NXP Semiconductors

LPC1766FBD100K - 100MHz ARM Cortex-M3 256KB LQFP-100 | NXP

Артикул: LPC1766FBD100K ✓ Активен
100-LQFP, 14 mm x 14 mm Package 100 MHz Speed 256 KB Memory
MOQ: 1 |

LPC1766FBD100K Обзор

The NXP LPC1766FBD100K is a 32-bit ARM Cortex-M3 microcontroller operating at up to 100 MHz, with 256 KB of embedded flash memory, 64 KB of SRAM, Ethernet MAC, USB Device/Host/OTG connectivity, and an LQFP-100 package measuring 14 mm by 14 mm. The part combines a high-performance Cortex-M3 core with integrated communications, analog, timing, and motor-control peripherals for embedded industrial, networking, and consumer systems.

An ARM Cortex-M3 microcontroller is a 32-bit reduced-instruction-set processor designed for embedded control. The Cortex-M3 core uses the Thumb-2 instruction set and provides deterministic interrupt handling, while integrated flash, SRAM, peripherals, and communication interfaces reduce system complexity. The LPC1766 belongs to the NXP LPC17xx microcontroller family, combining an ARM processor core with Ethernet, USB, CAN, serial, analog, and timer resources.

The LPC1766FBD100K provides 256 KB of flash memory and 64 KB of data memory for code and working data. Its integrated Ethernet MAC supports network-connected equipment, while USB Device, Host, and OTG operation supports peripheral connectivity, USB storage, and host applications. The device also includes an 8-channel DMA controller, four UARTs, two CAN channels, three SSP/SPI interfaces, three I2C interfaces, I2S support, an 8-channel 12-bit ADC, a 10-bit DAC, and motor-control PWM resources.

The 100 MHz Cortex-M3 core provides a practical balance of processing performance, memory capacity, and peripheral integration. It is suited to applications requiring multiple communication protocols, mixed analog and digital functions, or deterministic control without requiring a separate Ethernet controller, USB interface, or analog conversion system. The eight-channel ADC and motor-control PWM blocks are particularly useful in monitoring and actuator-control designs.

Typical uses include industrial Ethernet gateways, USB-to-serial data loggers, CAN-based industrial controllers, networked measurement equipment, motor-control systems, audio equipment using I2S, and connected consumer products. The LQFP-100 package provides exposed component leads and works with conventional reflow and inspection processes, while its 100-pin count supports the large number of communications and control functions.

Designers should use the manufacturer datasheet and pin-description tables when assigning PCB tracks, configuring peripheral multiplexing, and selecting decoupling. Verify the operating voltage, clock configuration, Ethernet PHY integration, USB transceiver requirements, and unused-pin treatment against the device documentation before releasing a layout. The LQFP-100 footprint also requires adequate thermal copper and assembly clearance because of its relatively large lead frame.

Аналоги без доработки для LPC1766FBD100K — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

LPC1766FBD100,551

✅ Прямая замена
📦 100-LQFP (14 x 14 mm)
Same device and pin configuration; packing changes from tray to brick, with 0 MHz core-frequency difference and identical 256 KB flash class

📋 Справочный аналог (нет в каталоге)

LPC1766FBD100K Максимальные параметры и электрические характеристики

Product Type 32-bit ARM Cortex-M3 microcontroller
Core ARM Cortex-M3
Максимальная тактовая частота 100 MHz
Flash Memory 256 KB
SRAM 64 KB
Ethernet MAC Integrated Ethernet MAC
USB Support USB Device, Host, and OTG
DMA Controller 8 channels
UART Interfaces 4 channels
CAN Interfaces 2 channels
SSP/SPI Interfaces 3 channels
I2C Interfaces 3 channels
ADC 8-channel, 12-bit
DAC 10-bit
PWM Motor-control PWM
I2S Support Integrated I2S interface
Корпус 100-LQFP, 14 mm x 14 mm
Тип монтажа Surface mount

Руководство по цоколевке LPC1766FBD100K в корпусе 100-lqfp, 14 mm x 14 mm

Цоколевка для LPC1766FBD100K (корпус 100-lqfp, 14 mm x 14 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 100-lqfp, 14 mm x 14 mm для LPC1766FBD100K

Нет подробных данных о распиновке для LPC1766FBD100K.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

LPC1766FBD100K подходит для 6 применениеs: Industrial Ethernet Gateway, USB Data Logger, CAN-Based Industrial Controller, Precision Measurement Instrument, Motor Control and Monitoring, Networked Audio and I2S Equipment.

🏭

Industrial Ethernet Gateway

The LPC1766FBD100K fits industrial Ethernet gateways because its 100 MHz Cortex-M3 core can supervise protocols while the integrated Ethernet MAC handles network traffic. Its 256 KB of flash supports gateway firmware, while 64 KB of SRAM accommodates protocol state and packet buffering. Four UARTs, two CAN channels, three I2C interfaces, and three SSP/SPI interfaces provide local sensor and actuator connectivity. The LQFP-100 package also exposes the required communications and control pins without requiring a very large board.

🖥️

USB Data Logger

The LPC1766FBD100K is appropriate for a USB data logger because it supports USB Device, Host, and OTG alongside four UARTs and an eight-channel 12-bit ADC. The 100 MHz core can format collected measurements, while DMA helps move data efficiently between memory and peripherals. Its 256 KB flash stores application firmware and calibration tables, and 64 KB of SRAM supports temporary acquisition buffers. External memory can be added when long-term storage requirements exceed the internal resources.

🏭

CAN-Based Industrial Controller

The LPC1766FBD100K supports CAN-based industrial control with two CAN channels, three I2C interfaces, three SSP/SPI interfaces, and motor-control PWM. The 100 MHz Cortex-M3 core provides computational capacity for control logic, and the eight-channel 12-bit ADC supports analog feedback from sensors or power stages. An external CAN transceiver is still required for physical-layer communication, but the MCU integrates the protocol interface and firmware-facing peripherals in one package.

📡

Precision Measurement Instrument

The LPC1766FBD100K suits precision measurement instruments that combine analog acquisition with network or serial data transfer. Its eight-channel 12-bit ADC supports multi-channel sensor measurement, while the 10-bit DAC can provide a basic control or reference output. Four UARTs and three SSP/SPI interfaces connect displays, storage devices, and precision converters, while the Ethernet MAC and USB OTG capability support configuration and data export. The 100 MHz core performs filtering and calibration without requiring a separate DSP.

⚡

Motor Control and Monitoring

The LPC1766FBD100K fits motor-control and monitoring designs because it combines motor-control PWM, an eight-channel 12-bit ADC, DMA, and a 100 MHz Cortex-M3 core. PWM outputs can command motor drivers or power stages, while ADC channels can monitor current, position, temperature, or supply feedback. Two CAN channels support distributed control, and the Ethernet MAC enables diagnostics to a supervisory system. The external power stage and isolation strategy remain application-specific design choices.

🎧

Networked Audio and I2S Equipment

The LPC1766FBD100K can support networked audio equipment because it integrates I2S, Ethernet MAC, USB Device or Host, and multiple serial interfaces. The 100 MHz Cortex-M3 core can manage control traffic and audio configuration, while 64 KB of SRAM supports short audio frames, protocol buffers, and control state. USB and Ethernet provide separate paths for local computer connectivity and network control. Audio-clock routing and peripheral multiplexing should be checked against the device pin table before layout approval.

What is the LPC1766FBD100K?
The LPC1766FBD100K is a 32-bit ARM Cortex-M3 microcontroller from NXP Semiconductors, operating at up to 100 MHz with 256 KB of flash memory and 64 KB of SRAM. It integrates Ethernet MAC, USB Device, Host, and OTG, eight-channel DMA, four UARTs, two CAN channels, three SSP/SPI interfaces, three I2C interfaces, an eight-channel 12-bit ADC, a 10-bit DAC, and motor-control PWM in a 100-LQFP package.
What are the key specifications of LPC1766FBD100K that engineers should know?
The main LPC1766FBD100K specifications are a 100 MHz ARM Cortex-M3 core, 256 KB of flash memory, 64 KB of SRAM, and an LQFP-100 package measuring 14 mm by 14 mm. Connectivity includes Ethernet MAC, USB Device/Host/OTG, four UARTs, two CAN channels, three SSP/SPI interfaces, three I2C interfaces, and I2S. According to the NXP product information, the device also includes an 8-channel 12-bit ADC, a 10-bit DAC, eight DMA channels, and motor-control PWM.
Where can I find the LPC1766FBD100K datasheet and pinout?
The official LPC1766FBD100K product page is the primary starting point for datasheet, technical documentation, and package information. Use the manufacturer datasheet and its pin-description table when assigning tracks on the 100-LQFP footprint, especially for multiplexed pins, power supplies, ground connections, and analog inputs. The product-page search result identifies the LPC1766 as a 100 MHz Cortex-M3 device with 256 KB flash and 64 KB data memory.
How much flash and SRAM does the LPC1766FBD100K have?
The LPC1766FBD100K contains 256 KB of flash memory and 64 KB of SRAM. Flash provides nonvolatile storage for firmware and constant data, while SRAM supports working memory, stack space, Ethernet buffers, DMA transfers, and other runtime operations. NXP describes the device as an LPC1766 Cortex-M3 microcontroller with 256 kB of flash memory and 64 kB of data memory.
What communications interfaces are available on the LPC1766FBD100K?
The LPC1766FBD100K provides Ethernet MAC, USB Device, USB Host, USB OTG, four UARTs, two CAN channels, three SSP/SPI interfaces, three I2C interfaces, and I2S support. These interfaces make the microcontroller suitable for gateways, data loggers, industrial controllers, audio equipment, and USB peripherals. The NXP product information identifies the Ethernet, USB, CAN, serial, and I2S resources directly.
Is LPC1766FBD100K suitable for industrial Ethernet equipment?
The LPC1766FBD100K is suitable for industrial Ethernet equipment because it combines a 100 MHz Cortex-M3 core with an integrated Ethernet MAC, 256 KB of flash, and 64 KB of SRAM. Four UARTs, two CAN channels, three I2C interfaces, and three SSP/SPI interfaces allow it to coordinate local sensors and actuators with an Ethernet uplink. Confirm the required Ethernet PHY, isolation, magnetics, and connector implementation in the system design.
Can the LPC1766FBD100K be used for motor-control applications?
Yes, the LPC1766FBD100K includes motor-control PWM and an eight-channel 12-bit ADC, making it appropriate for sensing and closed-loop actuator control. Its 100 MHz Cortex-M3 core can execute control algorithms while the DMA controller transfers data without excessive CPU involvement. Pin multiplexing, timer channels, ADC inputs, and motor-driver interfaces must be assigned from the manufacturer pin-description tables.
What is the difference between LPC1766FBD100K and LPC1768FBD100K?
The LPC1766FBD100K provides 256 KB of flash memory, while the LPC1768FBD100K provides 512 KB. Both are described as 100 MHz ARM Cortex-M3 LPC17xx microcontrollers with 64 KB of SRAM and a 100-LQFP 14 mm by 14 mm package. The larger flash capacity of the LPC1768 may benefit firmware-heavy applications, but the larger memory should be checked against the design requirement and software constraints.
When should I choose LPC1766FBD100K instead of LPC1768FBD100K?
Choose the LPC1766FBD100K when 256 KB of flash is sufficient and the design does not require the additional flash memory of the 512 KB LPC1768FBD100K. Both devices use the same Cortex-M3 architecture, 100 MHz operating frequency, 64 KB SRAM class, and 100-LQFP package family. If firmware growth, dual-bank update, image storage, or complex connectivity code makes 256 KB restrictive, evaluate the LPC1768 instead.
What can replace LPC1766FBD100K?
The LPC1766FBD100,551 is the documented same-chip replacement for the LPC1766FBD100K. NXP community guidance identifies the change as a packing-format change from tray to brick, with the same device inside, so existing firmware and board-level pin assignments remain unchanged. Verify reel or tape orientation, moisture handling, and production packing requirements before substituting the suffix.
Is LPC1766FBD100,551 a drop-in replacement for LPC1766FBD100K?
The LPC1766FBD100,551 is a same-chip, pin-compatible replacement for the LPC1766FBD100K, with the documented difference being tray versus brick packing format. Because the internal device is the same, firmware reuse is expected. A replacement should still pass the normal production checks for pin compatibility, clock startup, peripheral configuration, and assembly orientation.
Where can I buy LPC1766FBD100K and check current lead time?
Use the Request a Quote form on this page to request LPC1766FBD100K availability, current lead time, and a quotation for the required quantity and packaging. The manufacturer and distributor listings identify the device as an ARM Cortex-M3 MCU with 256 KB flash, 64 KB SRAM, Ethernet, USB, and an LQFP-100 package. Confirm the exact suffix and delivery format with the supplier before placing an order.
What is the price of LPC1766FBD100K?
Use the Request a Quote form on this page for the current LPC1766FBD100K quotation and quantity breaks. Market pricing can vary with order quantity, packaging, date, and supply conditions, so a static price should not be treated as a current purchasing commitment. Include the target quantity, reel or tray requirement, and delivery location in the request.
Is LPC1766FBD100K in stock?
Current LPC1766FBD100K stock should be confirmed through the Request a Quote form on this page. The part is an active NXP microcontroller with an LQFP-100 package, but inventory can change between quotation events. Specify the required quantity, packing method, date of need, and approved manufacturer or authorized-channel requirements in the request.
Does LPC1766FBD100K support RoHS and automotive qualification?
RoHS status and automotive qualification should be confirmed from the current NXP product documentation or declaration for the exact LPC1766FBD100K orderable part. The available product information identifies the device as a general-purpose Cortex-M3 microcontroller but does not establish an AEC-Q100 qualification for this suffix. Do not infer automotive qualification from the Cortex-M3 architecture or from a similarly named family member.

Справочные инженерные данные для LPC1766FBD100K — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the LPC1766FBD100K for embedded systems that need a 100 MHz Cortex-M3 core, 256 KB of flash, 64 KB of SRAM, and extensive connectivity in one LQFP-100 device. It is particularly attractive for Ethernet gateways, CAN controllers, USB data loggers, and measurement equipment that need both serial interfaces and analog conversion. Select the LPC1766FBD100,551 when the device is electrically identical and tray packaging is the required production format. Choose the LPC1768FBD100K only when 512 KB of flash provides a meaningful design advantage, such as larger firmware images or more complex update logic. The LPC1768 retains the same broad family architecture and package format, so its larger memory should be justified by software requirements rather than by an assumed pinout change.

Сравнение с аналогами

Параметр Этот товар LPC1766FBD100,551
Brand NXP Semiconductors NXP Semiconductors
Package 100-LQFP (14 x 14 mm) 100-LQFP (14 x 14 mm)
Core ARM Cortex-M3 ARM Cortex-M3
Maximum Clock Frequency 100 MHz 100 MHz
Flash Memory 256 KB 256 KB
SRAM 64 KB 64 KB
Connectivity Ethernet MAC, USB Device/Host/OTG, 4 UART, 2 CAN, 3 SSP/SPI, 3 I2C, I2S Ethernet MAC, USB Device/Host/OTG, 4 UART, 2 CAN, 3 SSP/SPI, 3 I2C, I2S
Packing Difference Brick packing Tray packing; same device inside
Firmware Compatibility LPC1766 Cortex-M3 application firmware Same device; existing firmware expected to remain compatible
Analog and Control Resources 8-channel 12-bit ADC, 10-bit DAC, motor-control PWM 8-channel 12-bit ADC, 10-bit DAC, motor-control PWM

Ключевые отличия

  • Same-chip replacement path (против LPC1766FBD100,551)
  • High peripheral integration (против LPC1766FBD100,551)
  • Clearer selection against the higher-flash family member (против LPC1768FBD100K)

Заметки по проектированию

Use the manufacturer pin-description table to assign the 100-LQFP footprint and verify every multiplexed peripheral signal. Place decoupling capacitors close to the supply pins, provide adequate ground-plane continuity, and route high-speed clock and communication lines away from analog inputs. Confirm the exposed or non-exposed thermal-pad arrangement, solder mask, and copper recommendations for the exact package drawing.

Plan the power tree around the LPC1766's supply and I/O voltage requirements, including startup current and any Ethernet, USB, or external transceiver loads. Use the manufacturer's recommended supply sequencing and decoupling configuration rather than treating the digital core, analog circuits, and I/O rails as one unrestricted rail. Verify voltage tolerance, ground references, and analog input limits against the datasheet before connecting external modules.

Keep the 100 MHz clock route short and controlled, follow the recommended source and load topology, and provide solid return paths beneath high-speed signals. Ethernet and USB interfaces are sensitive to reference-plane discontinuities and noisy return currents; keep their physical-layer support components close to the controller or transceiver where the application architecture requires it. Perform signal-integrity and EMC checks after the final stack-up is selected.

Do not assume that a similarly named LPC1766 orderable code is electrically and logistically identical. The LPC1766FBD100,551 is documented as the same device in a different packing format, while LPC1768FBD100K increases flash from 256 KB to 512 KB. Confirm the exact suffix, package, memory configuration, startup behavior, and production packing requirements before substitution or redesign.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

Compliance declarations for the exact LPC1766FBD100K orderable part were not identified in the available manufacturer and distributor information. Automotive qualification must not be inferred from the Cortex-M3 core or family name.

Данные проверены: 2026-11-04 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors LPC1766FBD100K LPC1766FBD100,551 LPC1768FBD100K ARM Cortex-M3 LPC17xx microcontroller 32-bit microcontroller embedded processor semiconductor Thumb-2 instruction set Ethernet MAC USB Device USB Host USB OTG DMA controller UART CAN SSP/SPI I2C I2S 12-bit ADC 10-bit DAC motor-control PWM 100-LQFP package
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