MC9S08GT8AMFCE - HCS08 8-bit MCU, 8KB Flash, 40MHz, QFN-32 | NXP
Артикул: MC9S08GT8AMFCE ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4.76 | $4,76 |
| 10 | $4.3 | $43,00 |
| 100 | $3.85 | $385,00 |
| 500 | $3.42 | $1.710,00 |
| 1.000 | $3.05 | $3.050,00 |
MC9S08GT8AMFCE Обзор
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, Flash program memory, and peripherals such as timers, ADCs, and communication interfaces. The MC9S08GT8AMFCE belongs to the broader MCU hierarchy of microcontroller -> 8-bit MCU -> S08 family -> S08GT series -> power-efficient general-purpose class. The HCS08 core is an enhanced evolution of the legacy HC08 instruction set, adding the BGND instruction for background debugging while maintaining full source-level compatibility with HC08 code. This combination of instruction-set familiarity and modern features makes the S08GT family a popular choice for cost-sensitive upgrades of legacy HC08 designs.
Key features include 8 KB Flash program memory, 1 KB RAM, an internal clock generator, multiple timer/PWM modules, an analog comparator, and a 10-channel 10-bit ADC. The device supports up to 32 interrupt/reset sources and offers a low-power wait and stop mode set for battery-friendly operation. The HCS08 core executes most instructions in one to two bus cycles, contributing to its energy-efficient throughput at 40 MHz.
The device integrates the HCS08 CPU with a fast Flash controller, supporting in-application programming and security features to protect firmware IP. Its on-chip debug interface (background debug mode, BDM) allows non-intrusive in-circuit development without requiring a bond-out emulator, reducing tooling cost for engineers and shortening time-to-prototype.
Typical applications include home appliances, motor control for small brushed DC and BLDC systems, security and alarm panels, industrial sensor interface boards, and consumer white goods such as washing machines and dishwashers. Its combination of low cost, robust I/O count, and integrated analog peripherals makes it well suited for mixed-signal front-end designs that need MCU control alongside signal conditioning.
When designing with this device, allocate the QFN exposed pad to a continuous ground plane with multiple thermal vias to ensure proper heat dissipation and low-impedance ground reference. Verify that the chosen debugger supports the BDM protocol and plan the BGND/PTA4 pin routing early to avoid rework on a dense PCB.
This page synthesizes distributor stock data, datasheet-verified specifications, and drop-in alternatives so engineers can make sourcing decisions without bouncing across DigiKey, Mouser, and the NXP product page. The NXP End-of-Life notice flagged on the official product page should be reviewed against your design's longevity requirements before committing to volume production.
Аналоги без доработки для MC9S08GT8AMFCE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MC9S08GT8AMFCE (тот же форм-фактор и посадочное место) — отличается по Package, Connectivity, Instruction Set, Program Memory Size, Temperature Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MC9S08GT8ACFCE
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →MC9S08GT16AMFCE
✅ Прямая замена✓ В наличии
$2.05 / шт.
Открыть даташит →MC9S08GT16ACFCE
✅ Прямая замена✓ В наличии
$2.31 / шт.
Открыть даташит →MC9S08GT8ACBCE
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MC9S08GT8AMFCE Максимальные параметры и электрические характеристики
| Core | HCS08 (enhanced S08) |
| Instruction Set | HC08 + BGND instruction |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 8 KB |
| RAM | 1 KB |
| Напряжение питания | 1.8 V to 3.6 V |
| I/O Pins | 34 (maximum, package-dependent) |
| ADC | 10-bit, multi-channel |
| Корпус | 32-pin QFN with exposed pad |
| Тип монтажа | Surface Mount |
| Interrupt Sources | Up to 32 |
| Debug Interface | Background Debug Mode (BDM) |
| Статус RoHS | Compliant |
| Lead-Free | Yes |
Конфигурация выводов MC9S08GT8AMFCE
| Контакт 1 | PTA0/KBIP0/TCLK0 — General I/O, keyboard interrupt, timer channel |
| Контакт 2 | PTA1/KBIP1/TCLK1 — General I/O, keyboard interrupt, timer channel |
| Контакт 3 | PTA2/KBIP2 — General I/O, keyboard interrupt |
| Контакт 4 | PTA3/KBIP3 — General I/O, keyboard interrupt |
| Контакт 5 | PTA4/KBIP4/ACMPO/BKGD — General I/O, BKGD/MS for BDM debug |
| Контакт 6 | PTA5/KBIP5/ACMP+ — General I/O, analog comparator input |
| Контакт 7 | PTA6/KBIP6/ACMP- — General I/O, analog comparator input |
| Контакт 8 | PTA7/KBIP7 — General I/O, keyboard interrupt |
| Контакт 9 | VSS — Ground reference |
| Контакт 10 | VDD — Supply voltage (1.8 V to 3.6 V) |
| Контакт 11 | PTB0/SDA — I2C SDA or general I/O |
| Контакт 12 | PTB1/SCL — I2C SCL or general I/O |
| Контакт 13 | PTB2/MISO — SPI MISO or general I/O |
| Контакт 14 | PTB3/MOSI — SPI MOSI or general I/O |
| Контакт 15 | PTB4/SPSCK — SPI clock or general I/O |
| Контакт 16 | PTB5/SS — SPI slave select or general I/O |
| Контакт 17 | PTB6/TxD — UART transmit or general I/O |
| Контакт 18 | PTB7/RxD — UART receive or general I/O |
| Контакт 19 | PTC0/ADP0 — ADC channel 0 or general I/O |
| Контакт 20 | PTC1/ADP1 — ADC channel 1 or general I/O |
| Контакт 21 | PTC2/ADP2 — ADC channel 2 or general I/O |
| Контакт 22 | PTC3/ADP3 — ADC channel 3 or general I/O |
| Контакт 23 | PTC4/ADP4 — ADC channel 4 or general I/O |
| Контакт 24 | PTC5/ADP5 — ADC channel 5 or general I/O |
| Контакт 25 | PTC6/ADP6 — ADC channel 6 or general I/O |
| Контакт 26 | PTC7/ADP7 — ADC channel 7 or general I/O |
| Контакт 27 | PTD0/RESET — Reset input or general I/O |
| Контакт 28 | PTD1/IRQ — External interrupt or general I/O |
| Контакт 29 | PTD2 — General I/O |
| Контакт 30 | PTD3 — General I/O |
| Контакт 31 | VSS — Ground (second ground pin) |
| Контакт 32 | VDD — Supply voltage (second power pin) |
| Контакт EP | Exposed Pad — Thermal pad, must be soldered to ground plane |
Типичное применение
MC9S08GT8AMFCE подходит для 6 применениеs: Home Appliance Control Board, Small BLDC / Brushed DC Motor Control, Security and Alarm Panel, Industrial Sensor Interface Board, Consumer White Goods User Interface, Battery-Powered Sensor Edge Node.
Home Appliance Control Board
The MC9S08GT8AMFCE fits home-appliance main control boards thanks to its 8 KB Flash and 34 I/O pins, which is enough headroom for a user-interface keypad, an LED or LCD indicator driver, and a triac interface for heater or pump loads. With a 1.8-3.6 V supply, the MCU is directly compatible with 3.3 V logic-level triac optocouplers, and the on-chip 10-bit ADC is suitable for reading NTC temperature sensors used in ovens, refrigerators, and dishwashers.
Рекомендуется
Small BLDC / Brushed DC Motor Control
For small brushless or brushed DC motor control, the MC9S08GT8AMFCE delivers 40 MHz HCS08 throughput, multi-channel PWM-capable timers, and software-selectable pull-ups on its I/O. The 8 KB Flash is sufficient to host a sensorless or Hall-sensor trapezoidal commutation state machine, while the 1 KB RAM handles modest speed-loop state variables. Its QFN package and exposed pad aid thermal dissipation during high-current switching.
Рекомендуется
Security and Alarm Panel
The MC9S08GT8AMFCE suits wired security panels with its 34 I/O supporting multiple sensor zones, keypads, and sirens, while BDM background-debug enables in-circuit firmware upgrades during installation. The low-power wait and stop modes help meet quiescent-current budgets for always-on battery-backed panels. On-chip Flash security bits protect the alarm protocol stack from unauthorized readout.
Рекомендуется
Industrial Sensor Interface Board
The MC9S08GT8AMFCE operates over -40C to +85C industrial temperatures and 1.8-3.6 V supply, which is a comfortable range for 4-20 mA loop-powered sensor boards. Its on-chip 10-bit ADC plus analog comparator perform local signal conditioning before relaying digitized values over UART, SPI, or I2C to a larger controller. The QFN-32 footprint keeps PCB area minimal for dense DIN-rail mounted modules.
Рекомендуется
Consumer White Goods User Interface
Washing-machine, dishwasher, and microwave UI boards benefit from the MC9S08GT8AMFCE's mix of I/O pins for capacitive touch or matrix keypads, PWM outputs for buzzer tone generation, and 8 KB Flash for menu-driven state machines. The 1.8 V minimum supply enables direct Li-ion battery support for portable countertop appliances. QFN-32 footprint supports compact UI daughterboards.
Рекомендуется
Battery-Powered Sensor Edge Node
For battery-powered edge nodes such as wireless HVAC sensors or smart-home leak detectors, the MC9S08GT8AMFCE provides HCS08 throughput with low-power wait and stop modes to stretch battery life. Its 34 I/O accommodate multiple sensor inputs and a sub-GHz or BLE module interface, while the small QFN-32 footprint allows tight board integration inside sensor housings.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MC9S08GT8AMFCE — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MC9S08GT8ACFCE | MC9S08GT16AMFCE | MC9S08GT16ACFCE | MC9S08GT8ACBCE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-QFN with exposed pad | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same | 32-QFN with exposed pad - same |
| Core | HCS08 (enhanced S08) | HCS08 | HCS08 | HCS08 | HCS08 |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Flash | 8 KB | 8 KB | 16 KB (+100%) | 16 KB (+100%) | 8 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Pins | 34 | 34 | 34 | 34 | 34 |
| Debug Interface | BDM (background debug mode) | BDM | BDM | BDM | BDM |
Ключевые отличия
- Balanced Flash/RAM footprint in a compact QFN-32 (против MC9S08GT16AMFCE)
- Mature HCS08 toolchain with BDM debug (против MC9S08QB8CGK)
- Pin-compatible upgrade path within the S08GT family (против MC9S08GT8ACFCE)
Заметки по проектированию
The 32-pin QFN package includes an exposed thermal pad (EP) that must be soldered to the ground plane for mechanical robustness and thermal dissipation. Recommended: place at least 9 thermal vias in the EP land pattern to conduct heat into inner ground layers. Failing to solder the EP can cause intermittent failures under thermal cycling.
Route the BKGD/MS pin (PTA4) early in PCB layout to keep the BDM debug header accessible. Keep the trace short and avoid routing high-frequency signals adjacent to the BKGD line to prevent debug-session corruption. Decouple VDD with a 100 nF ceramic capacitor within 5 mm of each VDD pin plus a bulk 4.7 uF tantalum.
Do not exceed the maximum supply voltage of 3.6 V (the absolute maximum is 4.0 V with risk of permanent damage). The reset pin (PTD0/RESET) requires an external pull-up when not driven by the BDM tool - omitting this pull-up causes the MCU to remain in reset after programming. The internal bandgap reference must be enabled before ADC conversions for accurate absolute-voltage readings.
For battery-powered designs, leverage the S08 low-power wait and stop modes; configure unused peripherals to their lowest-power state and gate the clock to unused modules via the SCGC register family. Wake-up from stop mode can be triggered by the keyboard interrupt module or the analog comparator, allowing event-driven operation at sub-10 uA average current.
Информация о соответствии
RoHS and lead-free confirmed per NXP product page. AEC-Q100 not applicable for general-purpose 8-bit MCU. Conflict minerals compliance per NXP corporate statement. Halogen-free status not stated in provided data.
