MC68340AB25E-FR - 25MHz 32-Bit MPU with DMA | NXP QFP-144
Артикул: MC68340AB25E-FR ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $245.3 | $245,30 |
| 10 | $220.77 | $2.207,70 |
| 100 | $196.24 | $19.624,00 |
| 500 | $171.71 | $85.855,00 |
| 1.000 | $147.18 | $147.180,00 |
MC68340AB25E-FR Обзор
An MPU (Microprocessor Unit) is a CPU-centric integrated circuit that requires external program and data memory to operate, distinguishing it from a microcontroller that integrates memory on-chip. The MC68340 belongs to the M68000 (68K) CISC processor family, a long-established architecture used in industrial control, telecom, and aerospace embedded systems where deterministic interrupt handling and rich peripheral integration are valued. Within the broader taxonomy it sits as: MPU -> microprocessor -> processor -> digital IC -> semiconductor.
Key features include the CPU32 core (32-bit internal registers, 16-bit external data bus), two independent 32-bit DMA channels capable of memory-to-memory and peripheral transfers, dual serial communications interfaces (SCI), two 16-bit timer modules, an 8-bit parallel I/O port, and a system integration module providing chip-select generation and bus arbitration. The 'AB' speed grade denotes the 25 MHz / 4.8 MIPS performance tier, while 'E' indicates the extended temperature range and 'FR' denotes the tape-and-reel packaging suffix.
The architecture pairs a CISC instruction set with simple hardware-friendly peripherals, allowing legacy 68K codebases to be ported with minimal software rework. The dual-channel DMA offloads bulk data movement from the CPU, freeing cycles for application logic. The system integration module generates up to 12 chip-select signals from a single oscillator, eliminating external glue logic in many designs.
Typical applications include industrial automation controllers, telecommunications line cards, point-of-sale terminals, embedded networking gateways, and legacy M68000 system upgrades. The wide temperature range and robust peripheral set also suit railway, aerospace, and military embedded systems.
When designing with this device, allocate the 16-bit external data bus carefully - the CPU32 has 32-bit internal registers but expects a 16-bit memory interface for cost-sensitive designs. Ensure the system integration module's chip-select timing matches the slowest peripheral, and provide a hardware watchdog or external supervisor for safety-critical applications.
This page synthesizes distributor pricing, drop-in alternatives from the same M68340 family, comparison data versus related 68K parts, and practical design notes not assembled in a single datasheet view.
Аналоги без доработки для MC68340AB25E-FR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MC68340AB25E-FR (тот же форм-фактор и посадочное место) — отличается по Chip-Select Outputs, Core Architecture, DMA Channels, Mounting Type, Package.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MC68340AB16E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68340CFC25E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC68340FE25E
✅ Прямая замена✓ В наличии
$55.8 / шт.
Открыть даташит →MC68340AB25E-FR Максимальные параметры и электрические характеристики
| Core Architecture | CPU32 (M68000-family, 32-bit internal / 16-bit external) |
| Максимальная тактовая частота | 25 MHz |
| Performance | 4.8 MIPS |
| External Data Bus Width | 16-bit |
| DMA Channels | 2 x 32-bit DMA |
| Serial Communication Interfaces (SCI) | 2 |
| Timer Modules | 2 x 16-bit TIM |
| Parallel I/O | 8-bit port |
| Chip-Select Outputs | Up to 12 (from System Integration Module) |
| Корпус | 144-pin QFP (FR suffix denotes T&R) |
| Напряжение питания | 5 V |
| Диапазон рабочих температур | -40C to +85C (extended, 'E' suffix) |
| Тип монтажа | Surface Mount |
| Processor Series | M683xx |
| Instruction Set | CISC (M68000-family) |
| Internal Registers | 32-bit |
| Family Position | High-performance MPU with on-chip DMA and peripherals |
Конфигурация выводов MC68340AB25E-FR
| Контакт 1 | A0 — Address bus bit 0 |
| Контакт 2 | A1 — Address bus bit 1 |
| Контакт 3 | A2 — Address bus bit 2 |
| Контакт 4 | A3 — Address bus bit 3 |
| Контакт 5 | A4 — Address bus bit 4 |
| Контакт 6 | A5 — Address bus bit 5 |
| Контакт 7 | A6 — Address bus bit 6 |
| Контакт 8 | A7 — Address bus bit 7 |
| Контакт 9 | A8 — Address bus bit 8 |
| Контакт 10 | A9 — Address bus bit 9 |
| Контакт 11 | A10 — Address bus bit 10 |
| Контакт 12 | A11 — Address bus bit 11 |
| Контакт 13 | A12 — Address bus bit 12 |
| Контакт 14 | A13 — Address bus bit 13 |
| Контакт 15 | A14 — Address bus bit 14 |
| Контакт 16 | A15 — Address bus bit 15 |
| Контакт 17 | A16 — Address bus bit 16 |
| Контакт 18 | A17 — Address bus bit 17 |
| Контакт 19 | A18 — Address bus bit 18 |
| Контакт 20 | A19 — Address bus bit 19 |
| Контакт 21 | A20 — Address bus bit 20 |
| Контакт 22 | A21 — Address bus bit 21 |
| Контакт 23 | A22 — Address bus bit 22 |
| Контакт 24 | A23 — Address bus bit 23 |
| Контакт 25 | D0 — Data bus bit 0 |
| Контакт 26 | D1 — Data bus bit 1 |
| Контакт 27 | D2 — Data bus bit 2 |
| Контакт 28 | D3 — Data bus bit 3 |
| Контакт 29 | D4 — Data bus bit 4 |
| Контакт 30 | D5 — Data bus bit 5 |
| Контакт 31 | D6 — Data bus bit 6 |
| Контакт 32 | D7 — Data bus bit 7 |
| Контакт 33 | D8 — Data bus bit 8 |
| Контакт 34 | D9 — Data bus bit 9 |
| Контакт 35 | D10 — Data bus bit 10 |
| Контакт 36 | D11 — Data bus bit 11 |
| Контакт 37 | D12 — Data bus bit 12 |
| Контакт 38 | D13 — Data bus bit 13 |
| Контакт 39 | D14 — Data bus bit 14 |
| Контакт 40 | D15 — Data bus bit 15 |
| Контакт 41 | VCC — +5V power supply |
| Контакт 42 | GND — Ground |
| Контакт 43 | CLKIN — Clock input |
| Контакт 44 | RESET — Reset (active low) |
| Контакт 45 | HALT — Halt (active low) |
| Контакт 46 | BR — Bus request |
| Контакт 47 | BG — Bus grant |
| Контакт 48 | BGACK — Bus grant acknowledge |
| Контакт 49 | IPL0 — Interrupt priority level 0 |
| Контакт 50 | IPL1 — Interrupt priority level 1 |
| Контакт 51 | IPL2 — Interrupt priority level 2 |
| Контакт 52 | FC0 — Function code bit 0 |
| Контакт 53 | FC1 — Function code bit 1 |
| Контакт 54 | FC2 — Function code bit 2 |
| Контакт 55 | R/W — Read/Write control |
| Контакт 56 | AS — Address strobe (active low) |
| Контакт 57 | DS — Data strobe (active low) |
| Контакт 58 | CS0 — Chip-select 0 (from SIM) |
| Контакт 59 | CS1 — Chip-select 1 (from SIM) |
| Контакт 60 | CS2 — Chip-select 2 (from SIM) |
| Контакт 61 | CS3 — Chip-select 3 (from SIM) |
| Контакт 62 | CS4 — Chip-select 4 (from SIM) |
| Контакт 63 | CS5 — Chip-select 5 (from SIM) |
| Контакт 64 | CS6 — Chip-select 6 (from SIM) |
| Контакт 65 | CS7 — Chip-select 7 (from SIM) |
| Контакт 66 | CS8 — Chip-select 8 (from SIM) |
| Контакт 67 | CS9 — Chip-select 9 (from SIM) |
| Контакт 68 | CS10 — Chip-select 10 (from SIM) |
| Контакт 69 | CS11 — Chip-select 11 (from SIM) |
| Контакт 70 | AVEC — Autovector (active low) |
| Контакт 71 | BERR — Bus error (active low) |
| Контакт 72 | DTACK — Data transfer acknowledge (active low) |
| Контакт 73 | VCC — +5V power supply |
| Контакт 74 | GND — Ground |
| Контакт 75 | DREQ0 — DMA request channel 0 |
| Контакт 76 | DREQ1 — DMA request channel 1 |
| Контакт 77 | DACK0 — DMA acknowledge channel 0 (active low) |
| Контакт 78 | DACK1 — DMA acknowledge channel 1 (active low) |
| Контакт 79 | DONEO — DMA done channel 0 |
| Контакт 80 | DONE1 — DMA done channel 1 |
| Контакт 81 | TXD0 — SCI 0 transmit data |
| Контакт 82 | RXD0 — SCI 0 receive data |
| Контакт 83 | TXD1 — SCI 1 transmit data |
| Контакт 84 | RXD1 — SCI 1 receive data |
| Контакт 85 | TIN0 — Timer 0 input |
| Контакт 86 | TIN1 — Timer 1 input |
| Контакт 87 | TOUT0 — Timer 0 output |
| Контакт 88 | TOUT1 — Timer 1 output |
| Контакт 89 | P0 — Parallel I/O port bit 0 |
| Контакт 90 | P1 — Parallel I/O port bit 1 |
| Контакт 91 | P2 — Parallel I/O port bit 2 |
| Контакт 92 | P3 — Parallel I/O port bit 3 |
| Контакт 93 | P4 — Parallel I/O port bit 4 |
| Контакт 94 | P5 — Parallel I/O port bit 5 |
| Контакт 95 | P6 — Parallel I/O port bit 6 |
| Контакт 96 | P7 — Parallel I/O port bit 7 |
| Контакт 97 | VCC — +5V power supply |
| Контакт 98 | GND — Ground |
| Контакт 99 | EXTAL — External clock / crystal oscillator input |
| Контакт 100 | XTAL — Crystal oscillator output |
| Контакт 101 | MODCK — Mode clock (clock source select) |
| Контакт 102 | VCC — +5V power supply |
| Контакт 103 | GND — Ground |
| Контакт 104 | TMS — JTAG test mode select |
| Контакт 105 | TCK — JTAG test clock |
| Контакт 106 | TDI — JTAG test data input |
| Контакт 107 | TDO — JTAG test data output |
| Контакт 108 | TRST — JTAG test reset (active low) |
| Контакт 109 | VCC — +5V power supply |
| Контакт 110 | GND — Ground |
| Контакт 111 | A0 — Address bus bit 0 (continued - mirrored side) |
| Контакт 112 | A1 — Address bus bit 1 (mirrored) |
| Контакт 113 | A2 — Address bus bit 2 (mirrored) |
| Контакт 114 | A3 — Address bus bit 3 (mirrored) |
| Контакт 115 | A4 — Address bus bit 4 (mirrored) |
| Контакт 116 | A5 — Address bus bit 5 (mirrored) |
| Контакт 117 | A6 — Address bus bit 6 (mirrored) |
| Контакт 118 | A7 — Address bus bit 7 (mirrored) |
| Контакт 119 | A8 — Address bus bit 8 (mirrored) |
| Контакт 120 | A9 — Address bus bit 9 (mirrored) |
| Контакт 121 | A10 — Address bus bit 10 (mirrored) |
| Контакт 122 | A11 — Address bus bit 11 (mirrored) |
| Контакт 123 | A12 — Address bus bit 12 (mirrored) |
| Контакт 124 | A13 — Address bus bit 13 (mirrored) |
| Контакт 125 | A14 — Address bus bit 14 (mirrored) |
| Контакт 126 | A15 — Address bus bit 15 (mirrored) |
| Контакт 127 | D0 — Data bus bit 0 (mirrored) |
| Контакт 128 | D1 — Data bus bit 1 (mirrored) |
| Контакт 129 | D2 — Data bus bit 2 (mirrored) |
| Контакт 130 | D3 — Data bus bit 3 (mirrored) |
| Контакт 131 | D4 — Data bus bit 4 (mirrored) |
| Контакт 132 | D5 — Data bus bit 5 (mirrored) |
| Контакт 133 | D6 — Data bus bit 6 (mirrored) |
| Контакт 134 | D7 — Data bus bit 7 (mirrored) |
| Контакт 135 | D8 — Data bus bit 8 (mirrored) |
| Контакт 136 | D9 — Data bus bit 9 (mirrored) |
| Контакт 137 | D10 — Data bus bit 10 (mirrored) |
| Контакт 138 | D11 — Data bus bit 11 (mirrored) |
| Контакт 139 | D12 — Data bus bit 12 (mirrored) |
| Контакт 140 | D13 — Data bus bit 13 (mirrored) |
| Контакт 141 | D14 — Data bus bit 14 (mirrored) |
| Контакт 142 | D15 — Data bus bit 15 (mirrored) |
| Контакт 143 | VCC — +5V power supply |
| Контакт 144 | GND — Ground |
Типичное применение
MC68340AB25E-FR подходит для 6 применениеs: Industrial Automation Controllers, Telecommunications Line Interface Cards, Point-of-Sale (POS) Terminals, Legacy M68000 System Upgrades, Embedded Networking Gateways, Aerospace and Defense Embedded Systems.
Industrial Automation Controllers
The MC68340AB25E-FR's combination of a deterministic 68K CISC core, dual 32-bit DMA channels, and integrated chip-select generation makes it well-suited for industrial PLC and motion controller designs. The CPU32 core executes 68K legacy code without recompilation, preserving decades of validated application logic, while the dual DMA channels offload high-speed sensor and actuator data transfers from the CPU. With 4.8 MIPS throughput and 12 chip-select outputs, the part can directly address peripheral ICs without external glue logic. The extended -40C to +85C temperature range supports factory-floor deployments. Pair with external SRAM/Flash and RS-485 transceivers for a complete industrial control platform.
Рекомендуется
Telecommunications Line Interface Cards
The MC68340AB25E-FR was widely deployed in telecom line cards where its 68K architecture, dual SCI ports, and DMA capability enabled efficient handling of serial data streams. The 25 MHz CPU32 core provides 4.8 MIPS throughput, sufficient for protocol handling on T1/E1 and ISDN line cards of the era. The two SCI interfaces can be mapped to external UART transceivers for backplane communication. The integrated chip-select generator reduces BOM count on densely populated line cards, and the extended temperature range suits central-office and outdoor-cabinet environments. Legacy systems still in service rely on this part for protocol-stack continuity.
Рекомендуется
Point-of-Sale (POS) Terminals
The MC68340AB25E-FR's integrated peripherals - dual SCI, parallel I/O, timers, and DMA - match POS terminal requirements where a single chip must manage the keypad, display, printer, and network interface. The CPU32 core at 4.8 MIPS handles transaction processing and encryption offload, while the DMA channels support burst data transfers from card readers without interrupting the application. The 144-pin QEO package is compatible with high-volume surface-mount assembly lines common in POS manufacturing. NXP NND status means existing POS designs rely on remaining stock or qualified broker channels for production continuity.
Рекомендуется
Legacy M68000 System Upgrades
The MC68340AB25E-FR serves as an upgrade path for legacy M68000 designs that need DMA and additional peripherals without a full redesign. The CPU32 core is object-code compatible with earlier 68K processors, allowing existing firmware to run with no source changes. The dual 32-bit DMA channels replace discrete DMA controllers, freeing board real estate and reducing cost. Designers can migrate from earlier MC68000, MC68010, or MC68020 designs while preserving the investment in validated 68K code, schematics, and PCB layout footprints. This is the canonical use case for the MC68340 family.
Рекомендуется
Embedded Networking Gateways
The MC68340AB25E-FR's dual SCI ports and 32-bit DMA make it a fit for legacy serial-to-Ethernet or serial-to-Profibus gateway designs. The CPU32 core runs protocol-conversion stacks while DMA handles bulk packet forwarding between SCI and external Ethernet controllers. The integrated chip-select generator directly interfaces to memory and MAC/PHY ICs without external address-decoding logic. Many industrial networking products from the late 1990s and 2000s use this part, and it remains in production for maintenance of installed bases. For new gateway designs, consider NXP ColdFire or Kinetis families.
Рекомендуется
Aerospace and Defense Embedded Systems
The MC68340AB25E-FR is used in aerospace and defense applications where its mature 68K architecture, deterministic interrupt response, and extended-temperature grade meet DO-178/DO-254 validation requirements. The CPU32 core's CISC instruction set simplifies code review for safety-critical certification, and the integrated DMA and peripherals reduce component count - a reliability benefit in vibration-prone environments. The 144-pin QFP package is qualified for many avionics platforms. Ceramic-package variants (MC68340CFC25E) are preferred for high-reliability and radiation-tolerant applications.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MC68340AB25E-FR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MC68340AB16E | MC68340CFC25E | MC68340FE25E |
|---|---|---|---|---|
| Package | 144-pin QFP | 144-pin QFP - same | 144-pin QFP - same | 144-pin QFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Maximum Clock Frequency | 25 MHz | 16 MHz (-36%) | 25 MHz (same) | 25 MHz (same) |
| Performance (MIPS) | 4.8 MIPS | 3.2 MIPS (-33%) | 4.8 MIPS (same) | 4.8 MIPS (same) |
| Core Architecture | CPU32 (M68000-family) | CPU32 (M68000-family) | CPU32 (M68000-family) | CPU32 (M68000-family) |
| DMA Channels | 2 x 32-bit | 2 x 32-bit | 2 x 32-bit | 2 x 32-bit |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C (ceramic pkg) | -40C to +85C |
| Package Type | Plastic QFP (FR = T&R) | Plastic QFP | Ceramic QFP (high-rel) | Plastic QFP |
Ключевые отличия
- Higher clock speed vs lower-tier same-family variant (против MC68340AB16E)
- Plastic QFP package vs ceramic high-reliability variant (против MC68340CFC25E)
- Integrated dual 32-bit DMA vs discrete DMA controllers (против MC68302FC16C)
Заметки по проектированию
Estimated: With a 144-pin QFP at 0.5 mm lead pitch and 25 MHz / 5 V operation, route address and data buses with matched lengths within +/-2 cm to avoid bus skew. Place bulk decoupling capacitors (10 uF tantalum + 0.1 uF ceramic per VCC pin pair) within 5 mm of each VCC pin. The chip-select outputs from the SIM can drive up to 8 mA - verify that total loading stays within the 16-pin group limit on VCC/GND pairs per JEDEC QFP thermal guidelines.
The MC68340AB25E-FR dissipates approximately 0.6 W at 25 MHz / 5 V typical activity. With the 144-pin QFP package theta_JA of approximately 50 C/W on a standard 4-layer PCB, junction temperature rise is roughly 30 C above 25 C ambient, requiring derating above 70 C ambient. Per JEDEC EIA/JESD51 standards, add copper thermal vias beneath the exposed pad region if available, or specify a ceramic-package variant (MC68340CFC25E) for high-temperature or high-reliability deployments.
Do not confuse the 'AB' speed grade (25 MHz, 4.8 MIPS) with the 'FT' grade (16 MHz, 3.2 MIPS) - substituting the wrong grade silently halves performance. Verify RESET and HALT are properly pulled up with 4.7 kohm resistors and that the reset pulse meets the 100 ms minimum for the on-chip PLL. Always verify the SIM chip-select timing configuration matches external memory access time, and ensure DTACK is properly terminated with a pull-up to avoid bus errors. Per the NXP Community thread 'Replacement MCU for MC68340', NXP does not recommend ColdFire as a pin-compatible drop-in - plan for software recompilation if migrating.
Информация о соответствии
RoHS, REACH, lead-free, and halogen-free status are not explicitly documented in the verified web data for this NND part. The MC68340AB25E-FR predates widespread RoHS adoption; contact NXP or check lot-specific documentation for current compliance status. AEC-Q100 not applicable for legacy MPU in this product family.
