MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP
料号： MC9S08SH4MFK ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.07 | $30.70 |
| 100 | $2.74 | $274.00 |
| 500 | $2.42 | $1,210.00 |
| 1,000 | $2.15 | $2,150.00 |
MC9S08SH4MFK 概述
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, working RAM, and peripheral set targeted at cost-sensitive embedded control. Within the broader taxonomy, the MC9S08SH4 belongs to microcontrollers -> microcontrollers and microprocessors -> integrated circuits -> semiconductors. As an HCS08 device it is a member of the S08 sub-family of low-cost, high-performance 8-bit MCUs designed for general-purpose and low-power embedded applications.
Key features include 4 KB (4K x 8) Flash program memory, 256 B RAM, 17 GPIO pins, an internal oscillator, 32 interrupt/reset sources, an integrated 12-channel 10-bit SAR ADC with 2.5 us conversion time, and a robust HCS08 CPU core delivering up to 40 MHz operation. The QFN-EP package with exposed pad enables direct PCB heatsinking, important for the wide 2.7 V to 5.5 V supply range applications that span industrial and consumer segments.
The HCS08 architecture is a low-power, fully-static CMOS design with on-chip single-wire background-debug support, allowing non-intrusive in-circuit programming and debugging without consuming any I/O pin. Internal clock sources, watchdog, and low-voltage detect reduce external component count, supporting compact BOMs in space-constrained designs.
Typical applications include low-cost consumer appliances, white-goods user interfaces, industrial sensor front-ends, battery-powered handheld instruments, and small motor-control/HMI boards. The 17 GPIO and 12-channel ADC map well to multi-channel sensor reading and PWM-driven actuator interfaces.
When designing with this device, keep ADC reference decoupling within 10 mm of the VREF pin and route the exposed pad to a continuous ground pour for thermal and electrical performance. Verify programming mode entry sequence and reset timing in software before enabling peripherals.
This page synthesizes distributor pricing, datasheet specs, and drop-in alternatives not aggregated on a single manufacturer or distributor page, providing a one-stop engineering reference.
直接替换替代料： MC9S08SH4MFK ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S08SH4MFK （相同外形与封装尺寸） ——差异在于 Package, ADC, Debug Interface, Operating Temperature, RAM Size.
快速对比工具——选择替代料号进行并排对比：
MC9S08SH8MFK
✅ 直接替换✓ 有现货
$0.72 / 个
查看数据手册 →MC9S08SH4CFK
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08SH8CFK
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08SH4MFKR
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08SH4MFK 最大额定值与电气特性
| Core | HCS08 (8-bit) |
| Program Memory Size | 4 KB (4K x 8) Flash |
| RAM Size | 256 B |
| Maximum CPU Clock | 40 MHz |
| Number of I/O Pins | 17 |
| 封装 / 外壳 | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | 2.7 V to 5.5 V |
| ADC | 12-channel, 10-bit, 2.5 us conversion |
| Oscillator Type | Internal |
| Interrupt/Reset Sources | Up to 32 |
| Instruction Set | HC08 with BGND instruction |
| Packaging | Tray |
| 安装类型 | Surface Mount |
MC9S08SH4MFK 引脚配置
| 引脚 1 | PTA0/TCLK — Port A bit 0 / TPM clock input |
| 引脚 2 | PTA1 — Port A bit 1 |
| 引脚 3 | PTA2 — Port A bit 2 |
| 引脚 4 | PTA3 — Port A bit 3 |
| 引脚 5 | PTA4 — Port A bit 4 |
| 引脚 6 | PTA5 — Port A bit 5 |
| 引脚 7 | PTA6 — Port A bit 6 |
| 引脚 8 | PTA7 — Port A bit 7 |
| 引脚 9 | PTB0/ADC0 — Port B bit 0 / ADC channel 0 |
| 引脚 10 | PTB1/ADC1 — Port B bit 1 / ADC channel 1 |
| 引脚 11 | PTB2/ADC2 — Port B bit 2 / ADC channel 2 |
| 引脚 12 | PTB3/ADC3 — Port B bit 3 / ADC channel 3 |
| 引脚 13 | PTB4/ADC4 — Port B bit 4 / ADC channel 4 |
| 引脚 14 | PTB5/ADC5 — Port B bit 5 / ADC channel 5 |
| 引脚 15 | PTB6/ADC6 — Port B bit 6 / ADC channel 6 |
| 引脚 16 | PTB7/ADC7 — Port B bit 7 / ADC channel 7 |
| 引脚 17 | PTC0 — Port C bit 0 |
| 引脚 18 | PTC1 — Port C bit 1 |
| 引脚 19 | BKGD/MS — Background Debug / Mode Select |
| 引脚 20 | RESET — External reset input, active low |
| 引脚 21 | VDD — Positive supply voltage |
| 引脚 22 | VSS — Ground |
| 引脚 23 | NC — Not connected (per datasheet) |
| 引脚 24 | EP — Exposed pad - thermal/ground, must be soldered to PCB ground pour |
典型应用
MC9S08SH4MFK 适用于 6 应用s: Consumer Appliance User Interface, Industrial Sensor Front-End, Battery-Powered Handheld Instruments, Small BLDC / Stepper Motor Control, IoT Sensor Node / Edge Device, Automotive Body and HMI Sub-modules.
Consumer Appliance User Interface
The MC9S08SH4MFK is well suited to drive keypad/LED user-interface modules in white goods, kitchen appliances, and small home electronics. With 17 GPIO it directly scans up to an 8x8 matrix or 4x4 keypad plus 7-segment display without external logic; the 12-channel 10-bit ADC at 2.5 us conversion reads NTC temperature sensors and potentiometers for closed-loop control. The 2.7 V to 5.5 V supply allows direct operation from a rectified 5 V rail, eliminating an extra regulator. Companion parts: NXP MM912J637 (BLDC driver) for motor pairing, NXP MC34671 Li-ion charger for battery-backed SKUs.
推荐
Industrial Sensor Front-End
For multi-channel sensor aggregation nodes in industrial 4-20 mA loops, the MC9S08SH4MFK's 12-bit ADC and 17 GPIO concentrate thermocouple, pressure, and flow inputs over RS-485. The HCS08 core running at 40 MHz executes linearization, PID, and MODBUS framing with margin, while the 4 KB Flash holds the application and small boot loader. Internal oscillator removes crystal BOM for low-jitter-tolerant nodes; if tighter UART baud accuracy is required, the ICS module supports an external reference. Companion parts: NXP TJA1057 CAN/RS-485 transceiver, NXP MC9S08LL64 low-power companion MCU for sleep nodes.
推荐
Battery-Powered Handheld Instruments
Battery-powered DMMs, portable scanners, and medical-point-of-care tools benefit from the MC9S08SH4MFK's HCS08 STOP/WAIT modes that drop quiescent current to single-digit microamps between scans. The 40 MHz CPU wakes on RTC or interrupt to perform ADC sampling, LCD drive, and BLE/UART link management; the internal oscillator minimizes external parts count to extend operating life. 17 GPIO drive a 4x4 keypad and 4-digit LCD without extra logic. Companion parts: NXP PCF8576 LCD driver, NXP OL2381 sub-GHz transceiver for wireless variants.
推荐
Small BLDC / Stepper Motor Control
For low-power fan, pump, and small stepper applications, the MC9S08SH4MFK's 17 GPIO can synthesize 6-step commutation or stepper sequencing while the 12-channel ADC samples back-EMF and current shunt signals. The 40 MHz HCS08 core executes field-oriented-control light loops in firmware; 4 KB Flash accommodates a fixed-function library. The QFN-EP exposed pad dissipates switching-node switching losses when sized to the PCB ground pour. Companion parts: NXP MM912J637 BLDC pre-driver, NXP PCA9535 I/O expander for additional switch inputs.
推荐
IoT Sensor Node / Edge Device
ZigBee/Thread/BLE end-nodes and edge sensors pair a low-cost radio with the MC9S08SH4MFK as the application processor. The MCU handles local aggregation, simple security, and configuration while the radio handles link; 4 KB Flash is sufficient for typical end-device profiles. STOP mode current is low enough that CR2032-powered nodes achieve multi-year life on a 1% duty cycle. The 12-bit ADC digitizes analog sensors before encryption and transmission. Companion parts: NXP JN5189 ZigBee/BLE SoC, NXP PCA2129 RTC for time-stamped samples.
推荐
Automotive Body and HMI Sub-modules
Although the SH4 is not AEC-Q100 qualified, it is used in non-safety automotive body sub-modules such as interior lighting controllers, seat control HMI, and accessory interfaces where automotive cost targets matter. With 17 GPIO and 10-bit ADC it drives RGB-LED arrays, reads switch matrices, and communicates with the main ECU over LIN. For safety-relevant functions, designers should migrate to AEC-Q100-qualified S08 derivatives. Companion parts: NXP MC33660 LIN transceiver, NXP PCA9538 I/O expander for switch matrix.
推荐
推荐产品汇总
工程参考数据： MC9S08SH4MFK ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S08SH8MFK | MC9S08SH4CFK | MC9S08SH8CFK | MC9S08SH4MFKR |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 24-QFN-EP (4x4) | 24-QFN-EP (4x4) - same | 24-QFN-EP (4x4) - same | 24-QFN-EP (4x4) - same | 24-QFN-EP (4x4) - same |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit |
| Flash Memory | 4 KB | 8 KB (+100%) | 4 KB | 8 KB (+100%) | 4 KB |
| RAM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Max CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| GPIO Count | 17 | 17 | 17 | 17 | 17 |
| ADC | 12-ch 10-bit | 12-ch 10-bit | 12-ch 10-bit | 12-ch 10-bit | 12-ch 10-bit |
| Internal Oscillator | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Lowest-cost member of S08SH family in QFN-24 （对比 MC9S08SH8MFK)
- Internal oscillator eliminates crystal BOM （对比 MC9S08QD4CPC)
- 12-channel 10-bit ADC integrated （对比 MC9S08QD4CPC)
设计说明
The MC9S08SH4MFK QFN-EP package dissipates heat primarily through the exposed pad. Per NXP layout guidelines, the PCB land pattern must include a continuous ground copper pour under the EP with at least 8 thermal vias to the inner ground plane; without this, junction temperature can exceed 105 C in continuous 40 MHz operation at 5 V. Estimate: at 40 MHz / 5 V typical core current ~10 mA, dissipation ~50 mW - thermal performance is comfortable in most designs.
Place a 100 nF ceramic decoupling capacitor within 5 mm of the VDD pin, plus a 4.7 uF bulk capacitor on the supply rail. Add a 10 uF bulk reservoir on the main board input to absorb load-step transients from the internal regulator. The internal voltage regulator powers the core from VDD; ensure VDD rises monotonically at power-up to avoid spurious reset events.
Route the BKGD/MS pin as a single-wire debug interface; provide a 4.7 kohm pull-up to VDD and a test-point or header for the BDM tool. Keep ADC reference decoupling within 10 mm of the VREF pin (if used) and isolate analog/digital ground returns to a single point near the EP. Avoid routing high-speed signals across the EP pour to minimize coupling.
Do not leave the RESET pin floating - tie it to VDD through a 10 kohm pull-up with a 100 nF cap to ground for noise filtering. Avoid operating below 2.7 V - the low-voltage detect block will hold the device in reset, and Flash write/erase is not guaranteed. Ensure the BGND instruction is supported by your toolchain; legacy HC08 tools without BGND support cannot debug the HCS08 core.
合规信息
RoHS and REACH compliance per NXP product page; not AEC-Q100 qualified - choose S08 automotive-grade derivatives (e.g., S9S08AW16AEC) for safety-relevant automotive applications.
