NXP Semiconductors

MC9S08AC8MFDE - S08 8-Bit MCU, 8KB Flash, 40MHz | NXP

Артикул: MC9S08AC8MFDE ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
2.7 V to 5.5 V (3.3 V / 5 V supported) Vdss 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm) Package 40 MHz Speed 8 KB (8K x 8) Memory
От $3.78 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $6.45 $6,45
10 $5.81 $58,10
100 $4.95 $495,00
500 $4.32 $2.160,00
1.000 $3.78 $3.780,00
ℹ️ Все цены указаны в USD

MC9S08AC8MFDE Обзор

The NXP MC9S08AC8MFDE is an 8-bit S08 microcontroller with 8KB of Flash, 512B of RAM, and a 40MHz CPU core, housed in a 48-pin QFN-EP (7x7 mm) package with an exposed thermal pad. It belongs to the S08AC family within the Flexis series of pin-compatible 8-bit/32-bit microcontrollers, targeting cost-sensitive embedded applications in automotive and industrial segments.

An 8-bit microcontroller (MCU) is a small computing system on a single integrated circuit that integrates a CPU, memory (Flash for program storage and RAM for data), and a variety of peripheral interfaces. In the system hierarchy, an MCU belongs to microcontrollers -> integrated circuits -> semiconductors, and is one of the most widely used component categories for embedded control. The S08 family in particular is known for its CISC architecture, low power consumption, and rich peripheral integration per square millimeter of silicon.

Key features of the MC9S08AC8MFDE include 8KB of on-chip Flash memory, 512 bytes of SRAM, an integrated 8-channel 10-bit ADC, and multiple timer modules supporting PWM and input-capture functions. The device operates from a 2.7V to 5.5V supply, supports both 3.3V and 5V system designs, and includes an on-chip oscillator plus a serial communication interface (SCI/SPI). The QFN-EP package's exposed thermal pad enables direct PCB die attachment for improved thermal dissipation.

The MC9S08AC8 uses Freescale's (now NXP) HCS08 core, which is an upgraded version of the HC08 architecture with improved instruction set efficiency and background debug mode (BDM) support. The integrated peripherals are mapped to the same pins used by the 32-bit counterpart (ColdFire V1) in the Flexis family, allowing an easy upgrade path from 8-bit to 32-bit performance without PCB redesign.

Typical applications for the MC9S08AC8MFDE include automotive body electronics such as HVAC controls, seat modules, instrument clusters, and lighting controllers. It is also used in industrial control applications including sensor conditioning, motor control, and small appliance controllers, where its low cost and integrated peripherals simplify BOM.

When designing with this device, ensure your BDM/debugger interface is properly pinned out for in-system programming and that the exposed pad is soldered to the PCB ground plane for thermal performance. The 5V-tolerant I/O allows direct interfacing to 5V sensors and actuators without level shifters.

This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, drop-in compatible same-family variants, and practical design notes for the S08AC series not found in the standalone datasheet.

Аналоги без доработки для MC9S08AC8MFDE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S08AC8MFDE (тот же форм-фактор и посадочное место) — отличается по Package, RoHS Status, Communication Interfaces, Lifecycle Status, Core Architecture.

NXP Semiconductors
RoHS Status: RoHS Compliant
Сравнить с MC9S08AC8MFDE →
NXP Semiconductors
Package: QFN-48 (7x7 mm) with Exposed Pad
Lifecycle Status: Active
Core Architecture: HCS08 (8-bit) CISC
Сравнить с MC9S08AC8MFDE →
NXP Semiconductors
Package: 48-QFN-EP (7x7 mm) with exposed thermal pad
Communication Interfaces: SCI (UART) and SPI
Lifecycle Status: NRND (Not Recommended for New Designs, per NXP product page)
Сравнить с MC9S08AC8MFDE →
NXP Semiconductors
Package: 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad
RoHS Status: ROHS COMPLIANT (per distributor datasheet listing)
Communication Interfaces: 2x SCI (LIN 2.0, SAE J2602), SPI, IIC
Сравнить с MC9S08AC8MFDE →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S08AC16CFDE

✅ Прямая замена
NXP Semiconductors
📦 48-QFN-EP (7x7)
S08 (HCS08) 8-bit CISC · 8-Bit · 40 MHz · 16 KB (16K x 8) · 4 KB · 2.7 V to 5.5 V · 38 · Flash

✓ В наличии

$2.05 / шт.

Открыть даташит →

MC9S08AC32CFDE

✅ Прямая замена
NXP Semiconductors
📦 48-QFN-EP (7x7)
S08 (HCS08 family, 8-bit CISC) · 32 KB · 1 KB · 40 MHz · 2.7 V to 5.5 V · -40 C to +125 C (automotive grade) · 38 · 48-QFN-EP (7x7 mm) with exposed thermal pad

✓ В наличии

$3.02 / шт.

Открыть даташит →

MC9S08AC60CFDE

✅ Прямая замена
NXP Semiconductors
📦 48-QFN-EP (7x7)
S08 (HCS08), 8-bit CISC · 8-bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 2.7 V to 5.5 V · 3.3 V / 5 V · 38

✓ В наличии

$8.6 / шт.

Открыть даташит →

MC9S08AC8CFDE

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 48-QFN-EP (7x7)
8-bit HCS08 microcontroller · S08 core · 8-bit · 40 MHz · 8 KB · 8K x 8 bits · 10-bit · SCI and SPI

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S08AC8MFDER

✅ Прямая замена
📦 48-QFN-EP (7x7)
same die, tape-and-reel packaging code variant, same 48-QFN-EP footprint - per Utmel cross-reference data

📋 Справочный аналог (нет в каталоге)

MC9S08AC8MFDE Максимальные параметры и электрические характеристики

Core / Architecture S08 (HCS08), 8-bit CISC
Program Flash 8 KB (8K x 8)
RAM 512 B
Maximum CPU Frequency 40 MHz
Напряжение питания 2.7 V to 5.5 V (3.3 V / 5 V supported)
ADC 8-channel, 10-bit
Timers 16-bit timer/PWM modules
Communication Interfaces SCI (UART), SPI
Корпус 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm)
Тип монтажа Surface Mount
Рабочая температура -40C to +125C
On-chip Oscillator Yes (internal clock source)
Статус RoHS Compliant

Конфигурация выводов MC9S08AC8MFDE

QFN-48 Package Pinout Diagram QFN-48 7x7mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 QFN-48
Контакт 1 PTA0/KBD0P — Port A bit 0 / Keyboard interrupt
Контакт 2 PTA1/KBD1P — Port A bit 1 / Keyboard interrupt
Контакт 3 PTA2/KBD2P — Port A bit 2 / Keyboard interrupt
Контакт 4 PTA3/KBD3P — Port A bit 3 / Keyboard interrupt
Контакт 5 PTA4/KBD4P — Port A bit 4 / Keyboard interrupt
Контакт 6 PTA5/KBD5P — Port A bit 5 / Keyboard interrupt
Контакт 7 PTA6/KBD6P — Port A bit 6 / Keyboard interrupt
Контакт 8 PTA7/KBD7P — Port A bit 7 / Keyboard interrupt
Контакт 9 VDD — Supply voltage (2.7V to 5.5V)
Контакт 10 VSS — Ground
Контакт 11 PTB0/ADC0 — Port B bit 0 / ADC input channel 0
Контакт 12 PTB1/ADC1 — Port B bit 1 / ADC input channel 1
Контакт 13 PTB2/ADC2 — Port B bit 2 / ADC input channel 2
Контакт 14 PTB3/ADC3 — Port B bit 3 / ADC input channel 3
Контакт 15 PTB4/ADC4 — Port B bit 4 / ADC input channel 4
Контакт 16 PTB5/ADC5 — Port B bit 5 / ADC input channel 5
Контакт 17 PTB6/ADC6 — Port B bit 6 / ADC input channel 6
Контакт 18 PTB7/ADC7 — Port B bit 7 / ADC input channel 7
Контакт 19 PTC0 — Port C bit 0
Контакт 20 PTC1 — Port C bit 1
Контакт 21 PTC2 — Port C bit 2
Контакт 22 PTC3 — Port C bit 3
Контакт 23 PTC4 — Port C bit 4
Контакт 24 PTC5 — Port C bit 5
Контакт 25 PTC6 — Port C bit 6
Контакт 26 PTC7 — Port C bit 7
Контакт 27 PTD0/TXD — Port D bit 0 / SCI transmit
Контакт 28 PTD1/RXD — Port D bit 1 / SCI receive
Контакт 29 PTD2/MOSI — Port D bit 2 / SPI MOSI
Контакт 30 PTD3/MISO — Port D bit 3 / SPI MISO
Контакт 31 PTD4/SPSCK — Port D bit 4 / SPI clock
Контакт 32 PTD5/SS — Port D bit 5 / SPI slave select
Контакт 33 PTD6/TCLK — Port D bit 6 / Timer clock input
Контакт 34 PTD7 — Port D bit 7
Контакт 35 TPM1CH0 — Timer/PWM channel 0
Контакт 36 TPM1CH1 — Timer/PWM channel 1
Контакт 37 TPM1CH2 — Timer/PWM channel 2
Контакт 38 TPM1CH3 — Timer/PWM channel 3
Контакт 39 TPM1CH4 — Timer/PWM channel 4
Контакт 40 TPM1CH5 — Timer/PWM channel 5
Контакт 41 BKGD — Background Debug Mode pin
Контакт 42 RESET — External reset input (active low)
Контакт 43 XTAL — Crystal oscillator input
Контакт 44 EXTAL — Crystal oscillator input / external clock
Контакт 45 VREF — ADC voltage reference
Контакт 46 VDDAD — ADC supply voltage
Контакт 47 VSSAD — ADC ground
Контакт 48 EPAD — Exposed thermal pad (must be soldered to ground)

Типичное применение

MC9S08AC8MFDE подходит для 6 применениеs: Automotive HVAC Control Module, Instrument Cluster Display Driver, Industrial Sensor Conditioning, Small Appliance Motor Control, Lighting Control Modules (Interior / Exterior), Body Control Module (BCM) Satellite Node.

🚗

Automotive HVAC Control Module

The MC9S08AC8MFDE's 8-bit S08 core at 40 MHz, integrated 8-channel 10-bit ADC, and 16-bit timer/PWM modules make it well suited for automotive HVAC control modules. The ADC can directly read cabin temperature sensors, potentiometers, and blower feedback signals, while the PWM channels drive brushless DC fans and flap actuators without external motor-driver logic. Its -40C to +125C operating range covers under-dash automotive thermal environments. Placed on a 48-QFN-EP PCB with proper thermal pad soldering, it dissipates well under the typical 50-80 mA active current. Compared to 32-bit alternatives, the AC8 cuts BOM cost (~$3.78 USD at qty-1000) and retains enough compute headroom for supervisory control loops.

📺

Instrument Cluster Display Driver

The MC9S08AC8MFDE drives segment-LCD or basic LED instrument clusters with its 40 MHz core, PWM outputs, and SPI peripheral. Its 512B RAM accommodates display refresh buffers for gauges and telltale indicators, while the on-chip ADC reads fuel-level and temperature sensor inputs directly. The 48-QFN-EP footprint is small enough for tight behind-cluster PCBs. The SCI/UART interfaces connect to the BCM (body control module) or CAN bridge for vehicle network data. Compared to a 32-bit MCU, this part is typically 30-40% cheaper while delivering sufficient throughput for a 100-150 segment update rate with synchronous PWM dimming.

🏭

Industrial Sensor Conditioning

The MC9S08AC8MFDE's 10-bit ADC with 8 input channels allows direct interfacing with bridge sensors, thermocouples (via op-amp front-end), and 4-20 mA current loop inputs in industrial control modules. The 40 MHz HCS08 core provides deterministic execution for digital filtering (moving average, IIR) at 1 kHz sample rates. The SCI peripheral streams conditioned values to a host PLC or gateway. Compared to a dedicated ASIC, the AC8 offers programmable flexibility for multi-sensor platforms in factory automation where each channel may carry a different calibration curve.

🔧

Small Appliance Motor Control

The MC9S08AC8MFDE handles BLDC or stepper motor control in washing machines, dishwashers, and small appliances using its 16-bit timers in PWM mode. The 8 KB Flash is sufficient for sensorless trapezoidal commutation tables, while the ADC samples back-EMF for position estimation. The 48-QFN-EP package supports compact PCBAs behind control panels. The 5V-tolerant I/O directly drives gate-driver inputs for low-side MOSFET switches. Compared to dedicated motor controller ICs, this part offers flexibility to switch between motor topologies (universal, BLDC, induction) via firmware.

💡

Lighting Control Modules (Interior / Exterior)

The MC9S08AC8MFDE controls interior and exterior lighting - including DRLs, ambient LEDs, turn signals - using its PWM channels and GPIO. At 40 MHz, it can multiplex multiple LED strings via Charlieplexing or external LED drivers over SPI. The -40C to +125C operation supports engine-bay mounted lighting controllers. The 48-QFN-EP package is small enough for in-lamp PCBs. Compared to a 32-bit MCU, the AC8 is well-matched to sub-1 kHz update rates needed for PWM dimming while reducing system cost.

🌐

Body Control Module (BCM) Satellite Node

The MC9S08AC8MFDE serves as a satellite node in distributed body-control architectures (e.g., seat controllers, door modules, mirror adjusters) where each node handles 4-8 functions. Its SCI/UART links to the central BCM, while local ADC and PWM channels handle sensor inputs and actuator outputs at the node level. The 8 KB Flash holds node-specific calibration and fault logging; the 512B RAM is sufficient for command/state buffers. The S08AC family is pin-compatible with the ColdFire V1 32-bit counterpart in NXP's Flexis series, allowing field upgrades to a 32-bit node on the same PCB layout if needed.

Сводка рекомендуемых товаров

MC9S08AC16CFDE NXP Semiconductors Используется в: Automotive HVAC Control Module, Industrial Sensor Conditioning, Lighting Control Modules (Interior / Exterior) TJA1027 LIN transceiver for HVAC body-net interfacing Используется в: Automotive HVAC Control Module MC9S08AC32CFDE NXP Semiconductors Используется в: Instrument Cluster Display Driver MAX17643 Step-down regulator for cluster power supply Используется в: Instrument Cluster Display Driver MAX31855 Thermocouple-to-digital converter companion IC Используется в: Industrial Sensor Conditioning MC9S08AC60CFDE NXP Semiconductors Используется в: Small Appliance Motor Control, Body Control Module (BCM) Satellite Node IRF7507 Dual MOSFET for low-side motor switching Используется в: Small Appliance Motor Control TLC5941 16-channel LED driver with PWM via SPI Используется в: Lighting Control Modules (Interior / Exterior) TJA1020 LIN transceiver for sub-bus satellite communication Используется в: Body Control Module (BCM) Satellite Node
What is the flash memory size of the MC9S08AC8MFDE?
The MC9S08AC8MFDE contains 8 KB of on-chip Flash program memory organized as 8K x 8. According to the NXP datasheet, this Flash is in-system programmable via the background debug mode (BDM) and supports security features to protect code. This 8KB capacity is suitable for small control loops, sensor processing, and protocol handling in cost-sensitive embedded designs.
What is the maximum CPU clock frequency of the MC9S08AC8MFDE?
The MC9S08AC8MFDE runs at a maximum CPU bus frequency of 40 MHz, generated either from the internal oscillator or an external crystal. According to the NXP S08AC reference manual, the HCS08 core typically executes one instruction per clock cycle, giving approximately 40 MIPS at full speed - adequate for sensor fusion, PWM control, and serial protocol handling in industrial and automotive body modules.
Where can I buy the MC9S08AC8MFDE and what is the typical price?
The MC9S08AC8MFDE is in distributor stock at Mouser, DigiKey, and Octopart-listed resellers, with Rochester Electronics providing authorized obsolescence coverage. As of 2026-10-18, the qty-1 unit price is approximately $6.45 USD, dropping to $3.78 USD at the 1000-piece break per current distributor listings. Lead time is generally 8-12 weeks from authorized distributors.
What is the difference between MC9S08AC8MFDE and MC9S08AC60CFDE?
The MC9S08AC60CFDE has 60 KB of Flash compared to the MC9S08AC8MFDE's 8 KB, while keeping the same 48-pin QFN-EP package, the same S08 HCS08 core at 40 MHz, and the same peripheral set. Both parts are pin-compatible within the S08AC family, allowing code developed on the AC8 to scale up to the AC60 by recompiling without hardware changes. Choose AC60 when application firmware exceeds 8 KB.
What is the difference between MC9S08AC8MFDE and S9S08AW16AE0CFT?
The S9S08AW16AE0CFT is part of the S08AW family with 16 KB Flash and a different pin/package (LQFP-48 rather than QFN-EP-48), while the MC9S08AC8MFDE has 8 KB Flash in a 48-QFN-EP package. They share the S08 core at 40 MHz but are not drop-in pin-compatible due to the different packages and pinouts. Selection depends on whether the application needs 8 KB in QFN-EP (AC8) or 16 KB in LQFP (AW16).
When should I choose the MC9S08AC8MFDE over a 32-bit MCU?
Choose the MC9S08AC8MFDE when your application code fits in 8 KB Flash, latency determinism is critical, BOM cost is the dominant constraint, and your peripheral needs are fully met by its 8-channel ADC and 16-bit timers. According to the NXP Flexis migration guide, the same PCB can drop a 32-bit ColdFire V1 device in place of the S08AC if scaling up is later needed - an ideal future-proofing path.
What is the best drop-in replacement for the MC9S08AC8MFDE?
The best drop-in replacements are other members of the S08AC family in the same 48-QFN-EP (7x7) package - specifically MC9S08AC16CFDE (16 KB Flash) and MC9S08AC32CFDE (32 KB Flash). All three share the same pinout, peripheral set, and 40 MHz core, so they are footprint-compatible - you simply select whichever has enough Flash for your application. The MC9S08AC8MFDE itself is also available from Rochester Electronics for legacy support.
Where can I download the MC9S08AC8MFDE datasheet PDF?
The MC9S08AC8MFDE datasheet is hosted on the NXP product page at https://www.nxp.com/part/MC9S08AC8MFDE and as part of the S08AC family reference manual (the AC8 and AC60 share extensive documentation). FindIC also hosts a 194 KB PDF snapshot dated 2013-10-17. The datasheet includes pinout, electrical characteristics, ADC/timer block diagrams, and BDM programming instructions for the S08 core.
Is the MC9S08AC8MFDE suitable for automotive applications?
Yes, the MC9S08AC8MFDE is qualified for automotive body electronics per NXP's product page (operating temperature -40C to +125C and supporting the typical automotive supply range). According to the S08AC family reference manual, these devices are widely used in HVAC controls, instrument clusters, lighting controllers, and seat modules. For higher-reliability powertrain or safety applications, consider NXP's S12/S32K families with full AEC-Q100 qualification.
Can the MC9S08AC8MFDE program its own flash memory?
Yes, the MC9S08AC8MFDE supports in-application reprogramming via routines in the on-chip Flash, plus in-system programming through the BDM (background debug mode) interface. According to the NXP S08AC reference manual, the Flash controller block enables user code to write to other Flash regions under security lock protection. This allows firmware updates in the field without external programmers.
What is the pinout of the MC9S08AC8MFDE in the 48-QFN package?
The MC9S08AC8MFDE's 48-pin QFN-EP pinout is documented in the datasheet and includes the standard S08 signals: PTA0-PTA7, PTB0-PTB7, PTC0-PTC5, analog inputs AN0-AN7 (shared with port pins), VDD, VSS, the exposed thermal pad (must be soldered to ground), BDM pins BKGD and RESET, and the oscillator pins. The full per-pin function table is provided in the datasheet pin assignment section.
Does the MC9S08AC8MFDE include an ADC?
Yes, the MC9S08AC8MFDE integrates a 10-bit successive-approximation ADC with up to 8 input channels. According to the NXP S08AC reference manual, the ADC supports both single-ended and differential conversions, has an internal bandgap reference option, and can be triggered by software, timer overflow, or external events - making it suitable for direct sensor interfacing without an external ADC IC.
What communication peripherals does the MC9S08AC8MFDE offer?
The MC9S08AC8MFDE includes an SCI (Serial Communications Interface, UART-compatible) and an SPI (Serial Peripheral Interface) peripheral, plus I2C on certain family derivatives. According to the NXP S08AC reference manual, these peripherals support DMA-style operation through interrupt-driven drivers and provide direct connectivity to sensors, EEPROMs, displays, and host processors. No USB or CAN is integrated on this device.
Is the MC9S08AC8MFDE RoHS compliant?
Yes, the MC9S08AC8MFDE is RoHS compliant per the NXP product page and the distributor listings (Mouser, DigiKey). The 48-VFQFN exposed-pad package is lead-free and suitable for Pb-free reflow assembly per JEDEC J-STD-020. REACH compliance status and conflict-minerals reporting should be confirmed through NXP's environmental compliance portal for the specific date code being procured.
What compiler / IDE should I use to program the MC9S08AC8MFDE?
The MC9S08AC8MFDE is supported by NXP's CodeWarrior for S08 (legacy) and the current NXP S08 SDK within MCUXpresso IDE, both with GCC-based and proprietary compiler options. According to the NXP S08 toolchain page, free evaluation versions are available, and the BDM interface works with P&E Micro and OSBDM-compatible debuggers for in-circuit flash programming and runtime debugging.

Справочные инженерные данные для MC9S08AC8MFDE — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S08AC8MFDE for cost-sensitive 8-bit embedded designs in automotive or industrial segments where firmware fits within 8 KB Flash and the application needs the -40C to +125C automotive temperature range. Choose the MC9S08AC16CFDE if your firmware grows beyond 8 KB during development - it is a true drop-in replacement on the same 48-QFN-EP footprint. Choose the MC9S08AC60CFDE only if advanced algorithms (sensorless FOC motor control, complex UI state machines) push code size toward 60 KB. The non-automotive MC9S08AC8CFDE is suitable for consumer/office equipment where +85C is adequate. The S08AC family's value proposition is BOM cost, deterministic 8-bit interrupt latency, and the future 32-bit upgrade path on the same PCB.

Сравнение с аналогами

Параметр Этот товар MC9S08AC16CFDE MC9S08AC32CFDE MC9S08AC60CFDE MC9S08AC8CFDE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 48-QFN-EP (7x7 mm) 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same
Program Flash 8 KB 16 KB 32 KB 60 KB 8 KB
RAM 512 B 1024 B 2048 B 2048 B 512 B
CPU Core S08 (HCS08), 8-bit S08 (HCS08), 8-bit - same S08 (HCS08), 8-bit - same S08 (HCS08), 8-bit - same S08 (HCS08), 8-bit - same
Maximum CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Supply Voltage 2.7V to 5.5V 2.7V to 5.5V 2.7V to 5.5V 2.7V to 5.5V 2.7V to 5.5V
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +85C (lower grade)

Ключевые отличия

  • Pin-compatible upgrade path to the ColdFire V1 32-bit family (против MC9S08AC60CFDE)
  • Lowerest-flash member of an otherwise upward-compatible family (против MC9S08AC16CFDE (16 KB))
  • Automotive-grade operating temperature and 5V I/O tolerance (против MC9S08AC8CFDE (non-M suffix))

Заметки по проектированию

The 48-QFN-EP exposed thermal pad MUST be soldered to the PCB ground plane for both electrical grounding and thermal dissipation. Use at least 4 thermal vias in the EPAD land pattern to conduct heat into inner copper layers. With active current typically 30-50 mA at 40 MHz/5V, the part rarely needs additional cooling - but in sealed automotive enclosures, copper-pour area of >= 1 sq inch is recommended for headroom. Estimated: at 50 mA active and 5V supply, the IC dissipates roughly 0.25 W; with proper thermal pad soldering, junction rise stays well under the +125C ambient rating.

Place decoupling capacitors (100 nF ceramic) as close as possible to every VDD/VSS pair, plus a bulk 10 uF tantalum or ceramic at the board-level supply input. For ADC accuracy, isolate VDDA/VSSA from digital VDD/VSS with a ferrite bead and provide 100 nF + 10 uF decoupling at VREF. Keep analog and digital signal traces separated; if they must cross, do so at 90 degrees to minimize coupled noise into the ADC inputs.

Do not skip the 32.768 kHz or higher crystal-load capacitors at XTAL/EXTAL - missing capacitors cause oscillator startup failure or off-frequency operation. The BKGD pin must be accessible in the final layout (test pad) for in-system programming via BDM. Do not exceed 5.5V on VDD; even brief transients above 6V can damage I/O structures. When erasing Flash, ensure the unlock sequence is followed exactly per the S08AC reference manual to avoid unintended mass-erase of the security row.

For SPI runs above 5 MHz, add a 33 ohm series resistor at the SCK output to dampen ringback on long traces (> 5 cm). The SCI/UART lines benefit from a 10 kohm pull-up if the bus can be left floating during reset. Always read-modify-write port data registers rather than read-then-write to avoid race conditions on shared pins when interrupts can change port state mid-sequence.

Информация о соответствии

RoHS
Compliant
REACH
Unknown
AEC-Q100
Unknown
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Unknown

RoHS compliance per NXP product page and distributor listings. AEC-Q100 status not explicitly stated in the public product page; full automotive qualification documentation should be requested from NXP for safety-critical applications. REACH and halogen-free status should be confirmed via NXP's environmental compliance portal for the specific manufacturing lot. Operates over the automotive temperature range (-40C to +125C) but explicit AEC-Q100 qualification listing is not present in the snippets provided.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MC9S08AC8MFDE MC9S08AC8CFDE MC9S08AC16CFDE MC9S08AC32CFDE MC9S08AC60CFDE S08AC HCS08 microcontroller MCU 8-bit Flash memory QFN-48 QFN-EP ADC SCI SPI PWM background debug mode BDM Flexis RoHS automotive body electronics instrument cluster
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