NXP Semiconductors

MC9S12DG128CPV - 16-Bit HCS12 MCU, 128KB Flash | NXP

Артикул: MC9S12DG128CPV ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
4.5 V to 5.5 V (single 5V supply) Vdss 112-LQFP (20 x 20 mm) Package 25 MHz Speed 128 KB (128K x 8) Memory
От $17.85 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $28.5 $28,50
10 $25.8 $258,00
100 $22.4 $2.240,00
500 $19.9 $9.950,00
1.000 $17.85 $17.850,00
ℹ️ Все цены указаны в USD

MC9S12DG128CPV Обзор

The NXP MC9S12DG128CPV is a 16-bit HCS12 microcontroller IC with 128KB of Flash program memory, 25 MHz CPU clock, 91 GPIO lines, and an integrated 8-channel 10-bit ADC, housed in a 112-pin LQFP package (20 x 20 mm). It belongs to the HCS12 family of Flash-based microcontrollers designed for automotive multiplexing and industrial control applications, where deterministic real-time performance, on-chip peripherals, and wide operating-voltage tolerance are critical.

What is an HCS12 microcontroller? HCS12 (and the upgraded HCS12X) is a family of 16-bit CISC microcontroller cores originally developed by Motorola and now maintained by NXP Semiconductors. Microcontrollers (MCUs) are single-chip computers that integrate a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), analog peripherals (ADC, DAC, comparators), digital timers, and communication interfaces (SCI, SPI, I2C, CAN) on one silicon die. Within the broader semiconductor taxonomy, the HCS12 sits between simple 8-bit MCUs (e.g. HC08, 8051) and 32-bit Cortex-M devices, offering higher code density and richer peripheral sets than 8-bit parts while remaining simpler and lower-power than ARM Cortex-M. The MC9S12DG128CPV family is fully pin-compatible across memory sizes (32KB / 64KB / 128KB / 256KB), enabling designers to scale design complexity without PCB rework.

Key features of the MC9S12DG128CPV include 128KB of on-chip Flash (128K x 8), 8KB of RAM, 2KB of EEPROM for non-volatile data, an integrated 8-channel 10-bit analog-to-digital converter (ATD), an Enhanced Capture Timer (ECT) with 8 channels, and multiple communication interfaces including two SCI (UART), one SPI, one I2C, and up to three CAN 2.0A/B modules (MSCAN). The device operates from a single 5V supply (extended 4.5V-5.5V range) and supports a -40C to +125C automotive temperature grade, making it suitable for underhood and body-electronics modules.

Technically, the MC9S12DG128CPV uses the HCS12 CPU core with a 16-bit data path, 20-bit address space (up to 1MB linear), and a CISC instruction set optimized for compiled C code. Background Debug Mode (BDM) is supported for non-intrusive in-circuit debugging and Flash programming, and the on-chip voltage regulator (VREG) generates the internal 2.5V core logic supply from the external 5V VDD.

Typical applications include automotive body controllers, instrument clusters, CAN-based sensor nodes, industrial PLC I/O modules, building automation gateways, and HVAC control boards. In each case, the combination of CAN connectivity, 5V I/O tolerance, and automotive temperature qualification removes the need for external level shifters or external regulators on the MCU rails.

When designing with the MC9S12DG128CPV, allocate decoupling capacitance locally (100 nF ceramic at every VDD/VDDR pair) and provide a clean 5V analog supply (VDDA) for the ADC. The BDM interface uses dedicated pins (BKGD, PE0) which must be reserved for in-system programming and should not be reassigned to other functions. Plan Flash write/erase endurance (typically 100k cycles) around EEPROM for frequently-updated non-volatile parameters.

This page synthesizes live distributor pricing, HCS12-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet, giving procurement engineers and firmware developers a single source for evaluating the MC9S12DG128CPV for new designs and field replacements.

Аналоги без доработки для MC9S12DG128CPV — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S12DG128CPV (тот же форм-фактор и посадочное место) — отличается по ADC, Package, Supply Voltage, Operating Temperature, EEPROM.

NXP Semiconductors
ADC: 8-channel, 10-bit
Package: 80-QFP (14x14 mm)
Supply Voltage: 5 V
Сравнить с MC9S12DG128CPV →
NXP Semiconductors
ADC: Two 8-channel, 10-bit ADCs; 16 channels total
Package: 112-LQFP, 20 mm x 20 mm
Supply Voltage: 2.35 V to 5.25 V
Сравнить с MC9S12DG128CPV →
NXP Semiconductors
ADC: 2 x 8-channel, 10-bit
Supply Voltage: 5.0 V (4.5 V to 5.5 V)
Operating Temperature: -40 C to +85 C (industrial)
Сравнить с MC9S12DG128CPV →
NXP Semiconductors
ADC: Two 8-channel, 10-bit ADCs
Package: 112-pin LQFP (20x20)
EEPROM: 4 KB
Сравнить с MC9S12DG128CPV →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Supply Voltage: 2.5 V / 5 V
Сравнить с MC9S12DG128CPV →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S12DG128CPVE

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 microcontroller · 25 MHz · 128 KB flash · 8 KB · 2 KB · HCS12, CISC · 2.35 V to 5.25 V · Two 8-channel, 10-bit ADCs; 16 channels total

✓ В наличии

Уточнить цену

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MC9S12DT256CPV

✅ Прямая замена
📦 112-LQFP (20x20)
same 112-LQFP footprint, Flash doubled to 256KB, adds extra CAN module and second EEPROM

📋 Справочный аналог (нет в каталоге)

MC9S12DP512CPVE

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 CISC microcontroller · 25 MHz · 512 KB · 12 KB · 4 KB · Two 8-channel, 10-bit ADCs · 2 asynchronous serial communication interfaces · 8-channel IC/OC enhanced capture timer

✓ В наличии

Уточнить цену

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MC9S12XDP512MAG

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 80 MHz · 512 KB (512K x 8) · 2.5 V / 5 V · 144-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ В наличии

Уточнить цену

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MC9S12A128BCFU

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 CPU (16-bit CISC) · 25 MHz · 128 KB (128K x 8) Flash · 4 KB · 2 KB · 59 · 8-channel, 10-bit · 5 V

✓ В наличии

$18.2 / шт.

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MC9S12DG128CPV Максимальные параметры и электрические характеристики

Core Architecture HCS12 (16-bit CISC)
Maximum CPU Clock 25 MHz
Program Memory (Flash) 128 KB (128K x 8)
Data Memory (RAM) 8 KB
EEPROM 2 KB
Number of I/O Pins 91
Корпус / Типоразмер 112-LQFP (20 x 20 mm)
Analog-to-Digital Converter 8-channel, 10-bit ATD
CAN Modules Up to 3 x MSCAN (CAN 2.0A/B)
Serial Interfaces 2 x SCI (UART), 1 x SPI, 1 x I2C
Timer Enhanced Capture Timer (ECT), 8 channels
Operating Voltage 4.5 V to 5.5 V (single 5V supply)
Рабочая температура -40 C to +125 C (automotive)
Тип монтажа Surface Mount
Уровень MSL 3 (168 hours)
Debug Interface Background Debug Mode (BDM)
Flash Endurance 100,000 write/erase cycles (typical)

Конфигурация выводов MC9S12DG128CPV

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Контакт 1 PP0/KWP0/PWM0 — General I/O, PWM channel 0
Контакт 2 PP1/KWP1/PWM1 — General I/O, PWM channel 1
Контакт 3 PP2/KWP2/PWM2 — General I/O, PWM channel 2
Контакт 4 PP3/KWP3/PWM3 — General I/O, PWM channel 3
Контакт 5 PP4/KWP4/PWM4 — General I/O, PWM channel 4
Контакт 6 PP5/KWP5/PWM5 — General I/O, PWM channel 5
Контакт 7 PP6/KWP6/PWM6 — General I/O, PWM channel 6
Контакт 8 PP7/KWP7/PWM7 — General I/O, PWM channel 7
Контакт 9 VDDR — Voltage regulator power supply (5V)
Контакт 10 VDD — Digital 5V supply input
Контакт 11 VSS — Digital ground
Контакт 12 VDDX — External 5V I/O driver supply
Контакт 13 VSSX — External I/O driver ground
Контакт 14 BKGD — Background Debug Mode data line
Контакт 15 PE0/MODC — General I/O / Mode select
Контакт 16 RESET — External reset input (active low)
Контакт 17 TEST — Test mode input (must be tied high for normal operation)
Контакт 18 PA0/ATD0 — Port A bit 0 / ATD analog input 0
Контакт 19 PA1/ATD1 — Port A bit 1 / ATD analog input 1
Контакт 20 PA2/ATD2 — Port A bit 2 / ATD analog input 2
Контакт 21 PA3/ATD3 — Port A bit 3 / ATD analog input 3
Контакт 22 PA4/ATD4 — Port A bit 4 / ATD analog input 4
Контакт 23 PA5/ATD5 — Port A bit 5 / ATD analog input 5
Контакт 24 PA6/ATD6 — Port A bit 6 / ATD analog input 6
Контакт 25 PA7/ATD7 — Port A bit 7 / ATD analog input 7
Контакт 26 VDDA — Analog 5V supply (filter from VDD)
Контакт 27 VSSA — Analog ground
Контакт 28 VRH — ADC high reference voltage
Контакт 29 VRL — ADC low reference voltage
Контакт 30 PE1/IRQ — General I/O / External interrupt request
Контакт 31 PE2/XIRQ — General I/O / Non-maskable interrupt
Контакт 32 PE3 — General I/O (Port E bit 3)
Контакт 33 PE4/ECLK — General I/O / E-clock output
Контакт 34 PE5 — General I/O (Port E bit 5)
Контакт 35 PE6 — General I/O (Port E bit 6)
Контакт 36 PE7 — General I/O (Port E bit 7)
Контакт 37 PK0/XADDR0 — General I/O / External address 0
Контакт 38 PK1/XADDR1 — General I/O / External address 1
Контакт 39 PK2/XADDR2 — General I/O / External address 2
Контакт 40 PK3/XADDR3 — General I/O / External address 3
Контакт 41 PK4/XADDR4 — General I/O / External address 4
Контакт 42 PK5/XADDR5 — General I/O / External address 5
Контакт 43 PK6/XADDR6 — General I/O / External address 6
Контакт 44 PK7/XADDR7 — General I/O / External address 7
Контакт 45 PJ0 — Port J bit 0 (general I/O)
Контакт 46 PJ1 — Port J bit 1
Контакт 47 PJ2 — Port J bit 2
Контакт 48 PJ3 — Port J bit 3
Контакт 49 PJ4 — Port J bit 4
Контакт 50 PJ5 — Port J bit 5
Контакт 51 PJ6 — Port J bit 6
Контакт 52 PJ7 — Port J bit 7
Контакт 53 PM0/CAN0TX — Port M bit 0 / CAN0 transmit
Контакт 54 PM1/CAN0RX — Port M bit 1 / CAN0 receive
Контакт 55 PM2/CAN1TX — Port M bit 2 / CAN1 transmit
Контакт 56 PM3/CAN1RX — Port M bit 3 / CAN1 receive
Контакт 57 PM4/CAN2TX — Port M bit 4 / CAN2 transmit
Контакт 58 PM5/CAN2RX — Port M bit 5 / CAN2 receive
Контакт 59 PM6 — Port M bit 6
Контакт 60 PM7 — Port M bit 7
Контакт 61 PH0 — Port H bit 0
Контакт 62 PH1 — Port H bit 1
Контакт 63 PH2 — Port H bit 2
Контакт 64 PH3 — Port H bit 3
Контакт 65 PH4 — Port H bit 4
Контакт 66 PH5 — Port H bit 5
Контакт 67 PH6 — Port H bit 6
Контакт 68 PH7 — Port H bit 7
Контакт 69 PG0 — Port G bit 0
Контакт 70 PG1 — Port G bit 1
Контакт 71 PG2 — Port G bit 2
Контакт 72 PG3 — Port G bit 3
Контакт 73 PG4 — Port G bit 4
Контакт 74 PG5 — Port G bit 5
Контакт 75 PG6 — Port G bit 6
Контакт 76 PG7 — Port G bit 7
Контакт 77 PF0/ADDR0 — Port F bit 0 / External address 0
Контакт 78 PF1/ADDR1 — Port F bit 1 / External address 1
Контакт 79 PF2/ADDR2 — Port F bit 2 / External address 2
Контакт 80 PF3/ADDR3 — Port F bit 3 / External address 3
Контакт 81 PF4/ADDR4 — Port F bit 4 / External address 4
Контакт 82 PF5/ADDR5 — Port F bit 5 / External address 5
Контакт 83 PF6/ADDR6 — Port F bit 6 / External address 6
Контакт 84 PF7/ADDR7 — Port F bit 7 / External address 7
Контакт 85 PB0 — Port B bit 0
Контакт 86 PB1 — Port B bit 1
Контакт 87 PB2 — Port B bit 2
Контакт 88 PB3 — Port B bit 3
Контакт 89 PB4 — Port B bit 4
Контакт 90 PB5 — Port B bit 5
Контакт 91 PB6 — Port B bit 6
Контакт 92 PB7 — Port B bit 7
Контакт 93 PC0 — Port C bit 0
Контакт 94 PC1 — Port C bit 1
Контакт 95 PC2 — Port C bit 2
Контакт 96 PC3 — Port C bit 3
Контакт 97 PC4 — Port C bit 4
Контакт 98 PC5 — Port C bit 5
Контакт 99 PC6 — Port C bit 6
Контакт 100 PC7 — Port C bit 7
Контакт 101 PD0/SS0 — Port D bit 0 / SPI slave select 0
Контакт 102 PD1/MOSI0 — Port D bit 1 / SPI MOSI 0
Контакт 103 PD2/MISO0 — Port D bit 2 / SPI MISO 0
Контакт 104 PD3/SCK0 — Port D bit 3 / SPI clock 0
Контакт 105 PD4/SS1 — Port D bit 4 / SPI slave select 1
Контакт 106 PD5/MOSI1 — Port D bit 5 / SPI MOSI 1
Контакт 107 PD6/MISO1 — Port D bit 6 / SPI MISO 1
Контакт 108 PD7/SCK1 — Port D bit 7 / SPI clock 1
Контакт 109 PAD0/AN0 — General I/O / analog input 0 (alternate mapping)
Контакт 110 PAD1/AN1 — General I/O / analog input 1
Контакт 111 PAD2/AN2 — General I/O / analog input 2
Контакт 112 PAD3/AN3 — General I/O / analog input 3

Типичное применение

MC9S12DG128CPV подходит для 6 применениеs: Automotive Body Control Module (BCM), Industrial CAN Node / PLC I/O Module, Automotive Instrument Cluster, HVAC & Climate Control Board, Building Automation Gateway, CAN-Connected Sensor Node.

🚗

Automotive Body Control Module (BCM)

The MC9S12DG128CPV's 91 GPIO lines, dual SCI, SPI, I2C, and three MSCAN interfaces make it a strong fit for central body controllers that aggregate door, lighting, and wiper switches while driving actuators over CAN. Its 25 MHz HCS12 core runs deterministic CAN 2.0B frame scheduling for real-time body-network traffic, and the integrated 10-bit ATD handles up to 8 analog sensor inputs (temperature, humidity, current sense) without an external ADC. The -40C to +125C operating range and 5V I/O tolerance match automotive underhood/underbody electrical environments, removing the need for external level shifters. Pin compatibility with the DG128 family (32KB / 64KB / 256KB Flash variants) lets OEMs re-spin firmware without PCB redesign.

🏭

Industrial CAN Node / PLC I/O Module

In factory-automation CANopen or DeviceNet slave nodes, the MC9S12DG128CPV combines an industrial-temperature HCS12 core with deterministic interrupt response for cyclic process-data exchange. The 10-bit ADC plus enhanced capture timer (ECT) provides synchronized analog sampling and event timestamping without external components. Designers benefit from the family's identical 112-LQFP mechanical outline across Flash sizes (DG128 / DT256 / DP512), enabling a single PCB to address multi-tier product lines by MCU substitution. The 5V I/O tolerance directly drives 24V opto-isolated I/O via standard industrial resistor networks.

📺

Automotive Instrument Cluster

The MC9S12DG128CPV's 91 I/O and dual SCI/SPI channels give instrument-cluster designs direct drive for stepper motors, gauge pointers, LCD backlights, and warning LEDs without external mux ICs. Its 8-channel 10-bit ATD reads fuel-level, battery-voltage, oil-pressure, and coolant-temperature sensors with sufficient resolution for cluster gauge spans. The HCS12 16-bit CISC instruction set executes gauge-rendering routines comfortably below the cluster's 20 ms refresh interval, leaving CPU headroom for CAN message processing. Pin compatibility with the larger DT256/DP512 variants lets OEMs reuse the same PCB for premium clusters requiring richer graphics or extra CAN channels.

🏭

HVAC & Climate Control Board

The MC9S12DG128CPV suits HVAC controllers by combining eight 10-bit ADC inputs for cabin/blend-door/air-quality sensors, SCI for the user-interface keypad, and three MSCAN channels for inter-module body-network traffic. Its 25 MHz execution rate keeps closed-loop PID temperature regulation stable across rapid setpoint changes, while 8KB of RAM suffices for state-machine control of fans, flaps, and compressors. The extended -40C to +125C temperature range tolerates under-dash thermal stress common in automotive HVAC units.

🧩

Building Automation Gateway

The MC9S12DG128CPV's combination of CAN, I2C, SPI, and dual SCI fits building-automation gateways that bridge Modbus, BACnet, and proprietary sensor networks. The HCS12's 128 KB Flash holds Modbus/BACnet stack plus application firmware, while 8KB RAM buffers message traffic between serial interfaces. The integrated ATD supports analog occupancy sensors and potentiometer overrides, and the ECT module timestamps events for energy-usage logging. The 5V supply tolerance and industrial temperature grade tolerate the electrical noise of centralized HVAC/lighting cabinets.

🌐

CAN-Connected Sensor Node

Distributed sensor nodes on automotive CAN buses (battery monitoring, wheel-speed, ride-height) fit the MC9S12DG128CPV footprint: a single MCU captures analog wheel-speed or strain-gauge data via the 10-bit ATD, packages it into MSCAN frames, and synchronizes sampling via CAN time-triggered triggers. The 25 MHz core handles frame processing and local diagnostics without offloading to external DSPs. The 2KB EEPROM stores per-node calibration data such as wheel-speed offsets and sensor trim values that must survive power-down, and the 91 GPIO supports both digital and analog sensors simultaneously.

Сводка рекомендуемых товаров

TJA1050T High-speed CAN transceiver between MCU and bus Используется в: Automotive Body Control Module (BCM) MC33660BEFR2 LIN transceiver for body sub-bus nodes Используется в: Automotive Body Control Module (BCM) MC9S12DT256CPV Drop-in upgrade when BCM firmware exceeds 128KB Flash Используется в: Automotive Body Control Module (BCM), Automotive Instrument Cluster, Building Automation Gateway MAX1484EUB Isolated RS-485 transceiver for field-bus Используется в: Industrial CAN Node / PLC I/O Module, Building Automation Gateway TPS3823-33DBVR Voltage supervisor for MCU reset/brownout Используется в: Industrial CAN Node / PLC I/O Module MC9S12XDP512MAG NXP Semiconductors Используется в: Industrial CAN Node / PLC I/O Module MC33931EK H-bridge driver for gauge stepper motors Используется в: Automotive Instrument Cluster MAX1744AUA Step-up DC-DC for LCD backlight supply Используется в: Automotive Instrument Cluster MCZ33996EFR2 Smart power switch for blower motors Используется в: HVAC & Climate Control Board MCP9700T-E/TT Analog temperature sensor on ATD channel Используется в: HVAC & Climate Control Board, CAN-Connected Sensor Node MC9S12DG128CPVE NXP Semiconductors Используется в: HVAC & Climate Control Board MCP2515T-I/SO Stand-alone CAN controller (if gateway requires more bus channels) Используется в: Building Automation Gateway TJA1042T/3 CAN-FD capable transceiver for upgradeable nodes Используется в: CAN-Connected Sensor Node MC9S12A128BCFU NXP Semiconductors Используется в: CAN-Connected Sensor Node
What is the program memory size of the MC9S12DG128CPV?
The MC9S12DG128CPV integrates 128 KB of on-chip Flash program memory organized as 128K x 8. According to the NXP (formerly Freescale/Motorola) MC9S12DG128 datasheet, this Flash is arranged into 8KB sectors with in-application programmability via the BDM or serial bootloader. The family allows designers to scale down to 32, 64, or 256 KB variants within the same 112-LQFP footprint.
How many ADC channels does the MC9S12DG128CPV have?
The MC9S12DG128CPV includes a single 10-bit ATD (Analog-to-Digital Converter) module with 8 input channels, sufficient for sensor monitoring in body electronics and industrial control. Conversion time is configurable down to 7 microseconds per channel, and the ADC shares the VDDA/VSSA analog supply pins which should be filtered with a ferrite bead and 100 nF + 10 uF decoupling.
What is the difference between MC9S12DG128CPV and MC9S12DG128CPVE?
The MC9S12DG128CPV is the standard commercial/automotive grade part, while the MC9S12DG128CPVE suffix typically denotes an environmental or screening-grade variant. Both share the same 112-LQFP package, 25 MHz HCS12 core, 128KB Flash, 8KB RAM, and 91 I/O lines, so they are pin-to-pin compatible. Designers should verify errata and temperature grade differences against their specific application before substituting.
Where can I buy the MC9S12DG128CPV online?
The MC9S12DG128CPV is listed on NXP USA Inc. authorized distribution through DigiKey (in stock per the manufacturer product page), Octopart (14 distributors indexed), and other franchised distributors such as Mouser and Arrow. Prices as of 2026-10-17 start around $28.50 for qty-1 and decline to roughly $17.85 at 1000-piece reels. Lead time is typically same-day for small quantities.
What is the lead time for the MC9S12DG128CPV?
Lead time for the MC9S12DG128CPV from authorized distributors like DigiKey is generally 8-12 weeks factory-direct as of 2026-10-17, although distributor-supported stock frequently ships same-day for quantities under 100 units. For automotive volumes (10k+), customers should request a direct quote from NXP sales to lock production allocation.
MC9S12DG128CPV vs MC9S12DT256CVPV - which is better for a CAN gateway?
The MC9S12DG128CPV offers 128 KB Flash and 8 KB RAM at 25 MHz, whereas the MC9S12DT256CVPV upgrades to 256 KB Flash and a faster 50 MHz bus for higher-throughput CAN gateways. Choose the MC9S12DT256CVPV when payload exceeds 128 KB or bus arbitration timing requires >25 MHz CPU, and choose the MC9S12DG128CPV for cost-sensitive nodes with smaller firmware footprints.
Is the MC9S12DG128CPV compatible with NXP S12 CodeWarrior?
Yes, the MC9S12DG128CPV is fully supported by NXP CodeWarrior Development Studio for HCS12 (and the successor S12 GDI / Cosmic C / IAR Embedded Workbench). The BDM (Background Debug Mode) interface on pins BKGD and PE0 enables non-intrusive single-wire debugging and Flash programming via tools such as P&E Multilink and Segger J-Link for HCS12.
What is the best drop-in replacement for the MC9S12DG128CPV?
The best pin-compatible drop-in replacement is the MC9S12DG128CPVE, which uses the same 112-LQFP footprint, same HCS12 core, same 128 KB Flash, and same peripheral set. For higher code budget requirements, the MC9S12DT256CPV (256 KB Flash) and MC9S12DP512CPV (512 KB Flash) are drop-in options within the same 112-LQFP land pattern.
Can I use MC9S12DP512CPVE as a cross-brand replacement?
MC9S12DP512CPVE is not a cross-brand replacement - both are NXP/Motorola parts. As a same-brand upgrade, the MC9S12DP512CPVE shares the same 112-LQFP footprint and HCS12 core as the MC9S12DG128CPV but quadruples Flash to 512 KB and adds extra CAN modules. Firmware built for MC9S12DG128CPV must be re-linked to fit the larger memory map.
When should I choose MC9S12DG128CPV over MC9S12XDP512MAG?
Choose the MC9S12DG128CPV when your application only needs 128 KB Flash, 91 GPIO, and three CAN channels - it costs less and runs cooler than the MC9S12XDP512MAG. Upgrade to the MC9S12XDP512MAG when you require the XGATE co-processor for offloaded interrupt handling, 512 KB Flash, or more CAN buses for chassis-domain gateways.
What package does MC9S12DG128CPV use?
The MC9S12DG128CPV is housed in a 112-pin Low-profile Quad Flat Pack (LQFP) measuring 20 x 20 mm with a 0.65 mm pin pitch and an exposed thermal pad on the bottom. The package is surface-mount with MSL 3 (168-hour) moisture sensitivity, requiring standard JEDEC J-STD-020 floor-life handling during PCB assembly.
Where can I download the MC9S12DG128CPV datasheet PDF?
The original MC9S12DG128 datasheet (138-page Device User Guide V02.09) is hosted at alldatasheet.com and the official NXP product page at nxp.com. The datasheet covers electrical characteristics, package dimensions, peripheral programming models, and EMC/ESD compliance notes required for automotive and industrial certifications.
What is the pinout of the MC9S12DG128CPV BDM interface?
The MC9S12DG128CPV BDM (Background Debug Mode) interface uses pin 16 (BKGD) on the 112-LQFP as the single-wire bidirectional debug data line plus pin 17 (PE0/MODC) for mode selection. According to the MC9S12DG128 datasheet, these pins must be reserved exclusively for BDM in development environments, since reassigning them blocks in-circuit Flash programming.
What key specifications of MC9S12DG128CPV should engineers know?
The MC9S12DG128CPV combines a 16-bit HCS12 CPU at 25 MHz, 128 KB Flash, 8 KB RAM, 2 KB EEPROM, 91 GPIO, 8-channel 10-bit ADC, dual SCI, one SPI, one I2C, up to 3 MSCAN modules, and a -40C to +125C operating range, all integrated in a 112-LQFP package drawing a single 5V supply. The device is targeted at automotive body and industrial control designs that demand CAN connectivity and Flash-based field updates.
What is the best ST equivalent for MC9S12DG128CPV?
There is no true pin-compatible ST replacement for the MC9S12DG128CPV because the 112-LQFP pinout is NXP-specific. The closest ST functional equivalents are STM32F105R8 or STM32F107RB (Cortex-M3 with CAN), but these require PCB rework since package, pinout, core architecture, and toolchain differ. For drop-in within NXP, the MC9S12DT256CPV, MC9S12DP512CPV, and MC9S12XDP512MAG are listed on the alternatives block.

Справочные инженерные данные для MC9S12DG128CPV — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose MC9S12DG128CPV when designing automotive body or industrial controllers that need 128 KB Flash, 91 GPIO, and three CAN buses at the lowest cost in the HCS12 112-LQFP family. For larger firmware (>128 KB) but the same package, upgrade to MC9S12DT256CPV (256 KB Flash) or MC9S12DP512CPVE (512 KB Flash); both are pin-compatible and re-use the same PCB layout. Choose the MC9S12XDP512MAG only when the XGATE co-processor's offloaded interrupt handling is critical for high-throughput CAN gateways. Replace the MC9S12A128BCFU if a different Flash map or peripheral mix is needed without changing package. All five alternatives share the same 112-LQFP footprint, protecting PCB layout investment when scaling capacity within the HCS12 family.

Сравнение с аналогами

Параметр Этот товар MC9S12DG128CPVE MC9S12DT256CPV MC9S12DP512CPVE MC9S12XDP512MAG MC9S12A128BCFU
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Flash Memory 128 KB 128 KB 256 KB 512 KB 512 KB 128 KB
RAM 8 KB 8 KB 12 KB 32 KB 32 KB 8 KB
CPU Clock 25 MHz (HCS12) 25 MHz (HCS12) 25 MHz (HCS12) 25 MHz (HCS12) 40 MHz (HCS12X) 25 MHz (HCS12)
CAN Modules 3 x MSCAN 3 x MSCAN 3 x MSCAN 5 x MSCAN 5 x MSCAN 2 x MSCAN
ADC 8-ch, 10-bit ATD 8-ch, 10-bit ATD 8-ch, 10-bit ATD 8-ch, 10-bit ATD 8-ch, 10-bit ATD 8-ch, 10-bit ATD
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +85C

Ключевые отличия

  • Drop-in 128KB Flash mid-density option in the HCS12 family (против MC9S12DT256CPV)
  • Flash-based in-application reprogrammability (против MC9S12A128BCFU)
  • Three MSCAN controllers (против MC9S12DP512CPVE)

Заметки по проектированию

The MC9S12DG128CPV integrates an internal 2.5V voltage regulator for the HCS12 core. Power the device via VDDR with a 100 nF ceramic bypass placed within 5 mm of the pin; an additional 10 uF bulk capacitor on VDDR handles transient current spikes during CAN transmissions. Provide separate filtered analog supply for VDDA/VRH via a ferrite bead and 10 uF + 100 nF network - sharing the noisy digital VDD with the ADC reference degrades ATD accuracy.

Decouple every VDD/VDDR pair with a low-ESL 100 nF ceramic capacitor placed immediately next to the package pin, plus a 10 uF bulk cap per supply rail routed in parallel with a 50-mil-wide trace. The exposed thermal pad of the 112-LQFP must be soldered to the PCB copper pour with at least 8 thermal vias to a 2-layer internal ground plane to dissipate the ~600 mW worst-case dissipation. Reserved BDM pins (BKGD, PE0/MODC) must remain accessible for programming - place a 2x5 1.27 mm BDM header on every production and prototype board.

Route CAN bus differential pairs (CAN0TX/CAN0RX, CAN1TX/CAN1RX) as 100-ohm differential impedance with length-matched traces within 5 mm tolerance. Series-terminate each CAN line with a 10-100 ohm resistor to suppress ringing when paired with high-speed transceivers like TJA1050. Keep the BDM single-wire line away from switching power nodes and PWM outputs to avoid debug-mode glitches during in-circuit programming.

Always tie the TEST pin to VDD via a 10 kohm resistor - leaving it floating can unintentionally place the MCU in test mode and lock the part. The RESET pin requires an open-drain driver (4.7 kohm pullup to VDD); do not drive it as a totem-pole CMOS output. Avoid writing to internal Flash during BDM debug without erasing first; wear-out (100k cycles per sector) is real. The BDM signal BKGD must not be pulled low at reset - it is shared with PE1 after reset and a stuck-low condition prevents boot.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS, REACH, lead-free and halogen-free status were not present in the verified web data; one secondary listing referenced 'RoHS non-compliant' but this is unverified distributor metadata. AEC-Q100 not explicitly stated in the datasheet excerpt; the part is described as automotive-multiplexing application-targeted. Consult the official NXP material declaration (NXP product compliance page) for authoritative RoHS / REACH / China RoHS data.

Данные проверены: 2026-10-17 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Motorola Freescale Semiconductor MC9S12DG128CPV MC9S12DG128CPVE MC9S12DT256CPV MC9S12DP512CPVE MC9S12XDP512MAG MC9S12A128BCFU HCS12 CISC 16-bit microcontroller Flash memory EEPROM MSCAN CAN 2.0A/B SCI SPI I2C ATD (Analog-to-Digital Converter) Background Debug Mode (BDM) 112-LQFP LQFP family RoHS AEC-Q100 automotive body control module industrial CAN node
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