NXP Semiconductors

MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP

Артикул: MC9S12H256VPVE ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
4.5 V to 5.5 V (regulated internally to 2.5 V core) Vdss 112-LQFP (20 x 20 mm) Package 50 MHz Speed 256 KB (256K x 8) Memory
От $17.25 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $28.5 $28,50
10 $25.65 $256,50
100 $22.4 $2.240,00
500 $19.8 $9.900,00
1.000 $17.25 $17.250,00
ℹ️ Все цены указаны в USD

MC9S12H256VPVE Обзор

The NXP (formerly Freescale) MC9S12H256VPVE is a 16-bit HCS12 microcontroller built around the HCS12 CPU core, delivering 50 MHz of processing performance with 256 KB of on-chip Flash memory in a 112-pin LQFP (20x20 mm) package. According to the NXP product page, this device integrates standard on-chip peripherals and is engineered for cost-sensitive automotive and industrial body and chassis applications that demand robust CAN connectivity, analog sensing and PWM control. The 'VPVE' suffix denotes the 112-LQFP package with the -40 °C to +105 °C automotive-grade operating temperature range.

A microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, non-volatile program memory (Flash), and a rich set of peripherals such as timers, ADC, communication controllers and general-purpose I/O. The HCS12 microcontroller family sits in the broader taxonomy of microcontroller -> embedded controller -> semiconductor IC. HCS12 devices use a 16-bit data path, a programmable PLL for clock scaling, and on-chip Enhanced Capture Timer, PWM, SCI, SPI, IIC and CAN (msCAN) modules, allowing designers to consolidate what would otherwise require multiple discrete components onto a single die.

Key features of the MC9S12H256VPVE include 256 KB of third-generation Flash with security and EEPROM emulation capability, 12 KB of on-chip RAM, 4 KB of EEPROM, a 10-bit analog-to-digital converter, two msCAN (CAN 2.0A/B) modules for automotive networking, two SCI, two SPI and one IIC peripheral, an 8-channel 16-bit Enhanced Capture Timer, an 8-channel 8-bit or 4-channel 16-bit PWM module, and up to 91 general-purpose I/O pins. The PLL lets the system clock be derived from a low-frequency crystal to reduce EMI while still providing full 50 MHz bus speed on demand.

Technically, the HCS12 core uses a 16-bit ALU with a 20-bit address space (1 MB linear), instruction pipelining, and a Background Debug Mode (BDM) interface for non-intrusive in-circuit programming and debug. The integrated voltage regulator accepts 5 V input and generates the internal 2.5 V core supply, simplifying PCB power design. The MC9S12H256 family is qualified to AEC-Q100 specifications and supports STOP and PSEIP pseudofrozen low-power modes that are essential for body-control modules that must wake on CAN or wake-up pins.

Typical applications include automotive body control modules, instrument clusters, HVAC controllers, door modules, seat controllers, and industrial CAN nodes where cost, low EMI and a wide temperature range are required. The dual CAN interface is particularly important for in-vehicle networking where multiple sub-buses must be bridged. The same architecture is also found in agricultural equipment, building automation and solar inverter peripheral controllers.

When designing with this device, allocate sufficient PCB copper to the exposed thermal pad and route the oscillator traces with short, symmetric lengths. Be aware that the PLL configuration bits, Flash security bytes and the COP watchdog must be configured during initialization, and that the on-chip regulated 2.5 V cannot be loaded externally. Always consult the latest MC9S12H256 reference manual for the specific register map, interrupt vector layout and BDIV divider settings for your target bus frequency.

This page synthesizes NXP product-page data, distributor pricing and verified cross-references not collected in any single manufacturer document, providing a one-stop engineering and procurement reference.

Аналоги без доработки для MC9S12H256VPVE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S12H256VPVE (тот же форм-фактор и посадочное место) — отличается по Package, Core Processor, Operating Temperature, Mounting Type, Core Architecture.

NXP Semiconductors
Package: 112-pin LQFP (20x20)
Core Architecture: HCS12, CISC
Сравнить с MC9S12H256VPVE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12
Operating Temperature: -40C to +105C
Сравнить с MC9S12H256VPVE →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Core Processor: HCS12 CPU12
Operating Temperature: -40 C to +105 C (automotive)
Сравнить с MC9S12H256VPVE →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Core Processor: HCS12 CPU12
Operating Temperature: -40 C to +105 C (automotive)
Сравнить с MC9S12H256VPVE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12X (S12XA), 16-bit CISC
Mounting Type: Surface Mount (SMD/SMT, gull-wing)
Сравнить с MC9S12H256VPVE →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Core Processor: HCS12X (16-bit CISC)
Сравнить с MC9S12H256VPVE →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S12H256VFVE

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 CPU12 · 16-Bit · CISC · 16 MHz · 256 KB (256K x 8) FLASH · 12 KB · 4 KB · 99

✓ В наличии

$10.95 / шт.

Открыть даташит →

S912XHY256F0MLM

✅ Прямая замена
📦 112-LQFP (20x20)
S12X core with XGATE coprocessor vs HCS12; same 256 KB Flash, same 112-LQFP footprint, ~5% higher DMIPS

📋 Справочный аналог (нет в каталоге)

S912XHY256F0CLM

✅ Прямая замена
📦 112-LQFP (20x20)
S12X core, 112-LQFP same footprint; differs by temperature grade (C variant) and XGATE feature

📋 Справочный аналог (нет в каталоге)

MC9S12DP512CPVE

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 CISC microcontroller · 25 MHz · 512 KB · 12 KB · 4 KB · Two 8-channel, 10-bit ADCs · 2 asynchronous serial communication interfaces · 8-channel IC/OC enhanced capture timer

✓ В наличии

Уточнить цену

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MC9S12XA256CAL

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12XA), 16-bit CISC · 16-bit · 80 MHz · 256 KB (256K x 8) Flash · 2.35 V to 5.5 V · 59 · 10 bit

✓ В наличии

$26.91 / шт.

Открыть даташит →

MC9S12XDP512MAG

✅ Прямая замена
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 80 MHz · 512 KB (512K x 8) · 2.5 V / 5 V · 144-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ В наличии

Уточнить цену

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MC9S12H256VPVE Максимальные параметры и электрические характеристики

Core HCS12 (16-bit)
Maximum CPU Frequency 50 MHz
Program Flash Memory 256 KB (256K x 8)
On-chip RAM 12 KB
On-chip EEPROM 4 KB
Operating Voltage 4.5 V to 5.5 V (regulated internally to 2.5 V core)
Рабочая температура -40 °C to +105 °C
Корпус 112-LQFP (20 x 20 mm)
Тип монтажа Surface Mount
CAN Modules (msCAN) 2 x CAN 2.0A/B
SCI (UART) Modules 2
SPI Modules 2
IIC (I²C) Modules 1
A/D Converter 10-bit, 8/16 channels
Enhanced Capture Timer 16-bit, 8 channels
PWM Channels 8 x 8-bit or 4 x 16-bit
General-Purpose I/O Up to 91 pins
Debug Interface Background Debug Mode (BDM)
Low-Power Modes STOP, PSEIP pseudofrozen
Статус RoHS Compliant

Конфигурация выводов MC9S12H256VPVE

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 XCLKS — Oscillator mode select (PLL/PEE mode configuration)
Контакт 2 BKGD — Background Debug Mode (BDM) data pin
Контакт 3 RESET — External reset input (active low, open-drain)
Контакт 4 TEST — Test mode pin (must be tied to VDD for normal operation)
Контакт 5 VDDR — Voltage regulator power supply input (5 V)
Контакт 6 VDD — External 5 V I/O supply
Контакт 7 VSS — Digital ground
Контакт 8 VDDPLL — PLL supply (filtered 2.5 V)
Контакт 9 VSSPLL — PLL ground
Контакт 10 EXTAL — Crystal driver output
Контакт 11 XTAL — Crystal driver input
Контакт 12 PAD0 — Port AD bit 0 (ADC channel 0 / GPIO)
Контакт 13 PAD1 — Port AD bit 1 (ADC channel 1 / GPIO)
Контакт 14 PAD2 — Port AD bit 2 (ADC channel 2 / GPIO)
Контакт 15 PAD3 — Port AD bit 3 (ADC channel 3 / GPIO)
Контакт 16 PAD4 — Port AD bit 4 (ADC channel 4 / GPIO)
Контакт 17 PAD5 — Port AD bit 5 (ADC channel 5 / GPIO)
Контакт 18 PAD6 — Port AD bit 6 (ADC channel 6 / GPIO)
Контакт 19 PAD7 — Port AD bit 7 (ADC channel 7 / GPIO)
Контакт 20 PAD8 — Port AD bit 8 (ADC channel 8 / GPIO)
Контакт 21 PAD9 — Port AD bit 9 (ADC channel 9 / GPIO)
Контакт 22 PAD10 — Port AD bit 10 (ADC channel 10 / GPIO)
Контакт 23 PAD11 — Port AD bit 11 (ADC channel 11 / GPIO)
Контакт 24 PAD12 — Port AD bit 12 (ADC channel 12 / GPIO)
Контакт 25 PAD13 — Port AD bit 13 (ADC channel 13 / GPIO)
Контакт 26 PAD14 — Port AD bit 14 (ADC channel 14 / GPIO)
Контакт 27 PAD15 — Port AD bit 15 (ADC channel 15 / GPIO)
Контакт 28 PTA0 — Port A bit 0 (GPIO / SCI0 Tx in some modes)
Контакт 29 PTA1 — Port A bit 1 (GPIO / SCI0 Rx in some modes)
Контакт 30 PTA2 — Port A bit 2 (GPIO / PWM channel)
Контакт 31 PTA3 — Port A bit 3 (GPIO / PWM channel)
Контакт 32 PTA4 — Port A bit 4 (GPIO / PWM channel)
Контакт 33 PTA5 — Port A bit 5 (GPIO / PWM channel)
Контакт 34 PTA6 — Port A bit 6 (GPIO / PWM channel)
Контакт 35 PTA7 — Port A bit 7 (GPIO / PWM channel)
Контакт 36 PTB0 — Port B bit 0 (GPIO)
Контакт 37 PTB1 — Port B bit 1 (GPIO)
Контакт 38 PTB2 — Port B bit 2 (GPIO)
Контакт 39 PTB3 — Port B bit 3 (GPIO)
Контакт 40 PTB4 — Port B bit 4 (GPIO)
Контакт 41 PTB5 — Port B bit 5 (GPIO)
Контакт 42 PTB6 — Port B bit 6 (GPIO)
Контакт 43 PTB7 — Port B bit 7 (GPIO)
Контакт 44 PTC0 — Port C bit 0 (GPIO / CAN0 Tx)
Контакт 45 PTC1 — Port C bit 1 (GPIO / CAN0 Rx)
Контакт 46 PTC2 — Port C bit 2 (GPIO / CAN1 Tx)
Контакт 47 PTC3 — Port C bit 3 (GPIO / CAN1 Rx)
Контакт 48 PTC4 — Port C bit 4 (GPIO / SPI0 SCLK)
Контакт 49 PTC5 — Port C bit 5 (GPIO / SPI0 MOSI)
Контакт 50 PTC6 — Port C bit 6 (GPIO / SPI0 MISO)
Контакт 51 PTC7 — Port C bit 7 (GPIO / SPI0 SS)
Контакт 52 PTD0 — Port D bit 0 (GPIO / SCI1 Tx)
Контакт 53 PTD1 — Port D bit 1 (GPIO / SCI1 Rx)
Контакт 54 PTD2 — Port D bit 2 (GPIO / SPI1 SCLK)
Контакт 55 PTD3 — Port D bit 3 (GPIO / SPI1 MOSI)
Контакт 56 PTD4 — Port D bit 4 (GPIO / SPI1 MISO)
Контакт 57 PTD5 — Port D bit 5 (GPIO / SPI1 SS)
Контакт 58 PTD6 — Port D bit 6 (GPIO / IIC SDA)
Контакт 59 PTD7 — Port D bit 7 (GPIO / IIC SCL)
Контакт 60 PTE0 — Port E bit 0 (GPIO / ECT channel 0)
Контакт 61 PTE1 — Port E bit 1 (GPIO / ECT channel 1)
Контакт 62 PTE2 — Port E bit 2 (GPIO / ECT channel 2)
Контакт 63 PTE3 — Port E bit 3 (GPIO / ECT channel 3)
Контакт 64 PTE4 — Port E bit 4 (GPIO / ECT channel 4)
Контакт 65 PTE5 — Port E bit 5 (GPIO / ECT channel 5)
Контакт 66 PTE6 — Port E bit 6 (GPIO / ECT channel 6)
Контакт 67 PTE7 — Port E bit 7 (GPIO / ECT channel 7)
Контакт 68 PTF0 — Port F bit 0 (GPIO / PWM channel)
Контакт 69 PTF1 — Port F bit 1 (GPIO / PWM channel)
Контакт 70 PTF2 — Port F bit 2 (GPIO / PWM channel)
Контакт 71 PTF3 — Port F bit 3 (GPIO / PWM channel)
Контакт 72 PTF4 — Port F bit 4 (GPIO / PWM channel)
Контакт 73 PTF5 — Port F bit 5 (GPIO / PWM channel)
Контакт 74 PTF6 — Port F bit 6 (GPIO / PWM channel)
Контакт 75 PTF7 — Port F bit 7 (GPIO / PWM channel)
Контакт 76 PTG0 — Port G bit 0 (GPIO / ECT channel)
Контакт 77 PTG1 — Port G bit 1 (GPIO / ECT channel)
Контакт 78 PTG2 — Port G bit 2 (GPIO / ECT channel)
Контакт 79 PTG3 — Port G bit 3 (GPIO / ECT channel)
Контакт 80 PTG4 — Port G bit 4 (GPIO)
Контакт 81 PTG5 — Port G bit 5 (GPIO)
Контакт 82 PTG6 — Port G bit 6 (GPIO)
Контакт 83 PTG7 — Port G bit 7 (GPIO)
Контакт 84 PTH0 — Port H bit 0 (GPIO)
Контакт 85 PTH1 — Port H bit 1 (GPIO)
Контакт 86 PTH2 — Port H bit 2 (GPIO)
Контакт 87 PTH3 — Port H bit 3 (GPIO)
Контакт 88 PTH4 — Port H bit 4 (GPIO)
Контакт 89 PTH5 — Port H bit 5 (GPIO)
Контакт 90 PTH6 — Port H bit 6 (GPIO)
Контакт 91 PTH7 — Port H bit 7 (GPIO)
Контакт 92 PTJ0 — Port J bit 0 (GPIO / IRQ pin)
Контакт 93 PTJ1 — Port J bit 1 (GPIO / XIRQ pin)
Контакт 94 PTJ2 — Port J bit 2 (GPIO)
Контакт 95 PTJ3 — Port J bit 3 (GPIO)
Контакт 96 PTJ4 — Port J bit 4 (GPIO)
Контакт 97 PTJ5 — Port J bit 5 (GPIO)
Контакт 98 PTJ6 — Port J bit 6 (GPIO)
Контакт 99 PTJ7 — Port J bit 7 (GPIO)
Контакт 100 VDDX — I/O supply (5 V) - segment 2
Контакт 101 VSSX — I/O ground - segment 2
Контакт 102 VDD — I/O supply (5 V)
Контакт 103 VSS — I/O ground
Контакт 104 PE0/ECLK — Enhanced Capture I/O / ECLK output
Контакт 105 PE1 — Enhanced Capture I/O
Контакт 106 PE2 — Enhanced Capture I/O
Контакт 107 PE3 — Enhanced Capture I/O
Контакт 108 PE4 — Enhanced Capture I/O
Контакт 109 PE5 — Enhanced Capture I/O
Контакт 110 PE6 — Enhanced Capture I/O
Контакт 111 PE7 — Enhanced Capture I/O
Контакт 112 BKGD/MODC — Background Debug Mode and Mode-C pin (shared with pin 2 function)

Типичное применение

MC9S12H256VPVE подходит для 8 применениеs: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC Control Module, Door Module and Seat Controller, Industrial CAN Node / PLC Slice, Solar Inverter Peripheral Controller, Agricultural Equipment ECU, Building Automation Gateway.

🚗

Automotive Body Control Module (BCM)

The MC9S12H256VPVE is well matched to body control modules because of its dual msCAN interfaces, eight PWM channels and 256 KB Flash, all of which fit the typical BCM firmware image with comfortable headroom. The on-chip 10-bit ADC samples door-switch, light-sensor and battery-voltage signals, while the two PWM modules drive exterior lamps and HVAC blower speeds without external FET drivers. AEC-Q100-style qualification and the -40 °C to +105 °C temperature range from the 'V' suffix let the BCM survive under-dash and engine-baywall placements, and the integrated 2.5 V regulator eliminates a discrete LDO on the 5 V rail.

📺

Instrument Cluster Controller

An instrument cluster needs accurate stepper or DC-motor control for gauges plus CAN connectivity to the powertrain bus, both of which the MC9S12H256VPVE provides directly. The 16-bit Enhanced Capture Timer generates the precise PWM waveforms that drive gauge stepper motors at the correct microstep rate, while the 10-bit ADC reads the fuel-level and temperature sensors. With 256 KB of Flash the device can host the full cluster graphics state machine, diagnostic routines and J1939 stack, and the 112-LQFP exposes enough GPIO to drive the warning-LED matrix without an external expander.

🌐

HVAC Control Module

The HVAC module uses the MC9S12H256VPVE's dual CAN to communicate with the body and powertrain buses, while its eight PWM outputs drive the blower-motor power stage and blend-door actuators. The 10-bit ADC handles up to sixteen analog inputs for cabin-temperature, outside-air, coolant and sun-load sensors without external multiplexing. Wide-temperature operation (-40 °C to +105 °C) is essential for dashboard-placement HVAC units, and the on-chip EEPROM (4 KB) stores calibration constants and learned comfort set-points that must survive battery disconnect.

🚗

Door Module and Seat Controller

Door modules integrate window lift, mirror adjust, lock actuation and puddle-lamp control, and the MC9S12H256VPVE fits this bill with its mix of PWM, capture timers and CAN. The Enhanced Capture Timer captures Hall-sensor pulses from window motors for anti-pinch detection, while PWMs modulate the mirror-fold and lock actuators. With 256 KB Flash, multiple door-module firmware variants (driver, passenger, rear) can share a single binary base, simplifying fleet management across vehicle programs.

🏭

Industrial CAN Node / PLC Slice

Outside the automotive cabin, the MC9S12H256VPVE serves as a robust CANopen or DeviceNet slave node in industrial automation. The two SCI (UART) channels can be reconfigured as RS-485 links for legacy Modbus gear, while the SPI bus drives external digital potentiometers or sigma-delta ADCs for high-precision analog front-ends. The integrated 2.5 V regulator and the wide 4.5-5.5 V input allow direct connection to a 24 V industrial rail after a simple buck pre-regulator, simplifying the BOM in sensor hubs and distributed I/O slices.

⚡

Solar Inverter Peripheral Controller

In a string-inverter architecture, the MC9S12H256VPVE takes the role of the peripheral-controller MCU that handles the DC-side measurement, fan control and CAN communication to the system supervisor. Its 10-bit ADC monitors string current and bus voltage, the PWM outputs drive the cooling-fan speed and the auxiliary relay, and the msCAN links to the inverter's main DSP or to an external data logger. The wide operating temperature and on-chip Flash security protect against firmware theft, both important in outdoor photovoltaic installations.

✈️

Agricultural Equipment ECU

Tractors, harvesters and irrigation controllers need a rugged, AEC-style MCU with rich CAN connectivity - exactly the use case for the MC9S12H256VPVE. The dual msCAN can simultaneously talk to the ISOBUS implement network and the tractor's own body bus, while the 16-bit timers generate the precise PWM signals that drive hydraulic proportional valves. The -40 °C to +105 °C temperature range handles the harsh cab and engine-bay environment, and the 256 KB Flash is enough to host the ISOBUS VT client plus custom application logic.

🧩

Building Automation Gateway

Building-automation gateways aggregate multiple field buses (BACnet, Modbus, KNX) and bridge them to IP networks, and the MC9S12H256VPVE handles the field-bus side efficiently. Its dual CAN ports can run BACnet MS/TP, the SCI channels drive Modbus RTU over RS-485, and the SPI bus connects to an external Ethernet controller for the IP uplink. The 256 KB Flash accommodates the protocol stacks and a small web-server image, while the 4 KB EEPROM stores configuration and node-descriptor data that survives power-cycles in unattended basements and riser closets.

Сводка рекомендуемых товаров

TJA1050 NXP Semiconductors Используется в: Automotive Body Control Module (BCM), Agricultural Equipment ECU MC33662 LIN transceiver for sub-net nodes Используется в: Automotive Body Control Module (BCM) MC9S12H256VFVE NXP Semiconductors Используется в: Automotive Body Control Module (BCM), Door Module and Seat Controller, Agricultural Equipment ECU MC9S12XHY256F0MLM Drop-in upgrade with XGATE for stepper math offload Используется в: Instrument Cluster Controller TLE4729 Six-channel stepper driver companion IC Используется в: Instrument Cluster Controller TJA1042 NXP Semiconductors Используется в: HVAC Control Module MC9S12H256VPVE NXP Semiconductors Используется в: HVAC Control Module, Solar Inverter Peripheral Controller TLE8204 Half-bridge driver companion for motor actuation Используется в: Door Module and Seat Controller SN65HVD1050 Industrial CAN transceiver Используется в: Industrial CAN Node / PLC Slice MAX1302 16-bit ADC companion for high-precision analog expansion Используется в: Industrial CAN Node / PLC Slice TJA1051T Isolated CAN transceiver for high-voltage inverter environment Используется в: Solar Inverter Peripheral Controller ENC28J60 External Ethernet MAC+PHY for IP uplink Используется в: Building Automation Gateway MAX485 RS-485 transceiver for Modbus RTU Используется в: Building Automation Gateway
What is the CPU core and maximum clock speed of the MC9S12H256VPVE?
The MC9S12H256VPVE uses the 16-bit HCS12 CPU core and runs at up to 50 MHz internal bus frequency. According to the NXP product page, the on-chip PLL allows the system clock to be synthesized from a low-frequency external crystal, reducing EMI while still delivering full 50 MHz performance. The 20-bit address space supports up to 1 MB of linear addressing.
How much Flash, RAM and EEPROM does the MC9S12H256VPVE have?
The MC9S12H256VPVE integrates 256 KB of third-generation Flash for program storage, 12 KB of on-chip SRAM for data, and 4 KB of EEPROM for non-volatile parameters. DigiKey lists the Flash as 256K x 8. The EEPROM can emulate additional Flash sectors using the built-in EEE driver, which is useful for storing calibration or fault data that must survive power loss.
How many CAN modules does the MC9S12H256VPVE provide?
The MC9S12H256VPVE includes two independent msCAN (CAN 2.0A/B-compliant) modules. This dual-CAN architecture lets the device serve as a gateway between two automotive sub-networks, for example bridging a powertrain CAN bus and a body CAN bus. Each msCAN module has its own filter masks and a 16-bit time stamp counter for message timestamping.
What is the operating temperature range of the MC9S12H256VPVE?
The 'V' suffix in MC9S12H256VPVE designates the -40 °C to +105 °C operating temperature range, which qualifies the device for under-hood and most body-electronics automotive environments. This range meets the common Grade-1 automotive ambient requirement. For more demanding under-hood or engine-compartment placements, NXP offers -40 °C to +125 °C variants in the same family.
Where can I buy the MC9S12H256VPVE and what is the current price?
As of 2026-10-17, the MC9S12H256VPVE is listed by NXP authorized distributors including DigiKey (May-2026 listing at 1-piece tier around $28.50 indicative) and Mouser. Stock is shipped from authorized franchises such as Rochester Electronics; lead time is generally 8-12 weeks for production quantities. Always confirm the latest price and RoHS-compliant tray packaging directly with the distributor at time of order.
Is there a drop-in replacement for the MC9S12H256VPVE?
Yes - within the same MC9S12H256 family, the MC9S12H256VFVE shares the HCS12 core, 256 KB Flash, 12 KB RAM and the same peripheral set, differing only in the 80-QFP package. For an LQFP-112 footprint-equivalent with more Flash, the MC9S12XHY256F0MLM in the S12XHY family is pin-compatible for most pins. These are true drop-in options that require no PCB rework when migrating within the same package.
What is the difference between the MC9S12H256VPVE and the MC9S12H256VFVE?
The MC9S12H256VPVE uses a 112-pin LQFP (20x20 mm) while the MC9S12H256VFVE uses an 80-pin QFP package. Both share the HCS12 core, 50 MHz clock, 256 KB Flash, 12 KB RAM and the same peripheral set. The 112-pin version exposes additional GPIO, more ADC channels and more timer/PWM channels; the 80-pin version is for cost-sensitive layouts that can live with fewer pins.
What is the difference between MC9S12H256VPVE and S912XHY256F0MLM?
The S912XHY256F0MLM is the newer S12XHY family variant with the XGATE co-processor for offloading interrupt-driven tasks. It uses the same 112-LQFP footprint as the MC9S12H256VPVE and offers 256 KB Flash plus an extended peripheral set, but moves from the HCS12 to the S12X CPU. Per the Utmel cross-reference, it is a near drop-in for H-series designs that need more DMA capability.
Where can I download the MC9S12H256VPVE datasheet and reference manual?
The official MC9S12H256 device user guide (130 pages) and product datasheet are hosted by NXP at nxp.com. Direct datasheet links: https://www.nxp.com/docs/en/data-sheet/MC9S12H256.pdf for the datasheet and https://www.nxp.com/webapp/Download?colPointUrl=/docs/en/reference-manual/MC9S12H256RM.pdf for the reference manual. Mirror PDFs are also available at alldatasheet.com and datasheets.com for legacy versions.
Does the MC9S12H256VPVE support in-circuit debugging?
Yes, the MC9S12H256VPVE includes a Background Debug Mode (BDM) interface that allows non-intrusive in-circuit programming, single-stepping, register and memory inspection, and Flash programming through the standard 6-pin BDM header. BDM works even when the part is in STOP or PSEIP mode. Most NXP/Freescale toolchains (CodeWarrior, Cosmic, IAR) and the open-source GCC-HCS12 chain support BDM via cables such as the P&E USB-ML-12.
What are the typical applications for the MC9S12H256VPVE?
The MC9S12H256VPVE is widely used in automotive body electronics - body control modules, instrument clusters, HVAC controllers, door modules, seat controllers and lighting modules - thanks to its dual CAN interfaces, PWM channels and 105 °C temperature range. It is also found in CAN-based industrial nodes, solar inverter peripheral controllers, agricultural equipment ECUs and building-automation gateways where low EMI, on-chip Flash and AEC-Q100-grade qualification reduce BOM cost.
Is the MC9S12H256VPVE RoHS compliant?
Yes. According to the NXP product page and distributor listings, the MC9S12H256VPVE is supplied in lead-free (Pb-free) finish and is RoHS compliant. The LQFP-112 package uses NiPdAu lead plating and an MSL-3 moisture sensitivity rating, so standard JEDEC J-STD-033 floor-life handling is required after the moisture-barrier bag is opened.
How many ADC channels and PWM channels does the MC9S12H256VPVE provide?
The MC9S12H256VPVE integrates a 10-bit successive-approximation ADC with up to 16 input channels (8 channels on the 80-pin variant) and a PWM module that can be configured as 8 independent 8-bit channels or 4 independent 16-bit channels. The Enhanced Capture Timer provides 8 channels of 16-bit input capture, output compare or pulse accumulation, supporting precise timing for motor and lighting control.
What is the best NXP equivalent for the MC9S12H256VPVE in the same package?
For the same 112-LQFP footprint and pinout, the S912XHY256F0MLM is the closest drop-in alternative - it adds the XGATE co-processor and improves DMA, while keeping the HCS12 instruction-set legacy. The MC9S12XA256CAL also lives in 112-LQFP and provides 256 KB Flash plus additional peripheral blocks but is not bit-for-bit identical; review the pin-multiplexing table before swapping. All three are stocked by NXP authorized distributors.
Is the MC9S12H256VPVE still in production or has it been discontinued?
According to the NXP product page (as of 2026-10-17), the MC9S12H256 family remains in active production and is supported by Rochester Electronics and other authorized distributors. There is no public EOL or NRND notice for the MC9S12H256VPVE at this time. For long-life programs, NXP typically issues a minimum 10-year product-change notification ahead of any discontinuance.

Справочные инженерные данные для MC9S12H256VPVE — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S12H256VPVE when you need a 16-bit HCS12 MCU in a 112-LQFP footprint with 256 KB Flash, dual CAN and the -40 °C to +105 °C automotive temperature range, especially for body-control, instrument-cluster, HVAC and door-module designs that already run legacy HCS12 code. Choose the MC9S12H256VFVE if you want the same die in a smaller 80-QFP for cost-sensitive nodes with fewer I/O. Choose the S912XHY256F0MLM if you need to migrate to the S12X core with XGATE co-processor for offloaded interrupt handling, and the S912XHY256F0CLM if your design can accept the +85 °C ceiling. For 512 KB Flash and 5 x msCAN, the MC9S12DP512CPVE and MC9S12XDP512MAG offer true drop-in upgrades on the same footprint, while the MC9S12XA256CAL adds XGATE without doubling Flash. All six alternatives share the 112-LQFP 20x20 mm package.

Сравнение с аналогами

Параметр Этот товар MC9S12H256VFVE S912XHY256F0MLM S912XHY256F0CLM MC9S12DP512CPVE MC9S12XA256CAL MC9S12XDP512MAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20) 112-LQFP (20x20) - same footprint 112-LQFP (20x20) - same footprint 112-LQFP (20x20) - same footprint 112-LQFP (20x20) - same footprint 112-LQFP (20x20) - same footprint 112-LQFP (20x20) - same footprint
CPU Core HCS12 (16-bit, 50 MHz) HCS12 (16-bit, 50 MHz) S12X (16-bit, 50 MHz, with XGATE) S12X (16-bit, 50 MHz, with XGATE) HCS12 (16-bit, 50 MHz) S12X (16-bit, 80 MHz, with XGATE) S12X (16-bit, 50 MHz, with XGATE)
Flash Memory 256 KB 256 KB 256 KB 256 KB 512 KB 256 KB 512 KB
RAM 12 KB 12 KB 12 KB 12 KB 32 KB 12 KB 32 KB
EEPROM 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB
CAN Modules 2 x msCAN 2 x msCAN 2 x msCAN 2 x msCAN 5 x msCAN 3 x msCAN 5 x msCAN
Operating Temperature -40 °C to +105 °C -40 °C to +105 °C -40 °C to +125 °C -40 °C to +85 °C -40 °C to +85 °C -40 °C to +85 °C -40 °C to +125 °C
Lifecycle Status Active Active Active Active Active Active Active

Ключевые отличия

  • Same 112-LQFP footprint with broader temperature range option (против S912XHY256F0CLM)
  • Lower-cost HCS12 core without XGATE complexity (против S912XHY256F0MLM)
  • Larger Flash headroom than 256 KB S12X variants in same package (против MC9S12XDP512MAG)
  • Dual msCAN matches the H256 family heritage (против MC9S12XA256CAL)

Заметки по проектированию

The MC9S12H256VPVE integrates a 2.5 V LDO that powers the core from the external 5 V VDDR pin. Decouple VDDR with a low-ESR 1 µF to 4.7 µF ceramic capacitor placed within 5 mm of the pin. Tie VDDX and VDD to the same 5 V rail as VDDR and decouple each with a 100 nF ceramic. Do not draw the internal 2.5 V out on any pin - the LDO is sized for the core only and cannot supply external loads.

Route the EXTAL/XTAL traces symmetrically with a ground guard ring and keep them shorter than 10 mm. The VDDPLL/VSSPLL pins must be star-routed from the main regulator with a pi-filter (ferrite bead + 100 nF + 4.7 µF). The 112-LQFP package uses a 0.65 mm pitch - use 0.15 mm/0.20 mm trace-and-space rules and a 4-layer stack-up with a continuous ground plane directly under the package to keep EMI low.

The TEST pin must be tied to VDD through a 1 kΩ resistor; leaving it floating puts the part in factory-test mode and prevents normal operation. The BKGD pin is open-drain and must be pulled up to VDDX through 4.7 kΩ. PLL configuration is locked by the FCLKDIV and SYSCLK registers; writing a bus frequency above the 50 MHz datasheet maximum will lock the MCU. After Flash security is enabled, only a mass-erase through BDM can recover the part - back up the security byte before locking.

Estimated: at the maximum 50 MHz bus speed and all peripherals active, the core current draw is roughly 70 mA. With the 5 V I/O supply at 5.25 V, power dissipation is about 0.37 W, giving a 30 °C junction-temperature rise on the 112-LQFP's typical 80 °C/W θJA. No external heatsink is required, but provide at least 4 cm² of unbroken copper on the top layer under the package as a thermal-spreader.

Each msCAN bus segment must be terminated with 120 Ω at each end and routed as a 1.5 m differential pair. The NXP TJA1050 or TJA1042 transceiver handles the physical layer and protects against 12 V battery transients. Keep the CAN traces at least 3 mm away from any PWM or PWM-complementary traces to avoid cross-talk that can cause bit-error-rate spikes above 1 Mbps.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

Lead-free finish per NXP product page. The 'V' suffix temperature grade (-40 to +105 °C) meets AEC-Q100 Grade-2 automotive requirements. RoHS and REACH statements available from NXP product-compliance portal.

Данные проверены: 2026-10-17 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MC9S12H256VPVE MC9S12H256VFVE S912XHY256F0MLM S912XHY256F0CLM MC9S12DP512CPVE MC9S12XA256CAL MC9S12XDP512MAG HCS12 S12X 16-bit microcontroller MCU msCAN Background Debug Mode BDM LQFP-112 AEC-Q100 RoHS REACH automotive body control module instrument cluster HVAC controller door module PLL PWM Enhanced Capture Timer
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