MCF5274LVF166 - Coldfire V2 32-Bit 166MHz MPU | NXP | 196-MAPBGA
Référence : MCF5274LVF166 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.2 | $262,00 |
| 100 | $23.75 | $2 375,00 |
| 500 | $21.4 | $10 700,00 |
| 1 000 | $19.85 | $19 850,00 |
MCF5274LVF166 Présentation
A microprocessor (MPU) is the system-level CPU that executes operating systems, TCP/IP stacks, and real-time control firmware in an embedded design. The ColdFire V2 architecture is a variable-length instruction set that maintains source compatibility with the legacy Motorola 68000 family while adding modern features such as hardware multiply/accumulate, enhanced MAC, and EMAC peripheral integration. This positions the MCF5274LVF166 as a bridge component for designers migrating legacy 68K firmware to a more contemporary RISC pipeline without abandoning existing toolchains or driver libraries.
Key features include a 32-bit ColdFire V2 core running at 166 MHz, integrated 10/100 Ethernet MAC, USB 2.0 full-speed device, four 32-bit timers, eight programmable 3-wire UART channels, and a flexible external bus interface supporting SRAM, NOR flash, and SDRAM. Integrated peripheral DMA reduces CPU load for packet and ADC transfers. A hardware cryptographic accelerator (AES, DES, SHA) is accessible for secure boot and TLS offload in connected industrial gateways.
The architecture combines a Harvard-style bus with unified memory addressing, offering deterministic zero-latency interrupt response suitable for industrial CAN/Ethernet bridges, point-of-sale terminals, and serial-protocol concentrators. Compared with ARM Cortex-M parts, the ColdFire ISA preserves Freescale/NXP heritage code and benefits from a mature GCC and CodeWarrior toolchain. The device is offered in industrial-grade operating temperature and supports JTAG/BDM background debug mode for in-system programming and trace.
Typical applications include industrial Ethernet gateways, motor control and PLC communication modules, secure point-of-sale (POS) terminals, networked printers, and serial-protocol converters. The integrated dual MAC and USB support make it attractive for IoT edge routers requiring deterministic real-time performance alongside encrypted transport.
When designing with this part, allocate generous PCB area for the 15x15 mm MAP-BGA; route the external memory bus with length-matched traces, decoupling rails at 2.5 V and 3.3 V separately, and reserve a clean ground plane under the BGA footprint. The ROMless variant requires an external boot flash on the chip-select 0 bus - confirm boot mode strapping before committing to PCB layout.
This page synthesizes distributor pricing, drop-in alternatives, and engineering guidance for engineers considering ColdFire V2 designs in the October 2026 sourcing window.
Alternatives de remplacement direct pour MCF5274LVF166 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5274LVF166 (même facteur de forme et même empreinte) — différant par Mounting Type, Core Architecture, Ethernet, Program Memory, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF5275LCVM166
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.55 / unité
Voir la fiche technique →MCF5274LCVM166
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.2 / unité
Voir la fiche technique →MCF5272LVF166
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5274LVF166 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. |
| Series | MCF527x |
| Core Processor | ColdFire V2 (MCF5xxx) |
| Core Size | 32-Bit |
| Speed | 166 MHz |
| Program Memory Type | ROMless |
| Boîtier / Format | 196-LBGA / 196-MAPBGA (15x15 mm) |
| Tension d'alimentation | 2.5 V (core) / 3.3 V (I/O) |
| Connectivity | 10/100 Ethernet MAC, USB 2.0 Full-Speed, UART, I2C, SPI |
| Peripherals | DMA, Timers, PWM, Hardware Cryptographic Accelerator (AES/DES/SHA) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 Hours) |
| HTSUS | 8542.31.0001 |
Guide de configuration des broches du MCF5274LVF166 196-lbga / 196-mapbga (15x15 mm)
Configuration des broches du MCF5274LVF166 (boîtier 196-lbga / 196-mapbga (15x15 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCF5274LVF166.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCF5274LVF166 convient pour 6 applications: Industrial Ethernet Gateway, Motor Control and PLC Communication Modules, Secure Point-of-Sale (POS) Terminals, Networked Printers and Imaging Controllers, Serial-to-Ethernet Protocol Converters, Embedded IoT Edge Routers.
Industrial Ethernet Gateway
The MCF5274LVF166 integrates a 10/100 Ethernet MAC plus a hardware cryptographic engine and USB 2.0 full-speed device, making it well suited as the main CPU for industrial Ethernet-to-fieldbus gateways. The 166 MHz ColdFire V2 core can sustain deterministic Modbus TCP, PROFINET, or EtherNet/IP frame handling, while the on-chip AES/SHA accelerator offloads TLS handshake for secure remote management. Place the part on a four-layer PCB with a 25 MHz external crystal and 64 MB SDRAM for typical gateway designs.
Recommandé
Motor Control and PLC Communication Modules
The MCF5274LVF166's deterministic interrupt response and dual CAN compatibility through its FlexCAN modules suit motor-control and PLC-link peripheral boards. At 166 MHz, the ColdFire V2 core executes real-time motion profiles alongside parallel EtherCAT, CANopen, or PROFIBUS slave stacks. Hardware timers and PWMs can be routed to motor-driver subsystems while the EMAC handles diagnostics and firmware upload.
Recommandé
Secure Point-of-Sale (POS) Terminals
POS terminals benefit from the MCF5274LVF166's hardware AES/SHA engine for PCI PIN transaction security and its integrated USB 2.0 device for PIN-pad attachment. The 32-bit ColdFire V2 core runs the terminal application stack, while DMA-driven Ethernet ensures EMV receipt and online authorization latency targets. The 196-MAPBGA package supports slimmer chassis designs than larger QFP packages.
Recommandé
Networked Printers and Imaging Controllers
Office and industrial printers benefit from the MCF5274LVF166's combination of 10/100 Ethernet, USB 2.0 device, and parallel DMA channels. The 166 MHz core sustains rendering pipelines and job queuing while the cryptographic accelerator offloads IPsec and 802.1x authentication. Multiple UARTs handle paper-tray sensors, finisher controllers, and operator-panel interfaces concurrently.
Recommandé
Serial-to-Ethernet Protocol Converters
Multi-port UARTs and the EMAC on the MCF5274LVF166 make it ideal for serial concentrators that bridge RS-232/485 equipment to Ethernet SCADA networks. The ColdFire V2 core's compact variable-length ISA fits multi-protocol stacks (Modbus RTU/ASCII, DNP3) in modest flash footprints. The 196-MAPBGA keeps the converter footprint small while supporting extended industrial temperature grades.
Recommandé
Embedded IoT Edge Routers
Compact IoT edge routers can use the MCF5274LVF166 as their main CPU, drawing on the integrated 10/100 Ethernet MAC and USB 2.0 device to bridge local sensors to cloud uplinks via Wi-Fi or LTE companion modules. The hardware cryptographic accelerator offloads MQTT-over-TLS and secure boot validation, while the determinism of the ColdFire V2 architecture ensures timely packet forwarding for time-sensitive edge analytics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5274LVF166 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5275LCVM166 | MCF5274LCVM166 | MCF5272LVF166 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-MAPBGA (15x15) | 196-MAPBGA (15x15) - same | 196-MAPBGA (15x15) - same | 196-MAPBGA (15x15) - same |
| Core | ColdFire V2 32-bit | ColdFire V2 32-bit | ColdFire V2 32-bit | ColdFire V2 32-bit |
| Core Speed | 166 MHz | 166 MHz | 166 MHz | 166 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless |
| Ethernet MAC | 10/100 MAC integrated | 10/100 MAC integrated | 10/100 MAC integrated | 10/100 MAC integrated |
| Crypto Accelerator | AES/DES/SHA hardware | AES/DES/SHA hardware | AES/DES/SHA hardware | Reduced / optional |
| USB | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device |
| Lifecycle | NRND | NRND | NRND | Legacy / EOL |
Principaux différenciateurs
- Hardware cryptographic accelerator integrated (vs MCF5272LVF166)
- Enhanced peripheral set vs earlier ColdFire siblings (vs MCF5272LVF166)
- Mature toolchain and firmware heritage (vs ARM Cortex-M3 MPU)
Notes de conception
Provide separate 2.5 V and 3.3 V rails to the MCF5274LVF166 - the core logic requires 2.5 V while the external memory bus and I/O ring need 3.3 V. Decouple each rail with 100 nF ceramic capacitors placed as close as possible to the BGA power balls, with bulk 10 uF tantalum or polymer caps on each supply pin. Sequence the rails so that 3.3 V comes up no later than 2.5 V to prevent I/O latch-up; follow the power sequencing diagram in the MCF5274 reference manual.
The 196-MAPBGA at 15x15 mm requires a four-layer PCB at minimum with a continuous ground plane on layer 2 for BGA return-current stitching. Length-match SDRAM data and address traces within +/- 50 mils and route clock signals over a continuous reference plane. Plan escape routing from the inner BGA rows using microvias on 0.65 mm pitch; confirm with the package land-pattern drawing before committing the PCB.
Do not rely on internal boot ROM - the 'LF' suffix designates a ROMless device that must boot from external flash on chip-select 0. Strap MODE pins correctly to select 8/16/32-bit external boot bus width. Designers commonly confuse the MCF5275 variant's peripheral map with the MCF5272 - verify peripheral base addresses against the silicon revision you actually receive.
At 166 MHz the MCF5274LVF166 dissipates up to ~1.2 W under maximum I/O toggling; ensure the BGA thermal pad is soldered to a copper pour of at least 1 square inch with 4 thermal vias to the internal plane. The industrial-grade temperature range requires minimum 200 LFPM airflow in sealed enclosures to keep junction temperature below 100 C.
Informations de conformité
RoHS status not stated explicitly in retrieved data; HTSUS 8542.31.0001 confirmed via Rochester Electronics listing. REACH status recorded as 'Vendor Undefined' on the Rochester listing - reach field recorded as 'compliant' based on standard NXP compliance defaults but should be re-verified before EU shipment.
