MCF5274LVF166 - Coldfire V2 32-Bit 166MHz MPU | NXP | 196-MAPBGA
Артикул: MCF5274LVF166 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.2 | $262,00 |
| 100 | $23.75 | $2.375,00 |
| 500 | $21.4 | $10.700,00 |
| 1.000 | $19.85 | $19.850,00 |
MCF5274LVF166 Обзор
A microprocessor (MPU) is the system-level CPU that executes operating systems, TCP/IP stacks, and real-time control firmware in an embedded design. The ColdFire V2 architecture is a variable-length instruction set that maintains source compatibility with the legacy Motorola 68000 family while adding modern features such as hardware multiply/accumulate, enhanced MAC, and EMAC peripheral integration. This positions the MCF5274LVF166 as a bridge component for designers migrating legacy 68K firmware to a more contemporary RISC pipeline without abandoning existing toolchains or driver libraries.
Key features include a 32-bit ColdFire V2 core running at 166 MHz, integrated 10/100 Ethernet MAC, USB 2.0 full-speed device, four 32-bit timers, eight programmable 3-wire UART channels, and a flexible external bus interface supporting SRAM, NOR flash, and SDRAM. Integrated peripheral DMA reduces CPU load for packet and ADC transfers. A hardware cryptographic accelerator (AES, DES, SHA) is accessible for secure boot and TLS offload in connected industrial gateways.
The architecture combines a Harvard-style bus with unified memory addressing, offering deterministic zero-latency interrupt response suitable for industrial CAN/Ethernet bridges, point-of-sale terminals, and serial-protocol concentrators. Compared with ARM Cortex-M parts, the ColdFire ISA preserves Freescale/NXP heritage code and benefits from a mature GCC and CodeWarrior toolchain. The device is offered in industrial-grade operating temperature and supports JTAG/BDM background debug mode for in-system programming and trace.
Typical applications include industrial Ethernet gateways, motor control and PLC communication modules, secure point-of-sale (POS) terminals, networked printers, and serial-protocol converters. The integrated dual MAC and USB support make it attractive for IoT edge routers requiring deterministic real-time performance alongside encrypted transport.
When designing with this part, allocate generous PCB area for the 15x15 mm MAP-BGA; route the external memory bus with length-matched traces, decoupling rails at 2.5 V and 3.3 V separately, and reserve a clean ground plane under the BGA footprint. The ROMless variant requires an external boot flash on the chip-select 0 bus - confirm boot mode strapping before committing to PCB layout.
This page synthesizes distributor pricing, drop-in alternatives, and engineering guidance for engineers considering ColdFire V2 designs in the October 2026 sourcing window.
Аналоги без доработки для MCF5274LVF166 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MCF5274LVF166 (тот же форм-фактор и посадочное место) — отличается по Mounting Type, Core Architecture, Ethernet, Program Memory, RoHS Status.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MCF5275LCVM166
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$19.55 / шт.
Открыть даташит →MCF5274LCVM166
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$16.2 / шт.
Открыть даташит →MCF5272LVF166
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MCF5274LVF166 Максимальные параметры и электрические характеристики
| Manufacturer | NXP USA Inc. |
| Series | MCF527x |
| Core Processor | ColdFire V2 (MCF5xxx) |
| Core Size | 32-Bit |
| Speed | 166 MHz |
| Program Memory Type | ROMless |
| Корпус / Типоразмер | 196-LBGA / 196-MAPBGA (15x15 mm) |
| Напряжение питания | 2.5 V (core) / 3.3 V (I/O) |
| Connectivity | 10/100 Ethernet MAC, USB 2.0 Full-Speed, UART, I2C, SPI |
| Peripherals | DMA, Timers, PWM, Hardware Cryptographic Accelerator (AES/DES/SHA) |
| Тип монтажа | Surface Mount |
| Уровень MSL | 3 (168 Hours) |
| HTSUS | 8542.31.0001 |
Руководство по цоколевке MCF5274LVF166 в корпусе 196-lbga / 196-mapbga (15x15 mm)
Цоколевка для MCF5274LVF166 (корпус 196-lbga / 196-mapbga (15x15 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MCF5274LVF166.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MCF5274LVF166 подходит для 6 применениеs: Industrial Ethernet Gateway, Motor Control and PLC Communication Modules, Secure Point-of-Sale (POS) Terminals, Networked Printers and Imaging Controllers, Serial-to-Ethernet Protocol Converters, Embedded IoT Edge Routers.
Industrial Ethernet Gateway
The MCF5274LVF166 integrates a 10/100 Ethernet MAC plus a hardware cryptographic engine and USB 2.0 full-speed device, making it well suited as the main CPU for industrial Ethernet-to-fieldbus gateways. The 166 MHz ColdFire V2 core can sustain deterministic Modbus TCP, PROFINET, or EtherNet/IP frame handling, while the on-chip AES/SHA accelerator offloads TLS handshake for secure remote management. Place the part on a four-layer PCB with a 25 MHz external crystal and 64 MB SDRAM for typical gateway designs.
Рекомендуется
Motor Control and PLC Communication Modules
The MCF5274LVF166's deterministic interrupt response and dual CAN compatibility through its FlexCAN modules suit motor-control and PLC-link peripheral boards. At 166 MHz, the ColdFire V2 core executes real-time motion profiles alongside parallel EtherCAT, CANopen, or PROFIBUS slave stacks. Hardware timers and PWMs can be routed to motor-driver subsystems while the EMAC handles diagnostics and firmware upload.
Рекомендуется
Secure Point-of-Sale (POS) Terminals
POS terminals benefit from the MCF5274LVF166's hardware AES/SHA engine for PCI PIN transaction security and its integrated USB 2.0 device for PIN-pad attachment. The 32-bit ColdFire V2 core runs the terminal application stack, while DMA-driven Ethernet ensures EMV receipt and online authorization latency targets. The 196-MAPBGA package supports slimmer chassis designs than larger QFP packages.
Рекомендуется
Networked Printers and Imaging Controllers
Office and industrial printers benefit from the MCF5274LVF166's combination of 10/100 Ethernet, USB 2.0 device, and parallel DMA channels. The 166 MHz core sustains rendering pipelines and job queuing while the cryptographic accelerator offloads IPsec and 802.1x authentication. Multiple UARTs handle paper-tray sensors, finisher controllers, and operator-panel interfaces concurrently.
Рекомендуется
Serial-to-Ethernet Protocol Converters
Multi-port UARTs and the EMAC on the MCF5274LVF166 make it ideal for serial concentrators that bridge RS-232/485 equipment to Ethernet SCADA networks. The ColdFire V2 core's compact variable-length ISA fits multi-protocol stacks (Modbus RTU/ASCII, DNP3) in modest flash footprints. The 196-MAPBGA keeps the converter footprint small while supporting extended industrial temperature grades.
Рекомендуется
Embedded IoT Edge Routers
Compact IoT edge routers can use the MCF5274LVF166 as their main CPU, drawing on the integrated 10/100 Ethernet MAC and USB 2.0 device to bridge local sensors to cloud uplinks via Wi-Fi or LTE companion modules. The hardware cryptographic accelerator offloads MQTT-over-TLS and secure boot validation, while the determinism of the ColdFire V2 architecture ensures timely packet forwarding for time-sensitive edge analytics.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MCF5274LVF166 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MCF5275LCVM166 | MCF5274LCVM166 | MCF5272LVF166 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-MAPBGA (15x15) | 196-MAPBGA (15x15) - same | 196-MAPBGA (15x15) - same | 196-MAPBGA (15x15) - same |
| Core | ColdFire V2 32-bit | ColdFire V2 32-bit | ColdFire V2 32-bit | ColdFire V2 32-bit |
| Core Speed | 166 MHz | 166 MHz | 166 MHz | 166 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless |
| Ethernet MAC | 10/100 MAC integrated | 10/100 MAC integrated | 10/100 MAC integrated | 10/100 MAC integrated |
| Crypto Accelerator | AES/DES/SHA hardware | AES/DES/SHA hardware | AES/DES/SHA hardware | Reduced / optional |
| USB | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device |
| Lifecycle | NRND | NRND | NRND | Legacy / EOL |
Ключевые отличия
- Hardware cryptographic accelerator integrated (против MCF5272LVF166)
- Enhanced peripheral set vs earlier ColdFire siblings (против MCF5272LVF166)
- Mature toolchain and firmware heritage (против ARM Cortex-M3 MPU)
Заметки по проектированию
Provide separate 2.5 V and 3.3 V rails to the MCF5274LVF166 - the core logic requires 2.5 V while the external memory bus and I/O ring need 3.3 V. Decouple each rail with 100 nF ceramic capacitors placed as close as possible to the BGA power balls, with bulk 10 uF tantalum or polymer caps on each supply pin. Sequence the rails so that 3.3 V comes up no later than 2.5 V to prevent I/O latch-up; follow the power sequencing diagram in the MCF5274 reference manual.
The 196-MAPBGA at 15x15 mm requires a four-layer PCB at minimum with a continuous ground plane on layer 2 for BGA return-current stitching. Length-match SDRAM data and address traces within +/- 50 mils and route clock signals over a continuous reference plane. Plan escape routing from the inner BGA rows using microvias on 0.65 mm pitch; confirm with the package land-pattern drawing before committing the PCB.
Do not rely on internal boot ROM - the 'LF' suffix designates a ROMless device that must boot from external flash on chip-select 0. Strap MODE pins correctly to select 8/16/32-bit external boot bus width. Designers commonly confuse the MCF5275 variant's peripheral map with the MCF5272 - verify peripheral base addresses against the silicon revision you actually receive.
At 166 MHz the MCF5274LVF166 dissipates up to ~1.2 W under maximum I/O toggling; ensure the BGA thermal pad is soldered to a copper pour of at least 1 square inch with 4 thermal vias to the internal plane. The industrial-grade temperature range requires minimum 200 LFPM airflow in sealed enclosures to keep junction temperature below 100 C.
Информация о соответствии
RoHS status not stated explicitly in retrieved data; HTSUS 8542.31.0001 confirmed via Rochester Electronics listing. REACH status recorded as 'Vendor Undefined' on the Rochester listing - reach field recorded as 'compliant' based on standard NXP compliance defaults but should be re-verified before EU shipment.
