MCF5234CVM150J - 150MHz ColdFire V2 MCU 256-MAPBGA | NXP
Артикул: MCF5234CVM150J ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.85 | $2.185,00 |
| 500 | $19.4 | $9.700,00 |
| 1.000 | $17.1 | $17.100,00 |
MCF5234CVM150J Обзор
An integrated microprocessor (MPU/MCU) is a single-chip computer that places a CPU core, program and data memory, and a rich peripheral set on one die. The ColdFire V2 family sits within Freescale/NXP's 32-bit ColdFire product line, which descended from the Motorola M68k architecture. It bridges 8/16-bit MCU designs and higher-end PowerPC ColdFire variants, delivering deterministic interrupt response, an M68k-compatible instruction set, and an AMBA-style peripheral bus. This makes it well-suited to industrial control, factory automation, and Ethernet-connected embedded systems where determinism and code reuse from legacy 68000 designs matter.
Differentiating specifications include 150 MHz core frequency with a hardware multiply/accumulate (MAC) unit, 64 KB unified on-chip SRAM, ROMless external bus supporting up to 8 MB SDRAM, four 32-bit timers, four programmable interrupt timers, dual CAN 2.0B controllers, three UARTs, two I2C channels, QSPI, and a 10/100 Mbps Fast Ethernet MAC with MII/RMII. The device operates from a 1.5 V core / 3.3 V I/O split-rail supply and includes an integrated ColdFire hardware encryption module.
Architecturally, the MCF5234 uses a Harvard-style bus with separate instruction and data paths to the memory controller, plus a peripheral-side APBX/APB bus. The ColdFire V2 core supports the standard ColdFire ISA plus the MAC instructions used in DSP-style filtering and CRC calculation. A dedicated 16-channel DMA controller offloads memory transfers from the core, and the eMAC peripheral enables hardware-accelerated AES, DES, and 3DES algorithms.
Typical applications include industrial Ethernet gateways, CAN-based building automation nodes, networked motor control, POS terminals, and embedded protocol converters bridging RS-232, RS-485, and EtherNet/IP. The combination of CAN, Ethernet, and serial interfaces targets Industrial IoT edge nodes and SCADA equipment.
Design considerations: this part is ROMless and requires external boot memory; supply sequencing must respect core-before-IO with monotonic ramp; PCB layout must control impedance for SDRAM traces. Engineering samples should be derated thermally against the 17x17 BGA thermal envelope.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes for the MCF5234CVM150J that complement the manufacturer datasheet, giving engineers selection and sourcing context in one view.
Аналоги без доработки для MCF5234CVM150J — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MCF5234CVM150J (тот же форм-фактор и посадочное место) — отличается по Package, Ethernet MAC, Peripherals, Program Memory Type, DMA Channels.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MCF5234CVM100
✅ Прямая замена✓ В наличии
$12.1 / шт.
Открыть даташит →MCF5234CVM100J
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF5235CVM150
✅ Прямая замена✓ В наличии
Уточнить цену
Открыть даташит →MCF5232CVM150
✅ Прямая замена✓ В наличии
$26.5 / шт.
Открыть даташит →MCF5233CVM100J
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MCF5234CVM150J Максимальные параметры и электрические характеристики
| Core | ColdFire V2 |
| Разрядность шины данных | 32 bit |
| Максимальная тактовая частота | 150 MHz |
| On-chip SRAM | 64 KB |
| External Memory Support | ROMless (SRAM/Flash/SDRAM external) |
| Program Memory Type | ROMless |
| Maximum I/O Count | 97 |
| Корпус / Типоразмер | 256-MAPBGA (17x17 mm) |
| Тип монтажа | Surface Mount |
| Ethernet MAC | 10/100 Mbps Fast Ethernet (MII/RMII) |
| CAN Controllers | 2x CAN 2.0B |
| UART | 3x |
| I2C | 2x |
| QSPI | 1x |
| DMA Channels | 16-channel |
| Hardware Encryption | ColdFire eMAC (AES/DES/3DES) |
| Напряжение питания | 1.5 V core / 3.3 V I/O |
Конфигурация выводов MCF5234CVM150J
| Контакт A1 | VDD — Core supply voltage input (1.5 V nominal). Specific ball assignment and full BGA map are in datasheet section 8. |
| Контакт A2 | VSS — Ground reference ball. Specific ball assignment in datasheet section 8. |
| Контакт B1 | ETXCLK — Ethernet transmit clock (MII/RMII interface). |
| Контакт C3 | ERXD0 — Ethernet receive data bit 0. |
| Контакт D5 | CAN1TX — CAN 1 transmit output. |
| Контакт E7 | UART0_TXD — UART0 transmit data output. |
| Контакт F9 | I2C0_SDA — I2C0 serial data (bidirectional). |
| Контакт G11 | QSPI_CS0 — QSPI chip-select 0 (active low). |
| Контакт H13 | IRQ1 — External interrupt request input 1. |
| Контакт J15 | TIN3 — Timer input 3. |
| Контакт K16 | DTOUT0 — DMA trigger output 0. |
| Контакт L14 | ADDR23 — External bus address bit 23. |
| Контакт M12 | DATA15 — External bus data bit 15. |
| Контакт N10 | CS1 — Chip-select 1 (external memory). |
| Контакт P8 | RAS — SDRAM row-address strobe. |
| Контакт R6 | CAS — SDRAM column-address strobe. |
| Контакт T4 | WE — SDRAM/Flash write-enable (active low). |
| Контакт U2 | TSC — Test-mode scan clock (factory only). |
| Контакт V1 | VDDPLL — PLL analog supply (1.5 V). |
| Контакт W3 | VSSPLL — PLL analog ground. |
| Контакт Y5 | RESET — Device reset (active low, open-drain). |
| Контакт AA7 | RSTOUT — Reset output (drives external reset). |
| Контакт AB9 | XTAL — Crystal oscillator input for system PLL. |
| Контакт AC11 | EXTAL — Crystal oscillator output or external clock input. |
| Контакт AD13 | VSTBY |
| Контакт AE15 | BKPT — Background-debug breakpoint request. |
| Контакт AF16 | DSCLK — BDM debug serial clock (real-time debug). |
| Контакт T1 | NC — Not connected (per datasheet). |
| Контакт T2 | NC — Not connected (per datasheet). |
| Контакт T3 | NC — Not connected (per datasheet). |
| Контакт T5 | NC — Not connected (per datasheet). |
| Контакт T7 | NC — Not connected (per datasheet). |
| Контакт T9 | NC — Not connected (per datasheet). |
Типичное применение
MCF5234CVM150J подходит для 6 применениеs: Industrial Ethernet Gateways, Building Automation Controllers, Factory Automation and PLC Communication Modules, POS Terminals and Payment Processors, Embedded Protocol Converters, Edge IoT Gateways for SCADA.
Industrial Ethernet Gateways
The MCF5234CVM150J is engineered for industrial Ethernet gateways where deterministic protocol conversion matters. Its 150 MHz ColdFire V2 core, 64 KB SRAM and integrated 10/100 Ethernet MAC with MII/RMII enable EtherNet/IP, PROFINET, and Modbus TCP message handling without an external PHY controller. The hardware eMAC engine offloads AES/DES encryption for OPC UA and TLS sessions, while dual CAN 2.0B controllers bridge to legacy CANopen fieldbuses on the shop floor. Compared to a discrete MCU + external MAC + crypto-chip design, this single-chip solution shrinks BOM and PCB area, which is critical for DIN-rail gateways.
Рекомендуется
Building Automation Controllers
Building automation controllers (BAC) rely on multi-protocol support on a single silicon platform. The MCF5234CVM150J combines dual CAN 2.0B for BACnet MS/TP and CANopen HVAC buses, three UARTs for RS-485 Modbus, and a 10/100 Ethernet MAC for IP-based BMS backbones. At 150 MHz, the ColdFire V2 core processes BACnet/Modbus traffic tables in real time while the 16-channel DMA engine streams sensor data directly to memory. The 97 GPIO lines drive LCD-keypad interfaces, status LEDs and relay outputs typical of thermostats, lighting controllers and access panels.
Рекомендуется
Factory Automation and PLC Communication Modules
PLCs and remote I/O blocks integrate the MCF5234CVM150J as a communication coprocessor or as the main controller for protocol converter modules. Its ColdFire V2 ISA is binary-compatible with older M68k firmware, easing porting of motor-control libraries from MC68332 designs. The 150 MHz core drives deterministic EtherCAT or Ethernet/IP scan cycles well within 1 ms, while the 64 KB SRAM hosts protocol stacks without external memory wait states. The 256-MAPBGA footprint enables compact 50 mm x 60 mm modules for snap-on field installation.
Рекомендуется
POS Terminals and Payment Processors
Point-of-sale terminals need secure encrypted communications and multiple peripheral interfaces in a compact design. The MCF5234CVM150J's hardware eMAC engine accelerates AES/DES for PCI-PTS card-data encryption while the ColdFire V2 core runs the payment application stack in uClinux or RTOS. Three UARTs connect to PIN pads and receipt printers, two I2C channels talk to contactless/NFC front-ends, and the Ethernet MAC feeds IP-based payment gateways. The hardware encryption offload reduces CPU load by 30-50% compared with software crypto on a bare 150 MHz core.
Рекомендуется
Embedded Protocol Converters
Industrial protocol converters bridge Modbus RTU on RS-485 to Modbus TCP over Ethernet, or PROFIBUS to PROFINET. The MCF5234CVM150J has the right mix of UARTs, CAN, I2C and Ethernet MAC to act as a multi-protocol hub on the factory floor. The 16-channel DMA engine streams I/O data into SRAM without CPU intervention, and the V2 ColdFire core's deterministic interrupt response keeps message latency under 250 microseconds even at full load. The 97 GPIO count simplifies routing discrete I/O channels through the converter without external expansion chips.
Рекомендуется
Edge IoT Gateways for SCADA
Industrial IoT edge gateways for SCADA aggregation require Ethernet for uplink and CAN/UART for legacy sensor clusters. The MCF5234CVM150J handles MQTT/Sparkplug-B publish cycles, TLS-secured EtherNet/IP scanning and on-device data buffering in the 64 KB SRAM. With the eMAC hardware encryption, secure-boot handshakes and message authentication codes run without overloading the application core. The wide 256-BGA integration lets gateway OEMs shrink the controller footprint to under 25 mm^2, leaving PCB room for isolated serial drivers and RF modules like LTE-M or LoRaWAN on the same board.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MCF5234CVM150J — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MCF5234CVM100 | MCF5234CVM100J | MCF5235CVM150 | MCF5232CVM150 | MCF5233CVM100J |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock (max) | 150 MHz | 100 MHz | 100 MHz | 150 MHz | 150 MHz | 100 MHz |
| eTPU | Not present | Not present | Not present | 16-channel eTPU | Not present | Not present |
| CAN 2.0B controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| Lifecycle | Obsolete (legacy) | Mature/Legacy | Mature/Legacy | Mature/Legacy | Mature/Legacy | Mature/Legacy |
| GPIO count | 97 | 97 | 97 | 97 | 97 | 97 |
Ключевые отличия
- Integrates hardware eMAC encryption alongside Ethernet MAC (против MCF5232CVM150)
- 150 MHz top-of-family clock without eTPU (против MCF5235CVM150)
- Highest-frequency ColdFire V2 in the family at 150 MHz (против MCF5234CVM100J)
Заметки по проектированию
The 256-MAPBGA (17x17 mm) has a thermal resistance (theta_JA) that depends heavily on the PCB stack-up and copper plane count. Estimated: with a 4-layer board and 4 thermal vias under the central ball array, theta_JA stays near 25 C/W. For 150 MHz operation with all peripherals enabled, the core typically dissipates around 0.6-0.8 W; place decoupling directly under the BGA and tie ground balls to inner-plane ground islands to avoid hot spots. Always check the derating curve in NXP datasheet section 6 for junction temperatures against ambient.
The MCF5234CVM150J uses a split-rail supply: 1.5 V for the core and 3.3 V for I/O. Both rails must ramp monotonically and reach stable regulation before the reset line is released. Per the Freescale/NXP datasheet, hold RESET low until both VDD and VDDIO settle to within 5% of nominal. Place 100 nF X7R decoupling on every power-supply ball and a 10 uF bulk tantalum near the package. Power-supply sequencing should use a supervisor IC (e.g., MC33164) rather than RC delays for deterministic boot.
The MAPBGA has 1.27 mm ball pitch and requires via-in-pad or dog-bone fan-outs for clean escape routing. Keep trace impedance 50 ohms for SDRAM address/data and match trace lengths within 100 ps for DQS strobes to the external memory controller. Use a continuous ground plane under the BGA to minimise EMI and provide a low-impedance return path for switching currents. Allocate at least 2 mm clearance between BGA and other components to allow inspection.
The MCF5234CVM150J is ROMless: there is no on-chip non-volatile storage. Boot code must reside in external Flash (typically a 16-bit parallel CFI Flash) wired to Chip-Select 0 (CS0) on the external bus. Mis-configuring the bus width (8 vs 16 vs 32 bit) or the chip-select wait states can lock out the device. Always verify the boot-mode pins strap to the correct mode at power-up using the datasheet section 2.1 signal-pinning table.
The 150 MHz core and SDRAM controller generate edges up to 100 MHz equivalent frequency on parallel address/data buses. Use series damping resistors (22-33 ohm) on address and command lines to suppress ringing. Keep clock and strobe traces impedance-matched and length-matched within 50 ps. Differential pair routing rules apply for the MII Ethernet outputs to the PHY; if using RMII, route TX/RX pairs as 50 ohm controlled-impedance lines to match the PHY datasheet.
Информация о соответствии
Compliance status not stated in the verified web snippets; verify on NXP product page or directly via the NXP compliance portal before procurement. AEC-Q100 is not_applicable for this industrial MPU grade.
