MC33FS6520NAE - 2.2A Vcore SBC with CAN FD | NXP
Артикул: MC33FS6520NAE ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC33FS6520NAE Обзор
A system basis chip is a mixed-signal power-management and communication IC placed beside an automotive microcontroller. In the device hierarchy, an SBC sits above DC/DC converters, linear regulators, wake logic, diagnostics, and vehicle-network transceivers. Rather than distributing every rail, control function, and network interface across separate components, the FS6500 consolidates them near the MCU to simplify design, reduce board area, and support deterministic power management.
The verified data identifies a 2.2 A Vcore regulator, a system basis chip architecture, advanced functional-safety measures targeting ASIL B/D systems, SPI control and diagnostics, and CAN FD/LIN physical interfaces. Other independent results identify moisture sensitivity level 3, a 40-second maximum time at peak reflow temperature, a 260°C peak reflow temperature, and AEC-Q100 screening. These details matter because automotive electronics must combine electrical performance with controlled assembly and production screening.
The device is intended for automotive embedded systems in which an MCU needs several regulated rails, low-power operating modes, network wake-up, diagnostic access, and safety monitoring. Integrating the MCU power subsystem and vehicle-network interfaces can reduce duplication while giving the host processor a centralized control path. SPI configuration supports firmware-controlled sequencing and diagnostics, while functional-safety features support systems designed around ISO 26262 objectives.
Typical uses include body controllers, gateway platforms, comfort systems, powertrain-adjacent controllers, and distributed electronic control units. The CAN FD interface suits high-bandwidth vehicle backbones, while LIN supports lower-cost peripheral networks. Exact voltage ranges, regulator outputs, pin functions, electrical limits, and package dimensions must be confirmed in the manufacturer datasheet before schematic or layout release.
Designers should preserve the exposed-pad thermal path, place high-current and communications circuitry according to the manufacturer layout guidance, and validate startup, undervoltage, fault-response, and network behavior in the final vehicle environment. Automotive qualification does not remove the need for system-level ISO 26262 work or EMC validation.
This page consolidates verified manufacturer and distributor information, including package, regulator class, communications support, lifecycle status, purchasing references, and practical qualification considerations. It also identifies missing numeric data explicitly rather than estimating unverified electrical limits.
Аналоги без доработки для MC33FS6520NAE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MC33FS6520LAE
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC33FS6520NAE Максимальные параметры и электрические характеристики
| Product Type | System basis chip (SBC) |
| Product Family | FS6500 |
| Статус жизненного цикла | Active |
| Vcore DC/DC Converter Current | 2.2 A |
| Корпус | 48-HLQFP, 7 mm × 7 mm |
| Тип монтажа | Surface mount |
| Power Conversion Features | DC/DC switching regulators and linear regulators |
| Host Processor Interface | SPI |
| Diagnostic Interface | SPI control and diagnostics |
| High-Speed Network Interface | CAN FD |
| Low-Speed Network Interface | LIN physical interface |
| Functional Safety Target | ASIL B/D applications |
| Energy Modes | Ultra-low-power saving modes |
| Moisture Sensitivity Level | MSL 3 |
| Screening Level | AEC-Q100 |
| Maximum Time at Peak Reflow Temperature | 40 s |
| Peak Reflow Temperature | 260°C |
Руководство по цоколевке MC33FS6520NAE в корпусе 48-hlqfp, 7 mm × 7 mm
Цоколевка для MC33FS6520NAE (корпус 48-hlqfp, 7 mm × 7 mm). Этот силовой прибор имеет выводы затвора, стока и истока. Для неполяризованных корпусов обратитесь к техническому описанию производителя для точной ориентации вывода 1 и деталей посадочного места. Типичные применения включают проектирование источников питания, управление двигателями и коммутацию нагрузки.
Нет подробных данных о распиновке для MC33FS6520NAE.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MC33FS6520NAE подходит для 6 применениеs: Automotive Body Control Unit, Automotive Gateway Platform, Distributed ECU Power Supply, Comfort and Convenience Controller, Powertrain-Adjacent Controller, Automotive Communication Hub.
Automotive Body Control Unit
MC33FS6520NAE fits an automotive body controller that requires an MCU rail, several regulated outputs, diagnostics, low-power states, and vehicle-network connectivity. The verified 2.2 A Vcore DC/DC converter provides the central processor supply, while SPI control allows firmware configuration and health monitoring. CAN FD supports high-bandwidth backbones and LIN supports lower-cost peripherals. Place local input, Vcore, and output capacitors at the datasheet-specified pins and preserve thermal copper beneath the exposed pad. Actual rail sequencing, current margin, and ASIL allocation must be verified from the NXP documentation.
Рекомендуется
Automotive Gateway Platform
MC33FS6520NAE is appropriate for a gateway that bridges CAN FD and LIN domains while supplying the controlling MCU. Its integrated 2.2 A Vcore converter consolidates a principal processor rail into the same 48-HLQFP device used for communications and diagnostics. The CAN FD transceiver supports high-rate backbone traffic, whereas LIN handles lower-bandwidth nodes. SPI diagnostics give the gateway processor a control path for configuration and fault handling. Layout must isolate switching-current paths from communication return currents and be validated against the module enclosure, harness, ESD, and vehicle EMC environment.
Рекомендуется
Distributed ECU Power Supply
MC33FS6520NAE can anchor the power and communication subsystem of a distributed electronic control unit. Its 2.2 A Vcore converter supplies the local MCU, integrated regulators distribute other required rails, and ultra-low-power saving modes support sleep-oriented body or comfort functions. SPI-based diagnostics allow centralized fault monitoring, while CAN FD and LIN provide network attachment without separate physical-layer transceivers. The exposed pad in the 48-HLQFP package requires uninterrupted thermal copper; engineer startup, undervoltage behavior, output discharge, and load transients from the manufacturer data before production release.
Рекомендуется
Comfort and Convenience Controller
MC33FS6520NAE fits comfort-system controllers that combine MCU processing, deterministic rail control, network wake-up, and low-energy operation. The 2.2 A Vcore converter provides headroom for the processor domain, while the linear regulators support auxiliary loads identified by the complete design. LIN is well matched to distributed switches, sensors, and seat or climate peripherals, and CAN FD can connect the controller to a higher-speed vehicle backbone. SPI access supports configuration and diagnostics. Firmware must validate every sleep transition, wake source, rail state, and fault report rather than treating the integrated functions as independent blocks.
Рекомендуется
Powertrain-Adjacent Controller
MC33FS6520NAE can support a powertrain-adjacent controller when its exact electrical limits and safety evidence satisfy the system requirements. Its 2.2 A Vcore regulator, SPI diagnostics, low-power controls, and CAN FD/LIN integration consolidate several subsystem functions. The part's verified information targets advanced functional-safety measures for ASIL B/D applications, but that statement does not by itself qualify every application. Hardware and software teams must build an ISO 26262 safety case, analyze freedom from interference, verify diagnostic coverage, and complete environmental, EMC, and fault-injection testing before deployment near propulsion systems.
Рекомендуется
Automotive Communication Hub
MC33FS6520NAE suits a compact communication hub requiring local processor power and both CAN FD and LIN connectivity. Its 48-HLQFP package integrates the 2.2 A switching Vcore regulator, linear regulators, transceivers, and diagnostic control into one device. The hub processor can use SPI to configure operating parameters and read fault information. Preserve short high-current supply loops, use manufacturer-recommended transceiver layout, and provide unobstructed ground paths beneath the package. Network timing, termination, ESD immunity, bus loading, and electromagnetic compatibility must be verified in the complete harness and enclosure rather than from bench conditions alone.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MC33FS6520NAE — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MC33FS6520LAE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Package | 48-HLQFP (7x7) | 48-HLQFP (7x7) |
| Product Family | FS6500 | FS65 system basis chip family |
| Host Interface | SPI control and diagnostics | SPI control and diagnostics |
| Vehicle Network Interfaces | CAN FD and LIN physical interfaces | CAN FD and LIN physical interfaces |
| Functional Safety Positioning | Advanced measures targeting ASIL B/D applications | Advanced measures targeting ASIL B/D applications |
| Power Modes | Ultra-low-power saving modes | Ultra-low-power saving modes |
Ключевые отличия
- Centralized FS6500 subsystem integration (против Discrete power and communication components)
- Automotive functional-safety positioning (против MC33FS6520LAE)
- Integrated dual vehicle-network support (против Separate CAN FD and LIN transceiver solutions)
- Confirmed active sourcing (против Obsolete or unclear-lifecycle alternatives)
Заметки по проектированию
The 48-HLQFP package includes an exposed thermal area according to the verified distributor description. Preserve a continuous ground or thermal-copper region beneath the pad, add thermal vias where recommended by NXP, and avoid placing temperature-sensitive or mechanically constrained components nearby. Because verified thermal-resistance and junction-temperature limits were not supplied, calculate dissipation from the final input-output voltages, regulator efficiencies, and load profiles rather than estimating from nominal current alone.
Keep the 2.2 A Vcore switching loop physically compact by following the NXP application schematic and layout guidance for inductor, switching node, capacitor, and ground connections. Keep the high-current loop out of communication reference paths. Place input and output decoupling at the specified package pins, use low-ESR parts where called for, and keep CAN FD and LIN routing away from the switch node and inductor to minimize radiated and conducted coupling.
Do not infer interchangeability from the NAE and LAE suffixes. The supplied cross-reference data names MC33FS6520LAE as an FS65-family candidate but does not prove identical pinout, regulator settings, transceiver limits, or option content. Before substitution, compare the manufacturer ordering-information tables, package drawings, absolute-maximum ratings, electrical characteristics, safety metrics, and errata. A footprint match alone does not establish drop-in compatibility.
Use solid ground references, controlled trace geometry, manufacturer-recommended bus spacing, and the specified point of termination for CAN FD and LIN. Account for connector and harness effects in EMC and network timing tests. SPI traces between the MCU and SBC also require a deliberate return path and reviewed clock levels; the retrieved sources identify SPI support but do not provide rise-time, capacitance, or isolation limits, so those values require the datasheet.
Информация о соответствии
The verified product result identifies AEC-Q100 screening, MSL 3, a 260°C peak reflow temperature, and a 40-second maximum at peak reflow. The NXP page describes measures targeting ASIL B/D applications, but component-level and application-level ISO 26262 claims must be distinguished. RoHS, REACH, lead-free, halogen-free, and conflict-minerals evidence was not exposed.
