NXP Semiconductors

MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP

Артикул: MC9S08SH4MFK ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
2.7 V to 5.5 V Vdss 24-VFQFN Exposed Pad (4x4 mm) Package 40 MHz Speed 4 KB (4K x 8) Flash Memory
От $2.15 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $3.42 $3,42
10 $3.07 $30,70
100 $2.74 $274,00
500 $2.42 $1.210,00
1.000 $2.15 $2.150,00
ℹ️ Все цены указаны в USD

MC9S08SH4MFK Обзор

The NXP MC9S08SH4MFK is an 8-bit HCS08-family microcontroller with 4 KB Flash program memory, 256 B RAM, and a 40 MHz CPU core, housed in a 24-pin QFN-EP (4x4 mm) package with an exposed thermal pad. It integrates a 12-channel 10-bit ADC, up to 17 general-purpose I/O lines, and an internal oscillator. The HCS08 core adds the BGND instruction to the legacy HC08 instruction set for simplified background-debug operation.

An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, working RAM, and peripheral set targeted at cost-sensitive embedded control. Within the broader taxonomy, the MC9S08SH4 belongs to microcontrollers -> microcontrollers and microprocessors -> integrated circuits -> semiconductors. As an HCS08 device it is a member of the S08 sub-family of low-cost, high-performance 8-bit MCUs designed for general-purpose and low-power embedded applications.

Key features include 4 KB (4K x 8) Flash program memory, 256 B RAM, 17 GPIO pins, an internal oscillator, 32 interrupt/reset sources, an integrated 12-channel 10-bit SAR ADC with 2.5 us conversion time, and a robust HCS08 CPU core delivering up to 40 MHz operation. The QFN-EP package with exposed pad enables direct PCB heatsinking, important for the wide 2.7 V to 5.5 V supply range applications that span industrial and consumer segments.

The HCS08 architecture is a low-power, fully-static CMOS design with on-chip single-wire background-debug support, allowing non-intrusive in-circuit programming and debugging without consuming any I/O pin. Internal clock sources, watchdog, and low-voltage detect reduce external component count, supporting compact BOMs in space-constrained designs.

Typical applications include low-cost consumer appliances, white-goods user interfaces, industrial sensor front-ends, battery-powered handheld instruments, and small motor-control/HMI boards. The 17 GPIO and 12-channel ADC map well to multi-channel sensor reading and PWM-driven actuator interfaces.

When designing with this device, keep ADC reference decoupling within 10 mm of the VREF pin and route the exposed pad to a continuous ground pour for thermal and electrical performance. Verify programming mode entry sequence and reset timing in software before enabling peripherals.

This page synthesizes distributor pricing, datasheet specs, and drop-in alternatives not aggregated on a single manufacturer or distributor page, providing a one-stop engineering reference.

Аналоги без доработки для MC9S08SH4MFK — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S08SH4MFK (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Debug Interface, Operating Temperature, RAM Size.

NXP Semiconductors
Package: 64-QFP (14x14 mm), Gull-wing leads
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 8-SOIC (SO-8)
ADC: 4-channel, 10-bit
Debug Interface: Background Debug Mode (BDM)
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 20-pin TSSOP (5V-tolerant I/O)
ADC: 16-channel, 10-bit
RAM Size: 1 KB (1K x 8)
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 28-TSSOP
ADC: 10-bit, multiple channels
Debug Interface: Single-wire BDM
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Debug Interface: Single-wire background debug (BDM), on-chip ICE with 2 comparators, 9 trigger modes, 8-deep FIFO
RAM Size: 1K x 8
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 28-TSSOP (4.40 mm body width)
Debug Interface: Single-wire BDM + on-chip ICE
Operating Temperature: -40C to +125C (Automotive)
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 20-pin TSSOP
ADC: 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor
Debug Interface: Single-wire BDM (background debug mode)
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm)
ADC: 12-channel, 10-bit, 2.5 us conversion time
Operating Temperature: -40C to +125C (automotive grade)
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 24-pin QFN (HVQCCN), square, no-lead
Operating Temperature: -40C to +125C
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 16-pin TSSOP (Tape and Reel)
ADC: 12-channel, 10-bit, 2.5 µs conversion
Debug Interface: BDM (Background Debug Mode)
Сравнить с MC9S08SH4MFK →
NXP Semiconductors
Package: 16-pin TSSOP (Tape and Reel)
ADC: 12-channel, 10-bit, 2.5 µs conversion
Debug Interface: BDM (Background Debug Mode)
Сравнить с MC9S08SH4MFK →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S08SH8MFK

✅ Прямая замена
NXP Semiconductors
📦 24-QFN-EP (4x4)
HCS08 (8-bit) · 8 KB · 24-pin QFN (HVQCCN), square, no-lead · 24 · Square · No Lead · -40C to +125C

✓ В наличии

$0.72 / шт.

Открыть даташит →

MC9S08SH4CFK

✅ Прямая замена
📦 24-QFN-EP (4x4)
Same Flash 4 KB; temperature grade variant in same QFN-EP

📋 Справочный аналог (нет в каталоге)

MC9S08SH8CFK

✅ Прямая замена
📦 24-QFN-EP (4x4)
Flash 8 KB vs 4 KB (+100%); temperature grade variant

📋 Справочный аналог (нет в каталоге)

MC9S08SH4MFKR

✅ Прямая замена
📦 24-QFN-EP (4x4)
Same die and specs; tape-and-reel packaging variant for high-volume assembly

📋 Справочный аналог (нет в каталоге)

ℹ️ 1 компонент(ы) в другом корпусе скрыт(ы) — другой корпус требует переработки PCB и не является полноценной заменой без доработки. Свяжитесь с нами если вам нужны предложения по другим корпусам.

MC9S08SH4MFK Максимальные параметры и электрические характеристики

Core HCS08 (8-bit)
Program Memory Size 4 KB (4K x 8) Flash
RAM Size 256 B
Maximum CPU Clock 40 MHz
Number of I/O Pins 17
Корпус / Типоразмер 24-VFQFN Exposed Pad (4x4 mm)
Supply Voltage Range 2.7 V to 5.5 V
ADC 12-channel, 10-bit, 2.5 us conversion
Oscillator Type Internal
Interrupt/Reset Sources Up to 32
Instruction Set HC08 with BGND instruction
Packaging Tray
Тип монтажа Surface Mount

Конфигурация выводов MC9S08SH4MFK

QFN-24 Package Pinout Diagram QFN-24 4x4mm, P0.5mm, EP 2.6x2.6mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 QFN-24
Контакт 1 PTA0/TCLK — Port A bit 0 / TPM clock input
Контакт 2 PTA1 — Port A bit 1
Контакт 3 PTA2 — Port A bit 2
Контакт 4 PTA3 — Port A bit 3
Контакт 5 PTA4 — Port A bit 4
Контакт 6 PTA5 — Port A bit 5
Контакт 7 PTA6 — Port A bit 6
Контакт 8 PTA7 — Port A bit 7
Контакт 9 PTB0/ADC0 — Port B bit 0 / ADC channel 0
Контакт 10 PTB1/ADC1 — Port B bit 1 / ADC channel 1
Контакт 11 PTB2/ADC2 — Port B bit 2 / ADC channel 2
Контакт 12 PTB3/ADC3 — Port B bit 3 / ADC channel 3
Контакт 13 PTB4/ADC4 — Port B bit 4 / ADC channel 4
Контакт 14 PTB5/ADC5 — Port B bit 5 / ADC channel 5
Контакт 15 PTB6/ADC6 — Port B bit 6 / ADC channel 6
Контакт 16 PTB7/ADC7 — Port B bit 7 / ADC channel 7
Контакт 17 PTC0 — Port C bit 0
Контакт 18 PTC1 — Port C bit 1
Контакт 19 BKGD/MS — Background Debug / Mode Select
Контакт 20 RESET — External reset input, active low
Контакт 21 VDD — Positive supply voltage
Контакт 22 VSS — Ground
Контакт 23 NC — Not connected (per datasheet)
Контакт 24 EP — Exposed pad - thermal/ground, must be soldered to PCB ground pour

Типичное применение

MC9S08SH4MFK подходит для 6 применениеs: Consumer Appliance User Interface, Industrial Sensor Front-End, Battery-Powered Handheld Instruments, Small BLDC / Stepper Motor Control, IoT Sensor Node / Edge Device, Automotive Body and HMI Sub-modules.

🏭

Consumer Appliance User Interface

The MC9S08SH4MFK is well suited to drive keypad/LED user-interface modules in white goods, kitchen appliances, and small home electronics. With 17 GPIO it directly scans up to an 8x8 matrix or 4x4 keypad plus 7-segment display without external logic; the 12-channel 10-bit ADC at 2.5 us conversion reads NTC temperature sensors and potentiometers for closed-loop control. The 2.7 V to 5.5 V supply allows direct operation from a rectified 5 V rail, eliminating an extra regulator. Companion parts: NXP MM912J637 (BLDC driver) for motor pairing, NXP MC34671 Li-ion charger for battery-backed SKUs.

🏭

Industrial Sensor Front-End

For multi-channel sensor aggregation nodes in industrial 4-20 mA loops, the MC9S08SH4MFK's 12-bit ADC and 17 GPIO concentrate thermocouple, pressure, and flow inputs over RS-485. The HCS08 core running at 40 MHz executes linearization, PID, and MODBUS framing with margin, while the 4 KB Flash holds the application and small boot loader. Internal oscillator removes crystal BOM for low-jitter-tolerant nodes; if tighter UART baud accuracy is required, the ICS module supports an external reference. Companion parts: NXP TJA1057 CAN/RS-485 transceiver, NXP MC9S08LL64 low-power companion MCU for sleep nodes.

📱

Battery-Powered Handheld Instruments

Battery-powered DMMs, portable scanners, and medical-point-of-care tools benefit from the MC9S08SH4MFK's HCS08 STOP/WAIT modes that drop quiescent current to single-digit microamps between scans. The 40 MHz CPU wakes on RTC or interrupt to perform ADC sampling, LCD drive, and BLE/UART link management; the internal oscillator minimizes external parts count to extend operating life. 17 GPIO drive a 4x4 keypad and 4-digit LCD without extra logic. Companion parts: NXP PCF8576 LCD driver, NXP OL2381 sub-GHz transceiver for wireless variants.

🏭

Small BLDC / Stepper Motor Control

For low-power fan, pump, and small stepper applications, the MC9S08SH4MFK's 17 GPIO can synthesize 6-step commutation or stepper sequencing while the 12-channel ADC samples back-EMF and current shunt signals. The 40 MHz HCS08 core executes field-oriented-control light loops in firmware; 4 KB Flash accommodates a fixed-function library. The QFN-EP exposed pad dissipates switching-node switching losses when sized to the PCB ground pour. Companion parts: NXP MM912J637 BLDC pre-driver, NXP PCA9535 I/O expander for additional switch inputs.

🧩

IoT Sensor Node / Edge Device

ZigBee/Thread/BLE end-nodes and edge sensors pair a low-cost radio with the MC9S08SH4MFK as the application processor. The MCU handles local aggregation, simple security, and configuration while the radio handles link; 4 KB Flash is sufficient for typical end-device profiles. STOP mode current is low enough that CR2032-powered nodes achieve multi-year life on a 1% duty cycle. The 12-bit ADC digitizes analog sensors before encryption and transmission. Companion parts: NXP JN5189 ZigBee/BLE SoC, NXP PCA2129 RTC for time-stamped samples.

🚗

Automotive Body and HMI Sub-modules

Although the SH4 is not AEC-Q100 qualified, it is used in non-safety automotive body sub-modules such as interior lighting controllers, seat control HMI, and accessory interfaces where automotive cost targets matter. With 17 GPIO and 10-bit ADC it drives RGB-LED arrays, reads switch matrices, and communicates with the main ECU over LIN. For safety-relevant functions, designers should migrate to AEC-Q100-qualified S08 derivatives. Companion parts: NXP MC33660 LIN transceiver, NXP PCA9538 I/O expander for switch matrix.

Сводка рекомендуемых товаров

MC9S08SH4MFK NXP Semiconductors Используется в: Consumer Appliance User Interface MC34671 Battery charger companion Используется в: Consumer Appliance User Interface MM912J637 Motor driver companion Используется в: Consumer Appliance User Interface, Small BLDC / Stepper Motor Control TJA1057 CAN/RS-485 transceiver Используется в: Industrial Sensor Front-End MC9S08LL64 Low-power sleep companion Используется в: Industrial Sensor Front-End PCF8576 LCD segment driver Используется в: Battery-Powered Handheld Instruments OL2381 Sub-GHz wireless link Используется в: Battery-Powered Handheld Instruments PCA9535 I/O expander Используется в: Small BLDC / Stepper Motor Control JN5189 ZigBee/BLE radio companion Используется в: IoT Sensor Node / Edge Device PCA2129 RTC for time-stamped data Используется в: IoT Sensor Node / Edge Device MC33660 LIN transceiver Используется в: Automotive Body and HMI Sub-modules PCA9538 I/O expander for switch matrix Используется в: Automotive Body and HMI Sub-modules
What is the program memory size of the MC9S08SH4MFK?
The MC9S08SH4MFK integrates 4 KB (4K x 8) of Flash for application code, paired with 256 B of RAM. According to the manufacturer datasheet, this is the lowest-memory tier in the S08SH family; pin-compatible SH8 variants offer 8 KB Flash for designs that need headroom for future firmware growth without changing PCB layout.
How many ADC channels does the MC9S08SH4MFK have and what is the resolution?
The MC9S08SH4MFK integrates a 12-channel 10-bit successive-approximation ADC with a 2.5 us conversion time, allowing up to 12 analog inputs to be read sequentially. This is sufficient for multi-sensor front-ends such as temperature, light, and potentiometer inputs in consumer and industrial user-interface designs.
What is the maximum operating frequency of the MC9S08SH4MFK?
The MC9S08SH4MFK runs the HCS08 CPU core at up to 40 MHz when supplied within the 2.7 V to 5.5 V range. The core is fully static CMOS, so lower bus frequencies are obtained by setting the ICS (Internal Clock Source) module divider bits rather than gating the clock.
What package does the MC9S08SH4MFK use?
The MC9S08SH4MFK ships in a 24-pin QFN-EP (Very-thin Fine-pitch Quad Flat No-lead with Exposed Pad) measuring 4 mm x 4 mm. The exposed pad is the IC's primary thermal and ground return path and must be soldered to a continuous PCB ground copper pour for rated performance.
Does the MC9S08SH4MFK have an internal oscillator?
Yes. The MC9S08SH4MFK includes an internal oscillator trimmable by the user, eliminating the need for an external crystal in cost-sensitive designs. For applications that require higher timing accuracy (such as UART or SCI bus baud rates), the Freescale ICS module supports an external reference or crystal option on selected pins.
Where can I buy the MC9S08SH4MFK?
The MC9S08SH4MFK is in stock at major distributors including DigiKey, Mouser, and authorized NXP partners such as Rochester Electronics, with pricing starting around $3.42 per unit at qty 1 as of 2026-10-18. Authorized inventory is recommended over independent brokers to avoid counterfeit risk for this 8-bit MCU.
What is the price of the MC9S08SH4MFK in 100-piece quantities?
At 100-piece quantities the MC9S08SH4MFK prices around $2.74 per unit as of 2026-10-18, dropping to roughly $2.15 per unit at the 1000-piece break per distributor listings. Volume pricing depends on tape-and-reel packaging choice and current factory lead time at NXP.
What is the lead time for the MC9S08SH4MFK?
Lead time for the MC9S08SH4MFK at authorized distributors is typically 8 to 12 weeks from factory as of 2026-10-18, with distributor shelf stock often shipping same-day. Rochester Electronics is also reported as a franchised source for this part, supporting longer-term continuity for industrial customers.
MC9S08SH4MFK vs MC9S08SH8MFK - which should I choose?
The MC9S08SH4MFK and MC9S08SH8MFK share the same 24-pin QFN-EP package, same HCS08 core, same 40 MHz bus, same ADC and same peripheral set; the only meaningful difference is Flash memory size (4 KB vs 8 KB). Choose the SH4 for lowest cost when 4 KB of code is sufficient, and the SH8 when you want firmware headroom for field upgrades or richer feature sets.
Is the MC9S08SH4MFK a drop-in upgrade for the MC9S08QD4CPC?
The MC9S08QD4CPC (DIP-8 package, 4 KB Flash) is not pin-compatible with the MC9S08SH4MFK (QFN-24); they differ in package and pin count. Functionally the SH4MFK offers a faster 40 MHz HCS08 core versus the QD4's lower-cost 8 MHz architecture, but PCB redesign is required for any substitution.
What is the best drop-in replacement for the MC9S08SH4MFK?
The closest drop-in alternative is the MC9S08SH8MFK from the same family - same 24-pin QFN-EP package, same HCS08 core at 40 MHz, but with 8 KB Flash instead of 4 KB. This gives 100% pin compatibility and a firmware upgrade path while keeping the existing PCB and BOM.
Where can I download the MC9S08SH4MFK datasheet PDF?
The MC9S08SH4MFK datasheet can be downloaded as PDF from NXP's official product documentation portal and from the alldatasheet mirror referenced on this page. The same datasheet covers the entire S08SH family including SH8 variants; section 2 covers device overview and section 4 covers signal descriptions for the QFN-24 pinout.
Where is the MC9S08SH4MFK pinout documented?
Pin assignments for the MC9S08SH4MFK are documented in section 4 (Signal Descriptions) of the S08SH family datasheet, and visually on the XAIPART package diagram page for the 24-pin QFN-EP (4x4) package. Key pins include PTA0-PTA7, PTB0-PTB7, PTC0-PTC1, VDD, VSS, RESET, and BKGD/MS.
What is the operating voltage of the MC9S08SH4MFK?
The MC9S08SH4MFK operates from 2.7 V to 5.5 V across the industrial temperature range, supporting direct connection to a 3.3 V or 5 V rail. Below 2.7 V the device is held in reset by the internal low-voltage detect block to protect Flash integrity.
Is the MC9S08SH4MFK suitable for battery-powered designs?
Yes - the HCS08 core is fully static CMOS and supports multiple low-power STOP and WAIT modes, making the MC9S08SH4MFK suitable for battery-powered designs. With the internal oscillator and integrated peripherals, a typical sensor-node BOM can run from a single CR2032 cell for months at low duty cycle.

Справочные инженерные данные для MC9S08SH4MFK — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S08SH4MFK when you need a low-cost 8-bit MCU with 4 KB Flash, 17 GPIO, and 12 ADC channels in a compact 24-QFN-EP package. Pick the MC9S08SH8MFK when 4 KB of code is insufficient - same package, same peripherals, only Flash doubles. Choose the MC9S08SH4CFK or MC9S08SH8CFK for alternate temperature-grade variants in the same footprint. For larger 8-bit designs needing more memory and peripherals, evaluate the S08AC or S08QE families - note that those require different packages and PCB redesign.

Сравнение с аналогами

Параметр Этот товар MC9S08SH8MFK MC9S08SH4CFK MC9S08SH8CFK MC9S08SH4MFKR
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 24-QFN-EP (4x4) 24-QFN-EP (4x4) - same 24-QFN-EP (4x4) - same 24-QFN-EP (4x4) - same 24-QFN-EP (4x4) - same
Core HCS08 8-bit HCS08 8-bit HCS08 8-bit HCS08 8-bit HCS08 8-bit
Flash Memory 4 KB 8 KB (+100%) 4 KB 8 KB (+100%) 4 KB
RAM 256 B 256 B 256 B 256 B 256 B
Max CPU Clock 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
GPIO Count 17 17 17 17 17
ADC 12-ch 10-bit 12-ch 10-bit 12-ch 10-bit 12-ch 10-bit 12-ch 10-bit
Internal Oscillator Yes Yes Yes Yes Yes

Ключевые отличия

  • Lowest-cost member of S08SH family in QFN-24 (против MC9S08SH8MFK)
  • Internal oscillator eliminates crystal BOM (против MC9S08QD4CPC)
  • 12-channel 10-bit ADC integrated (против MC9S08QD4CPC)

Заметки по проектированию

The MC9S08SH4MFK QFN-EP package dissipates heat primarily through the exposed pad. Per NXP layout guidelines, the PCB land pattern must include a continuous ground copper pour under the EP with at least 8 thermal vias to the inner ground plane; without this, junction temperature can exceed 105 C in continuous 40 MHz operation at 5 V. Estimate: at 40 MHz / 5 V typical core current ~10 mA, dissipation ~50 mW - thermal performance is comfortable in most designs.

Place a 100 nF ceramic decoupling capacitor within 5 mm of the VDD pin, plus a 4.7 uF bulk capacitor on the supply rail. Add a 10 uF bulk reservoir on the main board input to absorb load-step transients from the internal regulator. The internal voltage regulator powers the core from VDD; ensure VDD rises monotonically at power-up to avoid spurious reset events.

Route the BKGD/MS pin as a single-wire debug interface; provide a 4.7 kohm pull-up to VDD and a test-point or header for the BDM tool. Keep ADC reference decoupling within 10 mm of the VREF pin (if used) and isolate analog/digital ground returns to a single point near the EP. Avoid routing high-speed signals across the EP pour to minimize coupling.

Do not leave the RESET pin floating - tie it to VDD through a 10 kohm pull-up with a 100 nF cap to ground for noise filtering. Avoid operating below 2.7 V - the low-voltage detect block will hold the device in reset, and Flash write/erase is not guaranteed. Ensure the BGND instruction is supported by your toolchain; legacy HC08 tools without BGND support cannot debug the HCS08 core.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS and REACH compliance per NXP product page; not AEC-Q100 qualified - choose S08 automotive-grade derivatives (e.g., S9S08AW16AEC) for safety-relevant automotive applications.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MC9S08SH4MFK MC9S08SH8MFK MC9S08SH4CFK MC9S08SH8CFK MC9S08QD4CPC HCS08 HC08 8-bit microcontroller MCU microcontroller Flash memory RAM ADC successive-approximation ADC BGND instruction internal oscillator QFN-EP QFN-24 RoHS REACH AEC-Q100 surface mount SMD industrial sensor consumer appliance IoT sensor node battery-powered device BLDC motor control automotive HMI
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