MC68340AB25E-FR - 25MHz 32-Bit MPU with DMA | NXP QFP-144
Référence : MC68340AB25E-FR ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $245.3 | $245,30 |
| 10 | $220.77 | $2 207,70 |
| 100 | $196.24 | $19 624,00 |
| 500 | $171.71 | $85 855,00 |
| 1 000 | $147.18 | $147 180,00 |
MC68340AB25E-FR Présentation
An MPU (Microprocessor Unit) is a CPU-centric integrated circuit that requires external program and data memory to operate, distinguishing it from a microcontroller that integrates memory on-chip. The MC68340 belongs to the M68000 (68K) CISC processor family, a long-established architecture used in industrial control, telecom, and aerospace embedded systems where deterministic interrupt handling and rich peripheral integration are valued. Within the broader taxonomy it sits as: MPU -> microprocessor -> processor -> digital IC -> semiconductor.
Key features include the CPU32 core (32-bit internal registers, 16-bit external data bus), two independent 32-bit DMA channels capable of memory-to-memory and peripheral transfers, dual serial communications interfaces (SCI), two 16-bit timer modules, an 8-bit parallel I/O port, and a system integration module providing chip-select generation and bus arbitration. The 'AB' speed grade denotes the 25 MHz / 4.8 MIPS performance tier, while 'E' indicates the extended temperature range and 'FR' denotes the tape-and-reel packaging suffix.
The architecture pairs a CISC instruction set with simple hardware-friendly peripherals, allowing legacy 68K codebases to be ported with minimal software rework. The dual-channel DMA offloads bulk data movement from the CPU, freeing cycles for application logic. The system integration module generates up to 12 chip-select signals from a single oscillator, eliminating external glue logic in many designs.
Typical applications include industrial automation controllers, telecommunications line cards, point-of-sale terminals, embedded networking gateways, and legacy M68000 system upgrades. The wide temperature range and robust peripheral set also suit railway, aerospace, and military embedded systems.
When designing with this device, allocate the 16-bit external data bus carefully - the CPU32 has 32-bit internal registers but expects a 16-bit memory interface for cost-sensitive designs. Ensure the system integration module's chip-select timing matches the slowest peripheral, and provide a hardware watchdog or external supervisor for safety-critical applications.
This page synthesizes distributor pricing, drop-in alternatives from the same M68340 family, comparison data versus related 68K parts, and practical design notes not assembled in a single datasheet view.
Alternatives de remplacement direct pour MC68340AB25E-FR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC68340AB25E-FR (même facteur de forme et même empreinte) — différant par Chip-Select Outputs, Core Architecture, DMA Channels, Mounting Type, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68340AB16E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68340CFC25E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68340FE25E
✅ Remplacement direct✓ En stock
$55.8 / unité
Voir la fiche technique →MC68340AB25E-FR Valeurs maximales et caractéristiques électriques
| Core Architecture | CPU32 (M68000-family, 32-bit internal / 16-bit external) |
| Fréquence d'horloge maximale | 25 MHz |
| Performance | 4.8 MIPS |
| External Data Bus Width | 16-bit |
| DMA Channels | 2 x 32-bit DMA |
| Serial Communication Interfaces (SCI) | 2 |
| Timer Modules | 2 x 16-bit TIM |
| Parallel I/O | 8-bit port |
| Chip-Select Outputs | Up to 12 (from System Integration Module) |
| Boîtier | 144-pin QFP (FR suffix denotes T&R) |
| Tension d'alimentation | 5 V |
| Plage de température de fonctionnement | -40C to +85C (extended, 'E' suffix) |
| Type de montage | Surface Mount |
| Processor Series | M683xx |
| Instruction Set | CISC (M68000-family) |
| Internal Registers | 32-bit |
| Family Position | High-performance MPU with on-chip DMA and peripherals |
Configuration des broches de MC68340AB25E-FR
| Broche 1 | A0 — Address bus bit 0 |
| Broche 2 | A1 — Address bus bit 1 |
| Broche 3 | A2 — Address bus bit 2 |
| Broche 4 | A3 — Address bus bit 3 |
| Broche 5 | A4 — Address bus bit 4 |
| Broche 6 | A5 — Address bus bit 5 |
| Broche 7 | A6 — Address bus bit 6 |
| Broche 8 | A7 — Address bus bit 7 |
| Broche 9 | A8 — Address bus bit 8 |
| Broche 10 | A9 — Address bus bit 9 |
| Broche 11 | A10 — Address bus bit 10 |
| Broche 12 | A11 — Address bus bit 11 |
| Broche 13 | A12 — Address bus bit 12 |
| Broche 14 | A13 — Address bus bit 13 |
| Broche 15 | A14 — Address bus bit 14 |
| Broche 16 | A15 — Address bus bit 15 |
| Broche 17 | A16 — Address bus bit 16 |
| Broche 18 | A17 — Address bus bit 17 |
| Broche 19 | A18 — Address bus bit 18 |
| Broche 20 | A19 — Address bus bit 19 |
| Broche 21 | A20 — Address bus bit 20 |
| Broche 22 | A21 — Address bus bit 21 |
| Broche 23 | A22 — Address bus bit 22 |
| Broche 24 | A23 — Address bus bit 23 |
| Broche 25 | D0 — Data bus bit 0 |
| Broche 26 | D1 — Data bus bit 1 |
| Broche 27 | D2 — Data bus bit 2 |
| Broche 28 | D3 — Data bus bit 3 |
| Broche 29 | D4 — Data bus bit 4 |
| Broche 30 | D5 — Data bus bit 5 |
| Broche 31 | D6 — Data bus bit 6 |
| Broche 32 | D7 — Data bus bit 7 |
| Broche 33 | D8 — Data bus bit 8 |
| Broche 34 | D9 — Data bus bit 9 |
| Broche 35 | D10 — Data bus bit 10 |
| Broche 36 | D11 — Data bus bit 11 |
| Broche 37 | D12 — Data bus bit 12 |
| Broche 38 | D13 — Data bus bit 13 |
| Broche 39 | D14 — Data bus bit 14 |
| Broche 40 | D15 — Data bus bit 15 |
| Broche 41 | VCC — +5V power supply |
| Broche 42 | GND — Ground |
| Broche 43 | CLKIN — Clock input |
| Broche 44 | RESET — Reset (active low) |
| Broche 45 | HALT — Halt (active low) |
| Broche 46 | BR — Bus request |
| Broche 47 | BG — Bus grant |
| Broche 48 | BGACK — Bus grant acknowledge |
| Broche 49 | IPL0 — Interrupt priority level 0 |
| Broche 50 | IPL1 — Interrupt priority level 1 |
| Broche 51 | IPL2 — Interrupt priority level 2 |
| Broche 52 | FC0 — Function code bit 0 |
| Broche 53 | FC1 — Function code bit 1 |
| Broche 54 | FC2 — Function code bit 2 |
| Broche 55 | R/W — Read/Write control |
| Broche 56 | AS — Address strobe (active low) |
| Broche 57 | DS — Data strobe (active low) |
| Broche 58 | CS0 — Chip-select 0 (from SIM) |
| Broche 59 | CS1 — Chip-select 1 (from SIM) |
| Broche 60 | CS2 — Chip-select 2 (from SIM) |
| Broche 61 | CS3 — Chip-select 3 (from SIM) |
| Broche 62 | CS4 — Chip-select 4 (from SIM) |
| Broche 63 | CS5 — Chip-select 5 (from SIM) |
| Broche 64 | CS6 — Chip-select 6 (from SIM) |
| Broche 65 | CS7 — Chip-select 7 (from SIM) |
| Broche 66 | CS8 — Chip-select 8 (from SIM) |
| Broche 67 | CS9 — Chip-select 9 (from SIM) |
| Broche 68 | CS10 — Chip-select 10 (from SIM) |
| Broche 69 | CS11 — Chip-select 11 (from SIM) |
| Broche 70 | AVEC — Autovector (active low) |
| Broche 71 | BERR — Bus error (active low) |
| Broche 72 | DTACK — Data transfer acknowledge (active low) |
| Broche 73 | VCC — +5V power supply |
| Broche 74 | GND — Ground |
| Broche 75 | DREQ0 — DMA request channel 0 |
| Broche 76 | DREQ1 — DMA request channel 1 |
| Broche 77 | DACK0 — DMA acknowledge channel 0 (active low) |
| Broche 78 | DACK1 — DMA acknowledge channel 1 (active low) |
| Broche 79 | DONEO — DMA done channel 0 |
| Broche 80 | DONE1 — DMA done channel 1 |
| Broche 81 | TXD0 — SCI 0 transmit data |
| Broche 82 | RXD0 — SCI 0 receive data |
| Broche 83 | TXD1 — SCI 1 transmit data |
| Broche 84 | RXD1 — SCI 1 receive data |
| Broche 85 | TIN0 — Timer 0 input |
| Broche 86 | TIN1 — Timer 1 input |
| Broche 87 | TOUT0 — Timer 0 output |
| Broche 88 | TOUT1 — Timer 1 output |
| Broche 89 | P0 — Parallel I/O port bit 0 |
| Broche 90 | P1 — Parallel I/O port bit 1 |
| Broche 91 | P2 — Parallel I/O port bit 2 |
| Broche 92 | P3 — Parallel I/O port bit 3 |
| Broche 93 | P4 — Parallel I/O port bit 4 |
| Broche 94 | P5 — Parallel I/O port bit 5 |
| Broche 95 | P6 — Parallel I/O port bit 6 |
| Broche 96 | P7 — Parallel I/O port bit 7 |
| Broche 97 | VCC — +5V power supply |
| Broche 98 | GND — Ground |
| Broche 99 | EXTAL — External clock / crystal oscillator input |
| Broche 100 | XTAL — Crystal oscillator output |
| Broche 101 | MODCK — Mode clock (clock source select) |
| Broche 102 | VCC — +5V power supply |
| Broche 103 | GND — Ground |
| Broche 104 | TMS — JTAG test mode select |
| Broche 105 | TCK — JTAG test clock |
| Broche 106 | TDI — JTAG test data input |
| Broche 107 | TDO — JTAG test data output |
| Broche 108 | TRST — JTAG test reset (active low) |
| Broche 109 | VCC — +5V power supply |
| Broche 110 | GND — Ground |
| Broche 111 | A0 — Address bus bit 0 (continued - mirrored side) |
| Broche 112 | A1 — Address bus bit 1 (mirrored) |
| Broche 113 | A2 — Address bus bit 2 (mirrored) |
| Broche 114 | A3 — Address bus bit 3 (mirrored) |
| Broche 115 | A4 — Address bus bit 4 (mirrored) |
| Broche 116 | A5 — Address bus bit 5 (mirrored) |
| Broche 117 | A6 — Address bus bit 6 (mirrored) |
| Broche 118 | A7 — Address bus bit 7 (mirrored) |
| Broche 119 | A8 — Address bus bit 8 (mirrored) |
| Broche 120 | A9 — Address bus bit 9 (mirrored) |
| Broche 121 | A10 — Address bus bit 10 (mirrored) |
| Broche 122 | A11 — Address bus bit 11 (mirrored) |
| Broche 123 | A12 — Address bus bit 12 (mirrored) |
| Broche 124 | A13 — Address bus bit 13 (mirrored) |
| Broche 125 | A14 — Address bus bit 14 (mirrored) |
| Broche 126 | A15 — Address bus bit 15 (mirrored) |
| Broche 127 | D0 — Data bus bit 0 (mirrored) |
| Broche 128 | D1 — Data bus bit 1 (mirrored) |
| Broche 129 | D2 — Data bus bit 2 (mirrored) |
| Broche 130 | D3 — Data bus bit 3 (mirrored) |
| Broche 131 | D4 — Data bus bit 4 (mirrored) |
| Broche 132 | D5 — Data bus bit 5 (mirrored) |
| Broche 133 | D6 — Data bus bit 6 (mirrored) |
| Broche 134 | D7 — Data bus bit 7 (mirrored) |
| Broche 135 | D8 — Data bus bit 8 (mirrored) |
| Broche 136 | D9 — Data bus bit 9 (mirrored) |
| Broche 137 | D10 — Data bus bit 10 (mirrored) |
| Broche 138 | D11 — Data bus bit 11 (mirrored) |
| Broche 139 | D12 — Data bus bit 12 (mirrored) |
| Broche 140 | D13 — Data bus bit 13 (mirrored) |
| Broche 141 | D14 — Data bus bit 14 (mirrored) |
| Broche 142 | D15 — Data bus bit 15 (mirrored) |
| Broche 143 | VCC — +5V power supply |
| Broche 144 | GND — Ground |
Applications typiques
MC68340AB25E-FR convient pour 6 applications: Industrial Automation Controllers, Telecommunications Line Interface Cards, Point-of-Sale (POS) Terminals, Legacy M68000 System Upgrades, Embedded Networking Gateways, Aerospace and Defense Embedded Systems.
Industrial Automation Controllers
The MC68340AB25E-FR's combination of a deterministic 68K CISC core, dual 32-bit DMA channels, and integrated chip-select generation makes it well-suited for industrial PLC and motion controller designs. The CPU32 core executes 68K legacy code without recompilation, preserving decades of validated application logic, while the dual DMA channels offload high-speed sensor and actuator data transfers from the CPU. With 4.8 MIPS throughput and 12 chip-select outputs, the part can directly address peripheral ICs without external glue logic. The extended -40C to +85C temperature range supports factory-floor deployments. Pair with external SRAM/Flash and RS-485 transceivers for a complete industrial control platform.
Recommandé
Telecommunications Line Interface Cards
The MC68340AB25E-FR was widely deployed in telecom line cards where its 68K architecture, dual SCI ports, and DMA capability enabled efficient handling of serial data streams. The 25 MHz CPU32 core provides 4.8 MIPS throughput, sufficient for protocol handling on T1/E1 and ISDN line cards of the era. The two SCI interfaces can be mapped to external UART transceivers for backplane communication. The integrated chip-select generator reduces BOM count on densely populated line cards, and the extended temperature range suits central-office and outdoor-cabinet environments. Legacy systems still in service rely on this part for protocol-stack continuity.
Recommandé
Point-of-Sale (POS) Terminals
The MC68340AB25E-FR's integrated peripherals - dual SCI, parallel I/O, timers, and DMA - match POS terminal requirements where a single chip must manage the keypad, display, printer, and network interface. The CPU32 core at 4.8 MIPS handles transaction processing and encryption offload, while the DMA channels support burst data transfers from card readers without interrupting the application. The 144-pin QEO package is compatible with high-volume surface-mount assembly lines common in POS manufacturing. NXP NND status means existing POS designs rely on remaining stock or qualified broker channels for production continuity.
Recommandé
Legacy M68000 System Upgrades
The MC68340AB25E-FR serves as an upgrade path for legacy M68000 designs that need DMA and additional peripherals without a full redesign. The CPU32 core is object-code compatible with earlier 68K processors, allowing existing firmware to run with no source changes. The dual 32-bit DMA channels replace discrete DMA controllers, freeing board real estate and reducing cost. Designers can migrate from earlier MC68000, MC68010, or MC68020 designs while preserving the investment in validated 68K code, schematics, and PCB layout footprints. This is the canonical use case for the MC68340 family.
Recommandé
Embedded Networking Gateways
The MC68340AB25E-FR's dual SCI ports and 32-bit DMA make it a fit for legacy serial-to-Ethernet or serial-to-Profibus gateway designs. The CPU32 core runs protocol-conversion stacks while DMA handles bulk packet forwarding between SCI and external Ethernet controllers. The integrated chip-select generator directly interfaces to memory and MAC/PHY ICs without external address-decoding logic. Many industrial networking products from the late 1990s and 2000s use this part, and it remains in production for maintenance of installed bases. For new gateway designs, consider NXP ColdFire or Kinetis families.
Recommandé
Aerospace and Defense Embedded Systems
The MC68340AB25E-FR is used in aerospace and defense applications where its mature 68K architecture, deterministic interrupt response, and extended-temperature grade meet DO-178/DO-254 validation requirements. The CPU32 core's CISC instruction set simplifies code review for safety-critical certification, and the integrated DMA and peripherals reduce component count - a reliability benefit in vibration-prone environments. The 144-pin QFP package is qualified for many avionics platforms. Ceramic-package variants (MC68340CFC25E) are preferred for high-reliability and radiation-tolerant applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68340AB25E-FR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68340AB16E | MC68340CFC25E | MC68340FE25E |
|---|---|---|---|---|
| Package | 144-pin QFP | 144-pin QFP - same | 144-pin QFP - same | 144-pin QFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Maximum Clock Frequency | 25 MHz | 16 MHz (-36%) | 25 MHz (same) | 25 MHz (same) |
| Performance (MIPS) | 4.8 MIPS | 3.2 MIPS (-33%) | 4.8 MIPS (same) | 4.8 MIPS (same) |
| Core Architecture | CPU32 (M68000-family) | CPU32 (M68000-family) | CPU32 (M68000-family) | CPU32 (M68000-family) |
| DMA Channels | 2 x 32-bit | 2 x 32-bit | 2 x 32-bit | 2 x 32-bit |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C (ceramic pkg) | -40C to +85C |
| Package Type | Plastic QFP (FR = T&R) | Plastic QFP | Ceramic QFP (high-rel) | Plastic QFP |
Principaux différenciateurs
- Higher clock speed vs lower-tier same-family variant (vs MC68340AB16E)
- Plastic QFP package vs ceramic high-reliability variant (vs MC68340CFC25E)
- Integrated dual 32-bit DMA vs discrete DMA controllers (vs MC68302FC16C)
Notes de conception
Estimated: With a 144-pin QFP at 0.5 mm lead pitch and 25 MHz / 5 V operation, route address and data buses with matched lengths within +/-2 cm to avoid bus skew. Place bulk decoupling capacitors (10 uF tantalum + 0.1 uF ceramic per VCC pin pair) within 5 mm of each VCC pin. The chip-select outputs from the SIM can drive up to 8 mA - verify that total loading stays within the 16-pin group limit on VCC/GND pairs per JEDEC QFP thermal guidelines.
The MC68340AB25E-FR dissipates approximately 0.6 W at 25 MHz / 5 V typical activity. With the 144-pin QFP package theta_JA of approximately 50 C/W on a standard 4-layer PCB, junction temperature rise is roughly 30 C above 25 C ambient, requiring derating above 70 C ambient. Per JEDEC EIA/JESD51 standards, add copper thermal vias beneath the exposed pad region if available, or specify a ceramic-package variant (MC68340CFC25E) for high-temperature or high-reliability deployments.
Do not confuse the 'AB' speed grade (25 MHz, 4.8 MIPS) with the 'FT' grade (16 MHz, 3.2 MIPS) - substituting the wrong grade silently halves performance. Verify RESET and HALT are properly pulled up with 4.7 kohm resistors and that the reset pulse meets the 100 ms minimum for the on-chip PLL. Always verify the SIM chip-select timing configuration matches external memory access time, and ensure DTACK is properly terminated with a pull-up to avoid bus errors. Per the NXP Community thread 'Replacement MCU for MC68340', NXP does not recommend ColdFire as a pin-compatible drop-in - plan for software recompilation if migrating.
Informations de conformité
RoHS, REACH, lead-free, and halogen-free status are not explicitly documented in the verified web data for this NND part. The MC68340AB25E-FR predates widespread RoHS adoption; contact NXP or check lot-specific documentation for current compliance status. AEC-Q100 not applicable for legacy MPU in this product family.
