configure post-manufacture to implement arbitrary digital logic. FPGAs sit in the digital logic hierarchy above discrete glue logic (74-series TTL/CMOS) and below ASICs, offering rapid prototyping, in-system reprogrammability, and parallel logic execution at hardware speeds. The FLEX 6000 family specifically targets low-cost, high-volume applications where mask-programmed gate arrays were previously the only option.
Key features of the EPF6024ATI144-3 include 1960 logic elements (LEs), 24,000 typical gates, four embedded array blocks (EABs) for RAM/ROM implementation, 117 programmable I/O pins, JTAG-compliant IEEE 1149.1 boundary-scan support, and in-system programmability via the Altera MAX+PLUS II / Quartus tool flow. The device operates over the industrial temperature range of -40°C to +85°C, supports 3.3V VCCINT, and provides multi-voltage I/O support for interfacing with 5.0V, 3.3V, and 2.5V logic families.
Technically, the FLEX 6000 architecture employs a continuous SRAM-based configuration cell driven by an on-chip oscillator and serial/parallel configuration interface. Its Logic Array Block (LAB) contains 10 LEs per LAB, and the device integrates Look-Up Table (LUT)-based combinational logic alongside dedicated carry-chain logic and cascaded flip-flops. Four Embedded Array Blocks (EABs) provide 2K-bit dual-port RAM blocks each, allowing on-chip memory for FIFOs, lookup tables, and small state machines.
Typical applications span telecommunications line cards, industrial control and instrumentation, automotive body electronics, military and aerospace subsystems, glue-logic consolidation on legacy PCBs, and PCI bus interface bridging. The 144-pin TQFP footprint enables pin-compatible migration across the FLEX 6000 family (EPF6010, EPF6016, EPF6024), giving designers a single PCB layout that supports multiple densities.
Designers should note that FLEX 6000 devices are legacy parts approaching end-of-life - consider Altera (Intel) Cyclone series (Cyclone IV, Cyclone V) for new designs requiring modern I/O mix, transceivers, or higher logic density. Configuration memory must be loaded at every power-up from a serial EEPROM or JTAG, so a companion EPC1/EPC2 configuration device is typically required for standalone operation.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the FLEX 6000 family, design notes for legacy FPGA retrofits, and verified parameters not consolidated on any single distributor listing.
Alternatives de remplacement direct pour EPF6024ATI144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATI144-3 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Operating Temperature, Speed Grade, JTAG Support.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144-3
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EPF6024ATC144-3N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPF6024ATC144-3S
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF6024ATC144-4
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPF6024ATC144-2
✅ Remplacement direct✓ En stock
$24.95 / unité
Voir la fiche technique →EPF6024ATC1443
✅ Remplacement direct✓ En stock
$7.8 / unité
Voir la fiche technique →EPF6024ATI144-3 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements / Cells | 1960 |
| Typical Gates | 24,000 |
| User I/Os | 117 |
| Embedded Array Blocks (EABs) | 4 |
| Total EAB RAM Bits | 8,192 bits |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage Support | 5.0V / 3.3V / 2.5V tolerant |
| Température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 144-LQFP (TQFP) |
| Type de montage | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial |
| Process Technology | 0.42 um SRAM CMOS |
| Speed Grade | -3 (fastest in family) |
| Status | Obsolete / Last Time Buy (per Intel PSG) |
Configuration des broches de EPF6024ATI144-3
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | VCCINT — Core supply 3.3V |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O bank 1 |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | VCCIO1 — I/O bank 1 reference voltage |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | I/O — User I/O bank 1 |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O bank 1 |
| Broche 14 | I/O — User I/O bank 1 |
| Broche 15 | TMS — JTAG test mode select |
| Broche 16 | VCCIO1 — I/O bank 1 reference voltage |
| Broche 17 | TCK — JTAG test clock |
| Broche 18 | GND — Ground |
| Broche 19 | TDI — JTAG test data in |
| Broche 20 | nCONFIG — Configuration control (active low) |
| Broche 21 | TDO — JTAG test data out |
| Broche 22 | I/O — User I/O bank 2 |
| Broche 23 | I/O — User I/O bank 2 |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O bank 2 |
| Broche 26 | nSTATUS — Configuration status (active low) |
| Broche 27 | I/O — User I/O bank 2 |
| Broche 28 | VCCINT — Core supply 3.3V |
| Broche 29 | I/O — User I/O bank 2 |
| Broche 30 | I/O — User I/O bank 2 |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O bank 2 |
| Broche 33 | I/O — User I/O bank 2 |
| Broche 34 | VCCIO2 — I/O bank 2 reference voltage |
| Broche 35 | I/O — User I/O bank 2 |
| Broche 36 | I/O — User I/O bank 2 |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O bank 2 |
| Broche 39 | I/O — User I/O bank 2 |
| Broche 40 | CONF_DONE — Configuration done (open drain) |
| Broche 41 | I/O — User I/O bank 3 |
| Broche 42 | VCCINT — Core supply 3.3V |
| Broche 43 | I/O — User I/O bank 3 |
| Broche 44 | I/O — User I/O bank 3 |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O bank 3 |
| Broche 47 | I/O — User I/O bank 3 |
| Broche 48 | VCCIO3 — I/O bank 3 reference voltage |
| Broche 49 | I/O — User I/O bank 3 |
| Broche 50 | I/O — User I/O bank 3 |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O bank 3 |
| Broche 53 | I/O — User I/O bank 3 |
| Broche 54 | VCCIO3 — I/O bank 3 reference voltage |
| Broche 55 | I/O — User I/O bank 3 |
| Broche 56 | I/O — User I/O bank 3 |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O bank 3 |
| Broche 59 | I/O — User I/O bank 3 |
| Broche 60 | VCCINT — Core supply 3.3V |
| Broche 61 | I/O — User I/O bank 3 |
| Broche 62 | I/O — User I/O bank 3 |
| Broche 63 | GND — Ground |
| Broche 64 | MSEL0 — Configuration mode select |
| Broche 65 | MSEL1 — Configuration mode select |
| Broche 66 | I/O — User I/O bank 4 |
| Broche 67 | I/O — User I/O bank 4 |
| Broche 68 | VCCIO4 — I/O bank 4 reference voltage |
| Broche 69 | I/O — User I/O bank 4 |
| Broche 70 | I/O — User I/O bank 4 |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O bank 4 |
| Broche 73 | I/O — User I/O bank 4 |
| Broche 74 | VCCINT — Core supply 3.3V |
| Broche 75 | I/O — User I/O bank 4 |
| Broche 76 | I/O — User I/O bank 4 |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O bank 4 |
| Broche 79 | I/O — User I/O bank 4 |
| Broche 80 | VCCIO4 — I/O bank 4 reference voltage |
| Broche 81 | I/O — User I/O bank 4 |
| Broche 82 | I/O — User I/O bank 4 |
| Broche 83 | GND — Ground |
| Broche 84 | I/O — User I/O bank 4 |
| Broche 85 | I/O — User I/O bank 4 |
| Broche 86 | CLK0 — Dedicated clock input 0 |
| Broche 87 | I/O — User I/O bank 4 |
| Broche 88 | VCCINT — Core supply 3.3V |
| Broche 89 | CLK1 — Dedicated clock input 1 |
| Broche 90 | I/O — User I/O bank 4 |
| Broche 91 | I/O — User I/O bank 4 |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — User I/O bank 4 |
| Broche 94 | I/O — User I/O bank 4 |
| Broche 95 | VCCIO4 — I/O bank 4 reference voltage |
| Broche 96 | I/O — User I/O bank 4 |
| Broche 97 | I/O — User I/O bank 4 |
| Broche 98 | GND — Ground |
| Broche 99 | I/O — User I/O bank 4 |
| Broche 100 | I/O — User I/O bank 4 |
| Broche 101 | I/O — User I/O bank 4 |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — User I/O bank 4 |
| Broche 104 | I/O — User I/O bank 4 |
| Broche 105 | VCCINT — Core supply 3.3V |
| Broche 106 | I/O — User I/O bank 4 |
| Broche 107 | I/O — User I/O bank 4 |
| Broche 108 | GND — Ground |
| Broche 109 | I/O — User I/O bank 4 |
| Broche 110 | I/O — User I/O bank 1 |
| Broche 111 | I/O — User I/O bank 1 |
| Broche 112 | GND — Ground |
| Broche 113 | I/O — User I/O bank 1 |
| Broche 114 | I/O — User I/O bank 1 |
| Broche 115 | VCCIO1 — I/O bank 1 reference voltage |
| Broche 116 | I/O — User I/O bank 1 |
| Broche 117 | I/O — User I/O bank 1 |
| Broche 118 | I/O — User I/O bank 1 |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O bank 1 |
| Broche 121 | I/O — User I/O bank 1 |
| Broche 122 | VCCIO1 — I/O bank 1 reference voltage |
| Broche 123 | I/O — User I/O bank 1 |
| Broche 124 | I/O — User I/O bank 1 |
| Broche 125 | GND — Ground |
| Broche 126 | I/O — User I/O bank 1 |
| Broche 127 | I/O — User I/O bank 1 |
| Broche 128 | VCCINT — Core supply 3.3V |
| Broche 129 | I/O — User I/O bank 1 |
| Broche 130 | I/O — User I/O bank 1 |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — User I/O bank 1 |
| Broche 133 | I/O — User I/O bank 1 |
| Broche 134 | I/O — User I/O bank 1 |
| Broche 135 | VCCIO1 — I/O bank 1 reference voltage |
| Broche 136 | I/O — User I/O bank 1 |
| Broche 137 | I/O — User I/O bank 1 |
| Broche 138 | GND — Ground |
| Broche 139 | I/O — User I/O bank 1 |
| Broche 140 | I/O — User I/O bank 1 |
| Broche 141 | I/O — User I/O bank 1 |
| Broche 142 | VCCINT — Core supply 3.3V |
| Broche 143 | I/O — User I/O bank 1 |
| Broche 144 | I/O — User I/O bank 1 |
Applications typiques
EPF6024ATI144-3 convient pour 6 applications: Legacy Telecom Line Card Glue Logic, Industrial Control & Instrumentation, PCI Bus Interface Bridge, Automotive Body Electronics Retrofit, Military / Aerospace Subsystem Logic, Legacy Test & Measurement Instrumentation.
Legacy Telecom Line Card Glue Logic
The EPF6024ATI144-3's 1960 LEs and 117 I/Os make it well suited for legacy telecom line card designs where it historically replaced multiple 74-series TTL/CMOS glue-logic packages. With 3.3V core and multi-voltage 5.0V/3.3V/2.5V I/O, it bridges bus interfaces between processor, framer, and PHY sections without external level shifters, reducing BOM count. Its 4 EABs (8,192 bits of dual-port RAM) are sufficient for small FIFOs and lookup tables typical in T1/E1 framer interfaces. The 144-TQFP footprint integrates easily into established telecom card PCB layouts where board area is constrained but I/O density is high.
Recommandé
Industrial Control & Instrumentation
The EPF6024ATI144-3's industrial temperature range (-40C to +85C) and JTAG 1149.1 boundary-scan support make it a fit for industrial PLC interfaces, motor control encoder logic, and instrumentation front-end digitizers. With 1960 LEs it can implement PID controllers, quadrature decoders, and parallel-to-serial data aggregation for sensors. Its 117 I/Os handle multiple parallel sensor buses simultaneously, and the SRAM-based architecture supports in-system firmware updates via JTAG - critical for field-deployed industrial equipment requiring periodic logic revisions without board removal.
Recommandé
PCI Bus Interface Bridge
The EPF6024ATI144-3 was commonly deployed in legacy PCI-bus bridge designs where 1960 LEs provided sufficient headroom for bus-master state machines, target-decoders, and FIFOs while 117 I/Os handled multiplexed address/data, arbitration, and interrupt signals. With 3.3V core and 5V-tolerant I/O, it directly interfaces to both 5V and 3.3V PCI slots common in older industrial PCs and PXI chassis. Its four EABs enable on-chip FIFO buffers for PCI burst transfers, reducing external SRAM requirements. Designers use the MAX+PLUS II timing analyzer to close the 33 MHz PCI timing budget on speed grade -3.
Recommandé
Automotive Body Electronics Retrofit
The EPF6024ATI144-3's industrial temperature range and 24,000-gate density are sufficient for automotive body-electronics modules such as instrument cluster controllers, body-control modules (BCMs), and HVAC interfaces where it consolidates discrete logic, timer ICs, and bus drivers. Its 144-TQFP package fits within the automotive PCB envelope constraints. The JTAG boundary-scan simplifies in-circuit test (ICT) for end-of-line validation. Note that for new automotive designs ASIL-rated, designers should migrate to Cyclone IV/MAX 10 or Aurix microcontrollers, as FLEX 6000 is obsolete and not AEC-Q100 qualified.
Recommandé
Military / Aerospace Subsystem Logic
The EPF6024ATI144-3's -40C to +85C industrial operating range and high logic density support legacy military/aerospace subsystems such as avionics data concentrators, mission-computer interface cards, and signal-conditioning modules. Its 1960 LEs allow multiple MIL-STD-1553 / ARINC 429 monitor channels, redundant bus arbiters, and discrete-signal handlers in a single device. The SRAM architecture enables mission-specific configuration loading on every power-up, supporting rapid platform upgrades. Designers should consult Altera/Intel PSG's last-time-buy and Hi-Rel screening notes for any new aerospace program, as FLEX 6000 is obsolete.
Recommandé
Legacy Test & Measurement Instrumentation
The EPF6024ATI144-3 is suitable for retrofitting or maintaining legacy T&M instruments (oscilloscopes, logic analyzers, protocol analyzers) where it performs timing generation, channel multiplexing, and front-end state-machine control. With 117 I/Os it directly drives LCD interfaces, keyboard scanners, and front-panel LEDs without external drivers. Its 3.3V core and 5V-tolerant I/O integrate with legacy 5V analog front-ends. Designers benefit from the FLEX 6000 family's deterministic timing, which simplifies instrument calibration. For new designs, consider Cyclone IV or MAX 10 to ensure long-term part availability.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATI144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144-3 | EPF6024ATC144-3N | EPF6024ATC144-3S | EPF6024ATC144-4 | EPF6024ATC144-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Logic Elements | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 (fastest) | -3 | -3 | -3 | -4 (slower ~15%) | -2 |
| Operating Temperature | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| VCCINT | 3.3V | 3.3V | 3.3V | 3.3V | 3.3V | 3.3V |
| EABs (RAM bits) | 4 (8192 bits) | 4 (8192 bits) | 4 (8192 bits) | 4 (8192 bits) | 4 (8192 bits) | 4 (8192 bits) |
| Lifecycle Status | Obsolete (Last Time Buy) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Speed grade -3 is the fastest in FLEX 6000 family (vs EPF6024ATC144-4 (speed grade -4))
- Industrial -40C to +85C operating temperature (vs EPF6024ATC144-3 (commercial 0C to +70C))
- 117 user I/Os in 144-TQFP package (vs EPF6010TC144-3 (71 I/Os in same 144-TQFP))
Notes de conception
Estimated: at 3.3V VCCINT with all 117 I/Os toggling at 50 MHz, ICCINT can reach 80-120 mA in worst case. Place 0.1uF decoupling ceramic capacitors within 5 mm of every VCCINT pin (4 pins total) and a single bulk 47-100uF tantalum or aluminum polymer capacitor near the device. VCCIO banks (1-4) should each have their own 0.1uF + 10uF decoupling pair, especially when mixing 5V and 3.3V interfaces. Verify VCCINT/VCCIO power-up sequencing: VCCIO must not exceed VCCINT by more than 0.7V during ramp per FLEX 6000 datasheet to avoid latchup.
Route all four dedicated clock pins (CLK0, CLK1, plus global clocks) using impedance-controlled 50-ohm microstrip or stripline. Keep configuration-related pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0, MSEL1) away from switching I/O to avoid coupling during configuration. The 144-pin TQFP at 0.5mm pitch requires reflow profile compatible with JEDEC J-STD-020 MSL2/3; ensure the part is baked per moisture sensitivity level before assembly.
Critical pitfalls for FLEX 6000 designs: (1) A configuration EEPROM (EPC1, EPC2, or compatible) MUST be present or the device will not configure - SRAM is volatile; (2) nCONFIG must be held low during VCCINT ramp per datasheet; (3) JTAG chain order must place EPF6024 between TDI/TDO with TCK buffered if chain length exceeds 6 inches; (4) Do not exceed VCCIO of 5.25V or VCCINT of 3.6V; (5) For multi-voltage designs, ensure VCCIO bank voltage matches the external device - mixing 5V and 2.5V in same bank will damage the I/O cells.
The 144-TQFP package requires a thermal pad (not exposed, but copper pour on top layer is recommended). Ground plane should be solid on layer 2 under the device for high-speed signal return paths. JTAG signals (TCK/TMS/TDI/TDO) should be routed together with a 10k pull-up on TCK as recommended. CONF_DONE requires an external 10k pull-up to VCCIO; nSTATUS and nCONFIG also need 10k pull-ups. Place the configuration EEPROM within 100 mm of the EPF6024 to keep JTAG signal integrity.
Informations de conformité
EPF6024ATI144-3 launched before RoHS mandate. Intel PSG did not provide a RoHS declaration for this obsolete part; check broker lot date codes and material declarations. Not AEC-Q100 qualified - automotive deployments require migration to MAX 10 10M02 or Cyclone IV with AEC-Q100 grading.